CN209120138U - A kind of power amplifier module for supporting MIMO technology for 5G antenna - Google Patents
A kind of power amplifier module for supporting MIMO technology for 5G antenna Download PDFInfo
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- CN209120138U CN209120138U CN201821936246.XU CN201821936246U CN209120138U CN 209120138 U CN209120138 U CN 209120138U CN 201821936246 U CN201821936246 U CN 201821936246U CN 209120138 U CN209120138 U CN 209120138U
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Abstract
The utility model discloses a kind of power amplifier modules that MIMO technology is supported for 5G antenna, including shell, are set to the intracorporal pcb board of shell；The pcb board includes Micro-processor MCV and the descending power amplifying circuit connecting with Micro-processor MCV and uplink low-noise amplification circuit；Memory metal thermally conductive sheet is provided in the inner walls, memory metal thermally conductive sheet include radiating segment and be attached to for deformation in the case of a high temperature on the pcb board thermally conductive section, the radiating segment, which is close to, to be immobilized in the shell on wall, and described thermally conductive section of one end is connected with the radiating segment and the other end extends and is suspended from above the pcb board；Have the advantages that effective temperature control effect, stable signal transmission, realizes three kinds of signal network Joint construction and sharings, saves construction cost.
Description
Technical field
The utility model relates to the communication technologys, more specifically, it relates to which a kind of support MIMO technology for 5G antenna
Power amplifier module.
Background technique
Power amplifier module is the important component of various wireless transmitters, in the front stage circuits of transmitter, modulation
RF signal power very little caused by oscillating circuit needs after obtaining enough radio-frequency powers, to feed by amplification
It is radiate on to antenna.In order to obtain sufficiently large radio frequency power output, it is necessary to use power amplifier module.
With the development of network formats signal, on the basis of original 2G, 3G and 4G signal network, develop again now
5G signal network.And need it is a kind of may include multi-signal network power amplifier module, support the network construction of MIMO technology,
More net Joint construction and sharings can be achieved, to reducing the construction costs.But 4G signal network needs are compared in the signal transmission under 5G signal network
It is worked with higher frequency, more powerful efficiency, to ensure that the high speed network under 5G is current.Especially for signal network
Poor geographical location, power amplifier module also will go to operate with power again at double again at this time.The heat generated at this time is phase
It when big, do not take such as and effectively controls hot measure, be then easy to generate internal circuit the destruction of scaling loss, influence normal function
It can use.
Utility model content
MIMO is supported for 5G antenna in view of the deficienciess of the prior art, the purpose of this utility model is to provide one kind
The power amplifier module of technology has more effective temperature control effect.
To achieve the above object, the utility model provides following technical solution:
A kind of power amplifier module for supporting MIMO technology for 5G antenna, including shell, it is set to the intracorporal PCB of shell
Plate；
The pcb board includes Micro-processor MCV and the descending power amplifying circuit and uplink that connect with Micro-processor MCV
Low-noise amplification circuit；
Memory metal thermally conductive sheet is provided in the inner walls, memory metal thermally conductive sheet includes radiating segment and is used in height
Deformation is attached to thermally conductive section on the pcb board in warm situation, and the radiating segment, which is close to, to be immobilized in the shell on wall, described thermally conductive
Duan Yiduan and the radiating segment are connected and the other end extends and is suspended from above the pcb board.
By using above-mentioned technical proposal, when enclosure interior since the operating temperature of power amplifier module persistently rises, note
Recall thermally conductive section of metal conducting strip be gradually increased at a temperature of deformation occurs, preset shape is restored, so that thermally conductive section is attached to
On pcb board, so that temperature on pcb board is thermally conductive by thermally conductive section, transferred heat on shell through radiating segment, shell is direct
Contact is external, to achieve the purpose that rapid cooling, forms more effective temperature control effect；And when the temperature of pcb board reduces
Afterwards, thermally conductive section of memory metal thermally conductive sheet is close in the past to shell deformation, leaves pcb board, reduces it as metal and put to power
The signal processing of big module influences, and improves signal transmission quality.
Further, it is provided with one layer of heat conduction silicone outside for described thermally conductive section.
Play the role of insulation protection under the isolation of heat conduction silicone by using above-mentioned technical proposal, prevents from leading
Hot arc generates Electro-static Driven Comb part of damage during close to pcb board.
