CN209249460U - Complementary metal oxide semiconductor photosensory assembly and protective glass module - Google Patents
Complementary metal oxide semiconductor photosensory assembly and protective glass module Download PDFInfo
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- CN209249460U CN209249460U CN201920187550.7U CN201920187550U CN209249460U CN 209249460 U CN209249460 U CN 209249460U CN 201920187550 U CN201920187550 U CN 201920187550U CN 209249460 U CN209249460 U CN 209249460U
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- oxide semiconductor
- protective glass
- complementary metal
- metal oxide
- dry film
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Abstract
The utility model provides a kind of complementary metal oxide semiconductor photosensory assembly and protective glass module, it includes a bucket-shaped shell, one complementary metal oxide semiconductor sensitive chip, one protective glass and a shading dry film circle, the shell has an opening portion, the complementary metal oxide semiconductor sensitive chip is set in the shell, the protective glass seals the opening portion of the shell, and the protective glass has a light incident surface, the shading dry film circle is set to the light incident surface of the protective glass, and an optics area is defined in the shading dry film circle, the optics area face complementary metal oxide semiconductor sensitive chip.Whereby, shading dry film circle is easy molding, and is not easy injury protection glass surface.
Description
Technical field
The utility model relates to a kind of complementary metal-oxide that darkening ring can be precisely formed on protective glass
Semiconductor photosensory assembly and its protective glass module used.
Background technique
Complementary metal oxide semiconductor (hereinafter referred to as CMOS) is widely used in photosensory assembly, and then is applied
In fields such as mobile phone, on-vehicle lens.
Such CMOS photosensory assembly it is a common problem that, when CMOS photosensory assembly is from when entering from light shady place moment
(such as when entering and leaving tunnel), CMOS is easy to produce noise.In order to solve the problems, at present it has been proposed that molybdenum, chromium etc. is black
Non-ferrous metal is vaporized on the protective glass of CMOS photosensory assembly, it is subsequent again by coating resist, resist it is graphical, will be aforementioned
The processing procedure that ferrous metal is etched, finally removed resist forms a darkening ring on protective glass, reduces whereby
The situation of CMOS photosensory assembly generation noise.
However, preceding process has a disadvantage in that, in order to avoid there are etch residues on protective glass, and in order to be formed
The darkening ring of neat in edge, protective glass must be immersed in etching solution for a long time, and this leads to protective glass surface easily quilt
It etches together, causes subsequent generation flare, and resolution ratio can be reduced.
Separately it has been proposed that darkening ring to be printed on to the processing procedure of protective glass using special steel plate, but this method is easy to derive and prevent
Shield glass is scratched by steel plate, and the precision in order to maintain printing, and steel plate is every just to be had to replace using ten to 20 times.
In view of this, how to solve foregoing problems, needs those skilled in the art in fact and consider.
Utility model content
In view of this, the utility model proposes a kind of complementary metal oxygen that can precisely form darkening ring on protective glass
Compound semiconductor photosensory assembly and its protective glass module used.
In order to reach above-mentioned and other purposes, the utility model provides a kind of photosensitive group of complementary metal oxide semiconductor
Part comprising a bucket-shaped shell, a complementary metal oxide semiconductor sensitive chip, a protective glass and a shading dry film
Circle, the shell have an opening portion, which is set in the shell, the protective glass
The opening portion of the shell is sealed, and the protective glass has a light incident surface, which is set to the light of the protective glass
The plane of incidence, and an optics area is defined in the shading dry film circle, the optics area face complementary metal oxide semiconductor is photosensitive
Chip.
In order to reach above-mentioned and other purposes, the utility model provides a kind of for complementary metal oxide semiconductor sense
The protective glass module of optical assembly, the complementary metal oxide semiconductor photosensory assembly include that a bucket-shaped shell and one are complementary
Formula metal-oxide semiconductor (MOS) sensitive chip is set in the shell, which includes that a protective glass and a shading are dry
Film circle, the protective glass have a light incident surface, which is set to the light incident surface of the protective glass, and the shading is dry
An optics area is defined in film circle, the optics area is to the face complementary metal oxide semiconductor sensitive chip.
By above-mentioned design, the utility model proposes a kind of complementary metal oxide semiconductor with shading dry film circle
Photosensory assembly, shading dry film circle is easy molding, and is not easy injury protection glass surface.
