CN104540324A - Printed circuit board outer dry film sticking machine - Google Patents
Printed circuit board outer dry film sticking machine Download PDFInfo
- Publication number
- CN104540324A CN104540324A CN201410811405.3A CN201410811405A CN104540324A CN 104540324 A CN104540324 A CN 104540324A CN 201410811405 A CN201410811405 A CN 201410811405A CN 104540324 A CN104540324 A CN 104540324A
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- pressing roller
- hot
- dry film
- protective film
- circuit board
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Abstract
The invention discloses a printed circuit board outer dry film sticking machine. The machine comprises a support and is characterized in that an upper dry film installation roller, a lower dry film installation roller, an upper polyethylene protecting film stripping rod, a lower polyethylene protecting film stripping rod, an upper polyethylene protecting film winding roller, a lower polyethylene protecting film winding roller, an upper hot-pressing roller, a lower hot-pressing roller and a heating table are arranged on the support, a dry film can be wound around the upper dry film installation roller and the lower dry film installation roller, the upper polyethylene protecting film stripping rod and the lower polyethylene protecting film stripping rod are used for stripping off a polyethylene protecting film, the upper polyethylene protecting film winding roller and the lower polyethylene protecting film winding roller are used for collecting the stripped upper polyethylene protecting film, the upper hot-pressing roller and the lower hot-pressing roller are vertically aligned, the heating table is used for heating a printed circuit board to which a film is to be stuck, and the heating table is arranged on the front side of the upper hot-pressing roller and the front side of the lower hot-pressing roller and is provided with a temperature sensor connected with a single-chip microcomputer. According to the machine, a traditional film sticking machine is improved, the situation that film sticking effect is affected due to the fact that temperature is too high or too low during bulk production is avoided, and film sticking efficiency is improved.
Description
Technical field
The present invention relates to the laminator of the outer dry film of a kind of printed circuit board (PCB).
Background technology
Dry film is made up of polyethylene protective film, photoresist film and Carrier polyester film three part, and application dry film can simplify the manufacturing process of printed circuit board (PCB) greatly, is conducive to realizing mechanization and automation.Pad pasting completes usually on laminator, wherein should be noted that three key factors: pressure, temperature and transfer rate.Pressure can to advance Row sum-equal matrix at pad pasting, after fixing, and transfer rate is relevant with temperature, and the impact of temperature on pad pasting effect is most important, temperature is too high, then dry film image becomes fragile resistance to plating poor performance, temperature is too low, then dry film and copper face stick loosely, and in development or electroplating process, easy tilting even comes off.Especially, when producing in enormous quantities, hot-pressing roller is difficult to provide enough heats, causes pad pasting effect not ideal enough.
Summary of the invention
For the problems referred to above, the invention provides the laminator of the outer dry film of a kind of printed circuit board (PCB), traditional laminator is improved, when avoiding producing in enormous quantities, cause too high or too low for temperature, and then affect pad pasting effect, improve pad pasting efficiency simultaneously.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the present invention is achieved through the following technical solutions:
The laminator of the outer dry film of a kind of printed circuit board (PCB), comprise support, it is characterized in that, described support is provided with the upper dry film that can be wound around dry film install roller and lower dry film install roller, for peel off the upper polyethylene protective film stripping rod of polyethylene protective film and lower polyethylene protective film stripping rod, for collect the upper polyethylene protective film wind-up roll of the polyethylene protective film peeled off and lower polyethylene protective film wind-up roll, the upper hot-pressing roller of consistency from top to bottom and lower hot-pressing roller, for heating the heating station of the printed circuit board (PCB) treating pad pasting; Upper strata dry film is successively through the side that upper dry film installs roller, upper polyethylene protective film stripping rod, upper hot-pressing roller are attached to printed circuit board (PCB), and upper polyethylene protective film wind-up roll collects the polyethylene protective film peeled off by upper polyethylene protective film stripping rod; Lower floor's dry film is successively through the opposite side that lower dry film installs roller, lower polyethylene protective film stripping rod, lower hot-pressing roller are attached to printed circuit board (PCB), and lower polyethylene protective film wind-up roll collects the polyethylene protective film peeled off by lower polyethylene protective film stripping rod; Described heating station is arranged on the front side of hot-pressing roller and lower hot-pressing roller and heating station is provided with the temperature sensor be connected with single-chip microcomputer.