Further, high temperature breaking circuit is provided in the shell, the high temperature breaking circuit includes:
Temperature sensor detects signal for detecting the temperature of the pcb board, and in its signal output end output temperature；
Decision circuitry is coupled to the signal output end of the temperature sensor, for being more than when the temperature detection signal
Upper limit threshold Shi Qi output end exports the control OFF signal of a high level, and when the temperature detection signal is lower than lower threshold
A low level control OFF signal is exported in its output end；
Circuit is opened and closed, the output end of the decision circuitry is coupled to, for when the control OFF signal for receiving high level
When disconnect descending power amplifying circuit, uplink low-noise amplification circuit and power supply connection.
By using above-mentioned technical proposal, when pcb board when the temperature is excessively high, pass through high temperature breaking circuit Temporarily Closed signal
Access stops working, so that temperature quickly reduces, and is also generally weaker in signal strength reaching such high-temperature condition
Region when it is caused, power amplifier module continue with high power state work caused by high temperature, at this time by Temporarily Closed its
The work of signal transmission can achieve effective temperature controlled effect.
Further, the decision circuitry includes:
Resistance R1, one end are coupled to a direct current VCC_1, and the other end is grounded after connecting with a resistance R2, self-resistance R1
The upper limit threshold is generated between resistance R2；
Comparator A, has a non-inverting input terminal, an inverting input terminal and an output end, and non-inverting input terminal is coupled to institute
The signal output end of temperature sensor is stated, inverting input terminal is coupled between resistance R1 and resistance R2；
Resistance R3, one end are coupled to a direct current VCC_1, and the other end is grounded after connecting with a resistance R4, self-resistance R3
The lower threshold is generated between resistance R4；
Comparator B, has a non-inverting input terminal, an inverting input terminal and an output end, and inverting input terminal is coupled to institute
The signal output end of temperature sensor is stated, non-inverting input terminal is coupled between resistance R3 and resistance R4；
Or door OR_1, there are two input terminals and an output end, two input terminal to be respectively coupled to comparator A and ratio for tool
Compared with the output end of device B；
T trigger T_1, has control terminal T, input end of clock CK and output end Q, and control terminal T is coupled to direct current
VCC_1, input end of clock CK are coupled to described or door OR_1 output end, and export the control OFF signal in its output end Q.
Further, the opening and closing circuit includes:
NPN triode Q1, emitter ground connection, base stage are coupled to the output end Q of T trigger T_1 by resistance R5 and lead to
Cross a resistance R6 and emitter altogether；
Normally closed relay KM1, the first end of coil are coupled to direct current VCC_2, and the second end of coil is coupled to NPN
The collector of triode Q1, normally-closed contact switch S1 are serially connected with descending power amplifying circuit, uplink low-noise amplification circuit and electricity
Between the connection circuit in source；
Diode D1, cathode are coupled to the first end of the coil of normally closed relay KM1, and anode is coupled to normally closed relay
The second end of the coil of KM1.
By using above-mentioned technical proposal, when temperature sensor detects that pcb board temperature is more than the corresponding temperature of upper limit threshold
When spending, triggering T trigger T_1 exports high level, NPN triode Q1 is connected, then disconnect descending power through normally closed relay KM1 and put
It is connected between circuit, uplink low-noise amplification circuit and power supply greatly, has the function that the cooling that stops working；When temperature sensor is examined
When measuring pcb board temperature and dropping to the corresponding temperature of lower threshold, T trigger T_1 is triggered again and exports high level, closes NPN tri-
Pole pipe Q1, then through connecting between normally closed relay KM1 conducting descending power amplifying circuit, uplink low-noise amplification circuit and power supply
It connects, resumes work.
Further, the descending power amplifying circuit is amplified by the first descending power amplifying circuit, the second descending power
Circuit, third descending power amplifying circuit and the 4th descending power amplifying circuit composition, the uplink low-noise amplification circuit is by the
One uplink low-noise amplification circuit, the second uplink low-noise amplification circuit, third uplink low-noise amplification circuit and the 4th uplink low noise
Big circuit composition, the first descending power amplifying circuit, the second descending power amplifying circuit, third descending power amplifying circuit
With the 4th descending power amplifying circuit respectively with the first uplink low-noise amplification circuit, the second uplink low-noise amplification circuit,
Three uplink low-noise amplification circuits and the 4th uplink low-noise amplification circuit are corresponding.
