CN109509717A - A kind of quantum chip stereo packaging system and packaging method - Google Patents
A kind of quantum chip stereo packaging system and packaging method Download PDFInfo
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- CN109509717A CN109509717A CN201811552470.3A CN201811552470A CN109509717A CN 109509717 A CN109509717 A CN 109509717A CN 201811552470 A CN201811552470 A CN 201811552470A CN 109509717 A CN109509717 A CN 109509717A
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- quantum chip
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- plate
- adjustment plate
- support adjustment
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of quantum chip stereo packaging system and packaging method, be related to chip encapsulation technology field, the present invention include guide post and can successively be threaded through be in the guide post under placement above the average datum plate, support adjustment plate and alignment sheets；The support adjustment plate is fixed with quantum chip towards the first groove is provided among the surface of the alignment sheets in first groove, the quantum chip is towards being provided with alignment patterns on the surface of the alignment sheets；The alignment profiled orifice to match with the alignment patterns is provided in the alignment sheets；The guide post at least two, each guide post is uniformly distributed on the datum plate, in the support adjustment plate, in the alignment sheets, the datum plate and the support adjustment plate can be fixedly connected by bolt with the fixation hole, and it is fixed that the present invention can be realized precise positioning during quantum chip package, safety.
Description
Technical field
The invention belongs to chip encapsulation technology field, especially a kind of quantum chip stereo packaging system and packaging method.
Background technique
The normal work of quantum chip needs extremely stable working environment, exposed to avoid extraneous interference is derived from
Chip be highly prone to the influence of clutter in ambient enviroment, cause on chip the transmission of signal and it is enabled be affected, thus
Generate that chip performance is poor or even inoperable state, it is generally the case that need for exposed quantum chip to be first encapsulated
It reuses, to reduce the interference of environment.
In the prior art, the encapsulation for quantum chip generally includes support plate, adjustment plate, fixed plate and circuit board.Envelope
When dress, quantum chip is placed in the adjustment plate between support plate and fixed plate, adjustment plate position correction it
Afterwards, by bolt while fixed support plate, adjustment plate and fixed plate, the extruding of adjustment plate is fixed by support plate and fixed plate
The fixation for realizing quantum chip, is then fixed on circuit board in fixed plate again.
The fixed fixation for realizing quantum chip of the existing extruding by support plate and fixed plate and adjustment plate, has following lack
It falls into and insufficient:
When realizing that support plate and fixed plate squeeze fixed adjustment plate by bolt, the amount of force difficulty or ease control of bolt is tightened
System, and the thickness of the thickness of adjustment plate and quantum chip is almost equal, the active force of the offer of bolt is uneven or effect
When power control is bad, both support plate and fixed plate be easy to cause the damage of quantum chip to the extruding of quantum chip and adjustment plate
Even damage.
Summary of the invention
The object of the present invention is to provide one kind, and to solve deficiency in the prior art, it can be realized quantum chip package
Precise positioning in the process, safety are fixed.
The technical solution adopted by the invention is as follows:
A kind of quantum chip stereo packaging system, including guide post and can successively be threaded through in the guide post in lower
Horizontal positioned datum plate, support adjustment plate and alignment sheets；
The support adjustment plate is solid in first groove towards being provided with the first groove among the surface of the alignment sheets
Surely there is a quantum chip, the quantum chip is towards being provided with alignment patterns on the surface of the alignment sheets；
The alignment profiled orifice to match with the alignment patterns is provided in the alignment sheets；
The guide post at least two, each guide post on the datum plate, in the support adjustment plate, it is described
It is uniformly distributed in alignment sheets；
The first corresponding with each guide post position, cross-sectional sizes are equal pilot hole is respectively equipped on the datum plate,
The second pilot hole corresponding with each guide post position is respectively equipped in the support adjustment plate, second pilot hole compares institute
The section for stating guide post is big, be respectively equipped in the alignment sheets, cross-sectional sizes corresponding with each guide post position it is equal
Five pilot holes, the support adjustment plate can relatively each guide post move horizontally；
Fixation hole corresponding with position is provided in the support adjustment plate on the datum plate is set in the alignment sheets
Be equipped with hollow out corresponding with the fixation hole position, when the alignment patterns with it is described be aligned profiled orifice alignment when, the base
Quasi- plate and the support adjustment plate can be fixedly connected by bolt with the fixation hole.
