CN209199029U - A kind of through radiator structure for industry portable computer - Google Patents

A kind of through radiator structure for industry portable computer Download PDF

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Publication number
CN209199029U
CN209199029U CN201821973592.5U CN201821973592U CN209199029U CN 209199029 U CN209199029 U CN 209199029U CN 201821973592 U CN201821973592 U CN 201821973592U CN 209199029 U CN209199029 U CN 209199029U
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heat dissipation
area
temperature
radiator
fan
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CN201821973592.5U
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李南江
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Chengdu Shuo Mdt Infotech Ltd
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Chengdu Shuo Mdt Infotech Ltd
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Abstract

The utility model relates to a kind of through radiator structure for industry portable computer, including cabinet and setting be in the intracorporal computer main board of case, and is arranged in the through heat dissipation wind channel of case intracorporal first and the second through heat dissipation wind channel;The first area of installation CPU processor and the second area of installation GPU coprocessor are provided on computer main board, first through heat dissipation wind channel and the second through heat dissipation wind channel extend through first area and second area, and temperature-controlled fan is provided in each heat dissipation wind channel, positive and negative wind pressure section is formed by boundary of fan in air duct, accelerate the outer cold wind entrance of case and hot wind discharge, improve distinguished and admirable efficiency, reduce the amount of heat generated by high-performance calculation, noise is reduced simultaneously, calculates the operation of core high-frequency stabilization to ensure.

