CN209146745U - LED light - Google Patents

Abstract

A kind of LED light, including lamp cap, lamp housing, substrate, radiator and light source, the lamp cap, which is configured to connect with feeder ear, drives the light source luminescent to provide power supply, the lamp housing is connect with the lamp cap, the light source is disposed on the substrate, and the substrate to the radiator and radiates the heat transfer that light source generates；It is characterized by: the substrate includes protective layer, conductive layer and articulamentum, protective layer, conductive layer and articulamentum are sequentially connected, and the light source is mounted on the protective layer and is electrically connected with the conductive layer, and the articulamentum is connect with the radiator.

Description

LED light

Technical field

The invention belongs to the technical fields of LED light device, concretely relate to a kind of LED light, especially a kind of tool There is the LED light of the substrate of thermal conductive resin.

Background technique

LED illumination is because have many advantages, such as that energy conservation, the service life is long and is widely adopted.For LED light, heat dissipation is More important design consideration.

LED light in the prior art, comprising: optical module, substrate, LED light source and radiator, as shown in figure 5, such as Fig. 5 It is the cooperation schematic diagram of LED light source 5 Yu substrate, substrate therein includes protective layer 301, conductive layer 302, insulating layer 303 and base Layer 304, protective layer 301, conductive layer 302, insulating layer 303 and base 304 are sequentially overlapped setting, and protective layer 301 is generally configured to White oil material is made, and protective layer 301 has the function of protecting circuit, and conductive layer 302 is generally configured to metallic copper, insulating layer 303 Effect be that conductive layer 302 and base 304 is prevented to be shorted, base 304 is generally configured to metallic aluminum material and is made, and light source 5 passes through Scolding tin comes across via hole 3011, and is electrically connected by scolding tin with the realization of conductive layer 302.LED light in the prior art, substrate tool Have the disadvantage that: in heat transfer, due to being provided with insulating layer, and the heating conduction of insulating layer is poor, thus affects substrate Whole heating conduction, makes heat that can not conduct in time to radiator and radiate, influences the heat dissipation performance of entire LED light；It removes Except this, above-mentioned board structure, integral thickness is thicker, is unfavorable for the control of the size of LED light entirety.

In conclusion how deficiency and defect existing for LED light in view of the prior art, design substrate and pacify for LED light Dress, so that the LED light good heat dissipation effect, size are easier to control, it is the technical issues of urgently those skilled in the art solve.

Summary of the invention

Abstract description herein is about many embodiments of the invention.However the vocabulary present invention is used merely to description herein The some embodiments (in spite of in claim) disclosed in specification, rather than all possible embodiment is complete Whole description.The some embodiments for being described above as each features or aspect of the invention can merge in different ways to be formed LED light or in which a part.

The present invention provides the feature of a kind of new LED light and various aspects, has solved the above problems.

The present invention provides a kind of LED light, including lamp cap, lamp housing, substrate, radiator and light source, the lamp cap be configured to Feeder ear connection drives the light source luminescent to provide power supply, and the lamp housing is connect with the lamp cap, and the light source setting exists On substrate, and the substrate to the radiator and radiates the heat transfer that light source generates；It is characterized by:

The substrate includes protective layer, conductive layer and articulamentum, and protective layer, conductive layer and articulamentum are sequentially stacked, The light source is mounted on the protective layer and is electrically connected with the conductive layer, and the articulamentum is connect with the radiator.

Optionally, the articulamentum has the first adhesive layer and the second adhesive layer, the conductive layer and first bonding Layer connection, second adhesive layer are connect with the radiator.

Optionally, the articulamentum uses heat-conducting silicone grease.

Optionally, the articulamentum uses gypsum or silica gel.

Optionally, the articulamentum with a thickness of 30um to 300um.

Optionally, the conductive layer includes conducting wire.

Optionally, include via hole in the protective layer, scolding tin is filled in the via hole, the light source passes through the scolding tin It is electrically connected with conductive layer realization.

Optionally, the protective layer is using polyimides or white oil.