Further, the depth of first groove is greater than the thickness of the quantum chip.
Further, first groove is stepped ramp type groove；
The fixed quantum chip in the bottom of the stepped ramp type groove；
The stepped ramp type groove is parallel on the step surface of the quantum chip surface and is provided with bonding line.
Further, the quantum chip stereo packaging system further includes auxiliary packaging part, circuit board and connector；
The auxiliary packaging part for fix the circuit board and assisting realize the circuit board by the connector with
The quantum chip electrical connection；
The third guiding corresponding with each guide post position, cross-sectional sizes are equal is respectively equipped on the auxiliary packaging part
Hole；
The 4th pilot hole corresponding with each guide post position, cross-sectional sizes are equal is respectively equipped on the circuit board；
The auxiliary packaging part can be threaded through in the guide post by third pilot hole and be located at the support adjustment plate
Away from the side of the datum plate；
The circuit board, which can be threaded through in the guide post by the 4th pilot hole and be located at the auxiliary packaging part, to deviate from
The side of the support adjustment plate.
Further, there is first thickness at the position of the corresponding quantum chip on the auxiliary packaging part, it is described
Being corresponded at the position of the support adjustment plate on auxiliary packaging part has second thickness, and it is thick that the first thickness is less than described second
Degree；
The auxiliary packaging part can be by being threaded through the bolt at the second thickness position and the datum plate, the branch
Support adjustment plate is fixedly connected.
Further, the second groove is provided among surface of the auxiliary packaging part far from the support adjustable plate；
The circuit board is fixedly installed in second groove.
Further, cover board is also fixed in second groove；
The cover plate lid is located on the circuit board, and the cover board and second groove gap cooperate.
Further, it is corresponded on the auxiliary packaging part and is provided with the first via hole at the position of the quantum chip；
First via hole assembles the connector for gap.
Further, the connector includes spring needle and needle guard；
The spring needle is arranged in the needle guard, and described spring needle one end can be electrically connected the quantum chip, described
Spring needle one end can be electrically connected the circuit board.
Further, the quantum chip stereo packaging system further includes connector；
The connector is fixed on the auxiliary packaging part, and is electrically connected the circuit board.
Further, it is solid to be provided at least a pair first on the axial surface of the guide post in parallel for the auxiliary packaging part
Determine slot；
One first fixing groove is for fixing the connector.
A kind of quantum chip stereo packaging method utilizes quantum chip stereo packaging system described in any of the above embodiments, packet
Include following steps:
Guide post, datum plate, support adjustment plate and alignment sheets are provided, by the datum plate, the support adjustment plate and institute
It states alignment sheets and passes through first pilot hole, second pilot hole, the 5th pilot hole respectively and be successively threaded through described lead
Make on column the datum plate, the support adjustment plate and the alignment sheets three be under placement above the average；
The position of the relatively described guide post of adjustment plate is supported to make the alignment patterns alignment described right described in horizontal adjustment
Then the support adjustment plate is fixed on the datum plate by quasi- profiled orifice by bolt and the fixation hole.
Further, the position of the relatively described guide post of adjustment plate is supported to make the alignment figure described in the horizontal adjustment
Shape is directed at the profiled orifice, and the support adjustment plate is then fixed on the datum plate it by bolt and the fixation hole
Afterwards, further includes:
The alignment sheets are removed.
Further, after the removal by the alignment sheets, further includes:
Auxiliary packaging part is provided, the auxiliary packaging part is threaded through in the guide post by third pilot hole, makes institute
State auxiliary packaging part be located at the support adjustment plate deviate from datum plate obtain side, will assist packaging part be bolted on benchmark
On plate.
