CN209087811U - A kind of quantum chip stereo packaging cartridge - Google Patents
A kind of quantum chip stereo packaging cartridge Download PDFInfo
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- CN209087811U CN209087811U CN201822130430.1U CN201822130430U CN209087811U CN 209087811 U CN209087811 U CN 209087811U CN 201822130430 U CN201822130430 U CN 201822130430U CN 209087811 U CN209087811 U CN 209087811U
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- pilot hole
- quantum chip
- circuit board
- groove
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Abstract
The utility model discloses a kind of quantum chip stereo packaging cartridges, are related to chip encapsulation technology field, and the quantum chip of alignment patterns is equipped with including datum plate, support adjustment plate, auxiliary packaging part, circuit board, connector and surface；The first pilot hole is provided on datum plate；The second pilot hole is provided in support adjustment plate；It is provided with third pilot hole on auxiliary packaging part, assists being additionally provided with the first via hole and the second groove on packaging part；Circuit board is equipped with the 4th pilot hole；First pilot hole, third pilot hole and the 4th guiding hole site are corresponding, equal in magnitude, and the second pilot hole is bigger than first pilot hole；Datum plate, support adjustment plate, auxiliary packaging part and circuit board are sequentially connected from bottom to top, support adjustment plate and auxiliary packaging part are detachably secured on datum plate respectively, circuit board is detachably secured in auxiliary packaging part, connector is arranged in the first via hole, and the quantum chip position in the utility model packaging cartridge is fixed precisely and not by pressure to avoid pressure from damaging.
Description
Technical field
The utility model belongs to quantum chip encapsulation technology field, especially a kind of quantum chip stereo packaging cartridge.
Background technique
The normal work of quantum chip needs extremely stable working environment, exposed to avoid extraneous interference is derived from
Chip be highly prone to the influence of clutter in ambient enviroment, cause on chip the transmission of signal and it is enabled be affected, thus
Generate that chip performance is poor or even inoperable state, it is generally the case that need for exposed quantum chip to be first encapsulated
It reuses, to reduce the interference of environment.
In the prior art, Chinese patent literature application number 201721871596.8, December 28 2017 applying date, title
For " a kind of quantum chip packaging device ", using the quantum chip packaging device when being packaged, quantum chip is placed on
In adjustment plate between support plate and fixed plate, after adjustment plate position correction, by bolt simultaneously fixed support plate,
Adjustment plate and fixed plate, by support plate and fixed plate to the fixed fixation for realizing quantum chip of the extruding of adjustment plate, then again
Circuit board is fixed in fixed plate.
Be in place of the deficiencies in the prior art: in the encapsulation process of this packaging system, due to quantum chip position not
Good accurate adjustment, the contraposition of quantum chip is difficult, and the quantum chip position in the packaging cartridge finally obtained is caused more or less to deposit
In error, and in encapsulation process, by then passing through extruding quantum chip quantum chip is fixed, thus inevitably
The surface of quantum chip can be damaged, finally, influence service performance.
Utility model content
The purpose of the utility model is to provide a kind of quantum chip stereo packaging cartridges, to solve deficiency in the prior art,
Quantum chip position in packaging cartridge can be fixed precisely, and not by pressure to avoid damage caused by pressure.
The technical solution adopted in the utility model is as follows:
A kind of quantum chip stereo packaging cartridge, including datum plate, support adjustment plate, auxiliary packaging part, circuit board, connector
The quantum chip of alignment patterns is equipped with surface；
The first pilot hole is provided on the datum plate；It is provided with the second pilot hole in the support adjustment plate, supports adjustment plate
On be additionally provided with the first groove for fixed placement quantum chip；It is provided with third pilot hole on auxiliary packaging part, assists packaging part
On be additionally provided with the first via hole and the second groove；Circuit board is equipped with the 4th pilot hole；
First pilot hole, third pilot hole and the 4th guiding hole site are corresponding, equal in magnitude, second guiding
Hole is corresponding with the first guiding hole site, and the second pilot hole is bigger than first pilot hole；
The datum plate, the support adjustment plate, the auxiliary packaging part and the circuit board are sequentially connected from bottom to top,
The support adjustment plate and the auxiliary packaging part are detachably secured on datum plate respectively, and circuit board is detachably secured to assist
In packaging part, through being arranged in first via hole, bottom is electrically connected the connector with the quantum chip upper surface, top
Portion is electrically connected with the circuit board lower surface.