Optionally, thickness >=8um of the protective layer.

Optionally, the conductive layer with a thickness of 35um to 300um.

The present invention is prominent and beneficial compared with prior art to be had the technical effect that

Substrate of the invention improves the heat dissipation performance of substrate, and the thickness of substrate by the optimization to its structure Reduce, the more conducively control of the size of LED light；When the conductive layer etching conductive route of substrate, pass through setting supporting layer and technique On adjustment, solve the alignment issues of place on line.

Detailed description of the invention

Fig. 1 is a perspective view, shows the LED light of one embodiment of the invention；

Fig. 2 is a plan view, shows the cooperation schematic diagram of the substrate and light source in an embodiment；

Fig. 3 A is a structure process flow chart, shows a kind of process flow of the etching of conductive layer in an embodiment；

Fig. 3 B is a structure process flow chart, shows a kind of process flow of the etching of conductive layer in an embodiment；

Fig. 4 A is a structure process flow chart, shows a kind of process flow of the etching of conductive layer in an embodiment；

Fig. 4 B is a structure process flow chart, shows a kind of process flow of the etching of conductive layer in an embodiment；

Fig. 5 is a plan view, shows the cooperation schematic diagram of substrate and light source in the prior art；

Specific embodiment

To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing Give presently preferred embodiments of the present invention.But the present invention can be realized by many different forms, however it is not limited to below Described embodiment.On the contrary, purpose of providing these embodiments is makes to the more saturating of the disclosure understanding It is thorough comprehensive.It is for clearer showing locations of structures hereinafter with regard to direction such as " axial direction ", " top ", " lower section " Relationship, not limitation of the present invention.In the present invention, described " vertical ", the "horizontal" is defined as: including the base defined in standard ± 10% situation on plinth.For example, being vertically often referred to relative datum wire clamp angle is 90 degree, but in the present invention, vertically refer to Including the situation within 80 degree to 100.

Referring to Fig. 1, the present invention provides a kind of LED light in one embodiment, especially a kind of high-power LED light (such as function Rate is greater than 50w), which includes lamp cap 1, lamp housing 2, substrate 3, radiator 4 and light source 5.Lamp cap 1 therein is configured to and supplies Electric end connection, drives light source 5 to shine to provide power supply.Lamp housing 2 is connect with lamp cap 1, and lamp cap 1 can be a part of lamp housing 2, It is also possible to an individual component.Light source 5 is arranged on the substrate 3, and substrate 3 is generated light source 5 by way of heat transfer Heat transfer is to radiator 4 and radiates, and the light source 5 in the present embodiment is using LED light source 5.The above are the prior art, this Place repeats no more.

Referring to fig. 2, in the present embodiment, the substrate 3 of LED light includes protective layer 31, conductive layer 32 and articulamentum 33, protection Layer 31, conductive layer 32 and articulamentum 33 are sequentially connected, and are set specifically, protective layer 31, conductive layer 32 and articulamentum 33 are sequentially laminated It sets, includes via hole 311 in protective layer therein, be filled with scolding tin in via hole 311, light source 5 is mounted on protective layer 31, and is passed through The scolding tin in via hole 311 on protective layer 31 is electrically connected with the realization of conductive layer 32, specifically, light source 5 is by scolding tin come across guarantor The via hole 311 of sheath 31, and be electrically connected by scolding tin with the realization of conductive layer 32.The structure of this substrate 3, compared with prior art, With articulamentum 33 instead of insulating layer in the prior art and base, structure is simpler, the overall height dimension phase of substrate 3 To reduction, the more conducively control of the whole size of LED light.

In the present embodiment, articulamentum 33 is configured to be made of Heat Conduction Material, and its insulating properties is more excellent, so, The heat that one side light source 5 generates when shining will not form obstruction, heat dissipation performance is more preferable, separately in heat dissipation at articulamentum 33 On the one hand, it can be ensured that the insulation performance between conductive layer 32 and radiator 4.