Further, packaging part is assisted in the offer, the auxiliary packaging part is threaded through institute by third pilot hole
It states in guide post, so that auxiliary encapsulation is located at the support adjustment plate and deviate from after datum plate obtains side, further includes:
Connector is provided, connector is set in the first via hole, so that connector is obtained bottom and is connected electrically in quantum chip
Surface；
Circuit board is provided, the auxiliary is fixed on after the circuit board is threaded through in guide post by the 4th pilot hole and is connected
Fitting obtains bottom in the second groove, wherein the bottom surface of circuit board is electrically connected with the upper end of the connector.
Further, the quantum chip stereo packaging method further include:
Connector is provided, the connector is fixed in the first fixing groove of the auxiliary packaging part, and by the company
It connects device and is electrically connected the circuit board.
Further, the quantum chip stereo packaging method further include:
Cover board is provided, the cover plate lid is located in second groove, the top of the cover board and second groove
Opened gap cooperation.
Compared with prior art, the present invention provides a kind of quantum chip stereo packaging systems, including guide post, benchmark
Plate, support adjustment plate and alignment sheets, interior the first groove for being equipped with fixed quantum chip of support adjustment plate, successively will by guide post
Datum plate, support adjustment plate and alignment sheets are worn, by the mobile position for adjusting support adjustment plate, until on quantum chip
Alignment patterns be aligned with the alignment profiled orifice in alignment sheets after, so as to realize the precise positioning of quantum chip, then again
Adjustment plate will be supported to be fixed on datum plate by bolt, it should be in the process without applying pressing force to quantum chip, to realize
The safety of quantum chip is fixed.
It is based on above-mentioned quantum chip stereo encapsulation dress the present invention also provides a kind of quantum chip stereo packaging method
The method to be packaged to quantum chip is set, in encapsulation process, the position of quantum chip can be with support adjustment plate
It is mobile and moved, when position to be moved to determining, the support adjustment plate and the datum plate that are loaded with quantum chip are fixed, thus
The positional accuracy of quantum chip is substantially increased, while avoiding effectively protecting using the fixing means of pressure fastening quantum chip
The safety of quantum chip is protected.
Detailed description of the invention
Fig. 1 is a kind of quantum chip stereo packaging system schematic diagram of the embodiment of the present invention 1；
Fig. 2 is the schematic diagram of datum plate in Fig. 1；
Fig. 3 is the schematic diagram that adjustment plate is supported in Fig. 1；
Fig. 4 is the schematic diagram of alignment sheets in Fig. 1；
Fig. 5 is the schematic diagram of guide post in Fig. 1；
Fig. 6 is a kind of quantum chip stereo packaging system perspective view of the explosion of the embodiment of the present invention 4；
Fig. 7 is the schematic diagram that packaging part is assisted in Fig. 6；
Fig. 8 is the schematic diagram of circuit board in Fig. 6；
Fig. 9 is the schematic diagram of connector in Fig. 6；
Figure 10 is a kind of quantum chip stereo packaging system schematic diagram of the embodiment of the present invention 4；
Figure 11 is a kind of quantum chip stereo packaging system schematic diagram of the embodiment of the present invention 6；
Figure 12 is the covering plate structure schematic diagram in Figure 11；
Figure 13 is the structural schematic diagram of connector in the embodiment of the present invention 8.
Specific embodiment
The embodiments described below with reference to the accompanying drawings are exemplary, for explaining only the invention, and cannot be construed to
Limitation of the present invention.
