CN209402822U - Circuit board and calculating equipment - Google Patents
Circuit board and calculating equipment Download PDFInfo
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- CN209402822U CN209402822U CN201821841109.8U CN201821841109U CN209402822U CN 209402822 U CN209402822 U CN 209402822U CN 201821841109 U CN201821841109 U CN 201821841109U CN 209402822 U CN209402822 U CN 209402822U
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Abstract
The embodiment of the present disclosure proposes a kind of circuit board and calculates equipment, and the height of the intermediate heat sink of the intermediate region positioned at pcb board of the circuit board is not higher than the height of two side radiators of the two side areas except the intermediate region；Height in intermediate heat sink closest to the height of the first radiator group of the radiator fan lower than two side radiators of the two side areas except the intermediate region；And the height of the first radiator group of the closest radiator fan is not higher than the height of other radiators in the intermediate region；The intermediate region is the region of the wheel shaft central area corresponding to radiator fan on the pcb board.The embodiment of the present disclosure is capable of increasing the air quantity for flowing through the heat dissipation wind channel of intermediate region of circuit board, and raising circuit board corresponds to the radiating efficiency in the region of the wheel shaft central area of external fan, reduces the heat dissipation risk of the heat source device in the region.
Description
Technical field
The utility model relates to calculate the technical field of heat dissipation of equipment, set in particular to a kind of circuit board and calculating
It is standby.
Background technique
In existing artificial intelligence (abbreviation AI) solution, need are handled in order to meet the acceleration of large-scale data operation
It asks, technical staff handles chip using multiple groups to construct operation board, and forms high-performance calculation using one or more operation board
Equipment greatly improves the calculation processing power towards artificial intelligence.
As shown in Figure 1, existing calculating equipment 1 usually installs at least one piece of circuit board 10, the circuit board 10 in cabinet 2
It is evenly arranged on pcb board 11 including a pcb board 11 and the muti-piece chip 12 being installed on the pcb board 11, muti-piece chip 12,
In order to radiate to the circuit board, a fan 3 usually is installed in cabinet one end.
However, the disclosure inventors have found that since fan 3 has wheel shaft central area (the also known as region Hub) 30, and wind
The region Hub 30 of fan 3 is not covered by flabellum, causes the wind directly blown out from fan 3 without going past the region Hub 30, so that stream
Air quantity wind speed through corresponding to the intermediate region 20 in the region Hub 30 of the fan on circuit board 10 is smaller.Fig. 2 is that the circuit board 10 exists
Perpendicular to the longitudinal profile schematic diagram of heat dissipation wind channel flow direction, as shown in Fig. 2, the 12 dimensions phase of muti-piece chip on pcb board 11
Together, the windage of each heat dissipation wind channel is roughly the same, thus each region on circuit boards windage it is roughly the same when, when flowing through circuit board
Corresponded on 10 the intermediate region 20 in the region Hub 30 of the fan air quantity wind speed it is smaller when, the chip positioned at the intermediate region 20
Heat-sinking capability it is relatively weak, in the case where there are abnormal conditions, the chip positioned at the intermediate region 20 more has the risk burnt.
Utility model content
The embodiment of the present disclosure provides a kind of circuit board and calculates equipment, to improve in the prior art due to the area Hub of fan
The problem that domain causes the partial region radiating efficiency of circuit board low.
In a first aspect, the embodiment of the present disclosure proposes a kind of circuit board, comprising:
Pcb board；Radiator is provided on the pcb board；
The two sides except the intermediate region are not higher than positioned at the height of the intermediate heat sink of the intermediate region of the pcb board
The height of two side radiators in region；The intermediate heat sink includes multiple of the heat dissipation wind channel directional spreding along radiator fan
One radiator group；
In the multiple first radiator group, the height of the first radiator group of the closest radiator fan is lower than described
The height of two side radiators of the two side areas except intermediate region, and the first radiator of the closest radiator fan
Height of the height of group not higher than other radiators in the intermediate region；
Wherein, the intermediate region is the area of the wheel shaft central area corresponding to radiator fan on the pcb board
Domain.
In some embodiments, stream of the height of the intermediate heat sink of the intermediate region of the pcb board along heat dissipation wind channel
To ladder-like in from low to high.
In some embodiments, the height of two side radiators of the two side areas except the intermediate region of the pcb board
It is identical；Also, in the intermediate heat sink of the intermediate region of the pcb board, positioned at the first radiator of heat dissipation wind channel least significant end
The height of group is identical as the height of two side radiators of two side areas except the intermediate region.