Preferably, described upper hot-pressing roller and lower hot-pressing roller are all hollow structures, are provided with heater inside described upper hot-pressing roller and lower hot-pressing roller.
Preferably, described upper hot-pressing roller is also provided with inside lower hot-pressing roller the temperature sensor be connected with single-chip microcomputer.
During production in enormous quantities, can be heated in advance printed circuit board (PCB) by heating station on the one hand, by temperature sensor detected temperatures, on the other hand, the dry film being treated subsides by heater is heated in advance, and by temperature sensor detected temperatures, the too high dry film image that causes of temperature not only can be avoided to become fragile resistance to plating poor performance, or too low dry film and the copper face of causing of temperature sticks adverse consequences loosely, and heat respectively from two different carriers and detect, the time of preheating can be greatly reduced, improve pad pasting efficiency, and be heated evenly in pad pasting process, pad pasting better effects if.
The invention has the beneficial effects as follows: traditional laminator is improved, when avoiding producing in enormous quantities, cause too high or too low for temperature and affect pad pasting effect, improving pad pasting efficiency simultaneously, and be heated evenly in pad pasting process, pad pasting better effects if.
Accompanying drawing explanation
Fig. 1 is the structural representation of the laminator of the outer dry film of a kind of printed circuit board (PCB) of the present invention;
The mark implication of accompanying drawing is as follows:
1: support; 2: upper polyethylene protective film wind-up roll; 3: upper dry film installs roller; 4: upper polyethylene protective film stripping rod; 5: upper hot-pressing roller; 6: lower hot-pressing roller; 7: temperature sensor; 8: heating station; 9: lower polyethylene protective film stripping rod; 10: lower polyethylene protective film wind-up roll; 11: lower dry film installs roller.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, technical solution of the present invention is described in further detail, can better understand the present invention to make those skilled in the art and can be implemented, but illustrated embodiment is not as a limitation of the invention.
As shown in Figure 1; the laminator of the outer dry film of a kind of printed circuit board (PCB); comprise support 1, described support 1 is provided with the upper dry film that can be wound around dry film install roller 3 and lower dry film install roller 11, for peel off the upper polyethylene protective film stripping rod 4 of polyethylene protective film and lower polyethylene protective film stripping rod 9, for collect the upper polyethylene protective film wind-up roll 2 of the polyethylene protective film peeled off and lower polyethylene protective film wind-up roll 10, the upper hot-pressing roller 5 of consistency from top to bottom and lower hot-pressing roller 6, for heating the heating station 8 of the printed circuit board (PCB) treating pad pasting.
Pad pasting generally adopts continuous subsides, and upper hot-pressing roller 5 and lower hot-pressing roller 6 must consistencies from top to bottom, and printed circuit board (PCB) is sandwiched between hot-pressing roller 5 and lower hot-pressing roller 6, and pad pasting is carried out respectively in both sides, is specially:
Upper strata dry film is successively through the side that upper dry film installs roller 3, upper polyethylene protective film stripping rod 4, upper hot-pressing roller 5 are attached to printed circuit board (PCB), and upper polyethylene protective film wind-up roll 2 collects the polyethylene protective film peeled off by upper polyethylene protective film stripping rod 4.
Lower floor's dry film is successively through the opposite side that lower dry film installs roller 11, lower polyethylene protective film stripping rod 9, lower hot-pressing roller 6 are attached to printed circuit board (PCB), and lower polyethylene protective film wind-up roll 10 collects the polyethylene protective film peeled off by lower polyethylene protective film stripping rod 9.
