CN108445692A - Driving mechanism - Google Patents

Abstract

A kind of driving mechanism, to drive an optical element, including a load bearing unit, a base unit and a magnetic element.Aforementioned load bearing unit is to carry aforementioned optical element, and said base unit includes a metal substrate and the circuit structure being formed on aforementioned metal substrate, and wherein aforementioned circuit structure includes a driving coil.Aforementioned magnetic element is set on aforementioned load bearing unit and corresponds to aforementioned driving coil, to drive aforementioned optical element to be moved relative to said base unit.

Description

Driving mechanism

Technical field

The present invention relates to a kind of electromagnetic drive mechanism, more particularly to one kind can pass through electromagnetic driving force The electromagnetic drive mechanism of (electromagnetic force) moving lens.

Background technology

General camera, video camera or mobile phone can often be caused its internal optics to shake by external force collision, this When will be easy to cause light path offset and make shooting image it is smudgy.Known patent document TW I457693 disclose one Kind optical imagery vibration abatement, when auto-focusing, Inside coil can act after being powered with corresponding magnet so that with The fixed camera lens load-bearing part of coil can be moved along the optical axis direction of camera lens to achieve the effect that auto-focusing, in addition in optical imagery It is further provided with X-axis and Y-axis position sensing element in vibration abatement, thus can sense optical axis in the position of X-axis and Y direction, in turn It can be respectively by the coil and magnet generation electromagnetic induction corresponding to X-axis and Y-axis, to adjust camera lens to correct position, so Once to correct optical axis in the horizontal-shift of X-axis and Y direction, to reach shockproof effect and preferable image product can be obtained Matter.However, the size due to aforementioned coil, magnet and position sensing element increasingly minimizes, and then it is easily reduced its electromagnetism The sensitivity of driving force and position sensing；In view of this, how to take into account the micromation of mechanism and ensure electromagnetic drive machine simultaneously The overall performance of structure begins to become an important project.

Invention content

In view of aforesaid known problem, of the invention one is designed to provide a kind of driving mechanism, to drive a light Element is learned, driving mechanism includes a load bearing unit, a base unit and a magnetic element.Before aforementioned load bearing unit is to carry State optical element, said base unit includes a metal substrate and the circuit structure being formed on aforementioned metal substrate, Middle aforementioned circuit structure includes a driving coil.Aforementioned magnetic element is set on aforementioned load bearing unit and corresponds to aforementioned driving Coil, to drive aforementioned optical element to be moved relative to said base unit.

In an embodiment, aforementioned metal substrate on an optical axis direction of aforementioned optical element have a first thickness, And aforementioned circuit structure is in having a second thickness on aforementioned optical axis direction, wherein to be more than aforementioned second thick for aforementioned first thickness Degree.

In an embodiment, aforementioned circuit structure further includes a conducting wire, aforementioned driving coil in aforementioned optical element one There is a third thickness, and aforementioned wire is in having one the 4th thickness on aforementioned optical axis direction on optical axis direction, wherein aforementioned the Three thickness are more than aforementioned 4th thickness.

In an embodiment, aforementioned first thickness is more than aforementioned third thickness.

In an embodiment, aforementioned metal substrate on an optical axis direction of aforementioned optical element have a first thickness, And aforementioned circuit structure is in having a second thickness on aforementioned optical axis direction, wherein to be more than aforementioned first thick for aforementioned second thickness Degree.

In an embodiment, aforementioned circuit structure further includes a conducting wire, is electrically connected aforementioned driving coil, and aforementioned driving Coil and aforementioned wire are in least partially overlapped on an optical axis direction of aforementioned optical element.

In an embodiment, aforementioned circuit structure further includes a conducting wire, is electrically connected aforementioned driving coil, and aforementioned driving Coil and aforementioned wire are in least partially overlapped in a horizontal direction, and wherein aforementioned levels direction is perpendicular to aforementioned optical element One optical axis.

In an embodiment, aforementioned circuit structure further includes a conducting wire, is electrically connected aforementioned driving coil, and aforementioned driving Coil or aforementioned wire have a guiding angle surface.

