CN209434185U - Power supply chip encapsulating structure - Google Patents
Power supply chip encapsulating structure Download PDFInfo
- Publication number
- CN209434185U CN209434185U CN201920284989.1U CN201920284989U CN209434185U CN 209434185 U CN209434185 U CN 209434185U CN 201920284989 U CN201920284989 U CN 201920284989U CN 209434185 U CN209434185 U CN 209434185U
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- Prior art keywords
- power supply
- supply chip
- chip
- electrode
- metal frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a kind of power supply chip encapsulating structures, including conductive metal frames, it is transversely arranged in the conductive metal frames to have power supply chip and control chip, conductive bond material is covered between the power supply chip and conductive metal frames, and conductive bond material electrode is provided with above the power supply chip, the source electrode of the power supply chip and let out extremely by forked type conduction rack with conductive bond material electrode is electrical engages, the control chip carries out electrical engagement by plain conductor and each electrode of conductive metal frames, and the control chip is electrically engaged by plain conductor with power supply chip gate contact.The utility model reduces package area since power supply chip and control chip are transversely arranged, and in addition to reducing packaging cost, circuit system plate suqare also can substantially reduce, overall cost decline.
Description
Technical field
The utility model relates to chip encapsulation technology fields, and in particular to a kind of power supply chip encapsulating structure.
Background technique
Power supply chip is the necessary devices of most electronic equipments.Power supply chip needs to provide electricity to each road modular circuit
Pressure, power supply chip can generate a large amount of heat, if heat dissipation is bad, hot environment can make each module being connected on power supply chip
Electromagnetic interference is generated between circuit, each modular circuit signal frequency reduces, to various problems occur, for example, electronic equipment can go out
The problems such as picture that existing display screen show suspends, and electronic equipment can not wake up, constantly restart, especially when not having in electronic equipment
When protecting circuit, it is also possible to damage circuit power chip.So how to improve the effect of power supply chip heat dissipation, electronics is produced
Product are particularly significant.
Existing power supply chip encapsulating structure can not carry out longitudinal extension, cause package area big, packaging cost is high
Problem.
Utility model content
The purpose of this utility model is to provide a kind of power supply chip encapsulating structures, solve existing power supply chip encapsulation knot
Structure can not carry out longitudinal extension, cause package area big, the high problem of packaging cost.
In order to solve the above technical problems, the utility model uses following technical scheme:
A kind of power supply chip encapsulating structure, including conductive metal frames, it is transversely arranged in the conductive metal frames to have power supply core
Piece and control chip, are covered with conductive bond material, and the power supply chip is upper between the power supply chip and conductive metal frames
Side is provided with conductive bond material electrode, the source electrode of the power supply chip and lets out extremely electric by forked type conduction rack and conductive bond material
Extremely electrically engagement, the control chip carry out electrical engagement, and the control by plain conductor and each electrode of conductive metal frames
Coremaking piece is electrically engaged by plain conductor with power supply chip gate contact.
Preferably, being provided with the second conductive bond material between control chip and the conductive metal frames, and the control
The electrode of the second conductive bond material is provided with above chip, each electrode of the conductive metal frames passes through plain conductor and control
The electrode of the second conductive bond material on chip electrically engages.
Preferably, the conductive bond material electrode covered on power supply chip is set in distance, and the power supply chip door
Polar contact is positioned close at the position of control chip.
Preferably, the forked type conduction rack is to connect multiple vertical electric conduction framves by a transverse conductance frame to constitute, it is described
Transverse conductance frame is connected on the conductive bond material in conductive metal frames, and the vertical electric conduction frame is connected to leading on power supply chip
It electrically engages material electrode and is corresponded with the electrode on the conductive bond material.
A kind of power supply chip encapsulating structure, including conductive metal frames, it is transversely arranged in the conductive metal frames to have power supply core
Piece and control chip, are covered with conductive bond material, and the power supply chip is upper between the power supply chip and conductive metal frames
Side is provided with the electrode of conductive bond material, the source electrode of the power supply chip and lets out extremely by forked type conduction rack and conductive bond material
Electrode electrically engage, the control chip is engaged by the way that branch electrical property engagement protrusion and conductive metal frames are electrical.
Preferably, the branch electrical property engagement protrusion of the control beneath chips passes through power supply chip gate pole electric lead and electricity
The connection of source chip gate contact.
Preferably, the electrode of the conductive bond material covered on power supply chip is set in distance, and the power supply chip
Gate contact is positioned close at the position of control chip.
Preferably, the forked type conduction rack is to connect multiple vertical electric conduction framves by a transverse conductance frame to constitute, it is described
Transverse conductance frame is connected on the conductive bond material in conductive metal frames, and the vertical electric conduction frame is connected to leading on power supply chip
It electrically engages material electrode and is corresponded with the electrode on the conductive bond material.
Compared with prior art, the utility model has the beneficial effects that
The utility model is the encapsulating structure of low-cost and high-performance power supply chip module, carries power supply by a conductive metal frames
Chip and control chip, power supply chip are made electrically through forked type conduction rack and the external junction of conductive metal frames with conductive bond
Engagement.Can the arrange in pairs or groups chip of other function of control chip is longitudinally placed in one end of power supply chip side by side, and power supply chip can be according to
The demand of electrical characteristic and function longitudinally extends, and can continue to use original plastic package die in encapsulation and reduce fixed capital and throw
Enter；Simultaneously because power supply chip and control chip are transversely arranged, package area is reduced, in addition to reducing packaging cost, system electricity
Road plate suqare also can substantially reduce, overall cost decline.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the first embodiment of the utility model.
Fig. 2 is the structural schematic diagram of second of embodiment of the utility model.
Fig. 3 is the schematic diagram of the section structure of second of embodiment of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Referring to Fig. 1, for one embodiment of the utility model, a kind of power supply chip encapsulating structure, including metal are led
Coil holder 1, it is transversely arranged in the conductive metal frames 1 to have power supply chip 2 and control chip 3, the power supply chip 2 and plain conductor
Conductive bond material 4 is covered between frame 1, and the top of the power supply chip 2 is provided with conductive bond material electrode 6, the power supply
The source electrode of chip 2 and letting out extremely is engaged by 6 electrical property of forked type conduction rack 5 and conductive bond material electrode, and the control chip 3 passes through
Plain conductor 7 and each electrode of conductive metal frames 1 carry out electrical engagement, and the control chip 3 passes through plain conductor 7 and power supply
The electrically engagement of chip gate contact 8.
It is provided with the second conductive bond material 9 between the control chip 3 and conductive metal frames 1, and the control chip 3
Top is provided with the electrode of the second conductive bond material 9, and each electrode of the conductive metal frames 1 passes through plain conductor 7 and control core
The electrode of the second conductive bond material 9 on piece 3 electrically engages.
The conductive bond material electrode 6 covered on power supply chip 2 is set in distance, and the power supply chip gate contact 8
It is positioned close at the position of control chip 3.
The forked type conduction rack 5 is to connect multiple vertical electric conduction framves 52 by a transverse conductance frame 51 to constitute, the transverse direction
Conduction rack 51 is connected on the conductive bond material 4 in conductive metal frames 1, and the vertical electric conduction frame 52 is connected on power supply chip 2
Conductive bond material electrode 6 and on the conductive bond material 4 electrode correspond.
Referring to fig. 2,3, for another embodiment of the utility model, a kind of power supply chip encapsulating structure, including metal
Lead frame 1, transversely arranged in the conductive metal frames 1 to have power supply chip 2 and control chip 3, the power supply chip 2 is led with metal
Conductive bond material 4 is covered between coil holder 1, and the top of the power supply chip 2 is provided with conductive bond material electrode 6, the electricity
The source electrode of source chip 2 and letting out extremely electrically is engaged by forked type conduction rack 5 and conductive bond material electrode 5, and the control chip 3 leads to
It crosses branch electrical property engagement protrusion 10 and is electrically engaged with conductive metal frames 1.
The branch electrical property engagement protrusion 10 of 3 lower section of control chip passes through power supply chip gate pole electric lead and power supply chip
Gate contact 8 connects.
The conductive bond material electrode 6 covered on power supply chip 2 is set in distance, and the power supply chip gate contact 8
It is positioned close at the position of control chip 3.
The forked type conduction rack 5 is to connect multiple vertical electric conduction framves 52 by a transverse conductance frame 51 to constitute, the transverse direction
Conduction rack 51 is connected on the conductive bond material 4 in conductive metal frames 1, and the vertical electric conduction frame 52 is connected on power supply chip 2
Conductive bond material electrode 6 and on the conductive bond material 4 electrode correspond.
In the utility model power supply chip with control chip in transversely arranged and power supply chip source electrode and let out extremely respectively with
One symmetrical forked type conduction rack is made electrically to be combined with the binding site of conductive metal frames with conductive bond material, controls chip with metal
Conducting wire is electrically connected with the electrical node of lead frame.
The utility model be low-cost and high-performance power supply chip module encapsulation, by a conductive metal frames carry power supply chip and
Chip is controlled, power supply chip is made electrically to engage with the external junction of lead frame through metallic conduction frame with conductive bond.
The key of the utility model be power supply chip with control chip at transversely arranged, and power supply chip source electrode and
Let out and extremely respectively make electrically engage with conductive bond material with a symmetrical forked type conduction rack and the junction of lead frame, control chip with
Plain conductor is electrically connected with each electrode contact of lead frame.
Control new film can also electrically be fitted on lead frame in a manner of chip package.
Can the arrange in pairs or groups chip of other function of above-mentioned control chip is longitudinally placed in one end of power supply chip side by side.
The significance of the utility model is that power supply chip can longitudinally extend according to the demand of electrical characteristic and function, is being sealed
Original plastic package die can be continued to use and reduce fixed capital investment by loading onto, and newly-designed change can be rapidly completed.While by
Package area is reduced in transversely arranged, in addition to reducing packaging cost, circuit system plate suqare also can substantially reduce, overall cost
Decline.This encapsulation is most suitable for the module application of gallium nitride power supply chip.