In some embodiments, the height of multiple first radiator groups of the intermediate region is identical, and is less than described
The height of two side radiators of the two side areas except intermediate region.
In some embodiments, multiple chips are additionally provided on the circuit board；The multiple chip is in the circuit
It is arranged in array on plate, and the radiator is arranged above the multiple chip.
In some embodiments, in the multiple first radiator group, the heat dissipation that includes in every one first radiator group
The height of device is identical.
In some embodiments, the height of the radiator is the height of the radiating fin in the radiator.
In some embodiments, the height of the radiating fin in the radiator include: in the radiating fin most
The height of high fin.
In some embodiments, being provided with radiator on the pcb board includes:
Radiator is provided on first face of the pcb board and the second face opposite with first face.
Second aspect, the embodiment of the present disclosure also propose a kind of calculating equipment, comprising: cabinet；It is installed on described cabinet one end
The fan as air intake vent；And it is installed in the circuit board as described in first aspect any embodiment in the cabinet.
The heat dissipation that the embodiment of the present disclosure passes through the region to the wheel shaft central area for corresponding to external fan on circuit board
Device structure improves, and increases the air quantity for flowing through the heat dissipation wind channel of intermediate region of circuit board, and it is corresponding external to improve circuit board
The radiating efficiency in the region of the wheel shaft central area of fan reduces the heat dissipation risk of the heat source device in the region.
Detailed description of the invention
In order to illustrate more clearly of the embodiment of the present disclosure or technical solution in the prior art, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this public affairs
The some embodiments opened to those skilled in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for calculating equipment in the prior art；
Fig. 2 is the longitudinal profile schematic diagram of circuit board in the prior art；
Fig. 3 is to be illustrated according to the circuit board of disclosure first embodiment perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure；
Fig. 4 is the longitudinal profile signal that heat dissipation wind channel flow direction is parallel to according to the circuit board of disclosure first embodiment
Figure；
Fig. 5 is the longitudinal profile signal that heat dissipation wind channel flow direction is parallel to according to the circuit board of disclosure second embodiment
Figure；
Fig. 6 is to be illustrated according to the circuit board of disclosure third embodiment perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure；
Fig. 7 is the longitudinal profile signal that heat dissipation wind channel flow direction is parallel to according to the circuit board of disclosure third embodiment
Figure；
Fig. 8 is the longitudinal profile signal that heat dissipation wind channel flow direction is parallel to according to the circuit board of the 4th embodiment of the disclosure
Figure；
Fig. 9 is to be illustrated according to the circuit board of the 5th embodiment of the disclosure perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure；
Figure 10 is to be illustrated according to the circuit board of disclosure sixth embodiment perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure；
Figure 11 is the schematic diagram of the section structure according to the radiator of one embodiment of the disclosure.
Specific embodiment
To keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, below in conjunction with disclosure reality
The attached drawing in example is applied, the technical solution in the embodiment of the present disclosure is clearly and completely described.Obviously, described implementation
Example is a part of this disclosure embodiment, instead of all the embodiments.Based on the embodiment in the disclosure, the common skill in this field
Art personnel every other embodiment obtained without creative efforts belongs to the utility model protection
Range.
It refers to before, the circuit board of the prior art as illustrated in fig. 1 and 2, due to the wheel shaft center of corresponding external fan
The air quantity in the region in domain is reduced, and the radiating efficiency for causing circuit board to correspond to the region of the wheel shaft central area of external fan is reduced.
For this purpose, the embodiment of the present disclosure proposes a kind of circuit board, comprising:
Pcb board；Radiator is provided on the pcb board；
The two sides except the intermediate region are not higher than positioned at the height of the intermediate heat sink of the intermediate region of the pcb board
The height of two side radiators in region；The intermediate heat sink includes multiple of the heat dissipation wind channel directional spreding along radiator fan
One radiator group；
In the multiple first radiator group, the height of the first radiator group of the closest radiator fan is lower than described
The height of two side radiators of the two side areas except intermediate region, and the first radiator of the closest radiator fan
Height of the height of group not higher than other radiators in the intermediate region；
Wherein, the intermediate region is the area of the wheel shaft central area corresponding to radiator fan on the pcb board
Domain.
