CN209402827U - A kind of circuit board and electronic equipment - Google Patents

Abstract

The utility model discloses a kind of circuit board, including first line layer and at least one layer of second line layer, it is provided with connection sheet on the side wall of circuit board, is realized and is electrically connected by the connection sheet between first line layer and the second line layer.In the embodiments of the present invention, by the connection sheet being arranged on the side wall of circuit board, electric connection between Lai Shixian first line layer and the second line layer, the space of occupancy circuit board that can be less, and circuit board has the advantages of simple structure and easy realization.Which also discloses a kind of electronic equipments comprising foregoing circuit plate.

Description

A kind of circuit board and electronic equipment

Technical field

The utility model relates to circuit board design techniques fields, more specifically, the utility model relates to a kind of circuit board and Electronic equipment.

Background technique

Circuit board is divided into single sided board, dual platen and multi-layer board if dividing by the route number of plies.On single sided board, part is concentrated One side, conducting wire then concentrate on another side wherein.Because conducting wire be only present in wherein one side, just claim this circuit board Make single sided board.Dual platen is the extension of single sided board, when single layer wiring cannot meet electronic product when needing it is two-sided it is necessary to use Plate.It is two-sided have cover copper and have cabling, and the route between two layers of line layer can be connected by plated-through-hole, be allowed to be formed Required network connection.Multi-layer board refers to that the line layer with three layers or more is pressed with dielectric layer therebetween, and therebetween The circuit board that conductive pattern interconnects as required.Multilayer circuit board is electronic information technology to high speed, multi-functional, large capacity, small The product that volume, slimming, lightweight direction are developed.

If circuit board is divided by characteristic, it can be divided into soft board (FPC), hardboard (PCB), Rigid Flex (FPCB).

For narrower width, and the multilayer circuit board that thickness is thicker, if realized between line layer by plated-through-hole It is electrically connected, the more occupancy circuit board space of meeting.Moreover, also making the manufacture difficulty of multilayer circuit board larger.

Utility model content

One purpose of the utility model is to provide a kind of new solution of circuit board.

It is according to the present utility model in a first aspect, provide a kind of circuit board, including first line layer and at least one layer of the Two line layers are provided with connection sheet on the side wall of the circuit board, lead between the first line layer and second line layer It crosses the connection sheet and realizes electric connection.

Optionally, there is the surface of indent, the connection sheet is fitted in the table of the indent on the side wall of the circuit board On face.

It optionally, include at least one layer of signals layer at least one layer of second line layer, on the first line layer Be provided with the first pad and the second pad for connecting component, be provided on the side wall of the circuit board the first connection sheet and Second connection sheet is provided with signal wire on at least one layer signals layer, first pad by first connection sheet and The signal wire, which is realized, to be electrically connected；Second pad, which is realized by second connection sheet with the signal wire, electrically to be connected It connects.

Optionally, also set up that there are two be respectively used to connect first connection sheet and described the on second line layer The tie point of two connection sheets, the signal wire are connected between two tie points.

Optionally, at least one layer of second line layer be at least double-layer structure when, second line layer further include to Few one layer of stratum, at least one layer signals layer are arranged alternately at least one layer of formation interval；On the first line layer It is provided with the first ground wire；The second ground wire is provided on at least one layer stratum；It is provided at least on the side wall of the circuit board One third connection sheet realizes electricity by least one described third connection sheet between first ground wire and second ground wire Property connection.

Optionally, at least three third connection sheets are provided on the side wall of the circuit board, at least three third connects Contact pin is uniformly arranged on the side wall.

Optionally, the shape of cross section of the connection sheet on the direction perpendicular to the side wall is arc, U-shaped, V-arrangement Or waveform.

Optionally, the connection sheet is arranged on the side wall of the circuit board by way of plating.

Optionally, the circuit board includes at least one layer of is arranged between the first line layer and second line layer Dielectric layer.

Optionally, the connection sheet is formed as the plated-through-hole cutting and of the circuit board described in at least through part.

Optionally, the connection sheet is formed by being cut by laser the plated-through-hole.

Second aspect according to the present utility model provides a kind of electronic equipment, including according to the utility model first party Circuit board described in face.