Further, first pilot hole, the second pilot hole, third pilot hole and the 4th pilot hole are rectangular, and
At least provided with one.
Further, the first pilot hole, the second pilot hole, third pilot hole and the 4th pilot hole are circle, and extremely
There are two setting less.
Further, the depth of first groove is greater than the thickness of quantum chip.
Further, first groove is stepped ramp type groove；
The fixed quantum chip in the bottom of the stepped ramp type groove；
The stepped ramp type groove is parallel on the step surface of the quantum chip surface and is provided with bonding line.
Further, the quantum chip is pasted and fixed on the bottom of the first groove.
Further, the connector includes spring needle and needle guard；
The spring needle is arranged in the needle guard, and described spring needle one end can be electrically connected the quantum chip, described
Spring needle one end can be electrically connected the circuit board.
Further, the spring needle is Pogo-Pin needle.
Further, the quantum chip stereo packaging cartridge further includes cover board；
The cover board is fixed on second groove upper end, be located at the circuit board, in which: the cover board with it is described
Second groove upper end opening clearance fit.
Further, the quantum chip stereo packaging cartridge further includes connector；
The connector be fixed on auxiliary packaging part on, and with the circuit board electrical connection.
Compared with prior art, the utility model provides a kind of quantum chip stereo packaging cartridge, including datum plate, support
Adjustment plate, auxiliary packaging part, circuit board, connector and quantum chip, use the corresponding encapsulation side of the packaging cartridge of the utility model
Method can be by the guide post and alignment sheets that are additionally provided in encapsulation process, the section of guide post and the first guiding hole site
Correspondence, cross-sectional sizes are equal, and the 5th pilot hole is provided in alignment sheets, and the 5th pilot hole is corresponding with the position of the first pilot hole, big
It is small equal, the alignment profiled orifice to match with alignment patterns on quantum chip is also provided in the alignment sheets, it will by guide post
Together with datum plate, support adjustment plate are worn with alignment sheets, then adjustment supports the position of adjustment plate, thus accurately amount of movement
The position of sub- chip, the alignment patterns to be moved on quantum chip position completely corresponding with the alignment profiled orifice in alignment sheets
Afterwards, then by bolt adjustment plate and datum plate will be supported to be fixed, so that it is determined that realizing the accurate positioning of quantum chip
And it is fixed, and quantum chip not will receive external force pressure in encapsulation process, so that the safety of quantum chip, this reality be effectively ensured
It is more accurate, safe with the position of quantum chip in novel quantum chip stereo packaging cartridge, thus performance more stability and high efficiency.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is the quantum three-dimensional encapsulation box structure explosive view in the utility model embodiment 1；
Fig. 2 is the substrate in Fig. 1；
Fig. 3 is the support adjustment plate in Fig. 1；
Fig. 4 is the auxiliary packaging part in Fig. 1；
Fig. 5 is the circuit board in Fig. 1；
Fig. 6 is in the utility model embodiment 1 for assisting the alignment sheets of encapsulation；
Fig. 7 is in the utility model embodiment 1 for assisting the guide post of encapsulation；
Fig. 8 is the quantum three-dimensional encapsulation box structure schematic diagram in the utility model embodiment 1；
Fig. 9 is connector in the utility model embodiment 4；
Figure 10 is the quantum three-dimensional encapsulation box structure schematic diagram in the utility model embodiment 5；
Figure 11 is the cover board in Figure 10；
Figure 12 is the Structure explosion diagram of the quantum three-dimensional encapsulation box in figure utility model embodiment 6；
Figure 13 is the connector in Figure 12；
Figure 14 is the schematic diagram of step 3 in the utility model embodiment 6；
Figure 15 is the schematic diagram of step 4 in the utility model embodiment 6；
Figure 16 is the schematic diagram of step 5 in the utility model embodiment 6；
Figure 17 is the schematic diagram of step 8 in the utility model embodiment 6；
Figure 18 is the schematic diagram of step 9 in the utility model embodiment 6；
Figure 19 is the schematic diagram of step 11 in the utility model embodiment 6；
Figure 20 is the schematic diagram of step 15 in the utility model embodiment 6；
Figure 21 is the schematic diagram of step 17 in the utility model embodiment 6.