The embodiment of the present disclosure corresponds to the radiator in the region of wheel shaft central area of external fan by improving on circuit board
Structure so that circuit board the heat dissipation wind channel of intermediate region windage reduce, increase the air quantity for flowing through intermediate region, improve
Circuit board corresponds to the radiating efficiency in the region of the wheel shaft central area of external fan, reduces dissipating for the heat source device in the region
Hot wind danger.
It is to be appreciated that the intermediate region of the pcb board referred in the embodiment of the present disclosure is relative to external fan
For wheel shaft central area, the region of one exact area value of generation is not implied that.For example, in a kind of embodiment, pcb board
Intermediate region length be pcb board length value, but its width can correspond to the straight of the wheel shaft central area of external fan
Value within the scope of the one fixed width of diameter.
The optional embodiment of the embodiment of the present disclosure is introduced in detail below.
Fig. 3 is to be illustrated according to the circuit board of disclosure first embodiment perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure.Fig. 4 is the longitudinal profile schematic diagram that heat dissipation wind channel flow direction is parallel to according to the circuit board of disclosure first embodiment.Such as figure
Shown in 3 and Fig. 4, the circuit board 10 of the embodiment of the present disclosure include: pcb board 11, the pcb board 11 the first face (front) be provided with
Radiator.Wherein, there is multiple dissipate along the heat dissipation wind channel directional spreding of radiator fan positioned at the intermediate region 20 of the circuit board 10
Hot device group 13A.Wherein, the intermediate region 20 is to correspond to 3 (such as Fig. 1 of external cooling fan on the circuit board 10
It is shown) wheel shaft central area 30 region.
When it is implemented, being located at the height of multiple radiator group 13A of the intermediate region 20 of circuit board 10 along heat dissipation wind channel
Flow direction it is ladder-like in from low to high.Wherein, lower more the height for the radiator group for being proximate to heat dissipation wind channel entrance, lean on
The height of the radiator group of nearly heat dissipation wind channel tail portion gradually increases, and realizes ladder layout.This hierarchic structure from low to high subtracts
The small windage of the heat dissipation wind channel of the intermediate region of circuit board, the windage for foring two side areas is big, and the windage of intermediate region is small
Air duct layout, enhance the heat dissipation air quantity for flowing through the intermediate region.
In the present embodiment, by being located at for correspond to the region of the wheel shaft central area of external fan on circuit board
Heat radiator structure on one side be along heat dissipation wind channel flow direction it is ladder-like in from low to high so that circuit board dissipating in intermediate region
The windage of hot-flow flue reduces, and increases the air quantity for flowing through intermediate region, improves the wheel axis center that circuit board corresponds to external fan
The radiating efficiency in the region in region reduces the heat dissipation risk of the heat source device in the region.
In some embodiments, as shown in Figure 3 and Figure 4, two side areas except the intermediate region 20 of the pcb board
The height of two side radiator 14A is identical；Also, in the intermediate heat sink of the intermediate region of the pcb board 20, it is located at radiation air
The height and the height phase of two side radiators of the two side areas except the intermediate region of the radiator group 13A of road least significant end
Together.
In some embodiments, in the intermediate heat sink of the intermediate region of the pcb board 20, it is located at heat dissipation wind channel most
The height of the radiator group 13A of end may also be below the height of two side radiators of the two side areas except the intermediate region
Degree.The utility model does not do any restriction to the height of the radiator group of heat dissipation wind channel end, as long as it is not higher than two side areas
Two side radiators height, so that it may realize the reduction of windage.In some embodiments, the multiple radiator group 13A
In, the height for the radiator for including in each radiator group is identical.
In some embodiments, multiple chips 12 are additionally provided on the circuit board, the multiple chip 12 is described
It is arranged in array on circuit board, and the radiator is arranged above the multiple chip.
In some embodiments, the chip 12 can be IC chip, and it is special specifically to can be ASIC
With IC chip, for executing various data processing operations, such as can include but is not limited to execute artificial intelligence operation.
The circuit board 10 can be the circuit board in the calculating equipment for executing data processing operation, such as operation board or calculation power plate.
In some embodiments, as shown in Figure 3 and Figure 4, second face opposite with the first face of the pcb board 11 is (anti-
Face) on radiator is also installed at position corresponding with the chip 12.
