CN209283648U - A kind of Full-automatic spot gluing chip mounter - Google Patents
A kind of Full-automatic spot gluing chip mounter Download PDFInfo
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- CN209283648U CN209283648U CN201821435778.5U CN201821435778U CN209283648U CN 209283648 U CN209283648 U CN 209283648U CN 201821435778 U CN201821435778 U CN 201821435778U CN 209283648 U CN209283648 U CN 209283648U
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Abstract
The utility model relates to dispensing chip mounter technical fields, refer in particular to a kind of Full-automatic spot gluing chip mounter, it includes mainframe, and mainframe is equipped with supporting table for carrying patch glass, for patch glass to be transmitted in supporting table or the patch glass for being carried on supporting table is removed the transport mechanism of supporting table, the positioning mechanism for being used to position dispensing patch location and is used for set on positioning mechanism the dispensing paster component to the dispensing of patch glass and patch.The communicated mechanism of patch glass is sent to supporting table, then dispensing and patch are completed via dispensing paster component on supporting table, the patch glass transmission for having completed dispensing and patch is removed supporting table again by last transport mechanism, and it is higher which controls higher, product high production efficiency, integrated level and the degree of automation to the position precision of dispensing and patch.
Description
Technical field
The present invention relates to dispensing chip mounter technical fields, refer in particular to a kind of Full-automatic spot gluing chip mounter.
Background technique
It is frequently necessary to carry out dispensing and patch to workpiece in the production process of electronic product.Currently, in the industry to large size
LED and other electronic components are all to carry out separate operaton to workpiece respectively by dispenser and chip mounter, are in paster glass first
Local dispensing on glass to mounted LED lamp piece is wanted, then again in local mounted LED lamp piece for dispensing glue, i.e., first dispensing bak stay.But
It is that existing large-scale dispensing chip mounter there is problems:
1. the requirement due to LED intelligent transparent glass screen for the position precision of dispensing and patch is very high, such as conducting resinl
The diameter sent forth in setting regions is 0.5mm~1.2mm, and dispensing position precision is 0.03mm, and the offset distance tolerance of patch is
± 0.1mm, but current large-scale dispensing chip mounter is difficult to control accurately the position and region of dispensing and patch, dispensing patch essence
Degree it is difficult to ensure that, the quality of LED intelligent transparent glass screen also cannot be guaranteed；
2. the rate of suitable control dispensing and patch is needed in order to improve the precision of dispensing and patch, thus it is existing big
Type dispensing chip mounter production efficiency is relatively low, it is difficult to meet the requirement of mass production；
3. the integrated level of equipment is lower, the degree of automation is lower.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of Full-automatic spot gluing chip mounters, have the position to dispensing and patch
Set higher precision controlling, high production efficiency of product, integrated level and the higher advantage of the degree of automation.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme:
A kind of Full-automatic spot gluing chip mounter comprising mainframe, the mainframe are equipped with for carrying patch glass
Supporting table, the biography for patch glass to be transmitted in supporting table to or removes the patch glass for being carried on supporting table supporting table
The positioning mechanism that send mechanism, the dispensing patch location of patch glass for being carried to supporting table to be positioned and it is set to positioning
Mechanism and for the dispensing paster component of the dispensing of patch glass and patch；
The transport mechanism includes lifting assembly and multiple first band transfer assemblies for conveying patch glass, Duo Gesuo
It states first band transfer assembly and is located at the supporting table two sides, the lifting assembly is fixed on mainframe, and multiple described first
Band transfer assembly is carried on lifting assembly, and the lifting assembly is for driving first band transfer assembly to rise so that first band transmits
The upper surface of component is higher than the upper surface of supporting table and for driving first band transfer assembly to decline so that first band transfer assembly
Upper surface be lower than supporting table upper surface；
The positioning mechanism includes the X-axis moving assembly being fixed on mainframe, the Y-axis connecting with X-axis moving assembly shifting
Dynamic component, the Z axis moving assembly being connect with Y-axis moving assembly, the Z axis moving assembly equipped with respectively with X-axis moving assembly,
The CCD autonavigator that Y-axis moving assembly, Z axis moving assembly are electrically connected, the CCD autonavigator are mobile for controlling X-axis
Component, Y-axis moving assembly and Z axis moving assembly are so that dispensing paster component is moved to dispensing patch location；
The dispensing paster component includes the dispensing part and patch part being located on Z axis moving assembly.
