CN209167638U - Optical module driving mechanism - Google Patents
Optical module driving mechanism Download PDFInfo
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- CN209167638U CN209167638U CN201821709679.1U CN201821709679U CN209167638U CN 209167638 U CN209167638 U CN 209167638U CN 201821709679 U CN201821709679 U CN 201821709679U CN 209167638 U CN209167638 U CN 209167638U
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- module
- building brick
- driving mechanism
- optical module
- electronic building
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Abstract
The disclosure provides a kind of optical module driving mechanism, including one first module, one second module, a drive module and an electronic component module.Drive module can drive the second module mobile relative to the first module.Electronic component module includes an at least electronic building brick, at least a lead frame and a package assembling.Lead frame connects aforementioned electronic component and the external circuit outside optical module driving mechanism.Package assembling has a homogenous material and coats electronic building brick and lead frame, and wherein lead frame is exposed to except package assembling, and electronic building brick is not revealed in except package assembling.
Description
Technical field
The utility model relates to a kind of optical module driving mechanisms.For more specifically, the utility model is about one kind
Optical module driving mechanism with electronic component module.
Background technique
With the development of science and technology, many electronic devices (such as tablet computer or smartphone) are equipped with camera lens now
Module and have the function of take a picture or record a video.These electronic devices using more and more common, and towards convenient and lightening
Design direction is developed, and is more selected with providing user.
Many small parts and route are generally included inside the aforementioned electronic device equipped with lens module, in electronic device
In the case where miniaturization, be not only difficult to assemble, and if electronic device when shaking or colliding, aforementioned components and route also may
Therefore it can be detached from or damage.Therefore, foregoing problems how are solved to begin into an important project.
Utility model content
In order to solve above-mentioned existing problem, the utility model provides a kind of optical module driving mechanism, including one
One module, one second module, a drive module and an electronic component module.Drive module can drive the second module relative to
First module is mobile.Electronic component module includes an at least electronic building brick, at least a lead frame and a package assembling.Conducting wire
Frame connects aforementioned electronic component and the external circuit outside optical module driving mechanism.Package assembling has a homogenous material simultaneously
Electronic building brick and lead frame are coated, wherein lead frame is exposed to except package assembling, and electronic building brick is not revealed in package assembling
Except.
The utility model proposes a kind of optical module driving mechanisms characterized by comprising one first module；One second
Module；One drive module drives second module mobile relative to first module；And an electronic component module, it is set to
In first module, comprising: an at least electronic building brick；An at least lead frame connects the electronic building brick and an external circuit, and should
External circuit is located at except the optical module driving mechanism；And a package assembling, there is homogenous material, and coat the electronics group
Part and the lead frame, wherein the lead frame is exposed to except the package assembling, and the electronic building brick is not revealed in the package assembling
Except.
In an embodiment of the present invention, lead frame has one section of portion, nearby electronic components, and the long axis direction along section portion
When viewing, lead frame and electronic building brick are least partially overlapped.Electronic component module further includes a lead, is directed away from lead frame
Direction extends simultaneously connecting wire frame and the sub-component.Wherein aforementioned encapsulation component touch lead, lead frame and electronic building brick.
In an embodiment of the present invention, electronic component module further includes another electronic building brick, and lead frame has one the
One end and a second end, are respectively adjacent to electronic building brick and another electronic building brick, wherein between first end and electronic building brick
Distance be different from the distance between the second end and another electronic building brick.
In an embodiment of the present invention, electronic building brick include a sensing component, a filter and one driving IC at least
One, package assembling includes resin, plastics or glass, and lead frame includes magnetic conductive material.In some embodiments, electronics group
Part module further includes that a magnetic conduction subassembly, nearby electronic components, and magnetic conduction subassembly and lead frame are electrically independent.
In an embodiment of the present invention, the first module is a fixed part, and aforementioned fixed part includes a framework.Encapsulation group
Part and framework are integrally formed.Second module includes a magnet assembly, and wire erection be placed in magnet assembly and electronic building brick it
Between.