Embodiment 1
The embodiment of the present invention 1 provides a kind of quantum chip stereo packaging system, as shown in Figs. 1-5, including 6 He of guide post
The datum plate 1 of placement above the average under being in the guide post 6, support adjustment plate 2 and alignment sheets 5 can be successively threaded through；
The support adjustment plate 2 is towards being provided with the first groove 22, first groove among the surface of the alignment sheets 5
It is fixed with quantum chip 7 in 22, the quantum chip 7 is towards being provided with alignment patterns on the surface of the alignment sheets 5；
The alignment profiled orifice 52 to match with the alignment patterns is provided in the alignment sheets 5；
The guide post 6 at least two, each guide post 6 on the datum plate 1, in the support adjustment plate 2,
It is uniformly distributed in the alignment sheets 5；
The first corresponding with each 6 position of guide post, cross-sectional sizes are equal pilot hole is respectively equipped on the datum plate 1
11, the second pilot hole 21 corresponding with each 6 position of guide post is respectively equipped in the support adjustment plate 2, described second leads
It is bigger than the section of the guide post 6 to hole 21, section corresponding with each 6 position of guide post is respectively equipped in the alignment sheets 5
Equal-sized 5th pilot hole 51, the support adjustment plate 2 can relatively each guide post 6 move horizontally；
Fixation hole corresponding with position is provided in the support adjustment plate 2, the alignment sheets 5 on the datum plate 1
On be provided with hollow out corresponding with the fixation hole position, when the alignment patterns with it is described be aligned profiled orifice 52 be aligned when,
The datum plate 1 and the support adjustment plate 2 can be fixedly connected by bolt with the fixation hole.
Pass through quantum chip stereo packaging system, including guide post 6, datum plate 1, support adjustment plate 2 and alignment sheets 5, branch
The first groove 22 that fixed quantum chip 7 is equipped in adjustment plate 2 is supportted, by guide post 6 successively by datum plate 1, support adjustment plate 2
Worn with alignment sheets 5, by the mobile position for adjusting support adjustment plate 2, until alignment patterns on quantum chip 7 with it is right
It, then again will by bolt so as to realize the precise positioning of quantum chip 7 after alignment profiled orifice 52 on quasi- plate 5 is aligned
Support adjustment plate 2 is fixed on datum plate 1, should be in the process without applying pressing force to quantum chip 7, to realize quantum chip
7 safety is fixed.
Wherein, first pilot hole 11 can be set to square hole, and the guide post 6 is cuboid at this time, at least need
Setting one；First pilot hole 11 may be set to be circular hole, in order to avoid turning effect, first pilot hole at this time
11 and second pilot hole 21 and the 5th pilot hole 51 should all at least be arranged two, the quantity of the guide post 6 at this time
Should also be as it is identical as the quantity of first pilot hole 11, and be cylindrical structure, it is attached it is shown in fig. 1 be the first pilot hole be
Situation that is round and being a clock synchronization, wherein the guide post 6 is preferably positioning pin.
The specific encapsulation process of the present embodiment 1 is as follows:
Step 1: guide post 6, datum plate 1, support adjustment plate 2 and alignment sheets 5 are provided, by the datum plate 1, the support
Adjustment plate 2 and the alignment sheets 5 pass through first pilot hole 11, second pilot hole 21, the 5th pilot hole respectively
51 are successively threaded through in the guide post 6 and make under the datum plate 1, the support adjustment plate 2 and 5 three of the alignment sheets be in
Placement above the average；
Step 2: supporting the position of the relatively described guide post 6 of adjustment plate 2 to make the alignment patterns pair described in horizontal adjustment
Then the support adjustment plate 2 is fixed on the datum plate 1 by bolt and the fixation hole by the quasi- alignment profiled orifice
On.
Embodiment 2
As shown in Figs. 1-5, on the basis of embodiment 1, further, the depth of first groove 22 is greater than the amount
The thickness of sub- chip 7.
The depth of first groove 22 is greater than the thickness of the quantum chip 7, and the quantum chip 7 may make to be fixed on
After in first groove 22, the upper surface of the quantum chip 7 is located at the lower face of support adjustment plate 2, so that
The lower surface of the subsequent other component for being located at 2 top of support adjustment plate can not all touch the upper surface of quantum chip 7, thus
Quantum chip 7 is further protected not influenced even to damage by external force.
Embodiment 3
As shown in Figs. 1-5, on the basis of embodiment 2, further, first groove 22 is stepped ramp type groove；
The fixed quantum chip 7 in the bottom of the stepped ramp type groove；
The stepped ramp type groove is parallel on the step surface on 7 surface of quantum chip and is provided with bonding line.
It is connected by bonding, so that the quantum chip 7 and the support adjustment plate 2 realize good ground connection.