Further, the lifting assembly includes the crane connecting with mainframe vertical sliding and for driving crane
The vertical actuator slided up and down, the first band transfer assembly include that rotation is carried on the first driving wheel of crane, carrying
In crane the first driven wheel, be set between the first driving wheel and the first driven wheel the first conveyer belt, for driving the
First actuator of one driving wheel rotation.
Further, sensor, controller are additionally provided on the mainframe, the sensor is located at the one of the first conveyer belt
End and the position for being used to detect patch glass, the controller are electrically connected with vertical actuator and the first actuator respectively；
When the patch glass is delivered to the surface of supporting table by the first conveyer belt, the patch glass triggering sensing
Device exports enabling signal；
When the controller receives the enabling signal of sensor output, the first actuator of control stops working, the control
Device processed controls vertical actuator starting, and the vertical actuator drives the first conveyer belt to decline the upper surface so that the first conveyer belt
Lower than the upper surface of supporting table.
Further, the X-axis moving assembly includes two X-axis slide rails disposed in parallel, two X-axis slide rail difference
Positioned at first band transfer assembly two sides, the first sliding block is slidably connected on each first sliding block, on each first sliding block
Equipped with the X-axis drive for driving the first sliding block to slide along X-axis slide rail；The Y-axis moving assembly includes that both ends are fixed respectively
Gantry support on two the first sliding blocks, the gantry support are equipped with Y-axis sliding rail, slidably connect on the Y-axis sliding rail
Second sliding block, second sliding block are equipped with the Y-axis actuator for driving the second sliding block to slide along Y-axis sliding rail；The Z axis moves
Dynamic component includes the Z axis slide rail for being fixed on the second sliding block, the third sliding block for being slidably connected to Z axis slide rail and is fixed on third sliding block
And the Z axis actuator for driving third sliding block to slide along Z axis slide rail；The X-axis slide rail, Y-axis sliding rail, Z axis slide rail are mutual two-by-two
It is perpendicular.
Further, the dispensing part includes the glue valve for storing up the gel quantity of the glue bucket of glue and control glue bucket, the glue
Bucket is connected with glue valve, is connected on the glue valve for Jiao Zui for dispensing glue.
Further, the patch part includes multiple material sucking mouths for adsorbing patch and for driving multiple material sucking mouths to turn
Dynamic rotating drive part, multiple material sucking mouths are connected with rotating drive part respectively, and one end of the Y-axis moving assembly, which is equipped with, to be used
In providing the supply disk of patch for material sucking mouth.
Further, the supply disk is equipped with multiple for accommodating the material reserve channel of patch, the Y-axis moving assembly and Z axis
Moving assembly driving material sucking mouth is moved to supply disk and adsorbs patch from material reserve channel.
Further, the side of the mainframe and be located at first band transfer assembly one end be equipped with slave frame, the pair
Rack is equipped with the second band transfer assembly for transmitting patch glass, and the second band transfer assembly includes that rotation is carried on slave
The second driving wheel and the second driven wheel of frame, the second conveyer belt being set between the second driving wheel and the second driven wheel.
Further, the mainframe is equipped with blanking rack far from the side of slave frame, and the blanking machine, which is provided with, to be used for
The third band transfer assembly of patch glass is transmitted, the third is with the third master that transfer assembly includes that rotation is carried on blanking rack
Driving wheel and third driven wheel, the third conveyer belt being set between third driving wheel and third driven wheel.
Further, the mainframe is equipped with control display screen.