In an embodiment of the present invention, electronic building brick and lead frame are to be embedded in encapsulation group by IC built-in substrate technology
In part, and optical module driving mechanism further includes another electronic building brick, is set on the outer surface of electronic component module.In some
In embodiment, the first module is a movable part.
Detailed description of the invention
Fig. 1 is the schematic diagram for indicating the electronic device of an embodiment of the present invention.
Fig. 2 is the explosive view for indicating the optical module driving mechanism of an embodiment of the present invention.
Fig. 3 is the schematic diagram for indicating the electronic component module in an embodiment of the present invention.
Fig. 4 is the explosive view for indicating the optical module driving mechanism of another embodiment of the utility model.
Fig. 5 A is the explosive view for indicating the optical module driving mechanism of another embodiment of the utility model.
Fig. 5 B is the cross-sectional view for indicating the electronic component module in another embodiment of the utility model.
Fig. 6 is the explosive view for indicating the optical module driving mechanism of another embodiment of the utility model.
Description of symbols:
10 optical module driving mechanisms
20 electronic devices
30 optical modules
100 first modules
110 shells
120 bottom plates
130 frameworks
200 second modules
210 optical module bearing seats
211 perforation
212 upper surfaces
213 lower surfaces
220 magnet assemblies
300 first elastic parts
310 inner ring sections
320 outer rings section
400 second elastic parts
410 inner ring sections
420 outer rings section
500 drive modules
511 first electromagnetic drive components
512 second electromagnetic drive components
600 electronic component modules
610,610A, 610B electronic building brick
620 lead frames
621 first ends
622 the second ends
623 sections of portions
630 leads
640 package assemblings
700 circuit boards
800 coil plates
900 suspension ring lines
C circuit board
O1 optical aperture
O2 optical aperture
Specific embodiment
Illustrate the optical module driving mechanism of the utility model embodiment below.However, the utility model can be will readily appreciate that
Embodiment provides many suitable utility model concepts and may be implemented in wide variety of specific background.Disclosed particular implementation
Example is merely illustrative with ad hoc approach using the utility model, not to limit to the scope of the utility model.
Unless otherwise defined, belonging to whole term (including technology and scientific words) as used herein has and discloses with this piece
The normally understood identical connotation of general those skilled in the art institute.It is appreciated that these terms, such as determines in usually used dictionary
The term of justice, should be interpreted to one and the consistent meanings of background or context of the relevant technologies and the disclosure, without should be with
One idealization or excessively formal mode are interpreted, unless especially definition herein.
Referring initially to Fig. 1, the optical module driving mechanism 10 of an embodiment of the present invention can be installed in electronics dress
It sets in 20, to carry and drive an optical module 30.Optical module 30 can be therefore relative to the photosensory assembly in electronic device 20
(non-icon) is mobile, and then achievees the purpose that adjust focal length.Aforementioned electronic 20 may be, for example, with photograph or camera function
Smartphone or digital camera, and optical module 30 then can be a camera lens.
Fig. 2 is the explosive view for indicating aforementioned optical Component driver mechanism 10.As shown, aforementioned optical mechanism 10 is mainly wrapped
Include one first module 100, one second module 200, one first elastic parts 300, one second elastic parts 400, a drive module
500 and an electronic component module 600.
In this present embodiment, the first module 100 is a fixed part, includes a shell 110, a bottom plate 120 and a framework
130, framework 130 is fixed on shell 110, and shell 110 and bottom plate 120 can be combined to a hollow box.Aforementioned second module
200, the first elastic parts 300, the second elastic parts 400, drive module 500 and electronic component module 600 can be enclosed by shell 110
Around and be placed in this hollow box.
Second module 200 is a movable part, such as may include an optical module bearing seat 210, and center is formed with one and wears
Hole 211, aforementioned optical component 30 are set in this perforation 211 in which can be fixed.The shell 110 and bottom plate 120 of first module 100
Be respectively provided with optical aperture O1, O2 of corresponding perforation 211, therefore, extraneous light can sequentially pass through optical aperture O1, optical module 30,
And optical aperture O2, the photosensory assembly in electronic device 20 is arrived at, finally to be imaged on photosensory assembly.
