CN209101802U - A kind of chip ceramic post sintering device - Google Patents
A kind of chip ceramic post sintering device Download PDFInfo
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- CN209101802U CN209101802U CN201821782171.4U CN201821782171U CN209101802U CN 209101802 U CN209101802 U CN 209101802U CN 201821782171 U CN201821782171 U CN 201821782171U CN 209101802 U CN209101802 U CN 209101802U
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- supporting element
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- bolster
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Abstract
The utility model discloses a kind of chip ceramic post sintering devices, it is characterized in that, the sintering equipment successively includes load bearing board, the first bolster, the first supporting element, the second supporting element, the second bolster and pressure plate from bottom to top, and chip ceramics to be sintered are placed between the first bolster and the second bolster；The load bearing board and pressure plate are rigid ceramic wafer, and first bolster is located at the upper layer of load bearing board, and second bolster is located at the lower layer of pressure plate, and first bolster and the second bolster are the ceramic fibre bolster of flexible, porous.Utility model aims to solve easily occurring the problems such as radial surface scratch, warpage and cracking when chip ceramic post sintering, to improve product yield.
Description
Technical field
The utility model belongs to ceramic sintering technology field more particularly to a kind of chip ceramic post sintering device.
Background technique
In chip ceramic post sintering, apply certain pressure in Z-direction, may advantageously facilitate the densification of sintered body, obtain
The good product of mechanical performance, electric property, further, pressure sintering promote Z-direction on sintering shrinkage while,
The sintering shrinkage in XY axis direction can also be inhibited, be conducive to the size Control of ceramic product.
The difficult point of Z axis pressure sintering technique is there is following problem: first, since there are sintering shrinkages, entire
The pressure that presses in sintering process is gradually reduced, and common solution is need to be in final sintering temperature some suitable temperature below
Secondary pressurized is carried out, but the temperature spot of secondary pressurized is not easy to hold, moreover, chip ceramics at this time are because not yet fully sintered,
It is just easy to chipping in secondary pressurized；Second, since there are sintering shrinkage, the contact surfaces of pressurizing device and chip ceramics
There are relative displacements, this just easilys lead to chip ceramics in sintering shrinkage, and surface is pressurized device damage, cause to radiate
The surface scratch of shape；Third, since pressurizing device is mostly rigid dense structure, even if being filled using the pressurization with porous structure
It sets, porosity can not be too high, otherwise can sacrifice the mechanical strength of pressurizing device, shorten the working life, but porosity is not
Being easy the problem of bringing enough is, the plain embryo of chip ceramics is in dumping, it cannot be guaranteed that obtaining enough fresh airs and then causing
The residual of organic/inorganic additive in biscuit, and the decomposition gas that cannot exclude to generate in time in turn result in ceramics bubbling, stick up
The defects of bent, deformation etc., influence the yield of product.
Utility model content
The utility model provides a kind of chip ceramic post sintering device, solves easily occur radial surface stroke when ceramic post sintering
The problems such as trace, warpage and cracking, to improve product yield.
The technical solution of the utility model is as follows:
A kind of chip ceramic post sintering device, the sintering equipment successively include load bearing board, the first bolster, the from bottom to top
One supporting element, the second supporting element, the second bolster and pressure plate, chip ceramics to be sintered are placed in the first bolster and second
Between bolster；The load bearing board and the pressure plate are the ceramic wafer of rigidity, and first bolster is located at the load bearing board
Upper layer, second bolster is located at the lower layer of the pressure plate, and first bolster and the second bolster are flexibility
Porous ceramic fibre bolster.
Preferably, the ceramic wafer of the rigidity is selected from zirconium oxide rigid ceramic plate, aluminium oxide rigid ceramic plate, calcium oxide
Rigid ceramic plate, magnesia rigid ceramic plate, yttrium oxide rigid ceramic plate, barium monoxide rigid ceramic plate, silicon carbide rigid ceramic
One of plate, mullite rigid ceramic plate, cordierite rigid ceramic plate.
Preferably, the ceramic fibre bolster of the flexible, porous is ceramic fiber blanket, ceramic fiber paper, ceramic beaverboard
And any one in ceramic fiber blanket.
Preferably, the ceramic fibre bolster of the flexible, porous is selected from Zr(1-x)R(x)O2, silicon carbide, mullite, violet it is green
One of stone, wherein any one of R in Ca, Mg, Y, Ba, Al, 0 < x < 0.8.
Preferably, first supporting element is chip supporting element, and the thickness of first supporting element is greater than described to be sintered
Chip ceramics sintering before thickness；Second supporting element is chip supporting element, and the thickness of second supporting element is equal to institute
State the predetermined sintering final thickness of chip ceramics to be sintered.
Preferably, the weight of the pressure plate and the area ratio of first supporting element are 20-100N/mm2；It is described to apply
The weight of pressing plate and the area ratio of second supporting element are 20-100N/mm2。
Preferably, first supporting element be high temperature can after-flame organic polymer supporting element.
Preferably, first supporting element is starch supporting element, graphite supporting element, carbon black supporting element, polyacrylic resin
Supporting element, nylon resin supporting element, epoxy resin support part, ABS plastic supporting element, phenolic resin supporting element or cellulosic plastics
Supporting element.Above-mentioned supporting element plays the glass transition temperature (Tg) of first supporting element between the dumping of ceramics to be sintered
Between beginning temperature and sintering shrinkage initial temperature, the sintering shrinkage of the decomposition temperature (Td) of the first supporting element between ceramics to be sintered
Between initial temperature and maximum sintering temperature.
Preferably, second supporting element is the low creep supporting element of high temperature of rigidity.
Preferably, second supporting element is selected from zirconium oxide supporting element, alumina supporting member, calcium oxide supporting element, oxidation
Magnesium supporting element, yttrium oxide supporting element, silicon carbide supporting element, silicon nitride supporting element, tungsten carbide supported part, aluminium nitride supporting element, just
One of beautiful supporting element, mullite supporting element, cordierite supporting element, tungsten, metal molybdenum.
Compared with prior art, the beneficial effects of the utility model are as follows:
1) in chip ceramic post sintering device provided by the utility model, since first buffer layer and second buffer layer are soft
The porous ceramic fibre bolster of property, has the advantages that the following aspects: first, first buffer layer and second buffer layer are opened
Hole porosity is far longer than conventional rigid dense or Rigid Porous pressurizing device, it is therefore intended that allows ceramics to be sintered in dumping
Sufficient air can be obtained, while convenient for excluding the exhaust gas that the organic additive in ceramics to be sintered is generated when decomposing in time,
The defects of avoiding ceramics from generating bubbling, warpage；Second, first buffer layer and second buffer layer are flexible structure, therefore, chip pottery
Porcelain is not easy to be scratched by first buffer layer and second buffer layer during sintering shrinkage, will not leave behind radial surface scratch；
Third, first buffer layer and second buffer layer are flexible structure, thereby it is ensured that the pressurization in entire sintering process is uniform
Property and consistency, guarantee that chip ceramic surface there is no biggish thermal stress gradient, and then guarantees that chip ceramics are not in
The defects of edge warping, wave deformation；
2) in chip ceramic post sintering device provided by the utility model, due to the presence of the first supporting element, to be sintered
Ceramic surface is to reach the glass transition between dumping initial temperature and sintering shrinkage initial temperature in temperature by pressure pressure
Temperature spot starts what slowly application was got on, and the accurate monitoring temperature sensor that need not rely on of the process adds with additional
Equipment operation is pressed, but the chemical property of the material used in the first supporting element determines that principle is simple, it is easy to operate, it is low in cost；
Moreover, the first supporting element before reaching maximum sintering temperature by after-flame, and do not interfere with ceramics it is final sintered
Journey ensure that product yield；
3) in chip ceramic post sintering device provided by the utility model, due to the presence of the second supporting element, when sintered
After the completion of journey, the second supporting element can play the role of limitation ceramics excess shrinkage in the Z-axis direction.Original is explained further
Because being, the total weight of pressure plate and the second bolster provides main pressure pressure, but before sintering, people are not
It is easy to accurately calculate suitable pressure pressure, once pressure pressure is excessive, will lead to ceramics in Z-direction excess shrinkage, and XY
The contraction of axis direction is again less than normal, leads to the size Control precision for being difficult to ensure final products.And the second supporting element has rigidity knot
Low creep feature under structure and high temperature, people can control the final of ceramics by the way that the thickness of the second supporting element is previously set
Thickness, once ceramics take place burning and the shrinking percentage of Z-direction is caused to be more than setting value, pressure pressure will be from pottery to be sintered
Remove and be merely exerted on the second supporting element on porcelain, so as to avoid ceramics will not as pressure pressure it is excessive caused by Z axis
The problem of direction excess shrinkage.Moreover, due to the presence of the second supporting element, people do not need not only to accurately calculate conjunction in advance
Suitable pressure pressure, or even pressure pressure can also be increased intentionally, so that certain surplus is reserved, set in this way a advantage
It is, when being sintered those ceramic products with dissymmetrical structure, since structure asymmetry will lead to additional stress, in turn
Be easy to cause product buckling deformation, and it is this as structure it is asymmetric caused by stress is almost impossible is accurately calculated in advance
Come, only by increasing pressure pressure intentionally, guarantees that pressure reserves certain surplus, to offset this structure asymmetry bring
Extra-stress.
Certainly, any product for implementing the utility model does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
Fig. 1 is the chip ceramic post sintering apparatus structure schematic diagram of the utility model embodiment；
Marked in the figure: 1- load bearing board；The first bolster of 2-；The second supporting element of 3-；Chip ceramics 4- to be sintered；5- first
Supporting element；The second bolster of 6-；7- pressure plate.
Specific embodiment
The present invention will be further illustrated below in conjunction with specific embodiments.It should be understood that these embodiments are merely to illustrate
The utility model, rather than limit the protection scope of the utility model.Those skilled in the art are according to this in practical applications
The modifications and adaptations that utility model is made, still fall within the protection scope of the utility model.
In order to better illustrate the utility model, the utility model is described in detail below with attached drawing.
A kind of chip ceramic post sintering device, which is characterized in that the sintering equipment from bottom to top successively include load bearing board 1,
First bolster 2, the first supporting element 5, the second supporting element 3, the second bolster 6 and pressure plate 7, chip ceramics 4 to be sintered are put
It is placed between the first bolster 2 and the second bolster 6；The load bearing board 1 and pressure plate 7 are rigid ceramic wafer, and described
One bolster 2 is located at the upper layer of load bearing board 1, and second bolster 6 is located at the lower layer of pressure plate 7,2 He of the first bolster
Second buffering 6 is the ceramic fibre bolster of flexible, porous.Or first bolster 2 is directly placed at the load bearing board
On 1, pressure plate 7 is directly placed on second bolster 6.
The utility model is further described below with specific embodiment.
Embodiment
A kind of chip ceramic post sintering device, the sintering equipment from bottom to top successively include load bearing board 1, the first bolster 2,
First supporting element 5, the second supporting element 3, the second bolster 6 and pressure plate 7, chip ceramics 4 to be sintered are placed in the first buffering
Between part 2 and the second bolster 6.
The load bearing board 1 is located at the lowest level of entire sintering equipment, and the pressure plate 7 is located at the most upper of entire sintering equipment
Layer, the load bearing board 1 and pressure plate 7 are rigid ceramic wafer, and further, the ceramic wafer material of the rigidity is selected from
Zr(1-x)R(x)O2, (wherein any one in R=Ca, Mg, Y, Ba, Al, 0 < x < 0.8), silicon carbide, mullite, in cordierite
Any one or a few；Wherein, Zr(1-x)R(x)O2, (wherein any one in R=Ca, Mg, Y, Ba, Al, 0 < x < 0.8),
Silicon carbide, mullite, cordierite are existing known materials；
First bolster 2 is located at the upper layer of load bearing board 1, and second bolster 6 is located at the lower layer of pressure plate 7, institute
It states the first bolster 2 and the second bolster 6 is the ceramic fibre bolster of flexible, porous；The ceramic fibre of the flexible, porous
Bolster is any one or the combination of several of them in ceramic fiber blanket, ceramic fiber paper, ceramic beaverboard and ceramic fiber blanket；
Further, the material of the ceramic fibre bolster of the flexible, porous is selected from Zr(1-x)R(x)O2, (wherein R=Ca, Mg, Y, Ba,
Any one in Al, 0 < x < 0.8), silicon carbide, mullite, any one or a few in cordierite；Wherein, Zr(1-x)R(x)
O2, (wherein any one in R=Ca, Mg, Y, Ba, Al, 0 < x < 0.8), silicon carbide, mullite, cordierite be it is existing
Know material.
First supporting element 5 is located at the upper layer of the first bolster 2, and the first supporting element 5 is chip, the first supporting element 5
Thickness is greater than the thickness of chip ceramics 6 to be sintered, the area of the first supporting element 5 and the weight-matched of pressure plate 7, matches herein
The area ratio of the weight and the first supporting element 5 that refer to pressure plate 7 is preferably 20-100N/mm2, the first supporting element 5 is preferably height
Temperature can after-flame organic polymer supporting element；The glass transition temperature (Tg) of further preferably the first supporting element 5 between to
Between the dumping initial temperature and sintering shrinkage initial temperature of the chip ceramics 6 of sintering, the decomposition temperature (Td) of the first supporting element
Between the sintering shrinkage initial temperature and maximum sintering temperature of chip ceramics 6 to be sintered, in another prioritization scheme,
First supporting element 5 is preferably starch supporting element, graphite supporting element, carbon black supporting element, polyacrylic resin supporting element, nylon tree
It is rouge supporting element, epoxy resin support part, ABS plastic supporting element, phenolic resin supporting element, any in cellulosic plastics supporting element
One or more of combinations；
Second supporting element 3 is located at the upper layer of the first bolster 5, and the second supporting element 3 is chip, the second supporting element 3
Thickness is equal to the thickness after the completion of 6 sintering of chip ceramics to be sintered, and the second supporting element 3 is preferably the low creep branch of high temperature of rigidity
Support member, in another prioritization scheme, the second supporting element is preferably Zr(1-x)R(x)O2, (wherein in R=Ca, Mg, Y, Ba, Al
Any one, 0 < x < 0.8), corundum, mullite, any one or the combination of several of them in cordierite；Wherein, Zr(1-x)R(x)
O2, (wherein any one in R=Ca, Mg, Y, Ba, Al, 0 < x < 0.8), silicon carbide, mullite, cordierite be it is existing
Know material.
The sintering method for carrying out chip ceramics using the chip ceramic post sintering device of the utility model is as follows:
Using the chip ceramic post sintering device, according to the heating of the size and actual set of chip ceramics 4 to be sintered
Curve comes preferred load bearing board 1, pressure plate 7, the first bolster 2, the second bolster 6, the first supporting element 5 and the second supporting element 3
Chip ceramics to be sintered are placed between the first bolster and the second bolster, chip to be sintered are made pottery by size and material
Porcelain and sintering equipment are put into togerther in high temperature furnace, are heated up according to the heating curve of actual set, to complete chip ceramics
Sintering process.
The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no the details that detailed descriptionthe is all, also not limiting the utility model is only the specific embodiment.Obviously, according to this theory
The content of bright book can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably
The principles of the present invention and practical application are explained, so that skilled artisan be enable to better understand and utilize this
Utility model.The utility model is limited only by the claims and their full scope and equivalents.
Claims (10)
1. a kind of chip ceramic post sintering device, which is characterized in that the sintering equipment successively includes load bearing board, first from bottom to top
Bolster, the first supporting element, the second supporting element, the second bolster and pressure plate, it is slow that chip ceramics to be sintered are placed in first
Between stamping and the second bolster；The load bearing board and the pressure plate are the ceramic wafer of rigidity, and first bolster is located at
The upper layer of the load bearing board, second bolster are located at the lower layer of the pressure plate, first bolster and the second buffering
Part is the ceramic fibre bolster of flexible, porous.
2. chip ceramic post sintering device as described in claim 1, which is characterized in that the ceramic wafer of the rigidity is selected from oxidation
Zirconium rigid ceramic plate, aluminium oxide rigid ceramic plate, calcium oxide rigid ceramic plate, magnesia rigid ceramic plate, yttrium oxide are rigidly made pottery
Porcelain plate, barium monoxide rigid ceramic plate, silicon carbide rigid ceramic plate, mullite rigid ceramic plate, in cordierite rigid ceramic plate
It is a kind of.
3. chip ceramic post sintering device as described in claim 1, which is characterized in that the ceramic fibre of the flexible, porous buffers
Part is any one in ceramic fiber blanket, ceramic fiber paper, ceramic beaverboard and ceramic fiber blanket.
4. chip ceramic post sintering device as described in claim 1, which is characterized in that the ceramic fibre of the flexible, porous buffers
Part is selected from Zr(1-x)R(x)O2, silicon carbide, mullite, one of cordierite, wherein R is any in Ca, Mg, Y, Ba, Al
One kind, 0 < x < 0.8.
5. chip ceramic post sintering device as described in claim 1, which is characterized in that first supporting element is chip support
Part, the thickness of first supporting element are greater than thickness before the sintering of the chip ceramics to be sintered；Second supporting element is
Chip supporting element, the thickness of second supporting element are equal to the predetermined sintering final thickness of the chip ceramics to be sintered.
6. chip ceramic post sintering device as described in claim 1, which is characterized in that the weight of the pressure plate and described first
The area ratio of supporting element is 20-100N/mm2；The weight of the pressure plate and the area ratio of second supporting element are 20-
100N/mm2。
7. chip ceramic post sintering device as described in claim 1, which is characterized in that first supporting element is that high temperature is flammable
Most organic polymer supporting element.
8. chip ceramic post sintering device as claimed in claim 7, which is characterized in that first supporting element is starch support
Part, graphite supporting element, carbon black supporting element, polyacrylic resin supporting element, nylon resin supporting element, epoxy resin support part, ABS
Plastic supporting pieces, phenolic resin supporting element or cellulosic plastics supporting element.
9. chip ceramic post sintering device as described in claim 1, which is characterized in that second supporting element is the high temperature of rigidity
Low creep supporting element.
10. chip ceramic post sintering device as described in claim 1, which is characterized in that second supporting element is selected from zirconium oxide
Supporting element, alumina supporting member, calcium oxide supporting element, magnesia supporting element, yttrium oxide supporting element, silicon carbide supporting element, nitridation
Silicon supporting element, tungsten carbide supported part, aluminium nitride supporting element, corundum supporting element, mullite supporting element, cordierite supporting element, metal
One of tungsten, metal molybdenum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821782171.4U CN209101802U (en) | 2018-10-31 | 2018-10-31 | A kind of chip ceramic post sintering device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821782171.4U CN209101802U (en) | 2018-10-31 | 2018-10-31 | A kind of chip ceramic post sintering device |
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| Publication Number | Publication Date |
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| CN209101802U true CN209101802U (en) | 2019-07-12 |
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| CN201821782171.4U Expired - Fee Related CN209101802U (en) | 2018-10-31 | 2018-10-31 | A kind of chip ceramic post sintering device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113916002A (en) * | 2021-11-22 | 2022-01-11 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic pressing and sintering device and using method thereof |
| CN116120076A (en) * | 2023-02-14 | 2023-05-16 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Sintering method of chip capacitor ceramic sheet |
| WO2023184934A1 (en) * | 2022-04-02 | 2023-10-05 | 中材高新氮化物陶瓷有限公司 | Dynamic sintering method for nitride ceramic substrate |
-
2018
- 2018-10-31 CN CN201821782171.4U patent/CN209101802U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113916002A (en) * | 2021-11-22 | 2022-01-11 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic pressing and sintering device and using method thereof |
| CN113916002B (en) * | 2021-11-22 | 2023-03-10 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic pressing and sintering device and using method thereof |
| WO2023184934A1 (en) * | 2022-04-02 | 2023-10-05 | 中材高新氮化物陶瓷有限公司 | Dynamic sintering method for nitride ceramic substrate |
| CN116120076A (en) * | 2023-02-14 | 2023-05-16 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Sintering method of chip capacitor ceramic sheet |
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Granted publication date: 20190712 Termination date: 20211031 |