Specific embodiment
The embodiments described below with reference to the accompanying drawings are exemplary, is only used for explaining the utility model, and cannot solve
It is interpreted as limitations of the present invention.
Embodiment 1
The utility model embodiment 1 provides a kind of quantum chip stereo packaging cartridge, as shown in figures 1-8, including datum plate
1, adjustment plate 2, auxiliary packaging part 3, circuit board 4, connector 10 and surface is supported to be equipped with the quantum chip 7 of alignment patterns；
The first pilot hole 11 is provided on the datum plate 1；It is provided with the second pilot hole 21 in the support adjustment plate 2, supports
The first groove 22 for fixed placement quantum chip 7 is additionally provided in adjustment plate 2；Third pilot hole is provided on auxiliary packaging part 3
31, it assists being additionally provided with the first via hole 32 and the second groove 33 on packaging part 3；Circuit board 4 is equipped with the 4th pilot hole 41；
First pilot hole 11, third pilot hole 31 and 41 position of the 4th pilot hole are corresponding, equal in magnitude, and described
Two pilot holes 21 are corresponding with 11 position of the first pilot hole, and the pilot hole 11 of the second pilot hole 21 to the first is big；
The datum plate 1, the support adjustment plate 2, the auxiliary packaging part 3 and the circuit board 4 are from bottom to top successively
Connection, the support adjustment plate 2 and the auxiliary packaging part 3 are detachably secured to respectively on datum plate 1, and circuit board 4 is detachable
It is fixed in auxiliary packaging part 3, the connector 10, which runs through, to be arranged in first via hole 32, bottom and the quantum chip
The electrical connection of 7 upper surfaces, top is electrically connected with 4 lower surface of circuit board.
Using the quantum chip stereo packaging cartridge of the utility model, it need to be additionally provided guide post 6 and alignment sheets 5 in encapsulation,
The section of the guide post 6 and the position of first pilot hole 11 are corresponding, equal in magnitude, are provided with the 5th in the alignment sheets 5
Pilot hole 51, the 5th pilot hole 51 and 11 position of the first pilot hole are corresponding, equal in magnitude, also open in the alignment sheets
There is the alignment profiled orifice 52 to match with alignment patterns on quantum chip 7, encapsulation process is specific as follows:
Compared with prior art, the utility model provides a kind of quantum chip stereo packaging cartridge, uses the utility model
The corresponding packaging method of packaging cartridge can pass through the guide post 6 that is additionally provided, the guide post 6 in encapsulation process
Section is corresponding with 11 position of the first pilot hole, cross-sectional sizes are equal, by the guide post 6 by the datum plate 1, the branch
Together with support adjustment plate 2 is worn with the alignment sheets 5, the position of the support adjustment plate 2 is then adjusted, to accurately move
The position of quantum chip 7, the alignment profile on the quantum chip 7 in alignment patterns and the alignment sheets 5
After hole 52 exactly matches corresponding position, then passes through bolt and the support adjustment plate 2 and the datum plate 1 are fixed, from
And it has been determined that the accurate positioning for realizing the quantum chip 7 is fixed, and the quantum chip 7 not will receive in fixation procedure
External force pressure, so that the safety of the quantum chip 7 be effectively ensured, successively the auxiliary packaging part is fixed in installation for subsequent continuation
3, the circuit board 4 and the connector 10, so that the entirety of three-dimensional encapsulation box is formed, the utility model quantum chip stereo envelope
The position of quantum chip is more accurate, safe in mounted box.
