CN209367797U - The sealing device of polymer chip - Google Patents
The sealing device of polymer chip Download PDFInfo
- Publication number
- CN209367797U CN209367797U CN201920059155.0U CN201920059155U CN209367797U CN 209367797 U CN209367797 U CN 209367797U CN 201920059155 U CN201920059155 U CN 201920059155U CN 209367797 U CN209367797 U CN 209367797U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- chip
- cylinder
- cloche
- semicircle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 61
- 229920000642 polymer Polymers 0.000 title claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 16
- 238000005086 pumping Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Joining Of Glass To Other Materials (AREA)
Abstract
The utility model discloses the sealing devices of polymer chip, including body, placement plate is fixedly connected between the inner wall of the body, the upper side wall of the placement plate is fixedly connected with the semicircle cloche for setting of standing upside down, jack is offered on the semicircle cloche, vacuum mechanism is equipped in the body, the vacuum mechanism includes the vacuum air pump being fixedly connected with the side wall of body, the pumping end of the vacuum air pump is inserted into semicircle cloche by jack, through-hole is offered on the placement plate and semicircle cloche, the inner roof wall of the body is fixedly connected with the first cylinder.The utility model is by the way that the first chip and the second chip to be placed in semicircle cloche, start vacuum air pump, air in double of end of the pumping circular glass cover of vacuum air pump is extracted, the inside of semicircle cloche is set to be in the state of relative vacuum, first chip and the second chip are sealed in semicircle cloche, can reduce the bubble of chip.
Description
Technical field
The utility model relates to polymer chip sealing field more particularly to the sealing devices of polymer chip.
Background technique
The conventional material of micro-fluidic chip includes the rigid polymers chip such as silicon wafer, glass, PDMS, PMMA and PC, micro-
Most applications of fluidic chip require the flow path sealing on micro-fluidic chip forming closure pipeline, convenient complete on pipeline
It is operated at biochemical reaction etc., the sealing means of the rigid polymers chip such as PMMA include Heat Sealing etc. at this stage.
But existing Heat Sealing device is when in use, since the environment of chip Heat Sealing is not vacuum, leads to core
Piece is easy to produce bubble in Heat Sealing, influences the use of chip.
Utility model content
Purpose of the utility model is to solve the problems in background techniques, and the sealing dress of the polymer chip proposed
It sets.
To achieve the goals above, the utility model adopts the technical scheme that
The sealing device of polymer chip, including body are fixedly connected with placement plate between the inner wall of the body, described
The upper side wall of placement plate is fixedly connected with the semicircle cloche for setting of standing upside down, and offers jack on the semicircle cloche,
Vacuum mechanism is equipped in the body, the vacuum mechanism includes the vacuum air pump being fixedly connected with the side wall of body, described
The pumping end of vacuum air pump is inserted into semicircle cloche by jack, is opened up on the placement plate and semicircle cloche
There is through-hole, the inner roof wall of the body is fixedly connected with the first cylinder, and the inner bottom wall of the body is fixedly connected with the second cylinder.
Preferably, the driving end of first cylinder straight down and is fixedly connected with the first fixed link, second gas
The driving end of cylinder straight up and is fixedly connected with the second fixed link, the internal diameter of two through-holes respectively with the first fixed link and
The diameter of second fixed link matches, and the semicircle cloche is made of transparent glass.
Preferably, the described one end of first fixed link far from the first cylinder is inserted into semicircle cloche and solid by through-hole
Surely it is connected with the first sealing plate, the described one end of second fixed link far from the second cylinder is inserted into semicircle cloche by through-hole
And it is fixedly connected with the second sealing plate.
Preferably, the lower wall of the first sealing plate is fixedly connected with the first chip, the upside of the second sealing plate
Wall is fixedly connected with the second chip.
Preferably, installation cavity is offered in the first sealing plate and the second sealing plate, in each installation cavity
It is installed with heating sheet.
Preferably, sealing ring is bonded on the inner wall of each through-hole and jack.
Compared with prior art, the advantages of sealing device of this polymer chip, is:
1, vacuum air pump and semicircle cloche are set, by the way that the first chip and the second chip are placed on semicircle glass
In glass cover, the first chip and the second chip is made to be isolated from the outside and come, starts vacuum air pump, the pumping end pair of vacuum air pump
Air in semicircle cloche is extracted, and the inside of semicircle cloche is made to be in the state of relative vacuum, the first chip
It is sealed in semicircle cloche with the second chip, the bubble of chip can be reduced.
2, the first cylinder, the second cylinder and heating sheet are set, by the first cylinder of starting and the second cylinder, make the first chip
It is adjacent to each other with the second chip, and be close together, restart heating sheet, hot pressing can be carried out to the first chip and the second chip
Sealing, it is easy to operate, it is time saving and energy saving.