Beneficial effects of the present invention:
First, the communicated mechanism of patch glass is sent to supporting table, then via dispensing paster component on supporting table
Dispensing and patch are completed, the patch glass transmission for having completed dispensing and patch is removed supporting table again by last transport mechanism, should
Full-automatic spot gluing chip mounter controls higher, product high production efficiency, integrated level and automatic to the position precision of dispensing and patch
Change degree is higher；
Second, transport mechanism includes lifting assembly and multiple first band transfer assemblies for conveying patch glass, lifting
Component is fixed on mainframe, and multiple first band group transmission parts are carried on lifting assembly, and lifting assembly is for driving first band to transmit
Component rises so that the upper surface of first band transfer assembly is higher than upper surface and the driving first band transfer assembly decline of supporting table
So that the upper surface of first band transfer assembly is lower than the upper surface of supporting table, facilitate that patch glass is placed on supporting table is enterprising
The stability of row dispensing and patch, supporting table is high, to improve the precision of the dispensing of Full-automatic spot gluing chip mounter and patch.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the schematic perspective view of the embodiment of the present invention one；
Fig. 2 is the perspective view of the explosion of mainframe and transport mechanism in the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram of first band transfer assembly in the embodiment of the present invention one；
Fig. 4 is that the connection relationship of sensor in the embodiment of the present invention one, controller, vertical actuator and the first actuator is shown
It is intended to；
Fig. 5 is the structural schematic diagram of positioning mechanism in the embodiment of the present invention one；
Fig. 6 is the configuration schematic diagram of positioning mechanism in the embodiment of the present invention one；
Fig. 7 is the structural schematic diagram of one midpoint glue paster component of the embodiment of the present invention and supply disk；
Fig. 8 is the schematic perspective view of the embodiment of the present invention two.
Description of symbols: 100, mainframe；101, pilot hole；110, supporting table；120, sensor；130, controller；
140, display screen；200, transport mechanism；210, lifting assembly；211, crane；212, slide bar；220, first band transfer assembly；
221, the first driving wheel；222, the first driven wheel；223, the first conveyer belt；224, the first actuator；300, positioning mechanism；310,
X-axis moving assembly；311, X-axis slide rail；312, the first sliding block；313, X-axis drive；320, Y-axis moving assembly；321, gantry
Bracket；322, Y-axis sliding rail；323, the second sliding block；324, Y-axis actuator；330, Z axis moving assembly；331, Z axis slide rail；332,
Third sliding block；333, Z axis actuator；340, CCD autonavigator；400, dispensing paster component；410, dispensing part；411, glue
Bucket；412, glue valve；413, Jiao Zui；420, patch part；421, material sucking mouth；422, rotating drive part；423, supply disk；424, storing
Road；500, slave frame；510, the second band transfer assembly；600, blanking rack；610, third band transfer assembly；700, paster glass
Glass.
Specific embodiment
For the ease of the understanding of those skilled in the art, the present invention is made further below with reference to embodiment and attached drawing
Bright, the content that embodiment refers to not is limitation of the invention.
Embodiment one:
As shown in Figure 1, a kind of Full-automatic spot gluing chip mounter provided by the invention comprising mainframe 100, mainframe 100
It is equipped with the supporting table 110 for carrying patch glass 700, for patch glass 700 to be transmitted in supporting table 110 or incite somebody to action
The patch glass 700 for being carried on supporting table 110 removes the transport mechanism 200 of supporting table 110, for being carried to supporting table 110
Patch glass 700 on the positioning mechanism 300 that is positioned of dispensing patch location and be set to positioning mechanism 300 and for patch
The dispensing paster component 400 of 700 dispensing of sheet glass and patch.The communicated mechanism 200 of patch glass 700 is sent to supporting table
110, dispensing and patch then are completed via dispensing paster component 400 on supporting table 110, last transport mechanism 200 again will
The transmission of patch glass 700 for having completed dispensing and patch removes supporting table 110, the automation journey of the Full-automatic spot gluing chip mounter
Degree is high and working efficiency is fast.
