CN209295712U - A kind of water-cooling heat radiating device of the parallel fin module of band - Google Patents
A kind of water-cooling heat radiating device of the parallel fin module of band Download PDFInfo
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- CN209295712U CN209295712U CN201821716600.8U CN201821716600U CN209295712U CN 209295712 U CN209295712 U CN 209295712U CN 201821716600 U CN201821716600 U CN 201821716600U CN 209295712 U CN209295712 U CN 209295712U
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Abstract
The utility model relates to a kind of water-cooling heat radiating devices of the parallel fin module of band, including coldplate；It is provided with one or more flow path grooves moved for water cooling liquid stream on coldplate, is connected to the inlet entered for water cooling liquid with flow path groove, and is connected to the liquid outlet for the discharge of water cooling liquid with flow path groove；The side surface of coldplate is provided with the first heat-conducting plate and installs the first mounting groove of heat-conducting plate；The multiple radiating fin units for protruding into flow path groove are provided on first heat-conducting plate；A kind of water-cooling heat radiating device of the parallel fin module of band, have easy processing, good heat dissipation, it is small in size the advantages that.
Description
Technical field
The utility model relates to water cooling technology fields, more specifically to a kind of parallel fin module of band
Water-cooling heat radiating device.
Background technique
The device to radiate in conjunction with fin and water cooling is commonplace, when needing Multicarity fin to radiate on workpiece,
Current most of using integrated cascaded structure fin module, i.e., in the same plane, processing walks all radiating fins
Rapid is integrated teeth, and fin is then divided into multimode form using machine cut mode；But since fin thickness is general
Less than 1mm, when machine cut, easily causes fin overlapping skew, and not only the quality of production is bad, and can cause to bear to heat dissipation effect
Face is rung.Especially when cooling requirements need to be greater than 500W, the fin modular structure of cascaded structure is needed by increasing dissipating for fin
Thermal interface reaches heat dissipation performance requirement, but sometimes workpiece size it has been determined that continue growing fin area of dissipation can be with
Technique requires conflict, so that product is unqualified.Therefore, in order to solve problem above, need to design a kind of using more radiating modules
Composition, so that it is guaranteed that parallel heat abstractor easy to process.
Utility model content
The technical problem to be solved by the present invention is in view of the above drawbacks of the prior art, it is in parallel provide a kind of band
The water-cooling heat radiating device of formula fin module.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
Construct a kind of water-cooling heat radiating device of parallel fin module of band, wherein including coldplate；It is set on the coldplate
It is equipped with one or more flow path grooves moved for water cooling liquid stream, is connected to the inlet entered for the water cooling liquid with the flow path groove,
The liquid outlet for water cooling liquid discharge is connected to with the flow path groove；The side surface of the coldplate is provided with the first heat-conducting plate
With the first mounting groove for installing the heat-conducting plate；The multiple heat dissipations for protruding into the flow path groove are provided on first heat-conducting plate
Fin unit.
Preferably, each radiating fin unit includes one or more pieces radiating fins.
Preferably, the coldplate includes the runner plate being fixedly connected and the first cover board；The runner plate is provided with described
Inlet, the liquid outlet and one or more flow path grooves；First cover board is provided with first heat-conducting plate, and with
First mounting groove of the flow path groove connection.
Preferably, the flow path groove runs through the runner plate；The coldplate further includes cover the flow path groove second
Cover board；The side of the runner plate is fixed with first cover board, and the other side is fixed with second cover board.
Preferably, second cover board is provided with the second heat-conducting plate and installs the second mounting groove of second heat-conducting plate；
Second mounting groove is connected to the flow path groove；The multiple institutes for protruding into the flow path groove are provided on second heat-conducting plate
State radiating fin unit.
Preferably, the side of the flow path groove is connected to first mounting groove, and the other side and second mounting groove
Connection.
Preferably, there are two the flow path grooves for setting；The runner plate is provided with through slot and separates the through slot at two
The partition of a flow path groove；The radiating fin unit there are two settings on first heat-conducting plate, and two heat dissipations
There are gaps corresponding with the thickness of the partition between fin unit；There are two the radiating fins for setting on second heat-conducting plate
Blade unit, and there are the gaps between two radiating fin units.
Preferably, it is provided with and corresponds two inlets being connected to two flow path grooves；It is provided with and two
A flow path groove corresponds two liquid outlets of connection.