Fig. 5 is the longitudinal profile signal that heat dissipation wind channel flow direction is parallel to according to the circuit board of disclosure second embodiment
Figure.As shown in figure 5, in the multiple radiator group 13A of intermediate region 20 for being located at circuit board 10, most being connect in present embodiment
The height of one or more groups of radiator group 13A of the nearly radiator fan 3 is identical, and dissipates lower than other in the intermediate region
The height of hot device.The height of other radiators in the intermediate region can be identical (such as Fig. 5), or such as Fig. 3 institute
The ladder-like distribution shown.
Present embodiment may be considered the extension embodiment of Fig. 4 embodiment, by will most connect in intermediate region
One side radiator group of nearly external fan is configured to the height of the radiator lower than the other side, so that circuit board is in intermediate region
The windage of heat dissipation wind channel reduces, and increases the air quantity for flowing through intermediate region, improves circuit board and correspond in the wheel shaft of external fan
The radiating efficiency in the region in heart district domain reduces the heat dissipation risk of the heat source device in the region.
Fig. 6 is to be illustrated according to the circuit board of disclosure third embodiment perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure.Fig. 7 is the longitudinal profile schematic diagram that heat dissipation wind channel flow direction is parallel to according to the circuit board of disclosure third embodiment.
As shown in Figure 6 and Figure 7, on the basis of Fig. 3 and 4 illustrated embodiment, the position of the circuit board 10 of the embodiment of the present disclosure
In multiple radiators that the intermediate region 20 of the circuit board 10 further comprises the heat dissipation wind channel directional spreding along radiator fan 3
Group 13B.
When it is implemented, being located at stream of the height along heat dissipation wind channel of the radiator group 13B of the intermediate region 20 of circuit board 10
To ladder-like in from low to high.Wherein, lower more the height for the radiator group for being proximate to heat dissipation wind channel entrance, it is more proximate to dissipate
The height of the radiator group of hot-flow flue tail portion gradually increases, and realizes ladder layout, further reduces positioned at circuit board reverse side
The windage of the heat dissipation wind channel of intermediate region, the windage for foring two side areas is big, the small air duct layout of the windage of intermediate region, into
One step enhances the heat dissipation air quantity for flowing through the intermediate region.
In the present embodiment, by the way that positive and negative the two of the region of the wheel shaft central area of external fan will be corresponded on circuit board
The radiator in face be configured to it is ladder-like in from low to high along the flow direction of heat dissipation wind channel so that circuit board dissipating in intermediate region
The windage of hot-flow flue reduces, and further increases the air quantity for flowing through intermediate region, further improves the corresponding external wind of circuit board
The radiating efficiency in the region of the wheel shaft central area of fan reduces the heat dissipation risk of the heat source device in the region.
In some embodiments, as shown in Figure 6 and Figure 7, two side areas except the intermediate region 20 of the pcb board
The height of two side radiator 14B is identical；Also, in the intermediate heat sink of the intermediate region of the pcb board 20, it is located at radiation air
The height and the height phase of two side radiators of the two side areas except the intermediate region of the radiator group 13B of road least significant end
Together.
In some embodiments, in the intermediate heat sink of the intermediate region of the pcb board 20, it is located at heat dissipation wind channel most
The height of the radiator group 13B of end may also be below the height of two side radiators of the two side areas except the intermediate region
Degree.
In some embodiments, in the multiple radiator group 13B, the height for the radiator for including in each radiator group
It spends identical.
Fig. 8 is the longitudinal profile signal that heat dissipation wind channel flow direction is parallel to according to the circuit board of the 4th embodiment of the disclosure
Figure.As shown in figure 8, the circuit board 10 of the embodiment of the present disclosure is located at the circuit board 10 on the basis of embodiment shown in Fig. 5
Intermediate region 20 further comprise the heat dissipation wind channel directional spreding along radiator fan 3 multiple radiator group 13B.Wherein, exist
In the multiple radiator group 13B, the height closest to one or more groups of radiator group 13B of the radiator fan 3 is identical, and
Lower than the height of other radiators in the intermediate region.
Fig. 9 is to be illustrated according to the circuit board of the 5th embodiment of the disclosure perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure.As shown in figure 9, the circuit board 10 of the embodiment of the present disclosure by be located at the circuit board 10 intermediate region 20 except two lateral areas
The height of the radiator 14A in domain is designed as being greater than the height of the radiator group 13A positioned at the intermediate region 20 of the circuit board 10,
Height i.e. positioned at the radiator group 13A of the intermediate region 20 of the circuit board is identical, and is less than and is located in the circuit board
Between two side areas except region 20 radiator 14A height.