First elastic parts 300 and the second elastic parts 400 are respectively arranged at the opposite side of optical module bearing seat 210,
And first elastic parts 300 inner ring section 310 and 212 He of upper surface that is separately connected optical module bearing seat 210 of outer ring section 320
Framework 130, the inner ring section 410 of the second elastic parts 400 and outer ring section 420 are then separately connected under optical module bearing seat 210
Surface 213 and bottom plate 120.In this way, which optical module bearing seat 210 can pass through the first elastic parts 300 and the second elasticity
Component 400 and be suspended in said hollow box body.
Please continue to refer to Fig. 2, drive module 500 includes at least one first electromagnetic drive component 511 and at least one second electricity
Magnetic driving component 512, wherein the first electromagnetic drive component 511 is set on optical module bearing seat 210, and the second electromagnetic drive
Component 512 is then set in bottom plate 120 or the framework 130 of the first module 100.Pass through the first electromagnetic drive component 511 and second
Electromagnetic action between electromagnetic drive component 512, optical module bearing seat 210 and the optical module 30 being arranged on can quilts
It drives and is moved relative to the first module 100 along Z-direction.
For example, in this present embodiment, the first electromagnetic drive component 511 can be driving coil, and the second electromagnetic drive
Component 512 then can be magnet assembly (such as magnet).When electric current is passed through driving coil (the first electromagnetic drive component 511), drive
The driving force that the electromagnetic action generated between moving winding and magnet assembly can provide Z-direction gives optical module bearing seat 210, makes
Optical module bearing seat 210 and the optical module 30 being arranged on are moved relative to the first module 100 along Z-direction, in turn
It is moved relative to the photosensory assembly in electronic device 20 along Z-direction, to realize the purpose of adjustment focal length.
In this present embodiment, drive module 500 includes that there are two the first electromagnetic drive components 511 and two the second electromagnetism to drive
Dynamic component 512, is set to the opposite side of optical module bearing seat 210, therefore can provide uniform driving force holds optical module
It is mobile to carry seat 210, optical module bearing seat 210 is avoided to rotate relative to the first module 100.In some embodiments, mould is driven
Block 500 may include around first electromagnetic drive component 511 of optical module bearing seat 210 and positioned at optical module bearing seat
Two the second electromagnetic drive components 512 of 210 opposite side (or are respectively arranged one second in 210 surrounding of optical module bearing seat
Electromagnetic drive component 512).In some embodiments, when the first electromagnetic drive component 511 and the second electromagnetic drive component 512 can
When providing enough driving forces, drive module 500 also may include that single first electromagnetic drive component 511 and single second electromagnetism drive
Dynamic component 512.
In some embodiments, electromagnetic drive component 511 can be magnet assembly, and electromagnetic drive component 512 can be then drive
Moving winding.
Fig. 3 is the schematic diagram for indicating electronic component module 600.As shown in Figure 2,3, electronic component module 600 is securable to
In first module 100 comprising an at least electronic building brick 610, at least a lead frame 620, at least a lead 630 and an envelope
Arrangement 640.
Package assembling 640 can completely coat electronic building brick 610 and lead 630, and can coated wire frame 620 a part.
In other words, the part of lead frame 620 will be revealed in except package assembling 640, and electronic building brick 610 and lead 630 will not then be shown
It is exposed to except package assembling 640.
Lead frame 620 is electrically connected with electronic building brick 610, and electronic building brick 610 is connected in electronic device 20
External circuit (non-icon).Specifically, one end that lead frame 620 is packaged the cladding of component 640 will connect electronic building brick 610,
And one end that non-encapsulated component 640 coats can then connect external circuit.
In this present embodiment, electronic component module 600 includes that there are two electronic building brick 610A, 610B, one of electronics
Component 610A is connect by lead 630 with lead frame 620, and another electronic building brick 610B is then directly to connect with lead frame 620
Touching.Therefore, as shown in figure 3, the first end 621 and the second end 622 of lead frame 620 are respectively adjacent to electronic building brick 610A and electricity
Sub-component 610B, and the distance between electronic building brick 610A and first end 621 can be different from electronic building brick 610B and second end
The distance between portion 622.
Specifically, lead frame 620 has the section portion 623 of nearby electronic components 610.Electronic building brick 610 can be straight
This section of portion 623 of contact or lead 630 can connect this section of portion 623 and be directed away from the direction extension of lead frame 620 to be connected to
Electronic building brick 610.When the long axis direction viewing along aforementioned section of portion 623, lead frame 620 and electronic building brick 610 are at least partly heavy
It is folded.
Aforementioned electronic component 610 for example may include sensing component, filter or driving IC.Sensing component may be, for example, suddenly
That effect sensor (Hall Sensor), magnetoresistive effect sensor (Magnetoresistance Effect Sensor, MR
Sensor), giant magnetoresistance effect sensor (Giant Magnetoresistance Effect Sensor, GMR Sensor), wear
Tunnel magnetoresistive effect sensor (Tunneling Magnetoresistance Effect Sensor, TMR Sensor) or magnetic flux
Quantity sensor (Fluxgate), to sense the displacement of the second module 200.
For example, as shown in Fig. 2, the second module 200 may include a magnet assembly 220 (such as magnet), it is set to light
It learns on assembly bearing base 210, and the neighbouring electronic building brick 610 as sensing component.When drive module 500 drives the second module
200 it is mobile relative to the first module 100 when, sensing component can pass through the variation of magnetic force and obtain 220/ second module of magnet assembly
200 position.
Since package assembling 640 is homogenous material (for example including resin, plastics or glass), and electronic building brick 610, conducting wire
Frame 620 and lead 630 be embedded in package assembling 640, therefore can lifting assembly combined strength and be conducive to optical module
Driving mechanism 10 minimizes.Furthermore when by lead frame 620 be connected by welding to external circuit when, can also to avoid because
Thermal energy and cause lead frame 620 tilt or fall off.
In some embodiments, lead frame 620 may include magnetic conductive material, so that sensing component can more precisely detect
The position of 220/ second module 200 of magnet assembly.In some embodiments, it can will also be electrically independent from aforementioned wire frame 620
Magnetic conduction subassembly is positioned adjacent at electronic building brick 610, and this magnetic conduction subassembly can also be packaged component 640 and be coated.
Referring to Fig. 4, in another embodiment of the utility model, the framework 130 of the first module 100 can be include resin,
Plastics or glass, and electronic building brick 610, lead frame 620 and lead 630 can directly be embedded in the framework 130 of the first module 100
In.Also that is, framework 130 and package assembling 640 can be integrally formed, framework 130 can be directly as the envelope of electronic component module 600
Arrangement 640.
Fig. 5 A, 5B are please referred to, in another embodiment of the utility model, in order to make optical module driving mechanism 10 more into one
The miniaturization of step ground, electronic building brick 610A and lead frame 620 as driving IC can utilize IC built-in substrate technology
(Semiconductor Embedded in Substrate, SESUB) is embedded in package assembling 640, other electronic building bricks 610B
It then may be disposed on the outer surface 601 of electronic component module 600, and connect with lead frame 620.In addition, in this present embodiment, electricity
Sub-component module 600 is more electrically connected with the circuit board C being set on shell 110.
Referring to Fig. 6, the first module 100 is movable part in another embodiment of the utility model, including optical module is held
Seat 210 is carried, and the second module 200 is then fixed part, including shell 110, bottom plate 120, framework 130 and magnet assembly 220.Electricity
Sub-component module 600 is set in the first module 100 as movable part.Due to shell 110, bottom plate 120, framework 130, optics
With the structure of component in the structure and previous embodiment of assembly bearing base 210, magnet assembly 220 and electronic component module 600
It is identical, therefore repeated no more in this.