In conclusion the utility model is started by the way that the first chip and the second chip to be placed in semicircle cloche
Vacuum air pump, the air in double of end of the pumping circular glass cover of vacuum air pump are extracted, and semicircle cloche is made
Inside is in the state of relative vacuum, and the first chip and the second chip are sealed in semicircle cloche, can reduce chip
Bubble.
Detailed description of the invention
Fig. 1 be the utility model proposes polymer chip sealing device front view；
Fig. 2 is the enlarged drawing of part A in Fig. 1；
Fig. 3 is the enlarged drawing of part B in Fig. 1.
In figure: 1 body, 2 placement plates, 3 first cylinders, 4 second cylinders, 5 first fixed links, 6 second fixed links, 7 semicircles
Shape cloche, 8 vacuum air pumps, 9 through-holes, 10 first sealing plates, 11 second sealing plates, 12 heating sheets, 13 first chips, 14 the
Two chips, 15 jacks, 16 sealing rings.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Referring to Fig.1-3, the sealing device of polymer chip, including body 1 are fixedly connected between the inner wall of body 1 and put
Plate 2 is set, the upper side wall of placement plate 2 is fixedly connected with the semicircle cloche 7 for setting of standing upside down, offers on semicircle cloche 7
Jack 15, body 1 is interior to be equipped with vacuum mechanism, and vacuum mechanism includes the vacuum air pump 8 being fixedly connected with the side wall of body 1, very
The pumping end of empty pump mechanism of qi 8 is inserted into semicircle cloche 7 by jack 15, and vacuum air pump 8 can double circular glass cover 7
Inside is evacuated, and the inside of semicircle cloche 7 is made to be in the state of relative vacuum.
Through-hole 9 is offered on placement plate 2 and semicircle cloche 7, the inner roof wall of body 1 is fixedly connected with the first cylinder
3, the inner bottom wall of body 1 is fixedly connected with the second cylinder 4, and the model of the first cylinder 3 and the second cylinder 4 is CP96, the first gas
The driving end of cylinder 3 straight down and is fixedly connected with the first fixed link 5, and the driving end of the second cylinder 4 straight up and fixed connects
It is connected to the second fixed link 6, diameter of the internal diameter of two through-holes 9 respectively with the first fixed link 5 and the second fixed link 6 matches, and half
Circular glass cover 7 is made of transparent glass, can make the first fixed link 5 and second by the first cylinder 3 of starting and the second cylinder 4
Fixed link 6 is inserted into semicircle cloche 7.
It is bonded with sealing ring 16 on the inner wall of each through-hole 9 and jack 15, in vacuum air pump 8 to half circular glass cover
After 7 pumpings, sealing ring 16 can make the gap in through-hole 9 and jack 15 closed, prevent air from entering half by through-hole 9 and jack 15
In circular glass cover 7.
The one end of first fixed link 5 far from the first cylinder 3 is inserted into semicircle cloche 7 and is fixedly connected by through-hole 9
There is the first sealing plate 10, the one end of the second fixed link 6 far from the second cylinder 4 is inserted into semicircle cloche 7 and is consolidated by through-hole 9
Surely it is connected with the second sealing plate 11, the lower wall of the first sealing plate 10 is fixedly connected with the first chip 13, the second sealing plate 11
Upper side wall is fixedly connected with the second chip 14, can be by the first core before carrying out Heat Sealing to the first chip 13 and the second chip 14
Piece 13 and the second chip 14 are respectively installed on the first sealing plate 10 and the second sealing plate 11, start the first cylinder 3 and the second gas
Cylinder 4 is inserted into the first chip 13 and the second chip 14 in semicircle cloche 7, restarts vacuum air pump 8, vacuum suction
Air in double of end of the pumping circular glass cover 7 of machine 8 is extracted, and the inside of semicircle cloche 7 is made to be in relative vacuum
State.
Installation cavity is offered in first sealing plate 10 and the second sealing plate 11, is installed with heating sheet in each installation cavity
12, when carrying out Heat Sealing to the first chip 13 and the second chip 14, it can be again started up the first cylinder 3 and the second cylinder 4, make the
One chip 13 and the second chip 14 are adjacent to each other, and are close together, and restart heating sheet 12, can be to the first chip 13 and
Two chips 14 carry out the connection type and Starting mode of Heat Sealing, heating sheet 12 and the first sealing plate 10 and the second sealing plate 11
It is the prior art, details are not described herein.
It further illustrates, it is above-mentioned to be fixedly connected unless specifically defined or limited otherwise, otherwise to shall be understood in a broad sense, example
Such as, it can be welding, be also possible to gluing, or be integrally formed the customary means well known to those skilled in the art such as setting.