By using above-mentioned technical proposal, uplink and downlink communication link separately includes four descending power amplifying circuits and four
Uplink low-noise amplification circuit may include three kinds of signal networks, can support the network construction of MIMO technology, it can be achieved that three kinds of signal nets
Network Joint construction and sharing, such as the Joint construction and sharing of tri- kinds of signal networks of 3G, 4G and 5G.So that communication quality is greatly improved, energy
Make full use of space resources, solve the problems such as repeated construction, the wasting of resources, difficult engineering construction, at the same saved construction at
This, meets the demand in market.
Further, it is serially connected with DAC circuit between the descending power amplifying circuit and the Micro-processor MCV, it is described
DAC circuit adjusts part, ALC power control part and PA switching controlling part by grid voltage and is grouped as.
By using above-mentioned technical proposal, the subpackage of grid voltage adjustment portion containing the grid voltage for adjusting power amplifier element under room temperature so that its
Performance optimization and compensation is modified to the grid voltage of power amplifier module according to the temperature of power amplifier module；ALC power
Control section is used to control the peak power output of each downstream communications link；PA switching control section is for controlling each road downlink
The switch state of communication link.
Further, the first descending power amplifying circuit and the second descending power amplifying circuit include being sequentially connected in series
The first π type attenuator, electric bridge, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, the second level amplification
Device, final amplifier, power-sensing circuit and isolator；The third descending power amplifying circuit includes first be sequentially connected in series
π type attenuator, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, second level amplifier, final stage amplification
Device, power-sensing circuit, RF switch, power switch circuit and circulator；The 4th descending power amplifying circuit include according to
First π type attenuator of secondary concatenation, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, the second level are put
Big device, final amplifier, power-sensing circuit and isolator.
Further, the first uplink low-noise amplification circuit, the second uplink low-noise amplification circuit, third uplink low noise
Big circuit and the 4th uplink low-noise amplification circuit are by low noise amplifier, SAW filter, radio frequency amplifier, the electricity being sequentially connected in series
Bridge, π type attenuator composition, the low noise amplifier of third uplink low-noise amplification circuit are connect with the RF switch.
By using above-mentioned technical proposal, combining output, amplification and the uplink communication links of downstream communications link are realized
Filtering, amplification, output.
Further, current detection circuit is serially connected between the descending power amplifying circuit and the Micro-processor MCV.
By using above-mentioned technical proposal, current detection circuit is serially connected in descending power amplifying circuit and Micro-processor MCV
Between, for detecting the current value of drain electrode, the drain current value that Micro-processor MCV is provided according to current detection circuit, to judge
Whether each downstream communications link switch is closed, whether each power amplifier element works normally.
Compared with prior art, the utility model has the advantages that:
(1) uplink and downlink communication link separately includes four descending power amplifying circuits and four uplink low-noise amplification circuits,
It may include three kinds of signal networks, can support the network construction of MIMO technology, it can be achieved that three kinds of signal network Joint construction and sharings, so that logical
Letter quality is greatly improved, and space resources can be made full use of, and solves repeated construction, the wasting of resources, engineering construction difficulty
The problems such as, while construction cost has been saved, meet the demand in market；
(2) when the operating temperature of power amplifier module persistently rises, thermally conductive section is attached on pcb board, so that the temperature on pcb board
Degree is thermally conductive by thermally conductive section, transfers heat on shell through radiating segment, shell directly contacts outside, to reach quick
The purpose of heat dissipation forms more effective temperature control effect；And when the temperature of pcb board reduce after, memory metal thermally conductive sheet it is thermally conductive
Section left pcb board to the shell deformation close past, and reducing it as metal influences the signal processing of power amplifier module, mentioned
High RST transmission quality.
Detailed description of the invention
Fig. 1 is the intracorporal structural schematic diagram of shell of the power amplifier module of the present embodiment, shows leading under the condition of high temperature
The deformation structure of hot arc, is tightly attached on the component of pcb board；
Fig. 2 is the intracorporal structural schematic diagram of shell of the power amplifier module of the present embodiment, shows leading under low-temperature condition
The structure of hot arc is restored to the shape close to shell；
Fig. 3 is the circuit diagram of the high temperature breaking circuit of the present embodiment.