The utility model has the beneficial effects that: the design will compared with the previous structure for using integrated fin module
Integration fin is divided into multiple radiating fin units, then each radiating fin unit, Ji Nengyou are installed by one first heat-conducting plate
Effect reduces the difficulty of processing fin, and good heat dissipation effect can be realized by way of fin in parallel；Simultaneously with it is previous straight
It connects for radiating fin unit to be directly exposed to air and compare, the design is to absorb outside heat by the first heat-conducting plate, and pass through
From radiating fin unit by heat to conducting inside coldplate, heat is walked by the water cooling liquid band in flow path groove, can be by heat
It concentrates on inside coldplate radiating, it is small to the temperature interference of external environment, it ensure that good heat dissipation effect, make simultaneously
Overall structure is more compact, occupies little space；Therefore, single unit system have easy processing, good heat dissipation, it is small in size the advantages that.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below in conjunction with attached drawing
And the utility model is described in further detail for embodiment, the accompanying drawings in the following description is only that the part of the utility model is implemented
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other accompanying drawings:
Fig. 1 is a kind of water-cooling heat radiating device explosion signal of the parallel fin module of band of the utility model preferred embodiment
Figure.
Specific embodiment
It is practical below in conjunction with this in order to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Technical solution in new embodiment carries out clear, complete description, it is clear that described embodiment is the portion of the utility model
Point embodiment, rather than whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not being paid
Every other embodiment obtained, belongs to the protection scope of the utility model under the premise of creative work.
A kind of water-cooling heat radiating device of the parallel fin module of band of the utility model preferred embodiment is as shown in Figure 1；Packet
Include coldplate 1；It is provided with one or more flow path grooves 180 moved for water cooling liquid stream on coldplate 1, is connected to confession with flow path groove 180
The inlet 181 that water cooling liquid enters, and the liquid outlet 182 being discharged for water cooling liquid is connected to flow path groove 180；The side table of coldplate 1
Face is provided with the first mounting groove 183 of the first heat-conducting plate 20 and installation heat-conducting plate 20；It is provided on first heat-conducting plate 20 and protrudes into
Multiple radiating fin units 21 of flow path groove 180；Compared with the previous structure for using integrated fin module, the design will be one
Body fin is divided into multiple radiating fin units 21, then installs each radiating fin unit 21 by one first heat-conducting plate 20, can
The difficulty of processing fin is effectively reduced, and good heat dissipation effect can be realized by way of fin in parallel；Simultaneously with it is previous
Directly radiating fin unit is directly exposed to air and is compared, the design is to absorb outside heat by the first heat-conducting plate 20,
And via radiating fin unit 21 by heat to conducting inside coldplate 1, heat is walked by the water cooling liquid band in flow path groove 180,
Heat can be concentrated on inside coldplate 1 radiating, guarantee good heat dissipation effect, while dry to the temperature of external environment
It disturbs small.
As shown in Figure 1, each radiating fin unit 21 includes one or more pieces radiating fins, radiating fin is more, and heat passes
It is fast to lead speed.
As shown in Figure 1, coldplate 1 includes the runner plate 10 and the first cover board 11 being fixedly connected；Runner plate 10 be provided with into
Liquid mouth 181, liquid outlet 182 and one or more flow path grooves 180；First cover board 11 is provided with the first heat-conducting plate 20, and and runner
The first mounting groove 183 that slot 180 is connected to, and directly produces the cooling with inlet 181, liquid outlet 182 and flow path groove 180
Plate 1 is compared, and by coldplate 1 being split into runner plate 10 and 11 two parts of the first cover board produce, processing can be effectively reduced
Difficulty and production cost.
As shown in Figure 1, flow path groove 180 runs through runner plate 10；Coldplate 1 further includes the second cover board for covering flow path groove 180
12；The side of runner plate 10 and the first cover board 11 are fixed, and the other side and the second cover board 12 are fixed, and coldplate 1 is split into stream
Guidance tape 10, the first cover board 11 and 12 three parts of the second cover board are produced, and difficulty of processing, while the first cover board 11 can be effectively reduced
Flow path groove 180 is covered by cooperation with the second cover board 12, can guarantee that water cooling liquid carries out proper flow heat dissipation, be not in leakage feelings
Condition.
As shown in Figure 1, the second cover board 12 is provided with the second mounting groove of the second heat-conducting plate 22 of the second heat-conducting plate 22 and installation
184；Second mounting groove 184 is connected to flow path groove 180；It is provided on second heat-conducting plate 22 and protrudes into the multiple scattered of flow path groove 180
The first heat-conducting plate 20 and the second heat-conducting plate is arranged compared with single heat absorbing member is arranged in hot fin unit 21 in a flow path groove 180
22 two groups of heat absorbing units can absorb more heats, so that radiating efficiency is more preferable.
As shown in Figure 1, the side of flow path groove 180 is connected to the first mounting groove 183, and the other side and the second mounting groove 184
Connection, with only 180 side of flow path groove be arranged two groups of heat absorbing units compared with, by two groups of heat absorbing units, one group of setting in flow path groove
180 front end, the layout type of another group of rear end that flow path groove 180 is arranged in makes the stress of runner plate 10 more balanced, and energy
The time of contact for extending water cooling liquid and radiating fin unit 21, so that heat dissipation effect is more preferable.