It, can be by 13 He of the first chip before carrying out Heat Sealing to the first chip 13 and the second chip 14 in the utility model
Second chip 14 is respectively installed on the first sealing plate 10 and the second sealing plate 11, is started the first cylinder 3 and the second cylinder 4, is made
First chip 13 and the second chip 14 are inserted into semicircle cloche 7, restart vacuum air pump 8, the pumping of vacuum air pump 8
Air in the circular glass cover 7 of double of gas end is extracted, and the inside of semicircle cloche 7 is made to be in the state of relative vacuum.
When carrying out Heat Sealing to the first chip 13 and the second chip 14, the first cylinder 3 and the second cylinder can be again started up
4, keep the first chip 13 and the second chip 14 adjacent to each other, and be close together, restarts heating sheet 12, it can be to the first chip
13 and second chip 14 carry out Heat Sealing.
After vacuum air pump 8 is to the pumping of half circular glass cover 7, sealing ring 16 can make the gap in through-hole 9 and jack 15
It is closed, prevent air from entering in semicircle cloche 7 by through-hole 9 and jack 15.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (6)
1. the sealing device of polymer chip, including body (1), which is characterized in that fixed between the inner wall of the body (1) to connect
It being connected to placement plate (2), the upper side wall of the placement plate (2) is fixedly connected with the semicircle cloche (7) for setting of standing upside down, and described half
It is offered on circular glass cover (7) jack (15), is equipped with vacuum mechanism in the body (1), the vacuum mechanism includes and machine
The pumping end of the vacuum air pump (8) that the side wall of body (1) is fixedly connected, the vacuum air pump (8) is inserted by jack (15)
In semicircle cloche (7), offered through-hole (9) on the placement plate (2) and semicircle cloche (7), the body (1)
Inner roof wall be fixedly connected with the first cylinder (3), the inner bottom wall of the body (1) is fixedly connected with the second cylinder (4).
2. the sealing device of polymer chip according to claim 1, which is characterized in that the drive of first cylinder (3)
Moved end straight down and is fixedly connected with the first fixed link (5), and the driving end of second cylinder (4) straight up and fixed connects
It is connected to the second fixed link (6), the internal diameter of two through-holes (9) is straight with the first fixed link (5) and the second fixed link (6) respectively
Diameter matches, and the semicircle cloche (7) is made of transparent glass.
3. the sealing device of polymer chip according to claim 2, which is characterized in that first fixed link (5) is remote
One end from the first cylinder (3) is inserted into semicircle cloche (7) by through-hole (9) and is fixedly connected with the first sealing plate
(10), the one end of second fixed link (6) far from the second cylinder (4) is inserted into semicircle cloche (7) simultaneously by through-hole (9)
It is fixedly connected with the second sealing plate (11).
4. the sealing device of polymer chip according to claim 3, which is characterized in that first sealing plate (10)
Lower wall is fixedly connected with the first chip (13), and the upper side wall of second sealing plate (11) is fixedly connected with the second chip
(14).
5. the sealing device of polymer chip according to claim 4, which is characterized in that it is described first sealing plate (10) and
Installation cavity is offered in second sealing plate (11), heating sheet (12) are installed in each installation cavity.
6. the sealing device of polymer chip according to claim 1, which is characterized in that each through-hole (9) and insert
Sealing ring (16) are bonded on the inner wall in hole (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920059155.0U CN209367797U (en) | 2019-01-15 | 2019-01-15 | The sealing device of polymer chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920059155.0U CN209367797U (en) | 2019-01-15 | 2019-01-15 | The sealing device of polymer chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209367797U true CN209367797U (en) | 2019-09-10 |
Family
ID=67825312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920059155.0U Expired - Fee Related CN209367797U (en) | 2019-01-15 | 2019-01-15 | The sealing device of polymer chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209367797U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113797984A (en) * | 2021-09-10 | 2021-12-17 | 姜春梅 | Full-automatic accurate involution device of polymer chip |
-
2019
- 2019-01-15 CN CN201920059155.0U patent/CN209367797U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113797984A (en) * | 2021-09-10 | 2021-12-17 | 姜春梅 | Full-automatic accurate involution device of polymer chip |
| CN113797984B (en) * | 2021-09-10 | 2022-04-26 | 姜春梅 | Full-automatic accurate involution device of polymer chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Building 5, No. 57, Jinfu Avenue, Gunan street, Qijiang District, Chongqing Patentee after: Huaxin Zhizao Microelectronics (Chongqing) Co.,Ltd. Address before: Building 5, No. 57, Jinfu Avenue, Guinan street, Qijiang County, Chongqing Patentee before: Huaxin Zhisheng Microelectronics (Chongqing) Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190910 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |