CN109799591B - Optical assembly driving mechanism - Google Patents
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- CN109799591B CN109799591B CN201811228776.3A CN201811228776A CN109799591B CN 109799591 B CN109799591 B CN 109799591B CN 201811228776 A CN201811228776 A CN 201811228776A CN 109799591 B CN109799591 B CN 109799591B
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Abstract
The present disclosure provides an optical assembly driving mechanism, which includes a first module, a second module, a driving module, and an electronic assembly module. The driving module can drive the second module to move relative to the first module. The electronic component module comprises at least one electronic component, at least one lead frame and a packaging component. The lead frame is connected with the electronic component and an external circuit outside the optical component driving mechanism. The packaging assembly is provided with a single material and covers the electronic assembly and the lead frame, wherein the lead frame is exposed outside the packaging assembly, and the electronic assembly is not exposed outside the packaging assembly.
Description
Technical Field
The present invention relates to an optical module driving mechanism. More particularly, the present invention relates to an optical module driving mechanism having an electronic module.
Background
With the development of technology, many electronic devices (such as tablet computers or smart phones) are equipped with a lens module to have a function of taking pictures or recording videos. The use of these electronic devices is becoming more common and the design direction of these electronic devices is being developed to be more convenient and thinner to provide more choices for users.
The electronic device equipped with the lens module generally includes many tiny components and circuits therein, which are difficult to assemble in the case of miniaturization of the electronic device, and may be detached or damaged in the event of shaking or collision of the electronic device. Therefore, how to solve the above problems becomes an important issue.
Disclosure of Invention
In order to solve the above-mentioned problems, the present invention provides an optical device driving mechanism, which includes a first module, a second module, a driving module, and an electronic device module. The driving module can drive the second module to move relative to the first module. The electronic component module comprises at least one electronic component, at least one lead frame and a packaging component. The lead frame is connected with the electronic component and an external circuit outside the optical component driving mechanism. The packaging assembly is made of a single material and covers the electronic assembly and the lead frame, wherein the lead frame is exposed outside the packaging assembly, and the electronic assembly is not exposed outside the packaging assembly.
In an embodiment of the invention, the lead frame has a segment portion adjacent to the electronic component, and when viewed along a long axis direction of the segment portion, the lead frame and the electronic component are at least partially overlapped. The electronic component module further includes a lead extending away from the lead frame and connecting the lead frame and the component. Wherein the package assembly contacts the leads, the lead frame and the electronic assembly.
In an embodiment of the invention, the electronic device module further includes another electronic device, and the lead frame has a first end portion and a second end portion, which are respectively adjacent to the electronic device and the another electronic device, wherein a distance between the first end portion and the electronic device is different from a distance between the second end portion and the another electronic device.
In an embodiment of the invention, the electronic device includes at least one of a sensing device, a filter and a driver IC, the package assembly includes resin, plastic or glass, and the lead frame includes magnetic conductive material. In some embodiments, the electronic device module further includes a magnetic conductive device adjacent to the electronic device, and the magnetic conductive device is electrically independent from the leadframe.
In an embodiment of the invention, the first module is a fixing portion, and the fixing portion includes a frame. The packaging assembly and the frame body are integrally formed. The second module comprises a magnetic component, and the lead frame is arranged between the magnetic component and the electronic component.
In an embodiment of the invention, the electronic device and the lead frame are embedded in the package assembly by an IC embedded substrate technology, and the optical device driving mechanism further includes another electronic device disposed on an outer surface of the electronic device module. In some embodiments, the first module is a movable portion.
Drawings
Fig. 1 is a schematic diagram illustrating an electronic device according to an embodiment of the invention.
Fig. 2 is an exploded view showing an optical module driving mechanism according to an embodiment of the present invention.
Fig. 3 is a schematic diagram illustrating an electronic component module according to an embodiment of the invention.
Fig. 4 is an exploded view showing an optical module driving mechanism according to another embodiment of the present invention.
Fig. 5A is an exploded view showing an optical module driving mechanism according to another embodiment of the present invention.
Fig. 5B is a sectional view showing an electronic component module in another embodiment of the invention.
Fig. 6 is an exploded view showing an optical module driving mechanism according to another embodiment of the present invention.
Description of the reference numerals:
10. optical assembly driving mechanism
20. Electronic device
30. Optical assembly
100. First module
110. Outer cover
120. Base plate
130. Frame body
200. Second module
210. Optical assembly bearing seat
211. Piercing of holes
212. Upper surface of
213. Lower surface
220. Magnetic assembly
300. A first elastic component
310. Inner ring section
320. Outer ring section
400. Second elastic component
410. Inner ring section
420. Outer ring section
500. Drive module
511. A first electromagnetic drive assembly
512. Second electromagnetic drive assembly
600. Electronic component module
610. 610A, 610B electronic component
620. Lead frame
621. First end part
622. Second end portion
623. Segment part
630. Lead wire
640. Packaging assembly
700. Circuit board
800. Coil flat plate
900. Suspension loop wire
C circuit board
O1 optical aperture
O2 optical aperture
Detailed Description
The optical module driving mechanism according to the embodiment of the present invention is explained below. It should be appreciated, however, that the embodiments of the present invention provide many suitable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to make and use the invention, and do not delimit the scope of the invention.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Referring to fig. 1, an optical device driving mechanism 10 according to an embodiment of the present invention can be installed in an electronic device 20 to carry and drive an optical device 30. The optical element 30 can move relative to a photosensitive element (not shown) in the electronic device 20, thereby achieving the purpose of adjusting the focal length. The electronic device 20 may be, for example, a smart phone or a digital camera having a camera function, and the optical element 30 may be a lens.
Fig. 2 is an exploded view showing the optical module driving mechanism 10. As shown in the figure, the optical mechanism 10 mainly includes a first module 100, a second module 200, a first elastic element 300, a second elastic element 400, a driving module 500, and an electronic element module 600.
In the embodiment, the first module 100 is a fixed portion, and includes a housing 110, a bottom plate 120 and a frame 130, the frame 130 is fixed on the housing 110, and the housing 110 and the bottom plate 120 can be combined into a hollow box. The second module 200, the first elastic element 300, the second elastic element 400, the driving module 500 and the electronic component module 600 may be surrounded by the housing 110 and accommodated in the hollow box.
The second module 200 is a movable portion, and for example, includes an optical device carrier 210 having a through hole 211 formed at the center thereof, and the optical device 30 can be fixedly disposed in the through hole 211. The housing 110 and the bottom plate 120 of the first module 100 have optical holes O1 and O2 corresponding to the through hole 211, respectively, so that external light can sequentially pass through the optical hole O1, the optical element 30, and the optical hole O2 and finally reach the photosensitive element in the electronic device 20 to form an image on the photosensitive element.
The first elastic element 300 and the second elastic element 400 are respectively disposed on opposite sides of the optical element carrier 210, and the inner ring section 310 and the outer ring section 320 of the first elastic element 300 are respectively connected to the upper surface 212 of the optical element carrier 210 and the frame 130, and the inner ring section 410 and the outer ring section 420 of the second elastic element 400 are respectively connected to the lower surface 213 of the optical element carrier 210 and the bottom plate 120. In this way, the optical device carrier 210 can be suspended in the hollow box by the first elastic device 300 and the second elastic device 400.
Referring to fig. 2, the driving module 500 includes at least one first electromagnetic driving element 511 and at least one second electromagnetic driving element 512, wherein the first electromagnetic driving element 511 is disposed on the optical element bearing seat 210, and the second electromagnetic driving element 512 is disposed on the bottom plate 120 or the frame 130 of the first module 100. Through the electromagnetic action between the first electromagnetic driving component 511 and the second electromagnetic driving component 512, the optical component carrier 210 and the optical component 30 disposed thereon can be driven to move along the Z-axis direction relative to the first module 100.
For example, in the present embodiment, the first electromagnetic driving element 511 may be a driving coil, and the second electromagnetic driving element 512 may be a magnetic element (e.g., a magnet). When a current is applied to the driving coil (the first electromagnetic driving component 511), an electromagnetic effect generated between the driving coil and the magnetic component can provide a driving force in the Z-axis direction to the optical component bearing seat 210, so that the optical component bearing seat 210 and the optical component 30 disposed thereon move in the Z-axis direction relative to the first module 100, and further move in the Z-axis direction relative to the photosensitive component in the electronic device 20, thereby achieving the purpose of adjusting the focal length.
In the embodiment, the driving module 500 includes two first electromagnetic driving components 511 and two second electromagnetic driving components 512 disposed on opposite sides of the optical device carrier 210, so as to provide a uniform driving force to move the optical device carrier 210 and prevent the optical device carrier 210 from rotating relative to the first module 100. In some embodiments, the driving module 500 may include a first electromagnetic driving device 511 surrounding the optical device carrier 210 and two second electromagnetic driving devices 512 located at opposite sides of the optical device carrier 210 (or one second electromagnetic driving device 512 is disposed around the optical device carrier 210). In some embodiments, the driving module 500 may also include a single first electromagnetic driving device 511 and a single second electromagnetic driving device 512 when the first electromagnetic driving device 511 and the second electromagnetic driving device 512 can provide sufficient driving force.
In some embodiments, the electromagnetic driving element 511 may be a magnetic element, and the electromagnetic driving element 512 may be a driving coil.
Fig. 3 is a schematic diagram illustrating an electronic component module 600. As shown in fig. 2 and 3, the electronic device module 600 may be fixed to the first module 100 and includes at least one electronic device 610, at least one lead frame 620, at least one lead 630, and a package assembly 640.
The lead frame 620 is electrically connected to the electronic device 610 to connect the electronic device 610 to external circuitry (not shown) in the electronic device 20. Specifically, one end of the leadframe 620 covered by the package 640 is connected to the electronic device 610, and the other end thereof not covered by the package 640 is connected to an external circuit.
In the present embodiment, the electronic device module 600 includes two electronic devices 610A, 610B, wherein one of the electronic devices 610A is connected to the leadframe 620 via leads 630, and the other electronic device 610B is in direct contact with the leadframe 620. Therefore, as shown in fig. 3, the first end 621 and the second end 622 of the lead frame 620 are respectively adjacent to the electronic element 610A and the electronic element 610B, and a distance between the electronic element 610A and the first end 621 is different from a distance between the electronic element 610B and the second end 622.
More specifically, leadframe 620 has a segment 623 adjacent to electronic component 610. The electronic device 610 may directly contact the segment 623, or the leads 630 may connect the segment 623 and extend away from the lead frame 620 to connect to the electronic device 610. When viewed along the long axis of the segment 623, the leadframe 620 and the electronic device 610 at least partially overlap.
The aforementioned electronic component 610 may include, for example, a sensing component, a filter, or a driving IC. The sensing element may be, for example, a Hall Effect Sensor (Hall Sensor), a magnetoresistive Effect Sensor (MR Sensor), a Giant magnetoresistive Effect Sensor (GMR Sensor), a Tunneling magnetoresistive Effect Sensor (TMR Sensor), or a flux Sensor (Fluxgate) for sensing the displacement of the second module 200.
For example, as shown in fig. 2, the second module 200 may include a magnetic element 220 (e.g., a magnet) disposed on the optical element holder 210 and adjacent to the electronic element 610 serving as a sensing element. When the driving module 500 drives the second module 200 to move relative to the first module 100, the sensing element can obtain the position of the magnetic element 220/the second module 200 through the change of the magnetic force.
Since the package assembly 640 is made of a single material (e.g., including resin, plastic or glass), and the electronic device 610, the lead frame 620 and the leads 630 are embedded in the package assembly 640, the assembly strength of the devices can be improved, and the miniaturization of the optical device driving mechanism 10 is facilitated. Furthermore, when the lead frame 620 is connected to an external circuit by soldering, the lead frame 620 is prevented from being tilted or separated due to heat.
In some embodiments, the lead frame 620 may include a magnetically permeable material to enable the sensing device to more accurately detect the position of the magnetic element 220/second module 200. In some embodiments, a magnetic conductive element electrically independent from the leadframe 620 may be disposed adjacent to the electronic element 610, and the magnetic conductive element may be encapsulated by the encapsulation element 640.
Referring to fig. 4, in another embodiment of the present invention, the frame 130 of the first module 100 may include resin, plastic or glass, and the electronic component 610, the lead frame 620 and the leads 630 may be directly embedded in the frame 130 of the first module 100. That is, the frame 130 and the package 640 may be integrally formed, and the frame 130 may directly serve as the package 640 of the electronic component module 600.
Referring to fig. 5A and 5B, in another embodiment of the present invention, in order to further miniaturize the optical device driving mechanism 10, the electronic device 610A and the lead frame 620 as the driving IC may be Embedded in the package assembly 640 by using a Semiconductor Embedded in Substrate (sub) technology, and the other electronic devices 610B may be disposed on the outer surface 601 of the electronic device module 600 and connected to the lead frame 620. In addition, in the present embodiment, the electronic device module 600 is further electrically connected to the circuit board C disposed on the housing 110.
Referring to fig. 6, in another embodiment of the present invention, the first module 100 is a movable portion including an optical assembly carrier 210, and the second module 200 is a fixed portion including a housing 110, a bottom plate 120, a frame 130 and a magnetic assembly 220. The electronic component module 600 is disposed on the first module 100 as a movable portion. Since the structures of the housing 110, the base plate 120, the frame 130, the optical device bearing seat 210, the magnetic device 220, and the electronic device module 600 are the same as those of the same components in the previous embodiments, further description is omitted here.
In addition, in the embodiment, the optical device driving mechanism 10 may further include a circuit board 700, a coil plate 800, and a plurality of suspension ring wires 900, wherein the circuit board 700 is disposed on the bottom plate 120, the coil plate 800 is disposed on the circuit board 700, and the suspension ring wires 900 are connected to the circuit board 700 and the first elastic device 300. When the current flows through the plate coil 800, a driving force can be generated between the coil plate 800 and the second electromagnetic driving component 512 to move the optical component bearing seat 210 along the X-axis and/or Y-axis direction, thereby achieving the purpose of shake compensation.
In summary, the present invention provides an optical device driving mechanism, which includes a first module, a second module, a driving module, and an electronic device module. The driving module can drive the second module to move relative to the first module. The electronic component module comprises at least one electronic component, at least one lead frame and a packaging component. The lead frame is connected with the electronic component and an external circuit outside the optical component driving mechanism. The packaging assembly is provided with a single material and covers the electronic assembly and the lead frame, wherein the lead frame is exposed outside the packaging assembly, and the electronic assembly is not exposed outside the packaging assembly.
Although the embodiments of the present invention and their advantages have been disclosed, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the invention. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but it is to be understood that any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed, that will become apparent to those skilled in the art from this disclosure, may be utilized according to the present invention, and that all the same functions or advantages of the disclosed embodiments may be accomplished by the present invention. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described in the specification. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes combinations of the respective claims and embodiments.
While the invention has been described with reference to certain preferred embodiments, it is not intended to be limited thereto. Those skilled in the art to which the invention pertains will readily appreciate that numerous modifications and adaptations may be made without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention is subject to the claims. Furthermore, each claim constitutes a separate embodiment, and combinations of various claims and embodiments are within the scope of the invention.
Claims (14)
1. An optical assembly drive mechanism comprising:
a first module;
a second module;
the driving module drives the second module to move relative to the first module; and
an electronic component module disposed on the first module, comprising:
a package assembly;
a first electronic component, wherein the packaging component directly contacts the first electronic component and the first electronic component is not exposed from the packaging component;
a second electronic component fixedly disposed in the package assembly, wherein a gap greater than zero is provided between the first electronic component and the second electronic component;
at least one first lead frame electrically connected to the first electronic component and including:
a first segment electrically connected to the first electronic component, wherein the package component directly contacts the first segment, and the first segment is not exposed from the package component; and
a second segment electrically connected to the first electronic component via the first segment, wherein the first segment and the second segment are integrally formed, and at least a portion of the second segment is exposed from the package assembly;
a second lead frame electrically connected to the second electronic component and including:
a third segment electrically connected to the second electronic component, wherein the package assembly directly contacts the third segment and the third segment is not exposed from the package assembly; and
a fourth segment electrically connected to the second electronic component through the third segment, wherein the third segment and the fourth segment are integrally formed, and at least a portion of the fourth segment is exposed from the package assembly.