Further, wherein first pilot hole 11 can be square hole, and the guide post 6 is cuboid at this time；
If first pilot hole is set as circular hole, in order to avoid turning effect, first pilot hole 11, described second
Pilot hole 21, the third pilot hole 31, the 4th pilot hole 41 and the 5th pilot hole 51 should at least be arranged two,
The quantity of guide post 6 should also be as identical with the quantity of first pilot hole 11 at this time, and be cylindrical structure, shown in attached drawing
As described first pilot hole 11 is situation that is round and being a clock synchronization, wherein the guide post 6 is preferably positioning pin.
Embodiment 2
As shown in figures 1-8, on the basis of embodiment 1, further, the depth of first groove 22 is greater than quantum core
The thickness of piece 7.
The depth of first groove 22 is greater than the thickness of the quantum chip 7, and the quantum chip 7 may make to be fixed on
After in first groove 22, the upper surface of the quantum chip 7 is located at the lower face of support adjustment plate 2, so that
The lower surface of the subsequent other component for being located at 2 top of support adjustment plate can not all touch the upper surface of quantum chip 7, thus
Quantum chip 7 is further protected not influenced even to damage by external force.
Embodiment 3
As shown in figures 1-8, on the basis of embodiment 2, further, first groove 22 is stepped ramp type groove；
The fixed quantum chip 7 in the bottom of the stepped ramp type groove；
The stepped ramp type groove is parallel on the step surface on 7 surface of quantum chip and is provided with bonding line.
It is connected by using bonding, so that the quantum chip 7 and the support adjustment plate 2 may be implemented well to contact,
To good earth.
Further, the quantum chip 7 is pasted and fixed on the bottom of the first groove 22.
Embodiment 4
As shown in figs 1-9, on the basis of embodiment 1, further, the connector 10 includes spring needle 101 and needle
Set 100；
The spring needle 101 is arranged in the needle guard 100, and 101 one end of the spring needle can be electrically connected the quantum
Chip 7, described 101 one end of spring needle can be electrically connected the circuit board 4.Since the spring needle 101 of use is used as electric connection structure
Be mounted in the first via hole 32, play the role of the connection quantum chip 7 and the circuit board 4, the spring needle 101 for
The pressure for connecting contact point is smaller, can cause stress damage to avoid the contact site to the quantum chip 7 and the circuit board 4
Wound.
Specifically, Pogo-Pin needle, optional double end elastic type or single-ended elastic type can be selected in the spring needle 101.
Embodiment 5
As shown in figs. 1-11, on the basis of embodiment 1, further, the quantum chip stereo packaging cartridge further includes
Cover board 9；
The cover board 9 is fixed on 33 upper end of the second groove, is located at 4 top of circuit board, in which: the cover board 9
With the 33 upper end opening clearance fit of the second groove.
By the way that cover board 9 is arranged, the circuit board 4 can be isolated with external environment, circuit board here refers specifically to
Pcb board, if pcb board is exposed in ambient enviroment, when ambient signals environment is there are when noise signal, noise signal can pass through PCB
Plate is coupled in the transmission line on pcb board, to influence the realization of 7 performance of quantum chip, quantum chip 7 in the utility model,
And all transmission line of pcb board is respectively positioned on inside closed packaging system, the influence of external environment is avoided, specifically, can
It is connected on auxiliary packaging part 3 with being detachably fixed cover board 9 by bolt.
Embodiment 6
As shown in figures 1-13, on the basis of embodiment 5, further, the quantum chip stereo packaging cartridge further includes
Connector 8；
The connector 8 is fixed on auxiliary packaging part 3, and is electrically connected with the circuit board 4, and connector 8 is added, thus
So that quantum chip packaging device has the function connecting with the external world,
Further, at least a pair of the is provided on the axial surface of the parallel guide post 6 of the auxiliary packaging part 3
One fixing groove 34；
For one first fixing groove 34 for fixing the connector 8, the effect of the first fixing groove 34 is can
Preferably to connect the connector 8.
As shown in attached drawing 13-20, in conjunction with a kind of quantum chip stereo packaging method of the present embodiment, based on above-mentioned quantum
Chip stereo packaging cartridge, the quantum chip stereo packaging method include:
Step 1: datum plate 1, support adjustment plate 2, auxiliary packaging part 3, circuit board 4, connector and quantum chip 7 are provided,
Wherein: quantum chip 7 is pasted and fixed in the second groove 22 of support adjustment plate 2；
Step 2: alignment layer 5 and guide post 6 is provided, in which: be provided on alignment layer 5 the 5th pilot hole 51 and with quantum core
The identical alignment profile slot of alignment patterns on piece 7, the section of guide post 6 and the shape of the first pilot hole 11 are identical, equal in magnitude；
Step 3: guide post 6 is inserted into the first pilot hole 11 of datum plate；
Step 4: support adjustment plate 2 being placed in 1 top of datum plate, and guide post 6 is made to pass through the second pilot hole 21；
Step 5: alignment layer 5 being placed in 2 top of support adjustment plate, and guide post 6 is made to pass through the 5th pilot hole 51；
Step 6: the position of support adjustment plate 2 is adjusted, so that alignment patterns on quantum chip 7 and pair being aligned on layer 5
Quasi- profile slot is mapped；
Step 7: support adjustment plate 2 is fixed on datum plate 1；
Step 8: taking lower alignment layer 5；
Step 9: auxiliary packaging part 3 being placed in 2 top of support adjustment plate, and guide post 6 is made to pass through third pilot hole
31, auxiliary packaging part 3 is fixed on datum plate 1；
Step 10: connector is mounted in the first via hole 32 in auxiliary packaging part 3；
Step 11: circuit board 4 is placed in auxiliary packaging part 3, and guide post 6 is made to pass through the 4th pilot hole 41, it will
Circuit board 4 is fixed in auxiliary packaging part 3.
Step 12: a kind of quantum chip stereo packaging method provided by the utility model, be based on the above embodiment in
Quantum chip stereo packaging cartridge is come the method that is packaged to quantum chip, and in encapsulation process, the position of quantum chip can be with
It is moved with moving for adjustment plate of support, when position to be moved to determining, the support adjustment plate of quantum chip will be loaded with
It is fixed with datum plate, to substantially increase the positional accuracy of quantum chip.
Further, circuit board 4 is placed in auxiliary packaging part 3 by this method described, and guide post 6 is passed through
4th pilot hole 41, after circuit board 4 is fixed in auxiliary packaging part 3, further includes:
Step 13: connector 8 is provided；
Step 14: the needle core of connector 8 being passed through to the side wall of auxiliary packaging part 3, is electrically connected with the transmission line on circuit board 4
It connects；
Step 15: connector 8 is fixed on to the side wall of auxiliary packaging part 3.
Further, this method further includes after the side wall that connector 8 is fixed on to auxiliary packaging part 3, going back
Include:
Step 16: cover board 9 is provided；
Step 17: cover board 9 being fixed on auxiliary packaging part 3, will be isolated inside packaging system with external environment, so that electric
Road plate is located at closed intracavitary environment, avoids influence of the extraneous clutter for signal input/output.
The structure, features, and effects of the present invention is described in detail based on the embodiments shown in the drawings, with
Upper described is only the preferred embodiment of the utility model, but the present invention does not limit the scope of implementation as shown in the drawings, it is all according to
Change or equivalent example modified to equivalent change made by conception according to the utility model, still without departing from specification and figure
When showing covered spirit, it should be within the protection scope of the present utility model.