As shown in Figure 1, Figure 2 and Figure 3, transport mechanism 200 is including lifting assembly 210 and for conveying patch glass 700
Multiple first band transfer assemblies 220, multiple first band transfer assemblies 220 are located at 110 two sides of supporting table.Here it supports
Platform 110 includes four blocks of marbles of the rectangular-shape being mounted on mainframe 100, four marble rectangular array arrangements and four
In same plane the supporting table 110 of other materials also can be used, cost is relatively low for marble, quality in a marmorean upper end surface
Relatively large, it is more stable to be used to support patch glass 700, and four marble rectangular arrays arrangements can increase supporting table
110 bearing area is suitable for large-scale patch glass 700.Here first band transfer assembly 220 is located at there are six setting
The two sides and middle position of four pieces of marble length directions.Lifting assembly 210 is fixed on mainframe 100, six first band transmission
Component 220 is carried on lifting assembly 210, and lifting assembly 210 is for driving first band transfer assembly 220 to rise so that first band passes
The upper surface of sending component 220 is higher than first band transfer assembly 220 declines in upper surface and driving of supporting table 110 so that first band
The upper surface of transfer assembly 220 is lower than the upper surface of supporting table 110.Six first band transfer assemblies 220 are passed patch glass 700
After being sent to the surface of supporting table 110, first band transfer assembly 220 is driven to decline for lifting assembly 210 so that first band transmits
The upper surface of component 220 be lower than supporting table 110 upper surface, patch glass 700 be placed in supporting table 110 carry out dispensing and
Patch, the high stability of supporting table 110 are not easy to influence the precision of dispensing and patch；After the completion of patch, drop part drives first band
Transfer assembly 220 rises so that the upper surface of first band transfer assembly 220 is higher than the upper surface of supporting table 110, first band transmission
Component 220, which supports patch glass 700 and transmitted, removes workspace.The degree of automation of the Full-automatic spot gluing chip mounter
High and working efficiency is fast, and the precision of dispensing and patch is higher.
Preferably, lifting assembly 210 includes the crane 211 connecting with 100 vertical sliding of mainframe and rises for driving
The vertical actuator (not shown in figure) that drop frame 211 slides up and down.It is provided with multiple pilot holes 101 on mainframe 100, rises
The multiple slide bars 212 for sliding setting one by one with multiple pilot holes 101 are respectively arranged on drop frame 211, vertical actuator is mounted on
On mainframe 100, vertical actuator connect with the bottom end of slide bar 212 and for driving crane 211 to glide along pilot hole 101
It is dynamic, vertical actuator here can using cylinder, hydraulic cylinder or other possess the framework of oscilaltion function.First band passes
Sending component 220 includes that rotation is carried on the first driving wheel 221 of crane 211, is carried on the first driven wheel of crane 211
222, it is set in the first conveyer belt 223 between the first driving wheel 221 and the first driven wheel 222, is used to drive the first driving wheel
Servo motor can be used in first actuator 224 of 221 rotations, the first actuator 224 here, and the output shaft of servo motor is solid
Surely it is connected to the axle center of the first driving wheel 221, the transmission speed and transmission direction of the first conveyer belt 223 of control can be facilitated, in turn
Facilitate the feeding process and blanking process of control patch glass 700, improves the degree of automation of Full-automatic spot gluing chip mounter.
Preferably, as shown in connection with fig. 4, in order to further increase the degree of automation of Full-automatic spot gluing chip mounter, mainframe
Sensor 120, controller 130 are additionally provided on 100, sensor 120 is located at one end of the first conveyer belt 223 and for detecting patch
The position of sheet glass 700, sensor 120 here can use infrared sensor or pressure sensor, and controller 130 is distinguished
The starting to control vertical actuator and the first actuator 224 is electrically connected with vertical actuator and the first actuator 224 and is stopped
Only.When patch glass 700 is delivered to the surface of supporting table 110 by the first conveyer belt 223, the output starting letter of sensor 120
Number；Controller 130 and the electrical connection of sensor 120 are to receive enabling signal, when controller 130 receives enabling signal, control
Device 130 processed controls the first actuator 224 and stops working, and controller 130 controls vertical actuator starting, vertical actuator driving the
One conveyer belt 223 declines so that the upper surface of the first conveyer belt 223 is lower than supporting table 110.
As shown in Figure 1 and Figure 5, positioning mechanism 300 includes being fixed on mainframe 100 and being located at first band transmission group
Two X-axis moving assemblies 310 of 220 direction of transfer two sides of part, the Y-axis moving assembly 320 being connect with X-axis moving assembly 310,
The Z axis moving assembly 330 connecting with Y-axis moving assembly 320, X-axis moving assembly 310 drive dispensing paster component 400 along support
The length direction of platform 110 is mobile, and Y-axis moving assembly 320 drives dispensing paster component 400 to move along the width direction of supporting table 110
Dynamic, Z axis moving assembly 330 drives dispensing paster component 400 to move along the short transverse of supporting table 110.Z axis moving assembly 330
Be equipped with CCD autonavigator 340, CCD autonavigator 340 respectively with X-axis moving assembly 310, Y-axis moving assembly 320, Z
Axis moving assembly 330 is electrically connected, and CCD autonavigator 340 is for controlling X-axis moving assembly 310, Y-axis moving assembly 320 and Z
Dispensing paster component 400 is moved to dispensing patch location by axis moving assembly 330.Dispensing paster component 400 is using CCD positioning system
System is positioned, and the position precision of dispensing and patch can be improved, and then improve the quality of product.
Preferably, as shown in connection with fig. 6, two X-axis moving assemblies 310 include X-axis slide rail 311, are slidably connected at X-axis cunning
The first sliding block 312 on rail 311 and the X-axis drive 313 for driving the first sliding block 312 to slide along X-axis slide rail 311.Here
Idler wheel can be installed on the first sliding block 312, X-axis drive 313 uses driving motor, and the output shaft and idler wheel of driving motor are solid
Fixed connection, to realize that the first sliding block 312 is moved along X-axis slide rail 311；Or X-axis slide rail 311 is made of permanent magnet, first
Sliding block 312 is floatation part, and X-axis drive 313 is magnetic suspension mechanism to drive floatation part to move in X-axis slide rail 311.
Y-axis moving assembly 320 includes that both ends are separately fixed at the gantry support 321 on two the first sliding blocks 312, gantry branch
Frame 321 is equipped with Y-axis sliding rail 322, and the second sliding block 323 is slidably connected on Y-axis sliding rail 322, and the second sliding block 323, which is equipped with, to be used
In the Y-axis actuator 324 for driving the second sliding block 323 to slide along Y-axis sliding rail 322.Rolling can be installed on the second sliding block 323 here
Wheel, Y-axis actuator 324 use driving motor, and the output shaft of driving motor is fixedly connected with idler wheel, to realize the second sliding block
323 move along Y-axis sliding rail 322；Or Y-axis sliding rail 322 is made of permanent magnet, the second sliding block 323 is floatation part, Y-axis driving
Part 324 is magnetic suspension mechanism to drive floatation part to move on Y-axis sliding rail 322.
Z axis moving assembly 330 includes the Z axis slide rail 331 for being fixed on the second sliding block 323, is slidably connected to Z axis slide rail 331
Third sliding block 332 and be fixed on Z axis of the third sliding block 332 for driving third sliding block 332 slide along Z axis slide rail 331 and drive
Part 333.Rack gear can be set in Z axis slide rail 331 here, and the gear of connection, Z is engaged with rack in setting on third sliding block 332
Shaft driver 333 is driving motor, is provided with worm and gear locking mechanism on the output shaft of driving motor, worm and gear locks machine
Structure is connect with gear, so that the short transverse for reaching driving third sliding block 332 along supporting table 110 is slided；Or Z axis slide rail 331
It is made of permanent magnet, third sliding block 332 is floatation part, and Z axis actuator 333 is magnetic suspension mechanism to drive floatation part in Z
It is moved on axis sliding rail 331.
Particularly, X-axis slide rail 311 is parallel with the length direction of supporting table 110, the width of Y-axis sliding rail 322 and supporting table 110
Degree direction is parallel, and Z axis slide rail 331 is parallel with the height degree direction of supporting table 110.Pass through X-axis moving assembly 310, the mobile group of Y-axis
The mutually coordinated running of part 320 and Z axis moving assembly 330, so that the patch of Full-automatic spot gluing chip mounter and point glue process running
Must be more flexible smooth, the position precision of dispensing patch and the efficiency of production LED glass screen can be improved simultaneously.
In conjunction with shown in Fig. 1 and Fig. 7, dispensing paster component 400 includes 410 He of dispensing part being located on Z axis moving assembly 330
Patch part 420.
Dispensing part 410 includes the glue bucket 411 and control glue bucket for storing conducting resinl being fixed on third sliding block 332
The glue valve 412 of 411 gel quantity, glue bucket 411 are connected with glue valve 412, are connected on glue valve 412 for glue mouth 413 for dispensing glue.
Can be with strict control gel quantity by glue valve 412, and then the diameter of conducting resinl and the thickness of conducting resinl are controlled, improve essence for dispensing glue
Degree.
Patch part 420 includes for adsorbing the three of patch material sucking mouths 421 and for driving three material sucking mouths 421 to rotate
Rotating drive part 422, three material sucking mouths 421 are connected with rotating drive part 422 respectively, and rotating drive part 422 here can be with
For servo motor, servo motor can rotate the drawn patch of material sucking mouth 421, so as to adjust the direction of patch, improve patch stream
The quality of journey.One end of gantry support 321 is equipped with for providing the supply disk 423 of patch for material sucking mouth 421, and supply disk 423 is set
There are three the material reserve channel 424 for accommodating patch, Y-axis moving assembly 320 and Z axis moving assembly 330 drive suction nozzle to supply disk
423 adsorb patch from material reserve channel 424.After 410 points of complete glue of dispensing part, material sucking mouth 421, which is moved at supply disk 423, adsorbs patch
Then piece carries out patch process, patch precision is high, and rate is fast.
As shown in Figure 1, mainframe 100 is equipped with control display screen 140, it is convenient that Full-automatic spot gluing chip mounter is grasped
Make.
As shown in Figure 1, for convenience conveying 700 plate of patch glass, the side of mainframe 100 and be located at the first conveyer belt
223 one end is equipped with slave frame 500, and slave frame 500 is equipped with the second band transfer assembly 510 for transmitting patch glass 700,
Second with transfer assembly 510 includes that rotation is carried on the second driving wheel of slave frame 500 and the second driven wheel, to be set in second main
The second conveyer belt between driving wheel and the second driven wheel can also install driving motor on the second driving wheel here.It, will when feeding
Patch glass 700 is placed on the second conveyer belt, and then patch glass 700 is delivered to the first conveyer belt 223 by the second conveyer belt,
When patch glass 700 reaches 110 surface of supporting table, the lower general who has surrendered's paster glass glass 700 of the first conveyer belt 223 is placed into supporting table
On 110, then start dispensing and patch process；After dispensing and patch, the first conveyer belt 223 rises, then the first transmission
Patch glass 700 is sent to the second conveyer belt by 223 counter motion of band, and worker takes the patch of completion away from the second conveyer belt
Glass 700.The automatization level of Full-automatic spot gluing chip mounter can be improved in the setting of slave frame 500, improves production and processing rate.
All technical characteristics in the present embodiment can be freely combined according to actual needs.
Embodiment two:
As shown in figure 8, a kind of Full-automatic spot gluing chip mounter, the present embodiment and embodiment one the difference is that: host
Frame 100 is located at the side opposite with slave frame 500 and is additionally provided with blanking rack 600, and blanking rack 600 is equipped with for transmitting patch
The third band transfer assembly 610 of glass 700, third is with the third that transfer assembly 610 includes that rotation is carried on blanking rack 600
Driving wheel and third driven wheel, the third conveyer belt being set between third driving wheel and third driven wheel, here can also be
Driving motor is installed on three driving wheels.When feeding, patch glass 700 is placed on the second conveyer belt, then the second conveyer belt
Patch glass 700 is delivered to the first conveyer belt 223, when patch glass 700 reaches 110 surface of supporting table, the first transmission
The lower general who has surrendered's paster glass glass 700 of band 223 is placed into supporting table 110, then starts dispensing and patch process；Dispensing and patch terminate
Afterwards, the first conveyer belt 223 rises, and then the first conveyer belt 223 starts, and patch glass 700 is sent to third conveyer belt, worker
The patch glass 700 for taking completion away from third conveyer belt, in the side feeding of mainframe 100, other side blanking, Ke Yijin
One step improves the rate of production LED glass display screen.
The rest part of the present embodiment is the same as example 1, in the present embodiment unaccounted feature, is all made of implementation
The explanation of example one, is not discussed here.