" one embodiment ", " another embodiment ", " embodiment ", " preferred implementation spoken of in the present specification
Example " etc., referring to combining specific features, structure or the feature of embodiment description includes describing extremely in the application generality
In few one embodiment.It is not centainly to refer to the same embodiment that statement of the same race, which occur, in multiple places in the description.Into one
For step, when describing a specific features, structure or feature in conjunction with any embodiment, what is advocated is to combine other implementations
Example realizes that this feature, structure or feature are also fallen in the scope of the utility model.
Although reference be made herein to the utility model is described in multiple explanatory embodiments of the utility model, still,
It should be understood that those skilled in the art can be designed that a lot of other modification and implementations, these modifications and implementations
It will fall within scope and spirit disclosed in the present application.More specifically, it discloses in the application, drawings and claims
In range, can building block to theme combination layout and/or layout carry out a variety of variations and modifications.In addition to building block
And/or outside the modification and improvement of layout progress, to those skilled in the art, other purposes also be will be apparent.
Claims (8)
1. a kind of power supply chip encapsulating structure, it is characterised in that: horizontal on the conductive metal frames (1) including conductive metal frames (1)
To power supply chip (2) and control chip (3) is arranged with, conduction is covered between the power supply chip (2) and conductive metal frames (1)
It engages material (4), and is provided with conductive bond material electrode (6) above the power supply chip (2), the source of the power supply chip (2)
Pole and letting out extremely is engaged by the way that forked type conduction rack (5) and conductive bond material electrode (6) are electrical, and the control chip (3) passes through gold
Each electrode for belonging to conducting wire (7) and conductive metal frames (1) carries out electrical engagement, and the control chip (3) passes through plain conductor (7)
It is electrically engaged with power supply chip gate contact (8).
2. power supply chip encapsulating structure according to claim 1, it is characterised in that: the control chip (3) is led with metal
It is provided with the second conductive bond material (9) between coil holder (1), and is provided with the second conductive bond above the control chip (3)
Each electrode of the electrode of material (9), the conductive metal frames (1) by plain conductor (7) and controls the second conduction on chip (3)
The electrode for engaging material (9) electrically engages.
3. power supply chip encapsulating structure according to claim 1, it is characterised in that: the conduction covered on power supply chip (2)
Engagement material electrode (6) is set in distance, and the power supply chip gate contact (8) is positioned close to the position of control chip (3)
Set place.
4. power supply chip encapsulating structure according to claim 3, it is characterised in that: the forked type conduction rack (5) is by one
Transverse conductance frame (51) connects what multiple vertical electric conduction framves (52) were constituted, and the transverse conductance frame (51) is connected to conductive metal frames
(1) on the conductive bond material (4) on, the vertical electric conduction frame (52) is connected to the conductive bond material electrode on power supply chip (2)
(6) and with the electrode on the conductive bond material (4) it corresponds.
5. a kind of power supply chip encapsulating structure, it is characterised in that: horizontal on the conductive metal frames (1) including conductive metal frames (1)
To power supply chip (2) and control chip (3) is arranged with, conduction is covered between the power supply chip (2) and conductive metal frames (1)
It engages material (4), and is provided with conductive bond material electrode (6) above the power supply chip (2), the source of the power supply chip (2)
Pole and letting out extremely is engaged by the way that forked type conduction rack (5) and conductive bond material electrode (6) are electrical, and the control chip (3) passes through branch
Electrical engagement protrusion (10) electrically engages with conductive metal frames (1).
6. power supply chip encapsulating structure according to claim 5, it is characterised in that: the branch below control chip (3)
Electrical engagement protrusion (10) is connect by power supply chip gate pole electric lead with power supply chip gate contact (8).
7. power supply chip encapsulating structure according to claim 5, it is characterised in that: the conduction covered on power supply chip (2)
Engagement material electrode (6) is set in distance, and the power supply chip gate contact (8) is positioned close to the position of control chip (3)
Set place.
8. power supply chip encapsulating structure according to claim 7, it is characterised in that: the forked type conduction rack (5) is by one
Transverse conductance frame (51) connects what multiple vertical electric conduction framves (52) were constituted, and the transverse conductance frame (51) is connected to conductive metal frames
(1) on the conductive bond material (4) on, the vertical electric conduction frame (52) is connected to the conductive bond material electrode on power supply chip (2)
(6) and with the electrode on the conductive bond material (4) it corresponds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920284989.1U CN209434185U (en) | 2019-02-28 | 2019-02-28 | Power supply chip encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920284989.1U CN209434185U (en) | 2019-02-28 | 2019-02-28 | Power supply chip encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209434185U true CN209434185U (en) | 2019-09-24 |
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ID=67978380
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920284989.1U Active CN209434185U (en) | 2019-02-28 | 2019-02-28 | Power supply chip encapsulating structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN209434185U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109742069A (en) * | 2019-02-28 | 2019-05-10 | 深圳市泰德半导体有限公司 | Power supply chip encapsulating structure |
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2019
- 2019-02-28 CN CN201920284989.1U patent/CN209434185U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109742069A (en) * | 2019-02-28 | 2019-05-10 | 深圳市泰德半导体有限公司 | Power supply chip encapsulating structure |
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