In an embodiment, aforementioned circuit structure further includes a conducting wire, is formed on aforementioned metal substrate.

In an embodiment, aforementioned circuit structure further includes a conducting wire, is electrically connected aforementioned metal substrate.

In an embodiment, aforementioned metal substrate has stainless steel.

In an embodiment, aforementioned driving mechanism further includes a magnetic field sensing element, to sense aforementioned magnetic element Position, wherein aforementioned metal substrate is between aforementioned magnetic element and aforementioned magnetic field sensing element.

In an embodiment, aforementioned driving mechanism further includes an illuminant module, and aforementioned illuminant module includes a sensing magnetic fields Element, a board and a photosensitive element, wherein aforementioned magnetic field sensing element and aforementioned photosensitive element are set to aforementioned board On.

In an embodiment, aforementioned metal substrate has a maximum gauge on an optical axis direction of aforementioned optical element, And aforementioned metal substrate has a minimum widith on the direction of aforementioned optical axis, wherein aforementioned maximum gauge is more than aforementioned Minimum widith.

In an embodiment, aforementioned metal substrate has a narrow part, and aforementioned narrow portion is the one of aforementioned optical element Thickness on optical axis direction is more than aforementioned narrow portion in the width on the direction of aforementioned optical axis.

In an embodiment, aforementioned metal substrate has a narrow part, and aforementioned circuit structure further includes a conducting wire, wherein Aforementioned narrow portion has a minimum widith of aforementioned metal substrate, and aforementioned wire forms a multilayer above aforementioned narrow portion Stereochemical structure a, wherein optical axis direction of the aforementioned minimum widith perpendicular to aforementioned optical element

In an embodiment, aforementioned driving mechanism further includes multiple magnetic elements, and aforementioned circuit structure further includes corresponding to Multiple driving coils of aforementioned magnetic element, and aforementioned metal substrate has a quadrilateral structure and a trepanning, wherein aforementioned Magnetic element corresponds respectively to the different corners of aforementioned quadrilateral structure, and is observed by an optical axis direction of aforementioned optical element, The line of centres of aforementioned magnetic element extends past aforementioned trepanning.

In an embodiment, aforementioned driving mechanism further includes multiple magnetic elements, and aforementioned circuit structure further includes corresponding to Multiple driving coils of aforementioned magnetic element, and aforementioned metal substrate has a quadrilateral structure, wherein aforementioned magnetic element point Not Dui Yingyu aforementioned quadrilateral structure different sides.

In an embodiment, aforementioned driving mechanism further includes a shell, and aforementioned metal substrate with aforementioned shell to weld, The mode of welding or bonding is fixed to each other.

In an embodiment, aforementioned driving mechanism further includes a shell, and aforementioned metal substrate has a quadrilateral structure, and Aforementioned metal substrate is be combined with each other with aforementioned shell in a manner of laser welding, and wherein aforementioned metal substrate and aforementioned shell is molten Contact is located at four corners of aforementioned metal substrate.

The beneficial effects of the present invention are, driving coil can with a conducting wire in the horizontal direction (perpendicular to Z axis) at least It partly overlapping, driving coil then can be least partially overlapped in vertical direction (Z-direction) with another conducting wire in addition, thus, it is possible to The further size of reduction base unit in the horizontal or vertical directions, to achieve the purpose that mechanism is miniaturized.

For above and other objects of the present invention, feature and advantage can be clearer and more comprehensible, it is cited below particularly go out preferable implementation Example, and coordinate appended attached drawing, it is described in detail below.

Description of the drawings

Fig. 1 shows the explosive views of the driving mechanism of one embodiment of the invention.

Fig. 2 indicates vertical view of the base unit 30 after combination in Fig. 1.

Fig. 3 and Fig. 4 then indicates sectional view of the driving mechanism after combination diagonally in Fig. 1.

Fig. 5 indicates the enlarged drawing of part A in Fig. 4.