One beneficial effect of the utility model is, passes through the connection sheet being arranged on the side wall of circuit board, Lai Shixian Electric connection between first line layer and the second line layer, the space of occupancy circuit board that can be less, and the knot of circuit board Structure is simple, it is easy to accomplish.

By the detailed description referring to the drawings to the exemplary embodiment of the utility model, the utility model it is other Feature and its advantage will become apparent.

Detailed description of the invention

It is combined in the description and the attached drawing for constituting part of specification shows the embodiments of the present invention, and And together with its explanation for explaining the principles of the present invention.

Fig. 1 is a kind of structural schematic diagram of implementation structure of the circuit board provided in the utility model one embodiment；

Fig. 2 is the main view of circuit board in an example；

Fig. 3 a~Fig. 3 g is the schematic diagram of each line layer in circuit board shown in Fig. 2；

Fig. 4 is the schematic layout pattern of the first line layer provided in the utility model one embodiment；

Fig. 5 is the main view of the circuit board obtained after the cutting that provides in the utility model one embodiment.

Description of symbols:

100- circuit board；110- first line layer；

The second line layer of 120-；200- connection sheet；

111,113, the first pad of 115-；112,114, the second pad of 116-；

The first ground wire of 117-；131,151, the second ground wire of 171-；

121,141,161- signal wire；1000- primary circuit board；

300- plated-through-hole；The boundary line of 400- circuit board；

122,123,142,143,162,163- tie point.

Specific embodiment

The various exemplary embodiments of the utility model are described in detail now with reference to attached drawing.It should also be noted that unless another It illustrates outside, the component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited The scope of the utility model processed.

Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to this is practical Novel and its application or any restrictions used.

Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable In the case of, the technology, method and apparatus should be considered as part of specification.

It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without It is as limitation.Therefore, other examples of exemplary embodiment can have different values.

It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.

The utility model provides a kind of circuit board 100, as shown in Figure 1, including first line layer 110 and at least one layer of the Two line layers 120.Specifically, circuit board 100 can be including at least two layers of line layer, it can be wiring board, be also possible to Multilayer circuit board.

Specifically, circuit board 100 may include at least one layer of setting first line layer 110 and the second line layer 120 it Between dielectric layer.

In the case where only including one layer of dielectric layer between first line layer 110 and the second line layer 120, first line layer 110 and second line layer 120 can be adjacent line layer.

In the case where including multilayer dielectricity layer between first line layer 110 and the second line layer 120, due to arbitrary neighborhood It can have line layer between two layers of dielectric layer, therefore, can also be wrapped between first line layer 110 and the second line layer 120 Include All other routes layer.

Connection sheet 200 is provided on the side wall of circuit board 100, first line layer 110 and the second line layer 120 pass through connection Piece 200, which is realized, to be electrically connected.Connector 200 is conductive material, such as can be the metals such as silver, copper or gold, is also possible to nickel gold The alloys such as alloy.

In one example, connection sheet 200, which can be, is arranged in by welding on the side wall of circuit board 100.

In another example, connection sheet 200, which can also be, is arranged on the side wall of circuit board 100 by way of plating 's.Plating is exactly the technique for making the attachment layer of metal film on the side wall of circuit board 100 using electrolysis.Pass through the side of plating Connection sheet 200 is arranged in formula, and implementation is relatively simple, furthermore, it is possible to make first line layer 110 and the second line layer 120 Between realize that the qualification rate of electric connection is higher.

For the circuit board of narrower width, if realizing first line layer 110 and the second line by common plated-through-hole Electric connection between road floor 120, manufacture difficulty and accuracy will increase.

And pass through the connection sheet 200 being arranged on the side wall of circuit board 100, Lai Shixian first line layer in the utility model 110 and the second electric connection between line layer 120, the space of occupancy circuit board that can be less, and structure is simple, is easy to real It is existing.

In one example, as shown in Figure 1, with the surface of indent, the fitting of connection sheet 200 on the side wall of circuit board 100 On the surface of indent.

In the case where connection sheet 200 is on the side wall for be arranged in by way of plating circuit board 100, if pass through by Connection sheet 200 is fitted on the surface of indent, can be carried out on the surface of indent plating form connection sheet 200.In this way, can Specific location accurately to determine connection sheet 200 and the size on side wall.