Appended drawing reference: 1, shell；2, pcb board；3, memory metal thermally conductive sheet；31, radiating segment；32, thermally conductive section；33, thermally conductive
Layer of silica gel；4, high temperature breaking circuit；5, temperature sensor；6, decision circuitry；7, circuit is opened and closed.
Specific embodiment
With reference to the accompanying drawings and examples, the utility model is described in detail.
As depicted in figs. 1 and 2, a kind of power amplifier module for supporting MIMO technology for 5G antenna, including shell 1, set
The pcb board 2 being placed in shell 1；
The pcb board 2 includes Micro-processor MCV and the descending power amplifying circuit that connect with Micro-processor MCV and upper
Row low-noise amplification circuit；
Memory metal thermally conductive sheet 3 is provided on 1 inner wall of shell, memory metal thermally conductive sheet 3 includes radiating segment 31 and uses
It is attached to thermally conductive section 32 on the pcb board 2 in deformation in the case of a high temperature, the radiating segment 31 is close to by viscose to be fixed on
On 1 inner wall of shell, described thermally conductive section of 32 one end are connected with the radiating segment 31 and the other end extends and is suspended from the pcb board 2
Side.The alloy with double-pass memory effect that above-mentioned memory metal thermally conductive sheet 3 uses restores high-temperature-phase shape when alloy heats,
It can restore low-temperature phase shape again when cooling.For example NiTi alloy just has this function.It is next thermally conductive that this alloy can be used.
Described thermally conductive section 32 is coated with one layer of heat conduction silicone 33.Under the isolation of heat conduction silicone 33, play absolutely
The effect of edge protection prevents thermally conductive section 32 to generate Electro-static Driven Comb part of damage during close to pcb board 2.
It is provided with high temperature breaking circuit 4 in the shell 1, as shown in figure 3, the high temperature breaking circuit 4 includes:
Temperature sensor 5 for detecting the temperature of the pcb board 2, and detects in its signal output end output temperature and believes
Number；
Decision circuitry 6 is coupled to the signal output end of the temperature sensor 5, for surpassing when the temperature detection signal
The control OFF signal that upper limit threshold Shi Qi output end exports a high level is crossed, and is lower than lower threshold in the temperature detection signal
Shi Qi output end exports a low level control OFF signal；
Circuit 7 is opened and closed, the output end of the decision circuitry 6 is coupled to, for closing letter when the control for receiving high level
Number when disconnect descending power amplifying circuit, uplink low-noise amplification circuit and power supply connection.
When pcb board 2 when the temperature is excessively high, by 4 Temporarily Closed signal path of high temperature breaking circuit, stop working so that
Temperature quickly reduces, and generally caused, the function when reaching such high-temperature condition and being also in the weaker region of signal strength
Rate amplification module continues high temperature caused by working with high power state, at this time can be with by the work that its signal of Temporarily Closed transmits
Reach effective temperature controlled effect.
The decision circuitry 6 includes:
Resistance R1, one end are coupled to a direct current VCC_1, and the other end is grounded after connecting with a resistance R2, self-resistance R1
The upper limit threshold is generated between resistance R2；
Comparator A, has a non-inverting input terminal, an inverting input terminal and an output end, and non-inverting input terminal is coupled to institute
The signal output end of temperature sensor 5 is stated, inverting input terminal is coupled between resistance R1 and resistance R2；
Resistance R3, one end are coupled to a direct current VCC_1, and the other end is grounded after connecting with a resistance R4, self-resistance R3
The lower threshold is generated between resistance R4；
Comparator B, has a non-inverting input terminal, an inverting input terminal and an output end, and inverting input terminal is coupled to institute
The signal output end of temperature sensor 5 is stated, non-inverting input terminal is coupled between resistance R3 and resistance R4；
Or door OR_1, there are two input terminals and an output end, two input terminal to be respectively coupled to comparator A and ratio for tool
Compared with the output end of device B；
T trigger T_1, has control terminal T, input end of clock CK and output end Q, and control terminal T is coupled to direct current
VCC_1, input end of clock CK are coupled to described or door OR_1 output end, and export the control OFF signal in its output end Q.