Fig. 6 then indicates the enlarged drawing of part B in Fig. 4.

Fig. 7 indicates the partial sectional view of the base unit 30 of another embodiment of the present invention.

Fig. 8 shows the driving mechanism schematic diagrames of another embodiment of the present invention.

Fig. 9 indicates the metal substrate 31 of another embodiment of the present invention and the relative position relation schematic diagram of magnet M.

Figure 10 then indicates the schematic diagram of the narrow part 311 in Fig. 9.

Figure 11 indicates to form the schematic diagram of layer stereo structure in circuit structure 32 of the conducting wire 322 above narrow part 311.

As Figure 12 indicates the relative position relation signal of the base unit 30, magnet M and driving coil C of another embodiment Figure.

Figure 13 indicates stereogram of the driving mechanism of one embodiment of the invention after combination.

Reference numeral is as follows：

10 shells

20 load-bearing parts

30 base units

31 metal substrates

311 narrow parts

32 circuit structures

321 driving coils

322 conducting wires

323 conducting wires

324 conducting wires

40 illuminant modules

41 boards

42 photosensitive elements

43 magnetic field sensing elements

C driving coils

The positions E

F frames

H thickness

L width

L1, L2 line

M magnet

M, M1, M2 magnet

MR reference elements

O optical axises

S1 upper reed plates

Reed under S2

T1 first thickness

T2 second thickness

T3 third thickness

The 4th thickness of T4

W elastic elements

Specific implementation mode

Illustrate the twin-lens photographic system of the embodiment of the present invention below.However, can will readily appreciate that the embodiment of the present invention provides Many suitable concept of the invention and may be implemented in wide variety of specific background.Disclosed specific embodiment is merely illustrative With ad hoc approach using the present invention, not limiting to the scope of the present invention.

Unless otherwise defined, belonging to whole term (including technology and scientific words) as used herein has and discloses with this piece The normally understood identical connotation of those skilled in the art institute.It is appreciated that these terms, such as in usually used dictionary Defined in term, should be interpreted to have a meaning consistent with the background or context of the relevant technologies and the disclosure, without Ying Yiyi is idealized or excessively formal mode is understood, unless especially definition herein.

Please first together refering to fig. 1~4, wherein Fig. 1 shows the explosive view of the driving mechanism of one embodiment of the invention, Fig. 2 tables Vertical view of the base unit 30 after combination in diagram 1, Fig. 3 and Fig. 4 then indicate the driving mechanism in Fig. 1 after combination along right The sectional view in linea angulata direction.The driving mechanism of the present embodiment is mainly to drive an optical element (such as optical lens), such as Include mainly a shell 10, at least a upper reed plate S1, a frame F, at least magnet M being fixed on frame F shown in Fig. 1 (or other magnetic elements), at least a driving coil C, a hollow load-bearing part 20, at least once reed S2, at least one elasticity member Part W and a base unit 30, middle frame F and load-bearing part 20 may make up a load bearing unit, to carry an optical element (example Such as optical lens).

For example, aforementioned driving mechanism may be disposed at a portable electronic equipment (such as mobile phone or tablet computer) It is interior, and the circuit unit (not shown) outside one is electrically connected to by base unit 30, wherein aforementioned optical element can be set It is placed in load-bearing part 20, and driving mechanism can adjust the position of optical element by magnetic force, so as to making light can be along optics member After the optical axis O (being parallel to Z axis) of part enters driving mechanism, across aforementioned optical element in being on a photosensitive element (not shown) Reveal clearly image.For example, aforementioned driving mechanism can be a voice coil motor (Voice Coil Motor, VCM).

Then it is set around 20 outside of load-bearing part also referring to Fig. 1, Fig. 3 and Fig. 4, aforementioned driving coil C, upper reed plate S1 connects Frame F and load-bearing part 20 are connect, lower reed S2 then connects bottom surface and the load-bearing part 20 of magnet M, so that load-bearing part 20 can Relative to frame F, vertically (Z-direction) is mobile；On the other hand, elastic element W (such as the metals extended towards Z-direction Rod piece) connect upper reed plate S1 and base unit 30 so that and frame F, the optical element of load-bearing part 20 and setting in the inner can be together It is mobile (perpendicular to Z axis) in the horizontal direction relative to base unit 30.

In this present embodiment, when driving coil C is passed into electric current, magnetic force can be generated between driving coil C and magnet M, To drive the optical element of load-bearing part 20 and setting in the inner to be moved up and down together along Z-direction relative to frame F, so it is reachable To the function of auto-focusing (autofocus).

Please continue to refer to Fig. 1~4, said base unit 30 mainly comprising a metal substrate 31 and is formed in the Metal Substrate One circuit structure 32 of 31 top of plate, wherein being embedded with an at least driving coil 321, and its position pair inside circuit structure 32 Ying Yu is fixed on the magnet M on frame F, thus can be driven by magnetic force load bearing unit (comprising frame F and load-bearing part 20) and The optical element being arranged in the inner is mobile (perpendicular to Z axis) in the horizontal direction relative to shell 10 and base unit 30 together, with Reach the function of optical imagery shockproof (Optical Image Stabilization, OIS).

By in Fig. 3 and 4 it can be clearly seen that aforementioned magnet M is fixed on the medial surface of frame F, and corresponding to carrying The driving coil 321 inside driving coil C and base unit 30 on part 20, to execute auto-focusing respectively (autofocus) and shockproof (the Optical Image of optical imagery

Stabilization, OIS) function.Specifically, it is removed in the circuit structure 32 of base unit 30 It is equipped with outside driving coil 321, is additionally provided with an at least conducting wire 322, is for electrically connecting to aforementioned driving coil 321 and driving mechanism External circuit unit, wherein circuit structure 32 can pass through insert molding (Insert Molding) or other integrally formed sides Formula is formed directly on metal substrate 31.

For example, a plastic material can be formed in 31 top of metal substrate in a manner of insert molding and coated aforementioned Driving coil 321 and conducting wire 322 so as to forming aforementioned circuit structure 32 on metal substrate 31, and then can reach reduction manufacture The purpose of cost and mechanism micromation.

Then also referring to Figures 5 and 6, wherein Fig. 5 indicates that the enlarged drawing of part A in Fig. 4, Fig. 6 then indicate the portions B in Fig. 4 The enlarged drawing divided.As it can be seen in figures 5 and 6, the driving coil 321 and conducting wire 322 in the present embodiment are covered by an insulating materials Inside, the wherein position of driving coil 321 correspond to the magnet M of top, (include frame so as to generating magnetic force to drive load bearing unit F and load-bearing part 20) and setting optical element in the inner (hang down in the horizontal direction relative to shell 10 and base unit 30 together Directly in Z axis) it is mobile.

It is to be understood that driving coil 321 and conducting wire 322 in this present embodiment can have multilayered structure, wherein driving The position of coil 321 compared with conducting wire 322 closer to magnet M, and driving coil 321 and conducting wire 322 on X, Y or Z-direction not It is overlapped.In addition, by Fig. 6 it can be clearly seen that metal substrate 31 in Z-direction have a first thickness T1, and For circuit structure 32 in having a second thickness T2 in Z-direction, wherein first thickness T1 can be more than second thickness T2；However, also The second thickness T2 of circuit structure 32 can be made to be more than the first thickness T1 of metal substrate 31, so that aforementioned circuit structure 32 can be in Z The driving coil 321 and conducting wire 322 of more layers are accommodated in axis direction.

As shown in fig. 6, aforementioned driving coil 321 is in having a third thickness T3 in Z-direction, and aforementioned wire 322 is in Z There is one the 4th thickness T4, wherein third thickness T3 to be more than the 4th thickness T4, and the first thickness of metal substrate 31 in axis direction T1 is more than third thickness T3；It is to be understood that part conducting wire 322 in figure 6 is also formed directly in 31 surface of metal substrate, And it is directly electrically connected with the metal substrate 31 of lower section, to be used as ground connection or heat dissipation.In addition, also may be used from Fig. 5 and Fig. 6 Find out that driving coil 321 and/or conducting wire 322 are formed with the guiding angle surface of arc-shaped, to avoid in circuit structure 32 coil or lead Distance closely generates the short circuit phenomenon caused by point discharge very much between line.