In one example, the first pad and second for connecting component can be set on first line layer 110 Pad.The first connection sheet and the second connection sheet are provided on the side wall of circuit board.First pad and the second pad can be by setting It sets the either ground wire of the signal wire on the second line layer and realizes electric connection.First pad can be by the first connection sheet with On second line layer corresponding signal wire either ground wire realize be electrically connected, the second pad can be by the second connection sheet with Corresponding signal wire either ground wire, which is realized, on second line layer is electrically connected.

Fig. 2 is the main view of circuit board 100 in an example.Circuit board shown in Fig. 2 can be 7 laminates, i.e. the circuit Plate includes 7 sandwich circuit layers, can be respectively as shown in Fig. 3 a~Fig. 3 g.Wherein, Fig. 3 a is the signal of the example of first layer line layer Figure, Fig. 3 b are the schematic diagram of the example of second layer line layer, and Fig. 3 c is the schematic diagram of the example of third layer line layer, and Fig. 3 d is the The schematic diagram of the example of four sandwich circuit layers, Fig. 3 e are the schematic diagram of the example of layer 5 line layer, and Fig. 3 f is layer 6 line layer Example schematic diagram, Fig. 3 g be layer 7 line layer example schematic diagram.

It, can be using first layer line layer shown in Fig. 3 a as First Line in the embodiment as shown in Fig. 2, Fig. 3 a~Fig. 3 g Road floor 110, using All other routes layer described in Fig. 3 b~Fig. 3 g as the second line layer 120.

Specifically, may include at least one layer of signals layer in the second line layer 120.As shown in Fig. 2, Fig. 3 a~Fig. 3 g In embodiment, signals layer 120-1,120-2,120-3 may include in the second line layer 120.

As shown in Fig. 2, Fig. 3 a and Fig. 3 b, the first weldering for connecting component can be set on first line layer 110 Disk 111 and the second pad 112 are provided with the first connection sheet 200-1 and the second connection sheet 200-2 (figure on the side wall of circuit board 100 In be not shown), signal wire 121 is provided on signals layer 120-1, the first pad 111 passes through the first connection sheet 200-1 and signal wire 121 realize electric connection.Second pad 112 is realized by the second connection sheet 200-2 and signal wire 121 and is electrically connected.In this way, the One pad 111 and the second pad 112 can pass through the signal in two connection sheets 200-1,200-2 and the second line layer 120 Line 121, which is realized, to be electrically connected.Wherein, connection sheet 200-1 and connection sheet 200-2 can be connects with the different location of signal wire 121 It connects.200 wherein, and the shape of the second pad 112 can be identical as the shape of the first pad 111, can also be different, the disclosure is simultaneously It is not limited.

Since signal wire 121 may be relatively thin, connected between signal wire 121 and connection sheet 200-1,200-2 to improve Reliability is also provided with two tie points 122 and 123 for being respectively used to two connection sheets of connection on the second line layer 120. Signal wire 121 is connected between tie point 122 and 123.Signal wire is connect by tie point 122 with connection sheet 200-1, and company is passed through Contact 123 is connect with connection sheet 200-2.The width of tie point 122 and 123 may be greater than the width of signal wire 121.

As shown in Fig. 2, Fig. 3 a and Fig. 3 d, the first pad 113 and the second pad 114 are additionally provided on first line layer 110, Signal wire 141 is provided on signals layer 120-2.First pad 113 realizes electricity by the first connection sheet 200-3 and signal wire 141 Property connection.Second pad 114 is realized by the second connection sheet 200-4 and signal wire 141 and is electrically connected.First connection sheet 200-3 It can be with the second connection sheet 200-4 and connect with the different location of signal wire 141.

Connect between signal wire 141 and the first connection sheet 200-3 (not shown), the second connection sheet 200-4 to improve The reliability connect is also provided with two and is respectively used to two connections of connection as shown in Fig. 2 and Fig. 3 d on signals layer 120-2 The tie point 142 and 143 of piece 200-3,200-4.Signal wire 141 is connected between tie point 142 and 143.Signal wire 141 passes through Tie point 142 is connect with the first connection sheet 200-3, is connect by tie point 143 with the second connection sheet 200-4.142 He of tie point 143 width may be greater than the width of signal wire 141.