The detailed content of other effects and embodiment in relation to the utility model, cooperation Detailed description of the invention are as follows.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application, for those of ordinary skill in the art, without creative efforts,
It can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the composition explanatory diagram of the utility model protective glass module wherein embodiment；
Fig. 2 be the utility model complementary metal oxide semiconductor photosensory assembly wherein an embodiment vertical section signal
Figure；
Fig. 3 to Fig. 5 is the production schematic diagram of the utility model protective glass module wherein embodiment.
Symbol description
1 protective glass module, 10 protective glass
11 light incident surface, 12 light-emitting face
20 shading dry film circle, 21 optics area
30 shell, 31 opening portion
40 complementary metal oxide semiconductor sensitive chips
41 light-receiving surface, 200 carrier film
100 complementary metal oxide semiconductor photosensory assemblies
300 shading dry film slurry, 300 ' shading photopolymer layer
Specific embodiment
Aforementioned and other technology contents, feature and effect in relation to the utility model refer to the one of attached drawing in following cooperation
In the detailed description of preferred embodiment, can clearly it present.The direction term being previously mentioned in following embodiment, such as: upper,
Under, it is left and right, front or rear etc., be only the direction with reference to attached drawing.Therefore, the direction term used is for illustrating not to be used to limit
The utility model processed.
Fig. 1 is the composition explanatory diagram of the utility model protective glass module wherein embodiment.Fig. 2 is then the utility model
The vertical section schematic diagram of a complementary metal oxide semiconductor photosensory assembly wherein embodiment.
Protective glass module 1 includes a protective glass 10 and a shading
Dry film circle 20, protective glass 10 have a light incident surface 11 and a light-emitting face 12.Protective glass 10 is for predetermined
By light wave there is high transparency, and it is preferred but be not limited to can by it is non-predetermined by light wave absorbed or reflected；It lifts
For example, protective glass 10 is, for example, to contain Cu2+Infrared absorbing glass (such as fluorophosphate system glass), can maintain can
The high transparency in light-exposed domain, while again can absorption near infrared ray.
Shading dry film circle 20 is formed in the light incident surface 11 of protective glass 10, defines at 20 center of shading dry film circle of frame-shaped
The some in one optics area 21,10 light incident surface 11 of protective glass is covered by shading dry film circle 20, and can hide unnecessary light
Removing is covered, makes most light that can only penetrate protective glass 10 in the optics area 21 that shading dry film circle 20 is defined.
As shown in Fig. 2, complementary metal oxide semiconductor photosensory assembly 100 includes bucket-shaped 30, one complementation of shell
Formula metal-oxide semiconductor (MOS) sensitive chip 40 and foregoing protective glass module 1.Bucket-shaped shell 30 has an opening
Portion 31, light can enter inside shell 30 via opening portion 31.Complementary metal oxide semiconductor sensitive chip 40 is set to shell
In body 30, there is a light-receiving surface 41, when light is projected to light-receiving surface 41, complementary metal oxide semiconductor sensitive chip
It can produce corresponding photoreceptor signal.
In addition, previous protective glass 10 passes through the opening portion 31 of adhesive seal shell 30, light-emitting face 12 is towards mutual
Benefit formula metal-oxide semiconductor (MOS) sensitive chip 40, light incident surface 11 is then away from complementary metal oxide semiconductor sense
The direction of optical chip 40.The 21 face complementary metal oxide semiconductor sensitive chip 40 of optics area of shading dry film circle 20, and
Its orthographic projection is greater than the light-receiving surface 41 of complementary metal oxide semiconductor sensitive chip 40, so that required light is passed through anti-
10 directive light-receiving surface 41 of glass is protected, but can avoid projecting to complementary metal oxide semiconductor sensitive chip unnecessary
Light reduces the generation of ghost image, flare or noise.It should be noted that the size in optics area 21 can be according to configuration complementary
The photosensitive cores of optical modules, complementary metal oxide semiconductor such as the lens in 100 outside of metal-oxide semiconductor (MOS) photosensory assembly
Depending on the size of piece 40 and the size of protective glass 10, it is not limited with the present embodiment those shown.
Illustrate the preparation method of the utility model protective glass module below.
