CN209453571U - A kind of robot - Google Patents
A kind of robot Download PDFInfo
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- CN209453571U CN209453571U CN201821928915.9U CN201821928915U CN209453571U CN 209453571 U CN209453571 U CN 209453571U CN 201821928915 U CN201821928915 U CN 201821928915U CN 209453571 U CN209453571 U CN 209453571U
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- wafer
- pallet
- robot
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- distance sensor
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Abstract
The utility model relates to technical field of semiconductors more particularly to a kind of robot, it is applied to transport wafer;Wherein, comprising: pallet is used for support wafer;First distance sensor is set to the front end of pallet, the distance of the object in front of wafer for sensing pallet support;The case where wafer of transport, can be monitored, avoid carrying out damaged in collision wafer with collision object during transporting wafer, ensure that the reliable of the automatic operating that wafer is transported and processed.
Description
Technical field
The utility model relates to technical field of semiconductors more particularly to a kind of robots.
Background technique
Robot is in semiconductor automation equipment using very extensive.Using robot, may be implemented to transport wafer
Automation, can adapt to wafer production, the processing request of industrial mass.
But now widely used robot is usually to fix wafer by circlip or vacuum.It is transported in robot
In capable process, it can deviate with wafer if the data of control robot operation have the case where losing, if robot original
Running track.If it find that not in time, it is easy to the damage for causing wafer, the case where may also result in wafer loss when serious
Even there is production accident.
Utility model content
In response to the above problems, the present invention proposes a kind of robot, it is applied to transport wafer, wherein include:
Pallet is used for support wafer;
First distance sensor is set to the front end of the pallet, before the wafer for sensing the pallet support
The distance of the object of side.
Above-mentioned robot, wherein the front end of the pallet offers the first groove, and the first distance sensor is embedded
In first groove.
Above-mentioned robot, wherein further include:
A plurality of second distance sensors, are laid on the support face of the pallet, for sense the wafer with it is described
The distance between support face.
Above-mentioned robot, wherein the upper surface of the pallet offers the second groove, and the second distance sensor is embedding
In second groove.
Above-mentioned robot, wherein a plurality of second distance sensors are uniformly distributed on the support face.
Above-mentioned robot, wherein the quantity of second distance sensor is 3.
Above-mentioned robot, wherein 3 second distance sensors equidistantly distributed between any two.
Above-mentioned robot, wherein further include:
Motor execution component;
Processor is separately connected each range sensor;
Controller is separately connected the processor and the Motor execution component.
Above-mentioned robot, wherein the Motor execution component is motor.
Above-mentioned robot, wherein the first distance sensor is laser range sensor.
The utility model has the advantages that the utility model proposes a kind of robot, the case where wafer of transport, can be monitored, be kept away
Exempt to carry out damaged in collision wafer with collision object during transporting wafer, ensure that the automatic operating that wafer is transported and processed
It is reliable.
Detailed description of the invention
Fig. 1 is the schematic side view of robot in an embodiment of the present invention;
Fig. 2 is the schematic top plan view of robot in an embodiment of the present invention.
Specific embodiment
The utility model is further described with reference to the accompanying drawings and examples.
In a preferred embodiment, it as shown in Figure 1, proposing a kind of robot, can be applied to transport wafer,
In, may include:
Pallet 10 is used for support wafer;
First distance sensor 21 is set to the front end of pallet 10, the object in front of wafer for sensing 10 support of pallet
The distance of body.
In above-mentioned technical proposal, pallet 10 may include each mechanical part for forming robot, such as carrying crystalline substance
Round horizontal platform and the card slot etc. for fixing wafer;The quantity of first distance sensor 21 in one robot is generally
One, in other cases, multiple first distance sensors 21 can be set in a robot, also to feel in a plurality of directions
Ranging from;When detected there are first distance sensor 21 on the transport track of wafer in the presence of may collide object when, this first away from
From the movement that the signal that sensor 21 acquires should be timely responded to simultaneously stop in time robot.
In a preferred embodiment, the front end of pallet 10 offers the first groove, and first distance sensor 21 can be with
It is embedded in the first groove.
In above-mentioned technical proposal, when first distance sensor 21 has multiple, each first distance sensor 21 can be right
Answer first groove.
As shown in Fig. 2, in a preferred embodiment, can also include:
Several second distance sensors 22, can be laid on the support face of pallet 10, for sensing wafer and support face
The distance between.
In above-mentioned technical proposal, second distance sensor 22 can be used for detecting the posture of the wafer carried on pallet 10
And/or position should stop the operation of robot when detecting wafer run-off the straight or fall the case where.
In above-described embodiment, it is preferable that the upper surface of pallet 10 offers the second groove, and second distance sensor 22 can be with
It is embedded in the second groove.
In above-described embodiment, it is preferable that a plurality of second distance sensors 22 may be uniformly distributed on support face.