Wherein, described heating station 8 is arranged on the front side of hot-pressing roller 5 and lower hot-pressing roller 6, it should be noted that, front side here refers to station, and in such as Fig. 1, printed circuit board (PCB) first just enters upper hot-pressing roller 5 and lower hot-pressing roller 6 through heating station 8.Heating station 8 is provided with the temperature sensor 7 be connected with single-chip microcomputer, for monitoring the temperature of printed circuit board (PCB).Preferably, temperature sensor 7 is arranged on the side of heating station 8 near upper hot-pressing roller 5 and lower hot-pressing roller 6.
Preferably, upper hot-pressing roller 5 and lower hot-pressing roller 6 are all hollow structures, and namely inside is provided with cavity, are provided with heater inside described upper hot-pressing roller 5 and lower hot-pressing roller 6.Such as, can be heater strip, for heating dry film.
Upper hot-pressing roller 5 is also provided with inside lower hot-pressing roller 6 the temperature sensor (not shown) be connected with single-chip microcomputer.Wherein, heater strip can be evenly be arranged in the shape of a spiral inside hot-pressing roller 5 and lower hot-pressing roller 6, also can be evenly be arranged in the form of a ring inside hot-pressing roller 5 and lower hot-pressing roller 6.In order to improve automation, the temperature that can also detect according to temperature sensor, the temperature utilizing single-chip microcomputer to carry out heating station 8, upper hot-pressing roller 5 and lower hot-pressing roller 6 controls.
During production in enormous quantities, can be heated in advance by heating station 8 pairs of printed circuit board (PCB)s on the one hand, by temperature sensor 7 detected temperatures, on the other hand, the dry film being treated subsides by heater is heated in advance, and by temperature sensor 7 detected temperatures, the too high dry film image that causes of temperature not only can be avoided to become fragile resistance to plating poor performance, or too low dry film and the copper face of causing of temperature sticks adverse consequences loosely, and heat respectively from two different carriers and detect, the time of preheating can be greatly reduced, improve pad pasting efficiency, and be heated evenly in pad pasting process, pad pasting better effects if.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in the technical field that other are relevant, be all in like manner included in scope of patent protection of the present invention.
Claims (7)
1. the laminator of the outer dry film of printed circuit board (PCB), comprise support (1), it is characterized in that, described support (1) is provided with the upper dry film that can be wound around dry film and roller (3) and lower dry film installation roller (11) are installed, for peeling off upper polyethylene protective film stripping rod (4) and the lower polyethylene protective film stripping rod (9) of polyethylene protective film, for collecting upper polyethylene protective film wind-up roll (2) and the lower polyethylene protective film wind-up roll (10) of the polyethylene protective film peeled off, the upper hot-pressing roller (5) of consistency from top to bottom and lower hot-pressing roller (6), for heating the heating station (8) of the printed circuit board (PCB) treating pad pasting, upper strata dry film successively through the side that upper dry film installs roller (3), upper polyethylene protective film stripping rod (4), upper hot-pressing roller (5) are attached to printed circuit board (PCB), the polyethylene protective film that the collection of upper polyethylene protective film wind-up roll (2) is peeled off by upper polyethylene protective film stripping rod (4), lower floor's dry film successively through the opposite side that lower dry film installs roller (11), lower polyethylene protective film stripping rod (9), lower hot-pressing roller (6) are attached to printed circuit board (PCB), the polyethylene protective film that the collection of lower polyethylene protective film wind-up roll (10) is peeled off by lower polyethylene protective film stripping rod (9), described heating station (8) is arranged on the front side of hot-pressing roller (5) and lower hot-pressing roller (6) and heating station (8) is provided with the temperature sensor (7) be connected with single-chip microcomputer.
2. the laminator of the outer dry film of a kind of printed circuit board (PCB) according to claim 1, is characterized in that, described temperature sensor (7) is arranged on the side of the close upper hot-pressing roller (5) of heating station (8) and lower hot-pressing roller (6).