Referring to fig. 2, in the present embodiment, articulamentum 33 has the first adhesive layer 331 and the second adhesive layer 332, conductive layer 32 connect with the first adhesive layer 331, specifically, conductive layer 32 is bonded in the first adhesive layer 331, the second adhesive layer 332 and heat dissipation Device 4 connects, specifically, the second adhesive layer 332 is bonded on radiator 4.The connection type of this bonding, installation is simpler, In process of production, assembly efficiency can be improved.The first adhesive layer 331 and the second adhesive layer 332 of articulamentum 33 herein, can be The material of articulamentum 33 itself has viscosity, and the first adhesive layer 331 of self-assembling formation and the second adhesive layer 332, after being also possible to Phase is provided with the first adhesive layer 331 and the second adhesive layer 332 of viscosity on articulamentum 33.

In the present embodiment, articulamentum 33 has good thermally conductive and insulating properties using heat-conducting silicone grease, heat-conducting silicone grease Can, heat-conducting silicone grease itself is a kind of existing material, because details are not described herein again.

In other embodiments, articulamentum 33 can also be used in the prior art other with good heat conductive and insulating properties The material of energy, such as gypsum in the prior art, silica gel, no longer enumerate herein.

In the present embodiment, the thickness of articulamentum 33 is 30um to 300um, on the one hand preferably 100um needs to protect The insulation performance between conductive layer 32 and radiator 4 is demonstrate,proved, the thickness of articulamentum 33 is on the other hand controlled again, if size It is excessive, then may be decreased heating conduction, and be unfavorable for the control of 3 overall dimensions of substrate, and it is undersized if, the company of influencing whether Connect the insulation performance of layer 33.

In the present embodiment, protective layer 31 is polyimides using PI layers, PI layers, and polyimides is in the prior art Material, details are not described herein again.By using PI layers, make protective layer 31 have excellent thermal stability, chemical corrosion resistance and Mechanical performance.In the present embodiment, protective layer 31 with a thickness of >=8um.

In other embodiments, white oil in the prior art can also be used in protective layer 31.In the present embodiment, protective layer 31 With a thickness of >=8um.

In the present embodiment, conductive layer 32 is configured to the metal material with excellent conductive performance, such as copper, iron or aluminium, And it is preferred, for the conductive layer 32 in the present embodiment using copper, thickness range is 35um to 300um.Preferably, thickness For 35um or 70un.

In the present embodiment, etching forms conducting wire on conductive layer 32, and light source 5 is then electrically connected to above-mentioned conduction On route.

Referring to Fig. 3 A and Fig. 3 B, in the present embodiment, about the process flow etched on conductive layer 32, its step are as follows:

Supporting layer 6 is configured, conductive layer 32 is placed on supporting layer 6, the sticking ultraviolet light irradiation of tool can be used in supporting layer 6 Adhesive tape (UV tape) is irradiated through ultraviolet light, its viscosity can be made to lose, and then supporting layer 6 is made to be detached from conductive layer 32；

The setting etching route on conductive layer 32, and perform etching, to form conducting wire on conductive layer 32；

In another side of the conductive layer 32 with respect to supporting layer 6, the protective layer 31 or articulamentum 33 are set, protective layer 31 is made Or articulamentum 33 realizes the connection with conductive layer 32, and is formed as one；

Integrated structure is formed into separate with supporting layer 6.

Above-mentioned supporting layer 6 with a thickness of 50um to 300um, preferably 200um.

In above-mentioned steps, etching route is configured according to targeted graphical, targeted graphical can according to the specification of actual product, Model etc. is determined, i.e., different targeted graphicals can be selected in different conductive layers 32, to form above-mentioned etching route.

In above-mentioned steps, after the completion of etching, conductive layer 32 is not separated with supporting layer 6 first, and first by protective layer 31 Or articulamentum 33 is connect with conductive layer 32, so, prevents the conductive layer 32 of the discrete state etched, with protective layer 31 Or when the connection of articulamentum 33, causes position inaccurate, influence the distribution of conducting wire.And it is not separated in conductive layer 32 with supporting layer 6 When, and the connection of protective layer 31 or articulamentum 33 is carried out, since conductive layer 32 is relatively fixed on supporting layer 6, because without making It is inaccurate at the position of conductive layer 32.

A and Fig. 4 B referring to fig. 4, in other embodiments, about the process flow etched on conductive layer 32, step is such as Under:

One of both conductive layer 32 and protective layer 31 or articulamentum 33 are connected as one；

Supporting layer 6 is configured, supporting layer 6 is configured on protective layer 31 or articulamentum 33, at this time protective layer 31 or articulamentum 33 are located at the position among supporting layer 6 and conductive layer 32, and the sticking ultraviolet light irradiation adhesive tape (UV of tool can be used in supporting layer 6 Tape), irradiated through ultraviolet light, its viscosity can be made to lose, and then supporting layer 6 is made to be disconnected layer 33；；

The setting etching route on conductive layer 32, and perform etching, to form conducting wire on conductive layer 32；

The structure being linked together is separated with supporting layer 6.

Above-mentioned supporting layer 6 with a thickness of 50um to 300um, preferably 200um.

In above-mentioned steps, etching route is configured according to targeted graphical, targeted graphical can according to the specification of actual product, Model etc. is determined, i.e., different targeted graphicals can be selected in different conductive layers 32, to form above-mentioned etching route.

In above-mentioned steps, conductive layer 32 and protective layer 31 or articulamentum 33 is realized connect at the very start, so, After the completion of etching, avoid in installation process, the conductive layer 32 of the discrete state etched, with protective layer 31 or articulamentum 33 connection when, caused by position will definitely not problem, to influence the distribution of conducting wire.

In above-mentioned steps, if being to connect conductive layer 32 with protective layer 31 at the beginning, due to being provided with supporting layer 6, it can play a protective role to the via hole 311 on protective layer 31.

In the present embodiment, radiator 4 includes ontology 41, and 41 peripheral surface of ontology is provided with several radiating fins 42, is dissipated Hot 42 opposing body 41 of fin and outwardly protrude, radiating fin 42 extends in the short transverse of ontology 41 on 41 surface of ontology to be set It sets.42 opposing body 41 of radiating fin and the distance outwardly protruded can be identical or different.For generally, radiating fin 42 opposing bodies 41 and the distance that outwardly protrudes is bigger, then its heat dissipation area is bigger, and heat dissipation effect is better, but if too big, then It will affect the control of the size of LED light.

In the present embodiment, the shape configuration of the outer profile of substrate 3 is circle, and at least it connects with substrate 3 on radiator 4 The cross section profile for connecing the part configuration at place is circle.

In his embodiment, the shape configuration of the outer profile of substrate 3 is ellipse, and at least itself and substrate 3 on radiator 4 The cross section profile of the part configuration of junction is ellipse.

In his embodiment, the shape configuration of the outer profile of substrate 3 is regular polygon, and at least itself and base on radiator 4 The cross section profile of the part configuration of 3 junction of plate is regular polygon.Preferably, in this embodiment, the shape of the outer profile of substrate 3 Shape is configured to rectangular, and the cross section profile of at least part configuration of itself and 3 junction of substrate is rectangular on radiator 4.

In the present embodiment, the distribution mode of light source 5 on the substrate 3 can be specifically determined according to the profile of substrate 3. The distribution mode of light source 5 substantially has following several, is such as arranged in array on 3 surface of substrate, arranges in a ring on 3 surface of substrate, Outward it is in multiple cricoid distributions at 3 center of substrate, can also be distributed by other arbitrary shapes, details are not described herein again.

LED of the present invention is as previously described in the realization of each embodiment.It needs to point out, in embodiments, for For the same LED light, at " lamp cap ", " lamp housing ", " substrate ", " radiator ", " light source ", " protective layer ", " conductive layer ", " connect Connect layer ", " light source is installed on the protection layer, and is electrically connected by via hole on protective layer with conductive layer realization ", " articulamentum configuration By being made of Heat Conduction Material ", " articulamentum is using heat-conducting silicone grease ", " protective layer is using PI layer ", " conductive layer configures To have many characteristics, such as the metal material of excellent conductive performance " in, one or more of technical characteristics can be only included.