2. The optical device driving mechanism according to claim 1, wherein the first leadframe has a segment portion adjacent to the first electronic device, and the first leadframe and the first electronic device at least partially overlap when viewed along a long axis of the segment portion.
3. The optical device driving mechanism according to claim 1, wherein the electronic device module further comprises a lead connecting the first leadframe and the first electronic device, wherein the package assembly contacts the lead, the first leadframe and the first electronic device.
4. The optical device driving mechanism according to claim 3, wherein the leads extend away from the first leadframe.
5. The optical device driving mechanism according to claim 1, wherein the second leadframe has a first end portion and a second end portion adjacent to the first electronic device and the second electronic device, respectively, wherein a distance between the first end portion and the first electronic device is different from a distance between the second end portion and the second electronic device.
6. The optical assembly driving mechanism of claim 1, wherein the packaging assembly comprises resin, plastic or glass.
7. The optical device driving mechanism as claimed in claim 1, wherein the first module is a fixed portion.
8. The optical device driving mechanism as claimed in claim 7, wherein the fixing portion comprises a frame, and the package assembly and the frame are integrally formed.
9. The optical device driving mechanism of claim 7, wherein the second module comprises a magnetic device adjacent to the first electronic device.
10. The optical device driving mechanism according to claim 1, wherein the first electronic device, the second electronic device, the first lead frame, and the second lead frame are embedded in the package assembly by IC-on-board technology.
11. The optical component drive mechanism of claim 10, wherein the optical component drive mechanism further comprises another electronic component disposed on an outer surface of the electronic component module.
12. The optical device driving mechanism according to claim 1, wherein the first module is a movable portion.
13. The optical device driving mechanism according to claim 1, wherein the electronic device module further comprises a magnetic conductive device adjacent to the first electronic device, and the magnetic conductive device is electrically independent from the first lead frame and the second lead frame.
14. The optical device driving mechanism according to claim 1, wherein the first lead frame and the second lead frame comprise magnetically permeable material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/193,490 US11067768B2 (en) | 2017-11-16 | 2018-11-16 | Optical member driving mechanism |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762587072P | 2017-11-16 | 2017-11-16 | |
| US62/587,072 | 2017-11-16 |
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| Publication Number | Publication Date |
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| CN109799591A CN109799591A (en) | 2019-05-24 |
| CN109799591B true CN109799591B (en) | 2022-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821709679.1U Active CN209167638U (en) | 2017-11-16 | 2018-10-22 | Optical module driving mechanism |
| CN201811228776.3A Active CN109799591B (en) | 2017-11-16 | 2018-10-22 | Optical assembly driving mechanism |
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| CN201821709679.1U Active CN209167638U (en) | 2017-11-16 | 2018-10-22 | Optical module driving mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209167638U (en) * | 2017-11-16 | 2019-07-26 | 台湾东电化股份有限公司 | Optical module driving mechanism |
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| TWI655490B (en) * | 2013-05-06 | 2019-04-01 | 台灣東電化股份有限公司 | Lens drive |
| JP6583601B2 (en) * | 2014-08-06 | 2019-10-02 | ミツミ電機株式会社 | Lens holder driving device and camera-equipped mobile terminal |
| TWI620975B (en) * | 2016-04-08 | 2018-04-11 | 台灣東電化股份有限公司 | Camera module |
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- 2018-10-22 CN CN201811228776.3A patent/CN109799591B/en active Active
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| JP2007241064A (en) * | 2006-03-10 | 2007-09-20 | Alps Electric Co Ltd | Lens-driving device |
| CN101339285A (en) * | 2007-07-06 | 2009-01-07 | 三星电机株式会社 | Camera module package |
| CN101149458A (en) * | 2007-10-31 | 2008-03-26 | 无锡凯尔科技有限公司 | Chip packaged fixed focus focusing-free imaging module processing method |
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| Publication number | Publication date |
|---|---|
| CN109799591A (en) | 2019-05-24 |
| CN209167638U (en) | 2019-07-26 |
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