Embodiment 4
As Figure 1-10 shows, on the basis of embodiment 1, further, the quantum chip stereo packaging system also wraps
Include auxiliary packaging part 3, circuit board 4 and connector 10；
The auxiliary packaging part 3 is for fixing the circuit board 4 and assisting realizing that the circuit board 4 passes through the connector
10 are electrically connected with the quantum chip 7；
The third corresponding with each 6 position of guide post, cross-sectional sizes are equal is respectively equipped on the auxiliary packaging part 3 to lead
To hole 31；
The 4th pilot hole corresponding with each 6 position of guide post, cross-sectional sizes are equal is respectively equipped on the circuit board 4
41；
The auxiliary packaging part 3 can be threaded through in the guide post 6 by third pilot hole 31 and be located at the support and adjusted
Whole plate 2 deviates from the side of the datum plate 1；
The circuit board 4 can be threaded through in the guide post 6 by the 4th pilot hole 41 and be located at the auxiliary packaging part
41 away from the side of the support adjustment plate 2.
It may make the packaging system after encapsulation by the way that auxiliary packaging part 3, circuit board 4 and connector 10 is added, so that described
It is electrically connected between quantum chip 7 and the circuit board 4 by the connector 10, to form a complete Package boxes.
Embodiment 5
As Figure 1-10 shows, on the basis of embodiment 4, further, the corresponding amount on the auxiliary packaging part 3
There is first thickness, corresponding on the auxiliary packaging part 3 has at the position of the support adjustment plate 2 at the position of sub- chip 7
Second thickness, the first thickness are less than the second thickness；
The auxiliary packaging part 3 can be by being threaded through the bolt at the second thickness position and the datum plate 1, described
Support adjustment plate 2 is fixedly connected, and realizes auxiliary packaging part 3 and datum plate 1, the fixation for supporting adjustment plate 2.
Further, the second groove is provided among surface of the auxiliary packaging part 3 far from the support adjustable plate 2
33；
It is fixedly installed the circuit board 4 in second groove 33, circuit board 4 is arranged in the second groove 33, it can
So that circuit board 4 be located at one it is comparatively safe intracavitary, avoid damaging.
Embodiment 6
As shown in figs. 1-12, on the basis of embodiment 5, further, lid is also fixed in second groove 33
Plate 9；
The lid of cover board 9 is located on the circuit board 4, and the cover board 9 and 33 clearance fit of the second groove.
By the way that cover board 9 is arranged, the circuit board 4 can be isolated with external environment, circuit board here refers specifically to
Pcb board, if pcb board is exposed in ambient enviroment, when ambient signals environment is there are when noise signal, noise signal can pass through PCB
Plate is coupled in the transmission line on pcb board, to influence the realization of 7 performance of quantum chip, in the present invention quantum chip 7 and
All transmission lines of pcb board are respectively positioned on inside closed packaging system, avoid the influence of external environment, specifically, can lead to
Cross bolt cover board 9 is detachably fixed be connected to auxiliary packaging part 3 on.
Embodiment 7
As shown in figs. 1-12, on the basis of embodiment 4, further, the quantum is corresponded on the auxiliary packaging part 3
The first via hole 32 is provided at the position of chip 7；
First via hole 32 assembles the connector 10 for gap, to guarantee the safety of connector 10.
Further, the connector 10 includes spring needle 101 and needle guard 100；
The spring needle 101 is arranged in the needle guard 100, and 101 one end of the spring needle can be electrically connected the quantum
Chip 7, described 101 one end of spring needle can be electrically connected the circuit board 4.
Since the spring needle 101 of use is mounted in first via hole 32 as electric connection structure, connection is played
The effect of the quantum chip 7 and the circuit board 4, the spring needle 101 are smaller for the pressure for connecting contact point, can keep away
Exempt to cause stress damage to the contact site of the quantum chip 7 and the circuit board 4.
Specifically, the spring needle 101 can specifically use Pogo-Pin, optional double end elastic type or single-ended elastic type.
Embodiment 8
As shown in figures 1-13, further, the quantum chip stereo packaging system further includes connector 8；
The connector 8 is fixed on the auxiliary packaging part 6, and is electrically connected the circuit board 4.