In addition, the content system about " radiator " can be selected from include in embodiment its relevant technologies feature wherein it One or combinations thereof, wherein it includes that its relevant technologies feature is wherein in embodiment that the content system about " protective layer ", which can be selected from, One or a combination set of, wherein the content system about " articulamentum " can be selected from include in embodiment its relevant technologies feature its One of or combinations thereof, wherein it includes its relevant technologies feature in embodiment that the content system about " conductive layer ", which can be selected from, One of them or combinations thereof.

For example, ontology peripheral surface is provided with several radiating fins in radiator, radiating fin opposing body and it is outside Protrusion, radiating fin are extended in short transverse of the body surface along ontology.Radiating fin opposing body and outwardly protrude Distance can be identical or different etc..

For example, protective layer is using PI layers, PI layers are polyimides, by using PI layers, there is protective layer excellent Thermal stability, chemical corrosion resistance and mechanical performance, white oil in the prior art, the thickness of protective layer can also be used in protective layer For >=8um.

For example, articulamentum has the first adhesive layer and the second adhesive layer, conductive layer is bonded in the first adhesive layer, the second bonding On a heat sink, the first adhesive layer and the second adhesive layer of articulamentum, can be articulamentum material itself has viscosity to layer bonding, And the first adhesive layer and the second adhesive layer of self-assembling formation, be also possible to the later period is arranged the first adhesive layer and second on articulamentum Adhesive layer, articulamentum using heat-conducting silicone grease, articulamentum can also be used it is in the prior art it is other have good heat conductive and The material of insulation performance, such as gypsum in the prior art, silica gel, in the present embodiment, the thickness of articulamentum 33 is 30um to 300um, preferably 100um.

For example, conductive layer is configured to the metal material with excellent conductive performance, such as copper, iron or aluminium, in the present embodiment Conductive layer using copper, thickness range is 35um to 300um.Preferably, with a thickness of 35um or 70un.

That is, features described above can be made to arbitrary permutation and combination, and it is used for the improvement of LED light.

Claims (10)

1. a kind of LED light, including lamp cap, lamp housing, substrate, radiator and light source, the lamp cap be configured to connect with feeder ear with Power supply is provided to drive the light source luminescent, the lamp housing is connect with the lamp cap, and the light source is disposed on the substrate, and described Substrate to the radiator and radiates the heat transfer that light source generates；It is characterized by:

The substrate includes protective layer, conductive layer and articulamentum, and protective layer, conductive layer and articulamentum are cascading, described Light source is mounted on the protective layer and is electrically connected with the conductive layer, and the articulamentum is connect with the radiator.

2. LED light according to claim 1, it is characterised in that: the articulamentum has the first adhesive layer and the second bonding Layer, the conductive layer are connect with first adhesive layer, and second adhesive layer is connected in the radiator.

3. LED light according to claim 1, it is characterised in that: the articulamentum uses heat-conducting silicone grease.

4. LED light according to claim 1, it is characterised in that: the articulamentum uses gypsum or silica gel.

5. according to LED light described in Claims 2 or 3 or 4, it is characterised in that: the articulamentum with a thickness of 30um extremely 300um。

6. LED light according to claim 1, it is characterised in that: include conducting wire on the conductive layer.

7. LED light according to claim 1, it is characterised in that: the protective layer includes via hole, and the via hole is filled with weldering Tin, the light source are electrically connected by the scolding tin with conductive layer realization.

8. LED light according to claim 1, it is characterised in that: the protective layer is using polyimides or white oil.

9. according to claim 1 to 4,6 to or 8 any LED light, it is characterised in that: the thickness of the protective layer >= 8um。

10. according to claim 1 to 4,6 to 8 any LED light, it is characterised in that: the conductive layer with a thickness of 35um To 300um.