In addition, in this present embodiment, optical module driving mechanism 10 may also include a circuit board 700, a coil plate
800 and plural suspension ring line 900, wherein circuit board 700 is set on bottom plate 120, and coil plate 800 is set to circuit board
On 700, and suspension ring line 900 connects circuit board 700 and the first elastic parts 300.When electric current flows through plate coil 800, coil
Can produce driving force between plate 800 and the second electromagnetic drive component 512 makes optical module bearing seat 210 along X-axis and/or Y-axis
Direction is mobile, achievees the purpose that sway compensating whereby.
In conclusion the utility model provides a kind of optical module driving mechanism, including one first module, one second mould
Block, a drive module and an electronic component module.Drive module can drive the second module mobile relative to the first module.Electricity
Sub-component module includes an at least electronic building brick, at least a lead frame and a package assembling.Lead frame connects aforementioned electronic group
Part and the external circuit outside optical module driving mechanism.Package assembling has a homogenous material and coats electronic building brick and lead
Coil holder, wherein lead frame is exposed to except package assembling, and electronic building brick is not revealed in except package assembling.
Although the embodiments of the present invention and its advantage have been disclosed as above, it will be appreciated that technology belonging to any
Technical staff in field, in the conception and scope for not departing from the utility model, when can change, substitute with retouching.In addition, this
The protection scope of utility model is not necessarily limited by technique, machine, manufacture, substance group in specification in the specific embodiment
At, device, method and step, technical staff can understand existing from the utility model disclosure in any technical field
Or following technique, machine, manufacture, material composition, device, method and the step developed, as long as can the reality here
It applies and implements more or less the same function in example or obtain more or less the same result all be used according to the utility model.Therefore, this is practical new
The protection scope of type includes above-mentioned technique, machine, manufacture, material composition, device, method and step.In addition, each claim
An other embodiment is constituted, and the protection scope of the utility model also includes the combination of each claim and embodiment.
Although the utility model is disclosed as above with aforementioned several preferred embodiments, so it is practical new to be not limited to this for it
Type.Technical staff in the utility model technical field, in the conception and scope for not departing from the utility model, when can do
Perhaps variation and retouching.Therefore the protection scope of the utility model is subject to view as defined in claim.In addition, each right
It is required that being construed as an independent embodiment, and the combination of various claims and embodiment is all between the scope of the utility model
It is interior.
Claims (15)
1. a kind of optical module driving mechanism characterized by comprising
One first module；
One second module；
One drive module drives second module mobile relative to first module；And
One electronic component module is set in first module, comprising:
An at least electronic building brick；
An at least lead frame connects the electronic building brick and an external circuit, and the external circuit is located at the optical module driving machine
Except structure；And
One package assembling has homogenous material, and coats the electronic building brick and the lead frame, and wherein the lead frame is exposed to the envelope
Except arrangement, and the electronic building brick is not revealed in except the package assembling.
2. optical module driving mechanism as described in claim 1, which is characterized in that the lead frame has one section of portion, neighbouring to be somebody's turn to do
Electronic building brick, and when along the viewing of the long axis direction in this section of portion, the lead frame and the electronic building brick are least partially overlapped.
3. optical module driving mechanism as described in claim 1, which is characterized in that the electronic component module further includes drawing
Line connects the lead frame and the electronic building brick, and wherein the package assembling contacts the lead, the lead frame and the electronic building brick.
4. optical module driving mechanism as claimed in claim 3, which is characterized in that the lead is directed away from the side of the lead frame
To extension.
5. optical module driving mechanism as described in claim 1, which is characterized in that the electronic component module further includes another electricity
Sub-component, and the lead frame has a first end and a second end, is respectively adjacent to the electronic building brick and another electronics group
Part, wherein the distance between the first end and the electronic building brick are different between the second end and another electronic building brick
Distance.
6. optical module driving mechanism as described in claim 1, which is characterized in that the electronic building brick include a sensing component,
At least one of one filter and a driving IC.
7. optical module driving mechanism as described in claim 1, which is characterized in that the package assembling include resin, plastics or
Glass.
8. optical module driving mechanism as described in claim 1, which is characterized in that first module is a fixed part.