Claims (10)
1. a kind of quantum chip stereo packaging cartridge, which is characterized in that including datum plate (1), support adjustment plate (2), auxiliary encapsulation
Part (3), circuit board (4), connector (10) and surface are equipped with the quantum chip (7) of alignment patterns；
The first pilot hole (11) are provided on the datum plate (1)；The second pilot hole (21) are provided on the support adjustment plate (2),
The first groove (22) for fixed placement quantum chip (7) is additionally provided in support adjustment plate (2)；It is opened in auxiliary packaging part (3)
Have third pilot hole (31), is additionally provided with the first via hole (32) and the second groove (33) in auxiliary packaging part (3)；On circuit board (4)
Equipped with the 4th pilot hole (41)；
First pilot hole (11), third pilot hole (31) and the 4th pilot hole (41) position are corresponding, equal in magnitude, described
Second pilot hole (21) is corresponding with the first pilot hole (11) position, and pilot hole (11) of the second pilot hole (21) than first is big；
The datum plate (1), the support adjustment plate (2), the auxiliary packaging part (3) and the circuit board (4) are from bottom to top
It is sequentially connected, the support adjustment plate (2) and the auxiliary packaging part (3) are detachably secured to respectively on datum plate (1), circuit
Plate (4) is detachably secured in auxiliary packaging part (3), and the connector (10) is interior in first via hole (32) through setting,
Bottom is electrically connected with quantum chip (7) upper surface, and top is electrically connected with the circuit board (4) lower surface.
2. a kind of quantum chip stereo packaging cartridge as described in claim 1, which is characterized in that first pilot hole (11),
Second pilot hole (21), third pilot hole (31) and the 4th pilot hole (41) are rectangular, and at least provided with one.
3. a kind of quantum chip stereo packaging cartridge as described in claim 1, which is characterized in that the first pilot hole (11), second
Pilot hole (21), third pilot hole (31) and the 4th pilot hole (41) are circle, and at least provided with two.
4. a kind of quantum chip stereo packaging cartridge as described in claim 1, which is characterized in that the depth of first groove (22)
Degree is greater than the thickness of quantum chip (7).
5. a kind of quantum chip stereo packaging cartridge as claimed in claim 4, which is characterized in that first groove (22) is platform
Rank type groove；
The fixed quantum chip (7) in the bottom of the stepped ramp type groove；
The stepped ramp type groove is parallel on the step surface on quantum chip (7) surface and is provided with bonding line.
6. a kind of quantum chip stereo packaging cartridge as claimed in claim 5, which is characterized in that the quantum chip (7) is pasted
It is fixed on the bottom of the first groove (22).
7. a kind of quantum chip stereo packaging cartridge as described in claim 1, which is characterized in that the connector (10) includes bullet
Spring needle (101) and needle guard (100)；
Spring needle (101) setting is in the needle guard (100), and the spring needle (101) one end can be electrically connected the amount
Sub- chip (7), described spring needle (101) one end can be electrically connected the circuit board (4).
8. a kind of quantum chip stereo packaging cartridge as claimed in claim 7, which is characterized in that the spring needle (101) is
Pogo-Pin needle.
9. a kind of quantum chip stereo packaging cartridge as described in claim 1, which is characterized in that the quantum chip stereo encapsulation
Box further includes cover board (9)；
The cover board (9) is fixed on the second groove (33) upper end, is located above the circuit board (4), in which: the cover board
(9) with the second groove (33) upper end opening clearance fit.
10. a kind of quantum chip stereo packaging cartridge as described in claim 1, which is characterized in that the quantum chip stereo envelope
Mounted box further includes connector (8)；
The connector (8) is fixed in auxiliary packaging part (3), and is electrically connected with the circuit board (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822130430.1U CN209087811U (en) | 2018-12-19 | 2018-12-19 | A kind of quantum chip stereo packaging cartridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822130430.1U CN209087811U (en) | 2018-12-19 | 2018-12-19 | A kind of quantum chip stereo packaging cartridge |
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| Publication Number | Publication Date |
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| CN209087811U true CN209087811U (en) | 2019-07-09 |
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| CN201822130430.1U Active CN209087811U (en) | 2018-12-19 | 2018-12-19 | A kind of quantum chip stereo packaging cartridge |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110474192A (en) * | 2019-07-23 | 2019-11-19 | 中国科学技术大学 | Signal connection structure and quantum chip package box body based on interference fit |
-
2018
- 2018-12-19 CN CN201822130430.1U patent/CN209087811U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110474192A (en) * | 2019-07-23 | 2019-11-19 | 中国科学技术大学 | Signal connection structure and quantum chip package box body based on interference fit |
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