Working principle:
Feeding: patch glass 700 is placed on the second conveyer belt, and then the second conveyer belt conveys patch glass 700
To the first conveyer belt 223, when patch glass 700 reaches 110 surface of supporting table, the lower general who has surrendered's paster glass of the first conveyer belt 223
Glass 700 is placed into supporting table 110；
Dispensing: CCD autonavigator 340 controls X-axis moving assembly 310, Y-axis moving assembly 320 and Z axis moving assembly
Dispensing part 410 is moved to dispensing patch location by 330, then carries out dispensing；
Patch: after dispensing, material sucking mouth 421 is moved to absorption patch at supply disk 423, then carries out patch process；
Blanking: after patch, the first conveyer belt 223 rises, then 223 counter motion of the first conveyer belt, by paster glass
Glass 700 is sent to the second conveyer belt, and worker takes the patch glass 700 of completion away from the second conveyer belt；Or first conveyer belt
223 rise, and then the first conveyer belt 223 starts, and patch glass 700 is sent to third conveyer belt, and worker is from third conveyer belt
On take the patch glass 700 of completion away, in the side feeding of mainframe 100, other side blanking.
Above-described embodiment is the preferable implementation of the present invention, and in addition to this, the present invention can be realized with other way,
Be not to move out the technical program design under the premise of it is any obviously replace it is within the scope of the present invention.
Claims (10)
1. a kind of Full-automatic spot gluing chip mounter, including mainframe, it is characterised in that: the mainframe is equipped with for carrying patch
The supporting table of glass is supported for patch glass to be transmitted in supporting table or remove the patch glass for being carried on supporting table
The positioning mechanism and set that the transport mechanism of platform, the dispensing patch location of patch glass for being carried to supporting table are positioned
In positioning mechanism and for the dispensing paster component to the dispensing of patch glass and patch；
The transport mechanism includes lifting assembly and multiple first band transfer assemblies for conveying patch glass, and multiple described
One band transfer assembly is located at the supporting table two sides, and the lifting assembly is fixed on mainframe, and multiple first bands pass
Sending component is carried on lifting assembly, and the lifting assembly is for driving first band transfer assembly to rise so that first band transfer assembly
Upper surface be higher than the upper surface of supporting table and for driving first band transfer assembly to decline so that first band transfer assembly
End face is lower than the upper surface of supporting table；
The positioning mechanism includes the X-axis moving assembly being fixed on mainframe, the mobile group of the Y-axis connecting with X-axis moving assembly
Part, the Z axis moving assembly being connect with Y-axis moving assembly, the Z axis moving assembly be equipped with respectively with X-axis moving assembly, Y-axis
The CCD autonavigator that moving assembly, Z axis moving assembly are electrically connected, the CCD autonavigator is for controlling the mobile group of X-axis
Part, Y-axis moving assembly and Z axis moving assembly are so that dispensing paster component is moved to dispensing patch location；
The dispensing paster component includes the dispensing part and patch part being located on Z axis moving assembly.
2. a kind of Full-automatic spot gluing chip mounter according to claim 1, it is characterised in that: the lifting assembly includes and master
The crane that rack vertical sliding connects and the vertical actuator for driving crane to slide up and down, the first band transmission group
Part includes that rotation is carried on the first driving wheel of crane, the first driven wheel for being carried on crane, is set in the first driving wheel
And first the first conveyer belt between driven wheel, the first actuator for driving the first driving wheel to rotate.
3. a kind of Full-automatic spot gluing chip mounter according to claim 2, it is characterised in that: be additionally provided with biography on the mainframe
Sensor, controller, the sensor are located at one end of the first conveyer belt and the position for detecting patch glass, the controller
It is electrically connected respectively with vertical actuator and the first actuator；
When the patch glass is delivered to the surface of supporting table by the first conveyer belt, the patch glass trigger sensor is defeated
Enabling signal out；
When the controller receives the enabling signal of sensor output, the first actuator of control stops working, the controller
Vertical actuator starting is controlled, the vertical actuator drives the decline of the first conveyer belt so that the upper surface of the first conveyer belt is lower than
The upper surface of supporting table.
4. a kind of Full-automatic spot gluing chip mounter according to claim 1, it is characterised in that: the X-axis moving assembly includes
Two X-axis slide rails disposed in parallel, two X-axis slide rails are located at first band transfer assembly two sides, each first sliding block
On slidably connect the first sliding block, each first sliding block is equipped with the X for driving the first sliding block to slide along X-axis slide rail
Shaft driver；The Y-axis moving assembly includes the gantry support that both ends are separately fixed on two the first sliding blocks, gantry branch
Frame is equipped with Y-axis sliding rail, slidably connects the second sliding block on the Y-axis sliding rail, and second sliding block is equipped with for driving the
The Y-axis actuator that two sliding blocks are slided along Y-axis sliding rail；The Z axis moving assembly includes the Z axis slide rail for being fixed on the second sliding block, cunning
The dynamic third sliding block for being connected to Z axis slide rail and the Z axis for being fixed on third sliding block and being used to that third sliding block to be driven to slide along Z axis slide rail
Actuator；The X-axis slide rail, Y-axis sliding rail, Z axis slide rail are orthogonal two-by-two.