As shown in figure 3, being coated with a shading dry film slurry 300 in a carrier film 200；Carrier film 200 can be but be not limited to
Polyethylene terephthalate (PET) or other polyester films, Kapton, polyamidoimide film, polypropylene are thin
Film or polystyrene film, for thickness preferably between 10-150 μm, surface can be shiny surface or cloudy surface, and the coating for example makes
It is carried out with lip coater；The shading dry film slurry is, for example, the epoxy resin compound of black or using silica gel as matrix
Compound；The shading dry film slurry for example has photocuring and heat cure special with photocuring or heat curable properties or simultaneously
Property.
Then, as shown in figure 4, enabling aforementioned bearer film 200 by dryer, shading dry film slurry 300 is dried as shading
Photopolymer layer 300 '；
Then, as shown in figure 5, the shading photopolymer layer 300 ' in carrier film 200 is passed through laminator layer before being fully cured
Together in the light incident surface 11 of protective glass 10；
Then, please also refer to Fig. 1, Fig. 2, some of shading photopolymer layer 300 ' is removed using laser cutting mode, is made
Shading photopolymer layer 300 ' defines an optics area 21 to face complementary metal oxide semiconductor sensitive chip 40, the light
The orthographic projection of school district 21 is greater than the light-receiving surface 41 of complementary metal oxide semiconductor sensitive chip 40；The laser cutting is logical
Laser cutter execution is crossed, can accurately cut shading photopolymer layer 300 ', cutting edge is able to maintain that smooth, and not easy damaged glass
Surface.Before laser cutting, carrier film 200 can be first from 300 ' sur-face peeling of shading photopolymer layer.Shading photopolymer layer 300 ' can be in laser
By photocuring, heat cure or photocuring and heat cure simultaneously before or after cutting.After forming optics area and being subject to solidification, institute
It states shading photopolymer layer 300 ' and becomes foregoing shading dry film circle.
Embodiment described above and/or embodiment are only the preferable realities to illustrate to realize the utility model technology
Example and/or embodiment are applied, not the embodiment of the utility model technology is made any form of restriction, any this field
Technical staff, in the range for not departing from technological means disclosed in the content of the present invention, when can make a little change or modification
For other equivalent embodiments, but still it should be regarded as technology identical with the utility model in essence or embodiment.
Claims (4)
1. a kind of complementary metal oxide semiconductor photosensory assembly characterized by comprising
One bucket-shaped shell has an opening portion；
One complementary metal oxide semiconductor sensitive chip is set in the shell；
One protective glass seals the opening portion of the shell, which has a light incident surface；And
One shading dry film circle defines an optics area in the light incident surface of the protective glass, the shading dry film circle, the optics area
To the face complementary metal oxide semiconductor sensitive chip.
2. complementary metal oxide semiconductor photosensory assembly as described in claim 1, which is characterized in that the optics area is just
Projection is greater than a light-receiving surface of the complementary metal oxide semiconductor sensitive chip.
3. a kind of protective glass module for complementary metal oxide semiconductor photosensory assembly, which is characterized in that the complementation
Formula metal-oxide semiconductor (MOS) photosensory assembly includes a bucket-shaped shell and a complementary metal oxide semiconductor sensitive chip
In the shell, which includes:
One protective glass, the protective glass have a light incident surface；And
One shading dry film circle defines an optics area in the light incident surface of the protective glass, the shading dry film circle, to face
The complementary metal of the shell helps to change object semiconductor sensitive chip.
4. being used for the protective glass module of complementary metal oxide semiconductor photosensory assembly, feature as claimed in claim 3
It is, the orthographic projection in the optics area is greater than a light-receiving surface of the complementary metal oxide semiconductor sensitive chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920187550.7U CN209249460U (en) | 2019-02-03 | 2019-02-03 | Complementary metal oxide semiconductor photosensory assembly and protective glass module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920187550.7U CN209249460U (en) | 2019-02-03 | 2019-02-03 | Complementary metal oxide semiconductor photosensory assembly and protective glass module |
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| Publication Number | Publication Date |
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| CN209249460U true CN209249460U (en) | 2019-08-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524921A (en) * | 2019-02-03 | 2020-08-11 | 同泰电子科技股份有限公司 | Complementary metal oxide semiconductor photosensitive assembly, protective glass module and manufacturing method |
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2019
- 2019-02-03 CN CN201920187550.7U patent/CN209249460U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524921A (en) * | 2019-02-03 | 2020-08-11 | 同泰电子科技股份有限公司 | Complementary metal oxide semiconductor photosensitive assembly, protective glass module and manufacturing method |
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