As shown in Fig. 2, Fig. 3 a and Fig. 3 f, the first pad 115 and the second pad 116 are additionally provided on first line layer 110, Signal wire 161 is provided on signals layer 120-3.First pad 115 realizes electricity by the first connection sheet 200-5 and signal wire 161 Property connection.Second pad 116 is realized by the second connection sheet 200-6 and signal wire 161 and is electrically connected.First connection sheet 200-5 It can be with the second connection sheet 200-6 and connect with the different location of signal wire 161.

In order to improve the reliability connected between signal wire 161 and connection sheet 200-5,200-6, as shown in Fig. 2 and Fig. 3 f, Two 162 and of tie point for being respectively used to two connection sheets 200-5,200-6 of connection are also provided on signals layer 120-3 163.Signal wire 161 is connected between tie point 162 and 163.Signal wire 161 passes through tie point 162 and the first connection sheet 200-5 Connection, is connect by tie point 163 with the second connection sheet 200-6.The width of tie point 162 and 163 may be greater than signal wire 161 width.

As shown in Figure 3a, pad 111~116, which can be, is arranged in circuit board 100 close on the edge of side wall, so that first Pad 111 can directly be connect with the first connection sheet 200-1, and the second pad 112 can directly connect with the second connection sheet 200-2 Connect, the first pad 113 can directly be connect with the first connection sheet 200-3, the second pad 114 can directly with the second connection sheet 200-4 connection, the first pad 115 can directly be connect with the first connection sheet 200-5, and the second pad 116 can be directly with second Connection sheet 200-6 connection.

When the second line layer 120 of at least one layer is at least double-layer structure, which further includes at least one layer Stratum.And at least one layer of signals layer is arranged alternately at least one layer of formation interval.It is respectively provided between the signals layer of arbitrary neighborhood There is stratum.In the embodiment as shown in Fig. 2, Fig. 3 a~Fig. 3 g, circuit board may include stratum 120-4,120-5,120-6. Wherein, signals layer 120-1, which can be, is arranged between the first signals layer 110 and stratum 120-4, and signals layer 120-2, which can be, to be set It sets between stratum 120-4 and stratum 120-5, signals layer 120-3, which can be, to be arranged between stratum 120-5 and stratum 120-6.

The first ground wire 117 can be set on first line layer 110, the second ground wire can be set on the 120-4 of stratum The second ground wire 151 can be set on 131, stratum 120-5, the second ground wire 171 can be set on the 120-6 of stratum.Circuit board It is provided at least one third connection sheet 200-7 on 100 side wall, the first ground wire 117 and the second ground wire 131,151,171 can be with It is realized and is electrically connected by least one described third connection sheet 200-7.

Still further, as shown in Fig. 2, be provided at least three third connection sheet 200-7 on the side wall of circuit board 100, At least three thirds connection sheet 200-7, which can be, to be uniformly arranged on the side wall of circuit board 100.It is being arranged in the same side In the case where being provided at least three third connection sheet 200-7 on wall, between the adjacent third connection sheet 200-7 of any two It is equidistant.In this way, the interference to ground wire 117,131,151,171 can be reduced.In one example, which exists It can be arc, U-shaped, V-arrangement or waveform perpendicular to the shape of the cross section on the direction of side wall.

In one example, connection sheet 200 can be forms and the plated-through-hole of at least through part circuit board is cut 's.

Further, connection sheet 200, which can be, is cut by laser the plated-through-hole and is formed.

Specifically, during making circuit board 100, can be in first line layer and the second route layout layer In the process, it can be by being electrically connected between setting plated-through-hole realization first line layer and the second line layer.And plated-through-hole is set It sets on the boundary line of preset circuit board 400.By after layout first line layer 110 and the second line layer 120 be arranged in original On beginning circuit board 1000.

Fig. 4 is the schematic diagram of primary circuit board in the present embodiment.As shown in figure 4, being provided with electricity on primary circuit board 1000 A part of the boundary line 400 of road plate, the plated-through-hole 300 is located in the boundary line 400 of circuit board, and another part is located at circuit board Boundary line 400 except.

Laser opening is carried out on the position of the plated-through-hole 300 in primary circuit board 1000, forms through-hole.Again to the through-hole Inner wall carry out electroplating technology, formed plated-through-hole.