In the present embodiment, since the radiator height of intermediate region 20 is constant, windage is also constant, by by middle area
The height of the radiator of two side areas except domain increases, to increase the windage of two side areas, also may be implemented to increase flow direction
The air quantity in the region of the wheel shaft central area of external fan is corresponded on circuit board.
It in some embodiments, can also be scattered to increase by increasing the quantity of the structural member of the radiator of two side areas
The flow resistance of hot device itself is also able to achieve to increase the windage of two side areas and flows to the wheel for corresponding to external fan on circuit board greatly
The air quantity in the region in axis center region.
Figure 10 is to be illustrated according to the circuit board of disclosure sixth embodiment perpendicular to the longitudinal profile that heat dissipation wind channel flows to
Figure.As shown in Figure 10, on the basis of embodiment shown in Fig. 9, the circuit board 10 of the embodiment of the present disclosure will further be located at the electricity
The height of the radiator 14B of two side areas except the intermediate region 20 of road plate 10 is designed as being greater than positioned at the circuit board 10
The height of the radiator group 13B of intermediate region 20 is located at the height of the radiator group 13B of the intermediate region 20 of the circuit board
It is identical, and it is less than the height of the radiator 14B for the two side areas being located at except the intermediate region 20 of the circuit board.
In the present embodiment, since the radiator height of intermediate region 20 is constant, windage is also constant, by by middle area
The height of the radiator of two side areas except domain increases, to increase the windage of two side areas, also may be implemented to increase flow direction
The air quantity in the region of the wheel shaft central area of external fan is corresponded on circuit board.
In some embodiments, the circuit can be realized according to any combination of the above embodiment of the disclosure
Plate 10, to realize that increase flows to the wheel axis center for corresponding to external fan on circuit board based on the means of one or more superpositions
The air quantity in the region in region reduces the heat dissipation risk of the heat source device in the region, and details are not described herein.
Figure 11 is the schematic diagram of the section structure according to the radiator of one embodiment of the disclosure.As shown in figure 11, radiator
Including egative film 131 and multiple radiating fins 132.The egative film 131 can also include be located in the middle first part 131A and
The second part 131B and Part III 131C tilted upward respectively from the two sides of the first part, the bottom of first part 131A
Face with the upper surface of chip 12 for being fixedly connected.Multiple fins 132 respectively with first part 131A, the second part of egative film
131B, Part III 131C top surface be connected.Multiple fins 132 can be arranged in parallel, can also be with spaced set.In order to just
In machine or manually to the lifting of cooling fin, handgrip 133 can also be set on the top of a wherein fin.Handgrip 133 can be with
It is to be connected to sheet or ring bodies of fin heads etc..
In some embodiments, the egative film 131 of radiator is fixed on the upper surface of the chip 12 with structural member.
In some embodiments, the egative film 131 of radiator can also be fixed on the chip 12 in a welding manner
Upper surface.For example, the first cooling fin can be connected by scolding tin with the upper surface of chip.
In some embodiments, the egative film 131 of radiator can also be individually fixed in the chip in a manner of gluing
12 upper surface.For example, bonding connection can be carried out with the upper surface of chip 12 by heat-conducting glue.
In some embodiments, the egative film 131 of radiator can be fixed on the bottom of the chip 12 in a welding manner
Face.
In this application, for the circuit board of aforementioned any embodiment, the height of the radiator is the radiator
In radiating fin height.More specifically, the height of the radiating fin in radiator can be in the radiating fin 132
Highest fin height.
The disclosure also proposes a kind of calculating equipment 100.The calculating equipment is in the calculating Equipment Foundations described in Fig. 1, by it
The circuit board for including replaces with the circuit board of disclosure any embodiment.In the embodiment of the present disclosure, calculating equipment 100 includes:
Cabinet 2；It is installed on the fan 3 as air intake vent of described cabinet one end；And it is installed at least one piece of sheet in the cabinet
The circuit board 10 of open any embodiment.
It should be noted that the quantity for calculating the circuit board in equipment 100 in practical application can be according to operational performance
Demand configures on demand.
In present embodiment, calculating equipment 100 generally can be computer or other ends for being arbitrarily able to carry out calculating task
End equipment is not limited in any way this.