Description

A kind of through radiator structure for industry portable computer
Technical field
The utility model relates to computer field of radiating, and in particular to a kind of for the through of industry portable computer Radiator structure.
Background technique
For industry portable computer in order to improve calculated performance, mainboard is (maximum by original low performance CPU processor 4 cores), it is promoted to high-performance CPU processor (maximum 48 cores), and increase GPU coprocessor, the addition of these accessories must The so bigger space of needs and more preferably heat-sinking capability, traditional solution is to increase the length, width and height of portable cabinet, multi-faceted Increase high revolving speed number of fans, so that industry portable computer massiveness, and not readily portable and deployment installation, it makes an uproar simultaneously Sound is also very big.
In order to easy to carry, it is necessary to by the volume-diminished of industry portable computer in the prior art, still, reduce While its volume, radiating efficiency is necessarily reduced, influences its calculated performance.Therefore, need using a kind of new radiator structure come Heat dissipation problem after solving the weight reducing of industry portable computer.
Utility model content
In view of the problems of the existing technology, the utility model embodiment provides a kind of for industry portable computer Through radiator structure, for solving the heat dissipation problem after the weight reducing of industry portable computer in the prior art.
The technical solution that the utility model solves above-mentioned technical problem is as follows:
This application provides a kind of through radiator structures for industry portable computer, including cabinet and setting to exist The intracorporal computer main board of case, and be arranged in the through heat dissipation wind channel of case intracorporal first and the second through heat dissipation wind channel;
First area and second area are respectively arranged on the computer main board, wherein are at least pacified in the first area Equipped with one piece of CPU processor, and it is provided with CPU radiator on the CPU processor, GPU association is installed in the second area Processor is provided with GPU radiator on the GPU coprocessor;The first through heat dissipation wind channel and second it is through dissipate Hot-flow flue extends through the first area and second area;Wherein, the described first through heat dissipation wind channel includes the first wind-guiding First air inlet and the first air outlet at the first wind scooper both ends are covered, are separately positioned on, and is arranged in the first wind scooper First temperature-controlled fan, first air inlet and the first air outlet are corresponding with the heat release hole of the tank ends respectively;It is described Second through heat dissipation wind channel includes that the second wind scooper, the second air inlet for being separately positioned on the second wind scooper both ends and second go out Air port, and the second temperature-controlled fan being arranged in the second wind scooper, second air inlet and the second air outlet respectively with case The heat release hole at body both ends is corresponding.
Further, divide to shorten hot wind section in the intracorporal distance of case, first temperature-controlled fan and the second temperature-controlled fan It is not positioned close at the first CPU radiator and GPU radiator.
Further, in order to not influence the work of other components in cabinet, the material of first wind scooper, the second wind scooper Matter is all made of insulation high-temperature-resistant flame-proof PVC material.
Further, the first CPU processor and the second CPU processor are installed, and the first CPU is handled in the first area The first CPU radiator and the 2nd CPU radiator are respectively arranged on device and the second CPU processor.
Further, in order to form positive and negative wind pressure section by boundary of fan in air duct, accelerate the outer cold wind of case and enter, accelerate hot wind Discharge, air duct cross section between the first air inlet and the first temperature-controlled fan of first wind scooper less than the first air outlet and Air duct cross section between first temperature-controlled fan;Wind between the second air inlet and the second temperature-controlled fan of second wind scooper Road cross section is less than the air duct cross section between the second air outlet and the second temperature-controlled fan.
The utility model compared to the prior art, it has the advantage that: CPU is handled in narrow portable cabinet 13 Device and the big pyrotoxin of GPU coprocessor two separate independent design into first area and second area, and in first area and second The first through heat dissipation wind channel and the second through heat dissipation wind channel are arranged side by side on region, and temperature is set in each heat dissipation wind channel Control fan, formed two groups it is unidirectional distinguished and admirable side by side, the distinguished and admirable resistance of straight line is small, flow velocity is fast, prevents CPU radiator and GPU radiator Blocking forms hot wind and streams or flow back, meanwhile, positive and negative wind pressure section is formed by boundary of fan in air duct, accelerates the outer cold wind of case and enters And hot wind discharge.Fan speed temperature is improved distinguished and admirable efficiency, reduced because of high-performance meter by fever source temperature airflow regulation amount The amount of heat generated is calculated, while reducing noise, calculates the operation of core high-frequency stabilization to ensure.
Detailed description of the invention
Fig. 1 is the through radiator structure schematic diagram of the utility model;
Fig. 2 is the product structure figure of the utility model.
Wherein, the first air inlet of 1-, the second air inlet of 2-, the first wind scooper of 3-, the second wind scooper of 4-, 5- the first temperature control wind Fan, the second temperature-controlled fan of 6-, the first CPU radiator of 7-, the 2nd CPU radiator of 8-, 9- computer main board, 10-GPU radiator, 11- First air outlet, the second air outlet of 12-, 13- framework.
Specific embodiment
The principles of the present invention and feature are described below in conjunction with attached drawing, example is served only for explaining that this is practical It is novel, it is not intended to limit the scope of the utility model.
As shown in Figure 1 and Figure 2, a kind of through radiator structure for industry portable computer is present embodiments provided, Including cabinet 13 and the computer main board 9 being arranged in cabinet 13, and the first through heat dissipation wind channel being arranged in cabinet 13 With the second through heat dissipation wind channel.First area and second area are provided on computer main board 9, wherein in the first area One piece of CPU processor is at least installed, and is provided with CPU radiator on the CPU processor, is equipped in the second area GPU coprocessor is provided with GPU radiator 10 on the GPU coprocessor.
In the present embodiment, the first through heat dissipation wind channel and the second through heat dissipation wind channel extend through described first Region and second area;Wherein, the described first through heat dissipation wind channel includes the first wind scooper 3, is separately positioned on the first wind-guiding Cover first air inlet 1 and the first air outlet 11 at 3 both ends, and the first temperature-controlled fan 5 being arranged in the first wind scooper 3, institute It is corresponding with the heat release hole at 13 both ends of cabinet respectively to state the first air inlet 1 and the first air outlet 11;Described second is through Heat dissipation wind channel includes the second wind scooper 4, the second air inlet 2 and the second air outlet 12 for being separately positioned on 4 both ends of the second wind scooper, And the second temperature-controlled fan 6 in the second wind scooper 4 is set, second air inlet 2 and the second air outlet 12 respectively with case The heat release hole at 13 both ends of body is corresponding.
In the present embodiment, in order to form positive and negative wind pressure section as boundary using fan in air duct, accelerate the outer cold wind of case enter and Hot wind discharge, the air duct cross section between the first air inlet 1 and the first temperature-controlled fan 5 of first wind scooper 3 is less than first Air duct cross section between air outlet 11 and the first temperature-controlled fan 5;Second air inlet 2 of second wind scooper 4 and the second temperature The air duct cross section between fan 6 is controlled less than the air duct cross section between the second air outlet 12 and the second temperature-controlled fan 6.
In the present embodiment, in relatively narrow portable cabinet 13, cool exterior air air inlet is devised for CPU processor Mouthful, i.e. the first air inlet 1 is equipped with the if being provided with two pieces of CPU processors on computer main board 9 in that is, described first area One CPU processor and the second CPU processor are respectively arranged with first on first CPU processor and the second CPU processor CPU radiator 7 and the 2nd CPU radiator 8, and when two pieces of CPU processors are laid out not point-blank, first is through scattered Hot-flow flue needs to do air duct extension, and the end before the extension of air duct is arranged one by the temperature controlled first temperature control wind of cpu system Fan 5, is discharged hot wind from the first air outlet 11, entire air circulation is limited in air duct, and the one direction that ventilates is passed through First CPU radiator 7 and the 2nd CPU radiator 8, the hot-air that the first CPU processor and the second CPU processor are generated are most fast Cabinet 13 is discharged, reaches most fast heat dissipation effect.First temperature-controlled fan, 5 revolving speed is controlled by cpu temperature, generates heat higher wind-force more Greatly, air quantity is bigger, and heat dissipation effect is better, and room temperature then reduces rotation speed of the fan, to achieve the effect that noise abatement.Similarly, for GPU processing Device devises cool exterior air air inlet, i.e. the second air inlet 2, and since the width of GPU card is greater than air inlet, air duct is close When GPU card, entire GPU card is covered in air duct, the end before the extension of air duct by the second through heat dissipation wind channel extension, if One is set by temperature controlled second temperature-controlled fan 6 of GPU system, hot wind is discharged from the second air outlet 12, entire air stream Logical to be limited in air duct, the one direction that ventilates passes through GPU radiator 10, and the hot-air that GPU processor generates most is arranged fastly Cabinet 13 out reach most fast heat dissipation effect.Second temperature-controlled fan, 6 revolving speed is controlled by GPU temperature of processor, and generate heat higher wind Power is bigger, and air quantity is bigger, and heat dissipation effect is better, and room temperature then reduces rotation speed of the fan, to achieve the effect that noise abatement.
In the present embodiment, CPU processor and GPU processor are passed through into the first wind scooper 3 respectively and the second wind scooper 4 separates It in two independent through heat dissipation wind channels, is independent of each other, adjusts corresponding temperature control wind according only to oneself heat condition Fan revolving speed has the function that heat dissipation or noise reduction, avoid strong air inlet and after dispersing powerless air draft caused high temperature frequency reducing feelings Condition, while noise caused by adding more multi-fan is reduced, so as to avoid the noise effect for using equipment personnel.
Portable cabinet 13 is designed as the through radiating layout of one direction, the distinguished and admirable resistance of straight line is small, wind pressure is big, flow velocity is fast, One temperature-controlled fan is respectively corresponded to CPU and the big pyrotoxin of GPU two, using insulation high-temperature-resistant flame-proof PVC material separates at two Independent ventiduct, two groups of formation is equidirectional unidirectional distinguished and admirable side by side, prevents the blocking of CPU radiator and GPU radiator 10, and forms heat Wind is streamed or is flowed back, and fan is maximized close to radiator to shorten the distance of hot wind section in the case, with temperature-controlled fan in air duct Positive and negative wind pressure section is formed for boundary, accelerates the outer cold wind entrance of case and hot wind discharge.Rotation speed of the fan is by fever source temperature airflow regulation Amount, has the function that room temperature noise abatement, high temperature are dropped fastly, calculates the operation of core high-frequency stabilization to ensure.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.