The opening and closing circuit 7 includes:
NPN triode Q1, emitter ground connection, base stage are coupled to the output end Q of T trigger T_1 by resistance R5 and lead to
Cross a resistance R6 and emitter altogether；
Normally closed relay KM1, the first end of coil are coupled to direct current VCC_2, and the second end of coil is coupled to NPN
The collector of triode Q1, normally-closed contact switch S1 are serially connected with descending power amplifying circuit, uplink low-noise amplification circuit and electricity
Between the connection circuit in source；
Diode D1, cathode are coupled to the first end of the coil of normally closed relay KM1, and anode is coupled to normally closed relay
The second end of the coil of KM1.
The power amplifier module radiating principle of the present embodiment are as follows:
Since the operating temperature of power amplifier module persistently rises inside shell 1, thermally conductive section of memory metal thermally conductive sheet 3
32 be gradually increased at a temperature of deformation occurs, preset shape is restored, so that thermally conductive section 32 is attached on pcb board 2, such as Fig. 1 institute
Show and (here for being easy to understand, the space size in shell 1 has been carried out to exaggerate display), so that the temperature on pcb board 2 passes through
Thermally conductive section 32 thermally conductive, transfers heat on shell 1 through radiating segment 31, shell 1 directly contact it is external, to reach quick
The purpose of heat dissipation forms more effective temperature control effect；And after the temperature of pcb board 2 reduces, memory metal thermally conductive sheet 3 is led
Hot arc 32 is close in the past to 1 deformation of shell, pcb board 2 is left, as shown in Fig. 2, reducing it as metal to power amplifier module
The magnetic field of signal processing influences, and improves signal transmission quality.
And the working principle of high temperature breaking circuit 4 are as follows: as shown in figure 3, when temperature sensor 5 detects that 2 temperature of pcb board is super
When crossing the corresponding temperature of upper limit threshold, the output end output high level of comparator A or the output end of door OR_1 export high level,
It triggers T trigger T_1 and exports high level, NPN triode Q1 is connected, then disconnect descending power amplification electricity through normally closed relay KM1
It is connected between road, uplink low-noise amplification circuit and power supply, has the function that the cooling that stops working；When temperature sensor 5 detects
When dropping to the corresponding temperature of lower threshold to 2 temperature of pcb board, the output end output high level of comparator B or the output of door OR_1
Output high level in end triggers T trigger T_1 again and exports high level, closes NPN triode Q1, then lead through normally closed relay KM1
It is logical to be connected between descending power amplifying circuit, uplink low-noise amplification circuit and power supply, resume work.
MIMO (Multiple-InputMultiple-Output) technology is " multiple-input, multiple-output " technology, is referred in transmitting terminal
It uses multiple transmitting antennas and receiving antenna respectively with receiving end, transmits signal by the mutiple antennas of transmitting terminal and receiving end
And reception.In the present embodiment, Micro-processor MCV is 32 single chip computer AT MEGA32.Descending power amplifying circuit is mainly used for
Amplify base station signal, the i.e. downlink signal of donor antenna reception Base Transmitter, into downlink low noise amplification, then again through downlink
Power amplification circuit amplification, sends enlarged downlink signal to mobile phone finally by duplexer and retransmitting antenna, through amplifying
Signal convenient for mobile phone reception；Uplink low-noise amplification circuit is mainly used for amplifying mobile phone signal convenient for base station reception, that is, retransmits
Antenna receives the signal that mobile phone is issued, and is introduced into the filtering of uplink duplexer, enters back into low noise amplification, then low through uplink again
Amplifying circuit of making an uproar amplification, is sent to base station for enlarged uplink signal finally by duplexer and donor antenna, reaches expansion
With the purpose of optimization mobile communication signal.
Descending power amplifying circuit is by the first descending power amplifying circuit, the second descending power amplifying circuit, third downlink
Power amplification circuit and the 4th descending power amplifying circuit composition.Uplink low-noise amplification circuit amplifies electricity by the first uplink low noise
Road, the second uplink low-noise amplification circuit, third uplink low-noise amplification circuit 33 and the 4th uplink low-noise amplification circuit composition.First
Descending power amplifying circuit, the second descending power amplifying circuit, third descending power amplifying circuit and the amplification of the 4th descending power
Circuit respectively with the first uplink low-noise amplification circuit, the second uplink low-noise amplification circuit, third uplink low-noise amplification circuit and
Four uplink low-noise amplification circuits are corresponding.The uplink and downlink communication link of the power amplifier module of the utility model separately includes four
Descending power amplifying circuit and four uplink low-noise amplification circuits, using power amplification integrated design, size is small, is not take up space,
It may be configured as to support the network construction of MIMO technology, it can be achieved that three kinds of signal networks comprising tri- kinds of signal networks of 2G, 4G and 5G
Joint construction and sharing can make full use of space resources so that communication quality is greatly improved, and solve repeated construction, resource wave
Take, the problems such as engineering construction is difficult, while having saved construction cost.
