CN209345434U - A kind of pad, circuit board and electronic device - Google Patents
A kind of pad, circuit board and electronic device Download PDFInfo
- Publication number
- CN209345434U CN209345434U CN201821606637.5U CN201821606637U CN209345434U CN 209345434 U CN209345434 U CN 209345434U CN 201821606637 U CN201821606637 U CN 201821606637U CN 209345434 U CN209345434 U CN 209345434U
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- counterbore
- pad
- copper
- layers
- solder mask
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Abstract
The utility model relates to a kind of pads, its described pad includes solder mask, layers of copper and substrate layer, the solder mask, layers of copper and substrate layer are cascading, welding section is provided on the pad, counterbore is provided in the welding section, the counterbore passes through the solder mask and is deep into the layers of copper.The utility model further relates to a kind of circuit board and electronic device.The utility model by being provided with counterbore in welding region in advance, counterbore gos deep into the layers of copper of pad, when needing to weld electronic component, is welded and fixed after welding region removing solder mask with electronic component, soldering paste is formed with column in counterbore, and thus the weld strength of pad and electronic component can enhance.
Description
Technical field
The utility model relates to printed circuit technique field more particularly to a kind of pads, circuit board and electronic device.
Background technique
Pad, the basic Component units of surface mount assembly, for constituting the welding disk pattern (land of circuit board
Pattern), i.e., the various pad combinations for the design of particular components type.
Along with the fast development shielded with backlight module comprehensively, the LED light in backlight module has the hair of microminiaturization
Exhibition trend, the pad design space for leaving LED light for as a result, is also smaller and smaller, however, for the SMT of LED light and flexible circuit board
The thrust of welding, coplanar and conllinear etc. requirements can't reduce, and therefore, the pad and component for how making area smaller and smaller weld
Still having qualified weld strength after connecing is the project for being worth research.
Summary of the invention
Technical problem to be solved in the utility model is that the welding after welding pad with electronic component is strong
Du Genggao.
The utility model solves technical solution used by above-mentioned technical problem:
A kind of pad, the pad include solder mask, layers of copper and substrate layer, the solder mask, layers of copper and substrate layer according to
It is secondary to be stacked, it is provided with welding section on the pad, counterbore is provided in the welding section, the counterbore passes through the welding resistance
Layer is simultaneously deep into the layers of copper.
In a preferred embodiment, the counterbore is provided with one, and the counterbore is located in the welding section
The heart.
In a preferred embodiment, there are three the counterbore settings, three counterbore distributions triangular in shape.
In a preferred embodiment, the solder mask is Kapton.
In a preferred embodiment, the layers of copper in the counterbore is also covered with one layer of organic guarantor and welds film.
A kind of circuit board includes above-mentioned pad.
A kind of electronic device includes above-mentioned circuit board, further includes having electronic component, the electronic component is welded and fixed
On the pad, column is formed in the counterbore, one end of the column is fixedly connected with the electronic component
The beneficial effects of the utility model are:
By being provided with counterbore in advance in welding region, counterbore gos deep into the layers of copper of pad the utility model, when needing to weld
When electronic component, it is welded and fixed after welding region removing solder mask with electronic component, soldering paste is formed with column in counterbore,
Thus the weld strength of pad and electronic component can enhance.
Detailed description of the invention
The utility model is described further with reference to the accompanying drawings and examples.
Fig. 1 is the schematic diagram of the pad of the utility model one embodiment；
Fig. 2 is the schematic diagram of the pad of the utility model another embodiment；
Fig. 3 is the structural schematic diagram of the welding region of the utility model one embodiment.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to the design of the utility model, specific structure and generation
Clear, complete description, to be completely understood by the purpose of this utility model, scheme and effect.It should be noted that not conflicting
In the case where, the features in the embodiments and the embodiments of the present application can be combined with each other.
It should be noted that unless otherwise specified, when a certain feature referred to as " fixation ", " connection " are in another feature,
It can directly fix, be connected to another feature, and can also fix, be connected to another feature indirectly.In addition, this
The descriptions such as upper and lower, left and right used in utility model are only the phase relative to each component part of the utility model in attached drawing
For mutual positional relationship.
In addition, unless otherwise defined, the technology of all technical and scientific terms used herein and the art
The normally understood meaning of personnel is identical.Term used in the description is intended merely to description specific embodiment herein, without
It is to limit the utility model.Term " and or " used herein includes appointing for one or more relevant listed items
The combination of meaning.
Referring to Figure 1 and Figure 3, Fig. 1 is the schematic diagram of the pad of the utility model one embodiment, in the present embodiment, weldering
Disk includes non-solder region 1 and welding region 2, and the structure of welding region 2 includes solder mask 22, glue-line 23,24 and of layers of copper
Substrate layer 25, solder mask 22 are that electronic component (such as LED light) can be welded to by Kapton after solder mask 22 is removed
In layers of copper 24, in the development process that bonding pad area tends to be smaller and smaller, 2 area of welding region is smaller, the intensity after welding
It is lower, it is easy to fall off after electronic component welding, by the way that counterbore 21 is pre-machined in welding region 2, counterbore 21 is deep into layers of copper
Certain depth in 24 after electronic component is welded in layers of copper 24, is formed with column in counterbore 21, thus electronic component and weldering
Weld strength between disk can be improved.
Multiple counterbores 21 can be processed in welding region 2, in the present embodiment to further increase weld strength referring to Fig. 2
In, there are three counterbore 21, three counterbores 21 to arrange in triangular shape for processing, thus can prevent electronic element rotation offset.
To prevent the layers of copper 24 after processing counterbore 21 by air corrosion, the layers of copper 24 in counterbore 21 can be carried out at coating
Reason is such as covered with one layer of organic guarantor using OSP technique and welds film, thus can prevent oxygen from corroding.
It is to be illustrated to the preferable implementation of the utility model, but the invention is not limited to the reality above
Example is applied, those skilled in the art can also make various equivalent variations without departing from the spirit of the present invention
Or replacement, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (7)
1. a kind of pad, which is characterized in that the pad includes solder mask, layers of copper and substrate layer, the solder mask, layers of copper and
Substrate layer is cascading, and welding section is provided on the pad, and counterbore is provided in the welding section, and the counterbore passes through
The solder mask is simultaneously deep into the layers of copper.
2. pad according to claim 1, which is characterized in that the counterbore is provided with one, and the counterbore is located at described
The center of welding section.
3. pad according to claim 1, which is characterized in that there are three the counterbore settings, and three counterbores are in three
Angular distribution.
4. pad according to claim 1, which is characterized in that the solder mask is Kapton.
5. pad according to claim 1, which is characterized in that the layers of copper in the counterbore is also covered with one layer of organic guarantor's weldering
Film.
6. a kind of circuit board, which is characterized in that including just like pad described in any one of claim 1 to 5.
7. a kind of electronic device, which is characterized in that include circuit board as claimed in claim 6, further includes having electronic component,
The electronic component is weldingly fixed on the pad, and column, one end of the column and the electricity are formed in the counterbore
Subcomponent is fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821606637.5U CN209345434U (en) | 2018-09-29 | 2018-09-29 | A kind of pad, circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821606637.5U CN209345434U (en) | 2018-09-29 | 2018-09-29 | A kind of pad, circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209345434U true CN209345434U (en) | 2019-09-03 |
Family
ID=67746173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821606637.5U Active CN209345434U (en) | 2018-09-29 | 2018-09-29 | A kind of pad, circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209345434U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770504A (en) * | 2020-11-26 | 2021-05-07 | 景德镇市恒耀电子科技有限公司 | Method for processing countersunk hole of multilayer circuit board |
-
2018
- 2018-09-29 CN CN201821606637.5U patent/CN209345434U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770504A (en) * | 2020-11-26 | 2021-05-07 | 景德镇市恒耀电子科技有限公司 | Method for processing countersunk hole of multilayer circuit board |
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