Connector 8 is added, so that quantum chip packaging device has the function connecting with the external world.
Further, at least a pair of the is provided on the axial surface of the parallel guide post 6 of the auxiliary packaging part 3
One fixing groove 34；
For one first fixing groove 34 for fixing the connector 8, the effect of the first fixing groove 34 is can
Preferably to connect the connector 8.
Embodiment 9
A kind of quantum chip stereo packaging method utilizes quantum chip stereo packaging system described in any of the above embodiments, packet
Include following steps:
Guide post 6, datum plate 1, support adjustment plate 2 and alignment sheets 5 are provided, by the datum plate 1, the support adjustment plate
2 and the alignment sheets 5 respectively by first pilot hole 11, second pilot hole 21, the 5th pilot hole 51 successively
It is threaded through in the guide post 6 and the datum plate 1, the support adjustment plate 2 and 5 three of the alignment sheets is made to be in upper water in lower
Placing flat；
The position of the relatively described guide post 6 of adjustment plate 2 is supported to make described in the alignment patterns alignment described in horizontal adjustment
It is directed at profiled orifice, then the support adjustment plate 2 is fixed on the datum plate 1 by bolt and the fixation hole.
In this encapsulation process, the position of quantum chip 7 can be by the mobile position for adjusting support adjustment plate 2 come smart
Standard is mobile, until after the alignment patterns on quantum chip 7 are corresponding with the alignment profiled orifice 52 in alignment sheets 5, then adjustment will be supported
Plate 2 is fixed on datum plate 1 accurate positioning for realizing quantum chip 7 and safety is fixed.
Further, the position of the relatively described guide post 6 of adjustment plate 2 is supported to make the alignment described in the horizontal adjustment
Then the support adjustment plate 2 is fixed on the datum plate 1 by bolt and the fixation hole by profiled orifice described in pattern alignment
After upper, further includes:
The alignment sheets 5 are removed.
Further, after the removal by the alignment sheets 5, further includes:
Auxiliary packaging part 3 is provided, the auxiliary packaging part 3 is threaded through in the guide post 6 by third pilot hole 31,
So that the auxiliary packaging part 3 is located at the support adjustment plate 2 and obtain side away from datum plate 1, auxiliary packaging part 3 is consolidated by bolt
It is scheduled on datum plate 1.
Further, packaging part 3 is assisted in the offer, the auxiliary packaging part 3 is worn by third pilot hole 31
In the guide post 6, it is located at auxiliary encapsulation 3 after the support adjustment plate 2 obtains side away from datum plate 1, also wraps
It includes:
Connector 10 is provided, connector 10 is set in the first via hole 32, connector 10 is made to obtain the bottom amount of being connected electrically in
The surface of sub- chip 7；
Circuit board 4 is provided, is fixed on after the circuit board 4 is threaded through in guide post 6 by the 4th pilot hole 41 described
Connection assist 3 obtains bottom in the second groove 33, wherein the bottom surface of circuit board 4 is electrically connected with the upper end of the connector 10.
Further, the quantum chip stereo packaging method further include:
Connector 8 is provided, the connector 8 is fixed in the first fixing groove 34 of the auxiliary packaging part 3, and by institute
It states connector 8 and is electrically connected the circuit board 4.
Further, the quantum chip stereo packaging method further include:
Cover board 9 is provided, the cover board 9 lid is located in second groove 33, the cover board 9 and second groove 33
Top opening clearance fit.
Structure, feature and effect of the invention, the above institute are described in detail based on the embodiments shown in the drawings
Only presently preferred embodiments of the present invention is stated, but the present invention does not limit the scope of implementation as shown in the drawings, it is all according to structure of the invention
Think made change or equivalent example modified to equivalent change, when not going beyond the spirit of the description and the drawings,
It should all be within the scope of the present invention.