9. optical module driving mechanism as claimed in claim 8, which is characterized in that the fixed part includes a framework, and the envelope
Arrangement and the framework are integrally formed.
10. optical module driving mechanism as claimed in claim 8, which is characterized in that second module includes a magnet assembly,
And the wire erection is placed between the magnet assembly and the electronic building brick.
11. optical module driving mechanism as described in claim 1, which is characterized in that the electronic building brick and the lead frame are logical
IC built-in substrate technology is crossed to be embedded in the package assembling.
12. optical module driving mechanism as claimed in claim 11, which is characterized in that the optical module driving mechanism further includes
Another electronic building brick, is set on the outer surface of the electronic component module.
13. optical module driving mechanism as described in claim 1, which is characterized in that first module is a movable part.
14. optical module driving mechanism as described in claim 1, which is characterized in that the electronic component module further includes leading
Magnetic assembly, the neighbouring electronic building brick, and the magnetic conduction subassembly and the lead frame are electrically independent.
15. optical module driving mechanism as described in claim 1, which is characterized in that the lead frame includes magnetic conductive material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762587072P | 2017-11-16 | 2017-11-16 | |
| US62/587,072 | 2017-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209167638U true CN209167638U (en) | 2019-07-26 |
Family
ID=66556227
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811228776.3A Active CN109799591B (en) | 2017-11-16 | 2018-10-22 | Optical assembly driving mechanism |
| CN201821709679.1U Active CN209167638U (en) | 2017-11-16 | 2018-10-22 | Optical module driving mechanism |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811228776.3A Active CN109799591B (en) | 2017-11-16 | 2018-10-22 | Optical assembly driving mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109799591A (en) * | 2017-11-16 | 2019-05-24 | 台湾东电化股份有限公司 | Optical module driving mechanism |
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| TW513558B (en) * | 2000-10-27 | 2002-12-11 | Fuji Electric Co Ltd | Range finder for automatic focusing |
| JP2007241064A (en) * | 2006-03-10 | 2007-09-20 | Alps Electric Co Ltd | Lens-driving device |
| KR100867523B1 (en) * | 2007-07-06 | 2008-11-10 | 삼성전기주식회사 | A camera module package |
| CN100504482C (en) * | 2007-10-31 | 2009-06-24 | 无锡凯尔科技有限公司 | Chip packaged fixed focus focusing-free imaging module processing method |
| TWI623802B (en) * | 2013-05-06 | 2018-05-11 | 台灣東電化股份有限公司 | Lens driving device |
| JP6583601B2 (en) * | 2014-08-06 | 2019-10-02 | ミツミ電機株式会社 | Lens holder driving device and camera-equipped mobile terminal |
| EP3370105A1 (en) * | 2014-11-14 | 2018-09-05 | LG Innotek Co., Ltd. | Lens moving apparatus |
| TWI518396B (en) * | 2014-12-19 | 2016-01-21 | 台灣東電化股份有限公司 | Slimed lens module |
| KR101832568B1 (en) * | 2015-05-20 | 2018-02-27 | 삼성전기주식회사 | Camera Module |
| CN106855652B (en) * | 2015-12-09 | 2019-08-06 | 台湾东电化股份有限公司 | Lens driving module |
| TWI659649B (en) * | 2016-04-08 | 2019-05-11 | 台灣東電化股份有限公司 | Camera module |
| CN109799591B (en) * | 2017-11-16 | 2022-10-28 | 台湾东电化股份有限公司 | Optical assembly driving mechanism |
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2018
- 2018-10-22 CN CN201811228776.3A patent/CN109799591B/en active Active
- 2018-10-22 CN CN201821709679.1U patent/CN209167638U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109799591A (en) * | 2017-11-16 | 2019-05-24 | 台湾东电化股份有限公司 | Optical module driving mechanism |
| CN109799591B (en) * | 2017-11-16 | 2022-10-28 | 台湾东电化股份有限公司 | Optical assembly driving mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109799591A (en) | 2019-05-24 |
| CN109799591B (en) | 2022-10-28 |
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