In above-described embodiment, it is preferable that the quantity of second distance sensor 22 can be 3, in other cases, can also
The second distance sensor 22 of other quantity to be arranged according to actual selection.
In above-described embodiment, it is preferable that 3 second distance sensors 22 equidistantly distributed between any two.
In above-mentioned technical proposal, the center of wafer can be Chong Die with the center of 3 second distance sensors 22 as far as possible.
In above-mentioned technical proposal, second distance sensing is arranged for detecting in above-mentioned second distance sensor 22 on support face
Vertical range between the point and wafer of device 22.Only when the vertical range that 3 second distance sensors 22 detect is consistent,
Just thinking wafer, there is no inclinations at this time.In other words, as long as the vertical range that 3 second distance sensors 22 detect exists
It is inconsistent, then it represents that wafer is tilted relative to support face, and the movement of robot at this time should be stopped in time, to avoid in crystalline substance
Carrying out subsequent operation in the inclined situation of circle causes wafer to be damaged.
Further, if robot transports wafer by the way of clamping, in addition to needing to guarantee above-mentioned 3 second distances
It is consistent that sensor 22 detects obtained vertical range, it is also necessary to guarantee that 3 vertical ranges are 0, that is, guarantee that wafer is that level is put
It sets on support face, otherwise equally stops the movement of robot.
In a preferred embodiment, can also include:
Motor execution component;
Processor is separately connected each range sensor;
Controller is separately connected processor and Motor execution component.
In above-mentioned technical proposal, processor can receive and the feelings of the distance signal according to the acquisition of first distance sensor 21
Condition, analysis, which obtains wafer, 10 front end of pallet and may collide at a distance from object, if finding wafer and may collide at a distance from object
When foreshortening to preset threshold or less, then corresponding processing result can be sent into controller, controller at this time can be according to place
Reason result controls Motor execution component, such as the operation of stop motion execution unit, to avoid wafer and may touch
Hit object collision.
In above-described embodiment, it is preferable that Motor execution component can be motor etc..
In a preferred embodiment, first distance sensor 21 can be laser range sensor, in other feelings
Under condition, other kinds of range sensor can also be used.
In a preferred embodiment, first distance sensor 21 can be imaging sensor, in the other cases,
Other kinds of range sensor can also be used.
In conclusion the utility model proposes a kind of robot, the case where wafer of transport, can be monitored, be kept away
Exempt to carry out damaged in collision wafer with collision object during transporting wafer, ensure that the automatic operating that wafer is transported and processed
It is reliable.
By description and accompanying drawings, the exemplary embodiments of the specific structure of specific embodiment are given, it is practical new based on this
Type spirit, can also make other conversions.Although above-mentioned utility model proposes existing preferred embodiment, however, these contents
It is not intended as limiting to.
For a person skilled in the art, after reading above description, various changes and modifications undoubtedly be will be evident.
Therefore, appended claims should regard whole variations and modifications of the true intention and range that cover the utility model as.
The range and content of any and all equivalences in Claims scope are all considered as still belonging to the intention and model of the utility model
In enclosing.
Claims (9)
1. a kind of robot is applied to transport wafer characterized by comprising
Pallet is used for support wafer;
First distance sensor is set to the front end of the pallet, in front of the wafer for sensing the pallet support
The distance of object;
Motor execution component;
Processor is separately connected each first distance sensor;
Controller is separately connected the processor and the Motor execution component.
2. robot according to claim 1, which is characterized in that the front end of the pallet offers the first groove, described
First distance sensor is embedded in first groove.
3. robot according to claim 1, which is characterized in that further include:
A plurality of second distance sensors, are laid on the support face of the pallet, for sensing the wafer and the support
The distance between face.
4. robot according to claim 3, which is characterized in that the upper surface of the pallet offers the second groove, institute
Second distance sensor is stated to be embedded in second groove.
5. robot according to claim 3, which is characterized in that a plurality of second distance sensors are uniformly distributed in
On the support face.
6. robot according to claim 3, which is characterized in that the quantity of second distance sensor is 3.
7. robot according to claim 6, which is characterized in that between 3 second distance sensors are equal between any two
Away from distribution.
8. robot according to claim 1, which is characterized in that the Motor execution component is motor.
9. robot according to claim 1, which is characterized in that the first distance sensor is laser ranging sensing
Device.
Priority Applications (1)
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CN201821928915.9U CN209453571U (en) | 2018-11-21 | 2018-11-21 | A kind of robot |
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CN201821928915.9U CN209453571U (en) | 2018-11-21 | 2018-11-21 | A kind of robot |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112340444A (en) * | 2020-11-27 | 2021-02-09 | 南京宏典园林工程有限公司 | Flexible feeding and discharging mechanism of transfer robot |
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2018
- 2018-11-21 CN CN201821928915.9U patent/CN209453571U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112340444A (en) * | 2020-11-27 | 2021-02-09 | 南京宏典园林工程有限公司 | Flexible feeding and discharging mechanism of transfer robot |
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