Again referring to Fig. 7, Fig. 7 indicates the partial sectional view of the base unit 30 of another embodiment of the present invention.Such as Fig. 7 institutes Show, in the circuit structure 32 of the present embodiment, driving coil 321 can with a conducting wire 323 in the horizontal direction (perpendicular to Z axis) on It is least partially overlapped, in addition driving coil 321 then can with another conducting wire 324 in vertical direction (Z-direction) at least partly Overlapping, thus, it is possible to further reduce the size of base unit 30 in the horizontal or vertical directions, to reach mechanism micromation Purpose.

Then referring to Fig. 8, the figure is the driving mechanism schematic diagram of another embodiment of the present invention, wherein saying for convenience Bright, Fig. 8 omits the subelement (such as shell 10 and upper and lower reed S1, S2) depicted in driving mechanism.It can from Fig. 8 To find out, the driving mechanism of the present embodiment further includes an illuminant module 40, and aforementioned illuminant module 40 is set under base unit 30 Side, includes mainly a board 41, a photosensitive element 42 and at least a magnetic field sensing element 43, aforementioned photosensitive element 42 are set It is placed in the middle position of board 41 and corresponds to aforementioned optical element, magnetic field sensing element 43 is then disposed on the side of board 41 Side, and its position corresponds to the magnet M (M1/M2) being fixed on frame F and/or the reference element being fixed on load-bearing part 20 MR (such as a sensing magnet or other magnetic elements), to sense the position of frame F or load-bearing part 20.

For example, aforementioned photosensitive element 42 can have photosensitive coupling element (Charge Coupled Device, CCD), To receive from the extraneous light entered in driving mechanism and across optical element, and then a digital picture can be generated；Another party Anisotropy magnetic resistance can be used in face, aforementioned magnetic field sensing element 43

(Anisotropic Magnetoesistance, AMR), giant magnetic resistance (Giant Magnetoresistance,

GMR) or tunnel magneto-resistance formula (Tunnel Magnetoresistance, TMR) magnetic field sensor, to sense magnet The position of M (M1/M2) and/or reference element MR, and then can help to reach auto-focusing

(autofocus) and the function of optical imagery shockproof (Optical Image Stabilization, OIS).

In the present embodiment, stainless steel substrate (stainless can be used in the metal substrate 31 in said base unit 30 Steel substrate), and metal substrate 31 in vertical direction (Z-direction) be located at aforementioned magnetic field sensing element 43 and Between magnet M (M1/M2), and/or between magnetic field sensing element 43 and reference element MR.

In the present embodiment, since metal substrate 31 can have relatively thin thickness and be made with stainless steel (SUS) material At, therefore the heat dissipation to illuminant module 40 can be significantly improved in the case where not influencing the sensing effect of magnetic field sensing element 43 Effect；Further, since magnetic field sensing element 43 is arranged in the illuminant module 40 below base unit 30, pedestal will not be occupied The space of 30 top of unit, therefore also can help to the micromation of driving mechanism entirety.

Then the metal substrate 31 and magnet of another embodiment of the present invention are indicated also referring to Fig. 9 and Figure 10, wherein Fig. 9 The relative position relation schematic diagram of M, Figure 10 then indicate the schematic diagram of the narrow part 311 in Fig. 9.As shown in Figures 9 and 10, this implementation Four sides of the metal substrate 31 in example are respectively formed with a narrow part 311, since narrow part 311 is (vertical in the horizontal direction In Z axis) on width L it is relatively narrow and cause its structural strength weaker, therefore can be by increasing narrow part 311 in vertical direction (Z axis Direction) on thickness H, effectively to promote structural strength of the metal substrate 31 at narrow part 311.For example, narrow part 311 It may can increase the thickness H of narrow part 311 at this time with a minimum widith of metal substrate 31 and be larger than narrow part 311 Width L, and make narrow part 311 thickness H become metal substrate 31 a maximum gauge, to promote the knot at narrow part 311 Structure intensity.