In the present embodiment, the first descending power amplifying circuit and the second descending power amplifying circuit include being sequentially connected in series
First π type attenuator, electric bridge, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, second level amplification
Device, final amplifier, power-sensing circuit (being not drawn on figure) and isolator.Third descending power amplifying circuit includes successively going here and there
The first π type attenuator that connects, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, second level amplifier,
Final amplifier, power-sensing circuit, RF switch, power switch circuit and circulator.4th descending power amplifying circuit packet
Include the first π type attenuator, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, second being sequentially connected in series
Grade amplifier, final amplifier, power-sensing circuit and isolator.First uplink low-noise amplification circuit, the second uplink low noise
Big circuit, third uplink low-noise amplification circuit and the 4th uplink low-noise amplification circuit are by low noise amplifier, the sound being sequentially connected in series
Table filter, radio frequency amplifier, electric bridge, π type attenuator composition, the low noise amplifier and radio frequency of third uplink low-noise amplification circuit
Switch connection.
Preferably, alc circuit is a voltage-controlled attenuator MA4P7455, and gain adjustable range reaches 30dB.Second level amplification
Device uses SKY65162-70LF, and at low cost, gain linearity is good.Final amplifier uses BLPG22-10, BLPG22-10 10W
Pipe, it is wide to be applicable in frequency range, can be used from 800MHz-2400MH, is 27dB or so, 1.8G- in 800MHz gain
2.4G gain is in 17dB or so, and small in size, match circuit is simple, meets linear requirements.Using these power amplifier elements, downlink communication
The gain of link is up to 28dB, peak power output 31dBm.
For low noise amplifier using MGA-6 series, noise is smaller, and noise coefficient is in 0.5dB or so, small in size, element matching
Simply, gain is 18dB or so in 2GHz frequency range；SAW filter has the features such as small in size, Insertion Loss is low, and Out-of-band rejection is good；It penetrates
Audio amplifier uses BG13B, has the characteristics that electric current is small, performance is stablized.Using these power amplifier elements, the increasing of uplink communication links
Benefit is up to 26dB, peak power output 0dB.
RF switch among the above is used to switch the working condition of uplink and downlink communication link, to increase uplink and downlink communication link
Between isolation, the closing of power switch circuit can equally increase isolation, while reduce RF high power signal pair
The impact of low noise amplification.
The power amplifier module of the present embodiment also has monitor portion, including DAC circuit, temperature sensing circuit and electric current inspection
Slowdown monitoring circuit.DAC circuit is serially connected between descending power amplifying circuit and Micro-processor MCV, DAC circuit by grid voltage adjust part,
ALC power control part and PA switching controlling part are grouped as.Grid voltage of the grid voltage adjustment portion subpackage containing adjusting power amplifier element under room temperature,
So that its Performance optimization and being modified compensation to the grid voltage of power amplifier module according to the temperature of power amplifier module；
ALC power control part is used to control the peak power output of each downstream communications link；PA switching control section is for controlling
The switch state of each road downstream communications link.Temperature sensing circuit is connect with Micro-processor MCV, for power amplifier module
Temperature is detected, and Micro-processor MCV is according to the temperature value of the offer of temperature sensing circuit, to the output work of power amplifier module
Rate controlling value is modified compensation.Current detection circuit is serially connected between descending power amplifying circuit and Micro-processor MCV, is used for
Detect the current value of drain electrode, the drain current value that Micro-processor MCV is provided according to current detection circuit, to judge that each downlink is logical
Whether chain way switch is closed letter, whether each power amplifier element works normally.