The through-hole to be formed can be made larger come aperture by laser in the present embodiment, and then plating can be improved this is logical The qualification rate in hole.

Finally, technique is cut by laser again cutting along boundary line 400 shape of primary circuit board 1000, can obtain To circuit board 100.The main view of the circuit board 100 obtained after cutting can be as shown in Figure 5.Due to pre-set plated-through-hole 300 position therefore, when cutting the shape of primary circuit board 1000, can be cut on the boundary line 400 of circuit board The plated-through-hole 300.After the completion of cutting, the part plated-through-hole on circuit board 100 is stayed in, can be used as the connection sheet in the present embodiment 200。

In this way, forming connection sheet 200 by way of cutting plated-through-hole, processing step is relatively simple, easy to accomplish.

It is very thin in 100 width of circuit board and in the case that thickness is thicker, if being punched original electricity using general punching block The shape of road plate 1000, it is easy to lead to primary circuit board 1000 flange and layering in punching.And it may be such that obtain Circuit board 100 side wall on generate burr and overlap, influence the beauty of circuit board 100.

In the present embodiment, the circuit board 100 very thin and thicker thickness for width, by laser to ifq circuit When the shape of plate 1000 is cut, the problem of flange can occur to avoid circuit board and be layered.Furthermore, it is possible to improve cutting essence The appearance yield of degree and circuit board 100.

In one example, which can be flexible circuit board.

The utility model additionally provides a kind of electronic equipment, which can be including circuit board above-mentioned.

The difference of the various embodiments described above primary focus description and other embodiments, but those skilled in the art should be clear Chu, the various embodiments described above can according to need exclusive use or are combined with each other.

Although being described in detail by some specific embodiments of the example to the utility model, this field It is to be understood by the skilled artisans that example above merely to be illustrated, rather than in order to limit the scope of the utility model.This Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case where, to above embodiments It modifies.The scope of the utility model is defined by the following claims.

Claims (10)

1. a kind of circuit board, which is characterized in that including first line layer and at least one layer of second line layer, the side of the circuit board It is provided with connection sheet on wall, is realized between the first line layer and second line layer by the connection sheet and is electrically connected It connects.

2. circuit board according to claim 1, which is characterized in that there is the surface of indent on the side wall of the circuit board, The connection sheet is fitted on the surface of the indent.

3. circuit board according to claim 1, which is characterized in that include at least at least one layer of second line layer One layer signal layer is provided with the first pad and the second pad for connecting component, the circuit on the first line layer It is provided with the first connection sheet and the second connection sheet on the side wall of plate, is provided with signal wire on at least one layer signals layer, it is described First pad is realized by first connection sheet and the signal wire and is electrically connected；Second pad connects by described second Contact pin and the signal wire, which are realized, to be electrically connected.

4. circuit board according to claim 3, which is characterized in that used respectively there are two being also set up on second line layer In the tie point for connecting first connection sheet and second connection sheet, the signal wire is connected between two tie points.

5. circuit board according to claim 3, which is characterized in that at least one layer of second line layer is at least two layers of knot When structure, second line layer further includes at least one layer of stratum, at least one layer signals layer and at least one layer of ground interlayer Every being arranged alternately；The first ground wire is provided on the first line layer；The second ground wire is provided on at least one layer stratum；Institute It states and is provided at least one third connection sheet on the side wall of circuit board, pass through institute between first ground wire and second ground wire It states at least one third connection sheet and realizes electric connection.

6. circuit board according to claim 5, which is characterized in that be provided at least three on the side wall of the circuit board Three connection sheets, at least three thirds connection sheet are uniformly arranged on the side wall.

7. circuit board according to claim 1, which is characterized in that the connection sheet is on the direction perpendicular to the side wall Cross section shape be arc, U-shaped, V-arrangement or waveform.

8. circuit board described in any one of -7 according to claim 1, which is characterized in that the connection sheet is by by least passing through Wear the part circuit board plated-through-hole cutting and formed.

9. circuit board according to claim 8, which is characterized in that the connection sheet be by being cut by laser the plated-through-hole and It is formed.

10. a kind of electronic equipment, which is characterized in that including circuit board according to claim 1 to 9.