When in the application, although term " first ", " second " etc. may be used in this application to describe respectively
Element, but these elements should not be limited by these terms.These terms are only used to by an element and another element region
It does not open.For example, in the case where not changing the meaning of description, first element can be called second element, and same, second
Element can be called first element, as long as " second yuan that " first element " occurred is unanimously renamed and occurred
Part " unanimously renames.First element and second element are all elements, but can not be identical element.
Word used herein is only used for description embodiment and is not used in limitation claim.Such as embodiment with
And used in the description of claim, unless context clearly illustrates, otherwise "one" (a) of singular, "one"
(an) and " described " (the) is intended to include equally plural form.Similarly, term "and/or" as used in this specification
Refer to comprising one or more associated any and all possible combinations listed.In addition, when being used for the application
When middle, term " includes " (comprise) and its modification " comprising " (comprises) and/or refer to including (comprising) etc. old
The presence of feature, entirety, step, operation, element and/or the component stated, but be not excluded for one or more other features,
Entirety, step, operation, element, component and/or these grouping presence or addition.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the disclosure, rather than its limitations；To the greatest extent
Pipe is described in detail the disclosure referring to foregoing embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the utility model that it does not separate the essence of the corresponding technical solution
The range of technical solution.
Claims (10)
1. a kind of circuit board characterized by comprising
Pcb board；Radiator is provided on the pcb board；
The two side areas being not higher than positioned at the height of the intermediate heat sink of the intermediate region of the pcb board except the intermediate region
Two side radiators height；The intermediate heat sink include the heat dissipation wind channel directional spreding along radiator fan multiple first dissipate
Hot device group；
In the multiple first radiator group, the height closest to the first radiator group of the radiator fan is lower than the centre
The height of two side radiators of the two side areas except region, and the first radiator group of the closest radiator fan
Height of the height not higher than other radiators in the intermediate region；
Wherein, the intermediate region is the region of the wheel shaft central area corresponding to radiator fan on the pcb board.
2. circuit board according to claim 1, which is characterized in that the intermediate heat sink of the intermediate region of the pcb board
Height is ladder-like in from low to high along the flow direction of heat dissipation wind channel.
3. circuit board according to claim 2, which is characterized in that the two side areas except the intermediate region of the pcb board
Two side radiators height it is identical；
Also, in the intermediate heat sink of the intermediate region of the pcb board, positioned at the first radiator group of heat dissipation wind channel least significant end
Height it is identical as the height of two side radiators of two side areas except the intermediate region.
4. circuit board according to claim 1, which is characterized in that the height of multiple first radiator groups of the intermediate region
Spend it is identical, and be less than the intermediate region except two side areas two side radiators height.
5. circuit board according to claim 1, which is characterized in that be additionally provided with multiple chips on the circuit board；
The multiple chip is arranged in array on the circuit board, and the radiator is arranged above the multiple chip.
6. circuit board according to claim 1-5, which is characterized in that in the multiple first radiator group, often
The height for the radiator for including in one first radiator group is identical.
7. circuit board according to claim 1-5, which is characterized in that the height of the radiator is the heat dissipation
The height of radiating fin in device.
8. circuit board according to claim 7, which is characterized in that the height of the radiating fin in the radiator includes:
The height of highest fin in the radiating fin.
9. circuit board according to claim 1, which is characterized in that being provided with radiator on the pcb board includes:
Radiator is provided on first face of the pcb board and the second face opposite with first face.
10. a kind of calculating equipment characterized by comprising cabinet；It is installed on the heat dissipation as air intake vent of described cabinet one end
Fan；And it is installed at least one piece such as the described in any item circuit boards of claim 1-9 in the cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821841109.8U CN209402822U (en) | 2018-11-08 | 2018-11-08 | Circuit board and calculating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821841109.8U CN209402822U (en) | 2018-11-08 | 2018-11-08 | Circuit board and calculating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209402822U true CN209402822U (en) | 2019-09-17 |
Family
ID=67879882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821841109.8U Active CN209402822U (en) | 2018-11-08 | 2018-11-08 | Circuit board and calculating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209402822U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022214923A1 (en) * | 2021-04-08 | 2022-10-13 | International Business Machines Corporation | Heat sinks with beyond-board fins |
-
2018
- 2018-11-08 CN CN201821841109.8U patent/CN209402822U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022214923A1 (en) * | 2021-04-08 | 2022-10-13 | International Business Machines Corporation | Heat sinks with beyond-board fins |
| GB2621939A (en) * | 2021-04-08 | 2024-02-28 | Ibm | Heat sinks with beyond-board fins |
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