The principle of the downstream communications link of the power amplifier module of the utility model are as follows: wherein the first descending power amplification electricity
Road and the second downlink amplifying circuit are input to electric bridge combination through the first π type attenuator by received base station two-way and three road signals respectively
Road output, then pass through alc circuit to first order amplifier, third descending power amplifying circuit and the 4th descending power amplifying circuit
It needs not move through electric bridge combining output after the first π type attenuator by one-channel signal respectively, directly passes through alc circuit to the first order
Amplifier, alc circuit are a voltage-controlled attenuator MA4P7455, and the signal being coupled out from first order amplifier out is through ALC function
The control of rate control section is added on voltage-controlled attenuator MA4P7455, to complete ALC control action；The amplification of first order amplifier
The signal exported afterwards enters the amplification of second level amplifier through the second π type attenuator after SAW filter filters；Enter back into end
Grade amplifier amplification realizes forward power detection through power-sensing circuit from the signal of final amplifier output end coupling output,
Then feedback arrives voltage-controlled attenuator MA4P7455, completes ALC control action, and the signal exported after final amplifier amplification leads to again
Cross isolator output；The signal that above-mentioned third descending power amplifying circuit exports after final amplifier amplification passes through annular again
Device output.
The principle of uplink communication links are as follows: received mobile phone signal is amplified into SAW filter through low noise amplifier and filters
Wave, then amplify through radio frequency amplifier and be output to π type attenuator through electric bridge branch, wherein the first uplink low-noise amplification circuit, second
The signal of uplink low-noise amplification circuit amplification passes through two-way respectively through π type attenuator and three tunnels export, the amplification of third uplink low noise
The signal that circuit, the 4th uplink low-noise amplification circuit are amplified passes through single channel through π type attenuator and exports.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of power amplifier module for supporting MIMO technology for 5G antenna, which is characterized in that including shell (1), be set to
Pcb board (2) in shell (1)；
The pcb board (2) includes Micro-processor MCV and the descending power amplifying circuit and uplink that connect with Micro-processor MCV
Low-noise amplification circuit；
It is provided with memory metal thermally conductive sheet (3) on shell (1) inner wall, memory metal thermally conductive sheet (3) includes radiating segment (31)
Thermally conductive section (32) on the pcb board (2) are attached to for deformation in the case of a high temperature, the radiating segment (31) is close to fixation
On shell (1) inner wall, described thermally conductive section of (32) one end and the radiating segment (31) are connected and the other end extend be suspended from it is described
Above pcb board (2).
2. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 1, which is characterized in that
One layer of heat conduction silicone (33) is provided with outside thermally conductive section (32).
3. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 1, which is characterized in that
It is provided with high temperature breaking circuit (4) in the shell (1), the high temperature breaking circuit (4) includes:
Temperature sensor (5) for detecting the temperature of the pcb board (2), and detects in its signal output end output temperature and believes
Number；
Decision circuitry (6), is coupled to the signal output end of the temperature sensor (5), for surpassing when the temperature detection signal
The control OFF signal that upper limit threshold Shi Qi output end exports a high level is crossed, and is lower than lower threshold in the temperature detection signal
Shi Qi output end exports a low level control OFF signal；
It opens and closes circuit (7), is coupled to the output end of the decision circuitry (6), for closing letter when the control for receiving high level
Number when disconnect descending power amplifying circuit, uplink low-noise amplification circuit and power supply connection.
4. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 3, which is characterized in that
The decision circuitry (6) includes:
Resistance R1, one end are coupled to a direct current VCC_1, and the other end is grounded after connecting with a resistance R2, self-resistance R1 and electricity
The upper limit threshold is generated between resistance R2；
Comparator A, has a non-inverting input terminal, an inverting input terminal and an output end, and non-inverting input terminal is coupled to the temperature
The signal output end of sensor (5) is spent, inverting input terminal is coupled between resistance R1 and resistance R2；
Resistance R3, one end are coupled to a direct current VCC_1, and the other end is grounded after connecting with a resistance R4, self-resistance R3 and electricity
The lower threshold is generated between resistance R4；
Comparator B, has a non-inverting input terminal, an inverting input terminal and an output end, and inverting input terminal is coupled to the temperature
The signal output end of sensor (5) is spent, non-inverting input terminal is coupled between resistance R3 and resistance R4；
Or door OR_1, there are two input terminals and an output end, two input terminal to be respectively coupled to comparator A and comparator for tool
The output end of B；
T trigger T_1 has control terminal T, input end of clock CK and output end Q, and control terminal T is coupled to direct current VCC_1,
Its input end of clock CK is coupled to described or door OR_1 output end, and exports the control OFF signal in its output end Q.
5. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 4, which is characterized in that
The opening and closing circuit (7) includes:
NPN triode Q1, emitter ground connection, base stage are coupled to the output end Q of T trigger T_1 by resistance R5 and pass through one
Resistance R6 and emitter are altogether；
Normally closed relay KM1, the first end of coil are coupled to direct current VCC_2, and the second end of coil is coupled to tri- pole NPN
The collector of pipe Q1, normally-closed contact switch S1 are serially connected with descending power amplifying circuit, uplink low-noise amplification circuit and power supply
It connects between circuit；
Diode D1, cathode are coupled to the first end of the coil of normally closed relay KM1, and anode is coupled to normally closed relay KM1
Coil second end.
6. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 1, which is characterized in that
The descending power amplifying circuit is by the first descending power amplifying circuit, the second descending power amplifying circuit, third descending power
Amplifying circuit and the 4th descending power amplifying circuit composition, the uplink low-noise amplification circuit amplify electricity by the first uplink low noise
Road, the second uplink low-noise amplification circuit, third uplink low-noise amplification circuit and the 4th uplink low-noise amplification circuit composition, described the
One downlink power amplification circuit, the second descending power amplifying circuit, third descending power amplifying circuit and the 4th descending power are put
Big circuit is electric with the first uplink low-noise amplification circuit, the second uplink low-noise amplification circuit, the amplification of third uplink low noise respectively
Road and the 4th uplink low-noise amplification circuit are corresponding.
7. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 6, which is characterized in that
DAC circuit is serially connected between the descending power amplifying circuit and the Micro-processor MCV, the DAC circuit is adjusted by grid voltage
Partially, ALC power control part and PA switching controlling part are grouped as.
8. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 6, which is characterized in that
The first descending power amplifying circuit and the second descending power amplifying circuit include the first π type attenuator being sequentially connected in series,
Electric bridge, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, second level amplifier, final amplifier, function
Rate detection circuit and isolator；The third descending power amplifying circuit includes the first π type attenuator being sequentially connected in series, ALC electricity
Road, first order amplifier, SAW filter, the 2nd π type attenuator, second level amplifier, final amplifier, power detection electricity
Road, RF switch, power switch circuit and circulator；The 4th descending power amplifying circuit includes the first π being sequentially connected in series
Type attenuator, alc circuit, first order amplifier, SAW filter, the 2nd π type attenuator, second level amplifier, final stage amplification
Device, power-sensing circuit and isolator.
9. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 8, which is characterized in that
The first uplink low-noise amplification circuit, the second uplink low-noise amplification circuit, third uplink low-noise amplification circuit and the 4th uplink
Low-noise amplification circuit is by low noise amplifier, SAW filter, radio frequency amplifier, the electric bridge, π type attenuator group being sequentially connected in series
At the low noise amplifier of third uplink low-noise amplification circuit is connect with the RF switch.
10. a kind of power amplifier module for supporting MIMO technology for 5G antenna according to claim 6, feature exist
In being serially connected with current detection circuit between the descending power amplifying circuit and the Micro-processor MCV.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821936246.XU CN209120138U (en) | 2018-11-22 | 2018-11-22 | A kind of power amplifier module for supporting MIMO technology for 5G antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821936246.XU CN209120138U (en) | 2018-11-22 | 2018-11-22 | A kind of power amplifier module for supporting MIMO technology for 5G antenna |
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| CN209120138U true CN209120138U (en) | 2019-07-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111506131A (en) * | 2020-04-23 | 2020-08-07 | Oppo广东移动通信有限公司 | Communication method, device, terminal and storage medium based on millimeter wave antenna |
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2018
- 2018-11-22 CN CN201821936246.XU patent/CN209120138U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111506131A (en) * | 2020-04-23 | 2020-08-07 | Oppo广东移动通信有限公司 | Communication method, device, terminal and storage medium based on millimeter wave antenna |
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Effective date of registration: 20200409 Address after: 518000 5th floor, building 1, Guoren science and Technology Park, the intersection of Jinxiu middle road and Cuijing Road, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Guoren Technology Co., Ltd Address before: 518000 Building A 14F1401, People's Building No. 3, Yuehai Street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN GRENTECH COMMUNICATION TECHNOLOGY SERVICE Co.,Ltd. |
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