Claims (5)

1. a kind of through radiator structure for industry portable computer, which is characterized in that including cabinet and be arranged in case Intracorporal computer main board, and be arranged in the through heat dissipation wind channel of case intracorporal first and the second through heat dissipation wind channel;
First area and second area are respectively arranged on the computer main board, wherein are at least equipped in the first area One piece of CPU processor, and CPU radiator is provided on the CPU processor, the processing of GPU association is installed in the second area Device is provided with GPU radiator on the GPU coprocessor;
The first through heat dissipation wind channel and the second through heat dissipation wind channel extend through the first area and second area; Wherein, the described first through heat dissipation wind channel includes the first wind scooper, the first air inlet for being separately positioned on the first wind scooper both ends Mouth and the first air outlet, and the first temperature-controlled fan being arranged in the first wind scooper, first air inlet and the first outlet air Mouth is corresponding with the heat release hole of the tank ends respectively;The second through heat dissipation wind channel includes the second wind scooper, difference Second air inlet and the second air outlet at the second wind scooper both ends, and the second temperature control being arranged in the second wind scooper are set Fan, second air inlet and the second air outlet are corresponding with the heat release hole of tank ends respectively.
2. through radiator structure according to claim 1, which is characterized in that first temperature-controlled fan and the second temperature control Fan is separately positioned at CPU radiator and GPU radiator.
3. through radiator structure according to claim 1, which is characterized in that first wind scooper, the second wind scooper Material be all made of insulation high-temperature-resistant flame-proof PVC material.
4. through radiator structure according to claim 1, which is characterized in that be equipped with first in the first area CPU processor and the second CPU processor, and be respectively arranged with the first CPU on the first CPU processor and the second CPU processor and dissipate Hot body and the 2nd CPU radiator.
5. through radiator structure according to claim 1, which is characterized in that the first air inlet of first wind scooper And the first air duct cross section between temperature-controlled fan is less than the air duct cross section between the first air outlet and the first temperature-controlled fan;Institute The air duct cross section between the second air inlet of the second wind scooper and the second temperature-controlled fan is stated less than the second air outlet and the second temperature Control the air duct cross section between fan.
CN201821973592.5U 2018-11-28 2018-11-28 A kind of through radiator structure for industry portable computer Active CN209199029U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821973592.5U CN209199029U (en) 2018-11-28 2018-11-28 A kind of through radiator structure for industry portable computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821973592.5U CN209199029U (en) 2018-11-28 2018-11-28 A kind of through radiator structure for industry portable computer

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CN209199029U true CN209199029U (en) 2019-08-02

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110718960A (en) * 2019-11-08 2020-01-21 广州视源电子科技股份有限公司 Uninterrupted power supply complete machine
CN111405826A (en) * 2020-04-01 2020-07-10 中国电子科技集团公司第五十四研究所 Air cooling CPCI time system case air duct structure
CN113056179A (en) * 2021-03-31 2021-06-29 联想(北京)有限公司 Electronic equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110718960A (en) * 2019-11-08 2020-01-21 广州视源电子科技股份有限公司 Uninterrupted power supply complete machine
CN111405826A (en) * 2020-04-01 2020-07-10 中国电子科技集团公司第五十四研究所 Air cooling CPCI time system case air duct structure
CN113056179A (en) * 2021-03-31 2021-06-29 联想(北京)有限公司 Electronic equipment

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