3. the laminator of the outer dry film of a kind of printed circuit board (PCB) according to claim 1, it is characterized in that, described upper hot-pressing roller (5) and lower hot-pressing roller (6) are all hollow structures, and described upper hot-pressing roller (5) and lower hot-pressing roller (6) inner side are provided with heater.
4. the laminator of the outer dry film of a kind of printed circuit board (PCB) according to claim 3, is characterized in that, described upper hot-pressing roller (5) is also provided with lower hot-pressing roller (6) inner side the temperature sensor be connected with single-chip microcomputer.
5. the laminator of the outer dry film of a kind of printed circuit board (PCB) according to claim 3, it is characterized in that, described heater is heater strip.
6. the laminator of the outer dry film of a kind of printed circuit board (PCB) according to claim 3, is characterized in that, described heater strip is evenly arranged on hot-pressing roller (5) and lower hot-pressing roller (6) inner side in the shape of a spiral.
7. the laminator of the outer dry film of a kind of printed circuit board (PCB) according to claim 3, is characterized in that, described heater strip is evenly arranged on hot-pressing roller (5) and lower hot-pressing roller (6) inner side in the form of a ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410811405.3A CN104540324A (en) | 2014-12-24 | 2014-12-24 | Printed circuit board outer dry film sticking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410811405.3A CN104540324A (en) | 2014-12-24 | 2014-12-24 | Printed circuit board outer dry film sticking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104540324A true CN104540324A (en) | 2015-04-22 |
Family
ID=52855738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410811405.3A Pending CN104540324A (en) | 2014-12-24 | 2014-12-24 | Printed circuit board outer dry film sticking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104540324A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211616A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | Pressure technique after a kind of pad pasting producing pcb board |
| CN108811328A (en) * | 2018-05-08 | 2018-11-13 | 广东思沃精密机械有限公司 | Film laminator press mold temperature automatic adjustment equipment and automatic adjusting method |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN113427887A (en) * | 2021-08-25 | 2021-09-24 | 常州欣盛半导体技术股份有限公司 | Method for laminating sputtered film and dry film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0547327A1 (en) * | 1991-12-13 | 1993-06-23 | Somar Corporation | Film applying method and film applying apparatus |
| JP2005340595A (en) * | 2004-05-28 | 2005-12-08 | Toppan Printing Co Ltd | Vacuum laminating apparatus and forming method of insulation layer using the same |
| CN2850204Y (en) * | 2005-11-18 | 2006-12-20 | 上海华仕德电路技术有限公司 | Integrated film sticking machine |
| CN204362422U (en) * | 2014-12-24 | 2015-05-27 | 昆山元茂电子科技有限公司 | The laminator of the outer dry film of a kind of printed circuit board (PCB) |
-
2014
- 2014-12-24 CN CN201410811405.3A patent/CN104540324A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0547327A1 (en) * | 1991-12-13 | 1993-06-23 | Somar Corporation | Film applying method and film applying apparatus |
| JP2005340595A (en) * | 2004-05-28 | 2005-12-08 | Toppan Printing Co Ltd | Vacuum laminating apparatus and forming method of insulation layer using the same |
| CN2850204Y (en) * | 2005-11-18 | 2006-12-20 | 上海华仕德电路技术有限公司 | Integrated film sticking machine |
| CN204362422U (en) * | 2014-12-24 | 2015-05-27 | 昆山元茂电子科技有限公司 | The laminator of the outer dry film of a kind of printed circuit board (PCB) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211616A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | Pressure technique after a kind of pad pasting producing pcb board |
| CN108811328A (en) * | 2018-05-08 | 2018-11-13 | 广东思沃精密机械有限公司 | Film laminator press mold temperature automatic adjustment equipment and automatic adjusting method |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN112020233B (en) * | 2020-08-28 | 2021-11-05 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN113427887A (en) * | 2021-08-25 | 2021-09-24 | 常州欣盛半导体技术股份有限公司 | Method for laminating sputtered film and dry film |
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Application publication date: 20150422 |
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| RJ01 | Rejection of invention patent application after publication |