In addition, by that can also can be clearly seen in Fig. 9, metal substrate 31 has a quadrilateral structure, the position of aforementioned magnet M Four corners corresponding to metal substrate 31 are set, and are observed by the directions optical axis O (being parallel to Z axis), the line of centres of aforementioned magnet M The trepanning 310 (as shown in line L1, L2 in Fig. 9) in 31 center of metal substrate can be extended past.

1 is please referred to Fig.1 again, since the width L of narrow part 311 is relatively narrow, the circuit structure 32 above narrow part 311 In, conducting wire 322 can form the layer stereo structure arranged along Z-direction, and thus, it is possible to efficiently use inside circuit structure 32 Space, to achieve the purpose that driving mechanism is miniaturized.

As shown in figure 12, in another embodiment, aforementioned magnet M can also use multipole magnet, and its position corresponds to The driving coil 321 of four sides of base unit 30 and position inside base unit 30, in addition in outer on load-bearing part 20 Two driving coil C can be arranged in side, correspond respectively to the two of which of aforementioned magnet M.Thus, when driving coil C is led to When entering electric current, magnetic force can be generated between driving coil C and magnet M, to drive the optics member of load-bearing part 20 and setting in the inner Part is moved up and down along Z-direction, and then can reach the function of auto-focusing (autofocus).

Figure 13 indicates that metal can be used in stereogram of the driving mechanism of one embodiment of the invention after combination, middle casing 10 Material, and the metal substrate 31 of base unit 30 and shell 10 can by welding (soldering), welding (welding) or It is fixed to each other in such a way that sticker is bonded.In the present embodiment, metal substrate 31 and shell 10 can pass through laser welding The mode of (laser welding) be combined with each other, and its fusion point can be located at four corners of the metal substrate 31 of quadrangle (as shown in four position E in Figure 13), thus can room for promotion utilization ratio with achieve the purpose that mechanism be miniaturized.

However, aforementioned fusion point also can position on the side of metal substrate 31, to be substantially improved to shell 10 and Metal Substrate Bond strength between plate 31；Alternatively, shell 10 and metal substrate 31 can also carry out full engagement (such as welding, welding or Gluing), joint between middle casing 10 and metal substrate 31 can around quadrangle metal substrate 31 and form a closing Shape, to reduce foreign matter by entering its internal risk outside driving mechanism, and circuit ground can be used for simultaneously.

Although the embodiment of the present invention and its advantage have been disclosed as above, it will be appreciated that those skilled in the art exist Do not depart from the spirit and scope of the present invention, when can change, substitute with retouching.In addition, protection scope of the present invention not office It is limited to technique, machine, manufacture, material composition, device, method and step in specification in the specific embodiment, Ren Heben Field technology personnel can understand existing or following the developed technique, machine, manufacture, substance group from the disclosure of invention At, device, method and step, as long as more or less the same function can be implemented in the embodiment here or obtain more or less the same knot Fruit all can be used according to the invention.Therefore, protection scope of the present invention includes above-mentioned technique, machine, manufacture, material composition, dress It sets, method and step.In addition, each claim constitutes an other embodiment, and protection scope of the present invention also includes each The combination of claim and embodiment.

Claims (20)

1. a kind of driving mechanism, to drive an optical element, including：

One load bearing unit, to carry the optical element；

One base unit, including a metal substrate and the circuit structure that is formed on the metal substrate, wherein the circuit knot Structure includes a driving coil；And

One magnetic element, be set on the load bearing unit and correspond to the driving coil, to drive the optical element relative to The base unit moves.

2. driving mechanism as described in claim 1, the wherein metal substrate have on an optical axis direction of the optical element One first thickness, and the circuit structure on the optical axis direction have a second thickness, wherein the first thickness be more than this second Thickness.