5. a kind of Full-automatic spot gluing chip mounter according to claim 1, it is characterised in that: the dispensing part includes for storing up
The glue valve of the gel quantity of the glue bucket and control glue bucket of glue, the glue bucket are connected with glue valve, are connected on the glue valve for point
The Jiao Zui of glue.
6. a kind of Full-automatic spot gluing chip mounter according to claim 1, it is characterised in that: the patch part includes for inhaling
Affixed multiple material sucking mouths and rotating drive part for driving the rotation of multiple material sucking mouths, multiple material sucking mouths respectively and turn
Dynamic actuator connection, one end of the Y-axis moving assembly are equipped with for providing the supply disk of patch for material sucking mouth.
7. a kind of Full-automatic spot gluing chip mounter according to claim 6, it is characterised in that: the supply disk is equipped with multiple use
In the material reserve channel for accommodating patch, the Y-axis moving assembly and Z axis moving assembly driving material sucking mouth are moved to supply disk and from storing
Adsorb patch in road.
8. a kind of Full-automatic spot gluing chip mounter according to claim 1, it is characterised in that: the side and position of the mainframe
It is equipped with slave frame in one end of first band transfer assembly, the slave is provided with the second band transmission group for transmitting patch glass
Part, described second with transfer assembly includes that rotation is carried on the second driving wheel of slave frame and the second driven wheel, is set in second
The second conveyer belt between driving wheel and the second driven wheel.
9. a kind of Full-automatic spot gluing chip mounter according to claim 8, it is characterised in that: the mainframe is far from slave frame
Side be equipped with blanking rack, the blanking machine be provided with the third for transmitting patch glass band transfer assembly, the third
It include that rotation is carried on the third driving wheel of blanking rack and third driven wheel, is set in third driving wheel and the with transfer assembly
Third conveyer belt between three driven wheels.
10. a kind of Full-automatic spot gluing chip mounter according to claim 1, it is characterised in that: the mainframe is equipped with control
Display screen processed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821435778.5U CN209283648U (en) | 2018-08-31 | 2018-08-31 | A kind of Full-automatic spot gluing chip mounter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821435778.5U CN209283648U (en) | 2018-08-31 | 2018-08-31 | A kind of Full-automatic spot gluing chip mounter |
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| CN209283648U true CN209283648U (en) | 2019-08-20 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882670A (en) * | 2018-08-31 | 2018-11-23 | 广东立迪智能科技有限公司 | A kind of Full-automatic spot gluing chip mounter |
| CN110841873A (en) * | 2019-11-06 | 2020-02-28 | 东莞市欧珀精密电子有限公司 | Processing equipment of display screen assembly |
| CN113385374A (en) * | 2021-06-21 | 2021-09-14 | 深圳市金睿朗精密制造有限公司 | Automatic adhesive dispensing and chip mounting production system for ultrasonic cleaning tank |
| WO2021184940A1 (en) * | 2020-03-17 | 2021-09-23 | 南京盾华电子科技有限公司 | Patching device for full-color led display screen |
-
2018
- 2018-08-31 CN CN201821435778.5U patent/CN209283648U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882670A (en) * | 2018-08-31 | 2018-11-23 | 广东立迪智能科技有限公司 | A kind of Full-automatic spot gluing chip mounter |
| CN110841873A (en) * | 2019-11-06 | 2020-02-28 | 东莞市欧珀精密电子有限公司 | Processing equipment of display screen assembly |
| WO2021184940A1 (en) * | 2020-03-17 | 2021-09-23 | 南京盾华电子科技有限公司 | Patching device for full-color led display screen |
| CN113385374A (en) * | 2021-06-21 | 2021-09-14 | 深圳市金睿朗精密制造有限公司 | Automatic adhesive dispensing and chip mounting production system for ultrasonic cleaning tank |
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