As shown in Figure 1, there are two flow path grooves 180 for setting；Runner plate 10 be provided with through slot 185 and by through slot 185 partition at
The partition 13 of two flow path grooves 180；Radiating fin unit 21 there are two settings on first heat-conducting plate 20, and two radiating fin lists
There are gaps 280 corresponding with the thickness 13 of partition 13 between member 21；There are two radiating fin units for setting on second heat-conducting plate 22
21, and there are gaps 280 between two radiating fin units 21, it is ensured that partition 13 will not generate interference with radiating fin unit 21.
Two inlets 181 being connected to are corresponded with two flow path grooves 180 as shown in Figure 1, being provided with；It is provided with and two
A flow path groove 180 corresponds two liquid outlets 182 of connection, manages multiple streams with an inlet 181, a liquid outlet 182
The mode of road slot 180 is compared, and each flow path groove 180 has individual inlet 181 and a liquid outlet 182, in a certain flow path groove
When blocking or leakage occur for 180 inlet 181 or a liquid outlet 182, other flow path grooves 180 will not be impacted, other
Flow path groove 180 can still provide for work of normally radiating.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations all should belong to the protection scope of the appended claims for the utility model.
Claims (8)
1. a kind of water-cooling heat radiating device of the parallel fin module of band, which is characterized in that including coldplate；It is set on the coldplate
It is equipped with one or more flow path grooves moved for water cooling liquid stream, is connected to the inlet entered for the water cooling liquid with the flow path groove,
The liquid outlet for water cooling liquid discharge is connected to with the flow path groove；The side surface of the coldplate is provided with the first heat-conducting plate
With the first mounting groove for installing the heat-conducting plate；The multiple heat dissipations for protruding into the flow path groove are provided on first heat-conducting plate
Fin unit.
2. the apparatus according to claim 1, which is characterized in that each radiating fin unit includes that one or more pieces are dissipated
Hot fin.
3. the apparatus according to claim 1, which is characterized in that the coldplate includes the runner plate being fixedly connected and first
Cover board；The runner plate is provided with the inlet, the liquid outlet and one or more flow path grooves；First cover board
It is provided with first heat-conducting plate, and first mounting groove being connected to the flow path groove.
4. device according to claim 3, which is characterized in that the flow path groove runs through the runner plate；The coldplate
It further include the second cover board for covering the flow path groove；The side of the runner plate is fixed with first cover board, and the other side with
Second cover board is fixed.
5. device according to claim 4, which is characterized in that second cover board is provided with the second heat-conducting plate and installation institute
State the second mounting groove of the second heat-conducting plate；Second mounting groove is connected to the flow path groove；It is arranged on second heat-conducting plate
There are the multiple radiating fin units for protruding into the flow path groove.
6. device according to claim 5, which is characterized in that the side of the flow path groove and first mounting groove connect
It is logical, and the other side is connected to second mounting groove.
7. device according to claim 5, which is characterized in that there are two the flow path grooves for setting；The runner plate setting
There is through slot, and by through slot partition at the partition of two flow path grooves；There are two described for setting on first heat-conducting plate
Radiating fin unit, and there are gaps corresponding with the thickness of the partition between two radiating fin units；Described second
There are two the radiating fin units for setting on heat-conducting plate, and there are the gaps between two radiating fin units.
8. device according to claim 7, which is characterized in that be provided with to correspond with two flow path grooves and be connected to
Two inlets；It is provided with and corresponds two liquid outlets being connected to two flow path grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821716600.8U CN209295712U (en) | 2018-10-22 | 2018-10-22 | A kind of water-cooling heat radiating device of the parallel fin module of band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821716600.8U CN209295712U (en) | 2018-10-22 | 2018-10-22 | A kind of water-cooling heat radiating device of the parallel fin module of band |
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| Publication Number | Publication Date |
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| CN209295712U true CN209295712U (en) | 2019-08-23 |
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| CN201821716600.8U Active CN209295712U (en) | 2018-10-22 | 2018-10-22 | A kind of water-cooling heat radiating device of the parallel fin module of band |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111432596A (en) * | 2020-02-18 | 2020-07-17 | 天津大学 | Water-cooling platform and water-cooling heat dissipation device for lithium niobate-based surface acoustic wave device and using method of water-cooling platform and water-cooling heat dissipation device |
-
2018
- 2018-10-22 CN CN201821716600.8U patent/CN209295712U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111432596A (en) * | 2020-02-18 | 2020-07-17 | 天津大学 | Water-cooling platform and water-cooling heat dissipation device for lithium niobate-based surface acoustic wave device and using method of water-cooling platform and water-cooling heat dissipation device |
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