3. driving mechanism as claimed in claim 2, the wherein circuit structure further include a conducting wire, the driving coil is in the optics There is a third thickness, and the conducting wire wherein should in having one the 4th thickness on the optical axis direction on one optical axis direction of element Third thickness is more than the 4th thickness.

4. driving mechanism as claimed in claim 3, the wherein first thickness are more than the third thickness.

5. driving mechanism as described in claim 1, the wherein metal substrate have on an optical axis direction of the optical element One first thickness, and the circuit structure on the optical axis direction have a second thickness, wherein the second thickness be more than this first Thickness.

6. driving mechanism as described in claim 1, the wherein circuit structure further include a conducting wire, it is electrically connected the driving line Circle, and the driving coil and the conducting wire are in least partially overlapped on an optical axis direction of the optical element.

7. driving mechanism as described in claim 1, the wherein circuit structure further include a conducting wire, it is electrically connected the driving line Circle, and the driving coil and the conducting wire, in least partially overlapped in a horizontal direction, wherein the horizontal direction is perpendicular to the optics One optical axis of element.

8. driving mechanism as described in claim 1, the wherein circuit structure further include a conducting wire, it is electrically connected the driving line Circle, and the driving coil or the conducting wire have a guiding angle surface.

9. driving mechanism as described in claim 1, the wherein circuit structure further include a conducting wire, it is formed in the metal substrate On.

10. driving mechanism as described in claim 1, the wherein circuit structure further include a conducting wire, it is electrically connected the Metal Substrate Plate.

11. driving mechanism as described in claim 1, the wherein metal substrate have stainless steel.

12. driving mechanism as described in claim 1, the wherein driving mechanism further include a magnetic field sensing element, to sense The position of the magnetic element, the wherein metal substrate are located between the magnetic element and the magnetic field sensing element.

13. driving mechanism as described in claim 1, the wherein driving mechanism further include an illuminant module, the illuminant module packet A magnetic field sensing element, a board and a photosensitive element are included, wherein magnetic field sensing element and the photosensitive element is set to On the board.

14. driving mechanism as described in claim 1, the wherein metal substrate have on an optical axis direction of the optical element One maximum gauge, and the metal substrate has a minimum widith, the wherein maximum gauge big on the direction perpendicular to the optical axis In the minimum widith.

15. driving mechanism as described in claim 1, the wherein metal substrate have a narrow part, and the narrow part is in the light The thickness learned on an optical axis direction of element is more than width of the narrow part on the direction perpendicular to the optical axis.

16. driving mechanism as described in claim 1, the wherein metal substrate have a narrow part, and the circuit structure also wraps A conducting wire is included, wherein the narrow part has a minimum widith of the metal substrate, and the conducting wire forms one above the narrow part The optical axis direction of the stereochemical structure of multilayer, the wherein minimum widith perpendicular to the optical element.

17. driving mechanism as described in claim 1, the wherein driving mechanism further include multiple magnetic elements, the circuit structure Further include multiple driving coils corresponding to multiple magnetic elements, and the metal substrate has a quadrilateral structure and one Trepanning, the plurality of magnetic element correspond respectively to the different corners of the quadrilateral structure, and by the one of the optical element Optical axis direction is observed, and the line of centres of multiple magnetic elements extends past the trepanning.

18. driving mechanism as described in claim 1, the wherein driving mechanism further include multiple magnetic elements, the circuit structure Further include multiple driving coils corresponding to multiple magnetic elements, and the metal substrate has a quadrilateral structure, wherein Multiple magnetic elements correspond respectively to the different sides of the quadrilateral structure.

19. driving mechanism as described in claim 1, the wherein driving mechanism further include a shell, and the metal substrate with should Shell is fixed to each other to weld, in a manner of welding or bonding.

20. driving mechanism as described in claim 1, the wherein driving mechanism further include a shell, which has one Quadrilateral structure, and the metal substrate is be combined with each other with the shell in a manner of laser welding, the wherein metal substrate and the shell The fusion point of body is located at four corners of the metal substrate.