Claims (17)
1. a kind of quantum chip stereo packaging system, including guide post (6) and under being successively threaded through and being on the guide post (6)
Datum plate (1), support adjustment plate (2) and the alignment sheets (5) of placement above the average；
For support adjustment plate (2) towards the first groove (22) are provided among the surface of the alignment sheets (5), described first is recessed
It is fixed with quantum chip (7) in slot (22), the quantum chip (7) is towards being provided with alignment on the surface of the alignment sheets (5)
Figure；
The alignment profiled orifice (52) to match with the alignment patterns is provided on the alignment sheets (5)；
It is characterized by:
The guide post (6) at least two, each guide post (6) is on the datum plate (1), the support adjustment plate
(2) on, the alignment sheets are uniformly distributed on (5)；
The first corresponding with each guide post (6) position, cross-sectional sizes are equal pilot hole is respectively equipped on the datum plate (1)
(11), the second pilot hole (21) corresponding with each guide post (6) position, institute are respectively equipped on the support adjustment plate (2)
It is bigger than the section of the guide post (6) to state the second pilot hole (21), is respectively equipped on the alignment sheets (5) and each guide post
(6) the 5th pilot hole (51) that position is corresponding, cross-sectional sizes are equal, the support adjustment plate (2) can relatively each guide posts
(6) it moves horizontally；
Fixation hole corresponding with position is provided on the support adjustment plate (2), the alignment sheets on the datum plate (1)
(5) hollow out corresponding with the fixation hole position is provided on, when the alignment patterns with described to be directed at profiled orifice (52) right
On time, the datum plate (1) and the support adjustment plate (2) can be fixedly connected by bolt with the fixation hole.
2. quantum chip stereo packaging system according to claim 1, which is characterized in that the depth of first groove (22)
Degree is greater than the thickness of the quantum chip (7).
3. quantum chip stereo packaging system according to claim 2, which is characterized in that first groove (22) is platform
Rank type groove；
The fixed quantum chip (7) in the bottom of the stepped ramp type groove；
The stepped ramp type groove is parallel on the step surface on quantum chip (7) surface and is provided with bonding line.
4. quantum chip stereo packaging system according to claim 1, which is characterized in that the quantum chip stereo encapsulation
Device further includes auxiliary packaging part (3), circuit board (4) and connector (10)；
The auxiliary packaging part (3) is for fixing the circuit board (4) and assisting realizing that the circuit board (4) passes through the connection
Part (10) is electrically connected with the quantum chip (7)；
The third corresponding with each guide post (6) position, cross-sectional sizes are equal is respectively equipped on auxiliary packaging part (3) to lead
To hole (31)；
The 4th pilot hole corresponding with each guide post (6) position, cross-sectional sizes are equal is respectively equipped on the circuit board (4)
(41)；
The auxiliary packaging part (3) can be threaded through on the guide post (6) by third pilot hole (31) and be located at the support
Adjustment plate (2) deviates from the side of the datum plate (1)；
The circuit board (4) can be threaded through on the guide post (6) by the 4th pilot hole (41) and be located at the auxiliary and encapsulated
Part (41) is away from the side of support adjustment plate (2).
5. quantum chip stereo packaging system according to claim 4, which is characterized in that on the auxiliary packaging part (3)
There is first thickness at the position of the corresponding quantum chip (7), the support adjustment is corresponded on the auxiliary packaging part (3)
There is second thickness, the first thickness is less than the second thickness at the position of plate (2)；
Auxiliary packaging part (3) can be by being threaded through the bolt at the second thickness position and the datum plate (1), described
Support adjustment plate (2) is fixedly connected.
6. quantum chip stereo packaging system according to claim 5, which is characterized in that the auxiliary packaging part (3) is remote
The second groove (33) are provided among surface from support adjustable plate (2)；
The circuit board (4) are fixedly installed in second groove (33).
7. quantum chip stereo packaging system according to claim 1, which is characterized in that in second groove (33) also
It is fixed with cover board (9)；
Cover board (9) lid is located above the circuit board (4), and the cover board (9) is matched with the second groove (33) gap
It closes.
8. quantum chip stereo packaging system according to claim 1, which is characterized in that on the auxiliary packaging part (3)
The first via hole (32) are provided at the position of the corresponding quantum chip (7)；
First via hole (32) assembles the connector (10) for gap.
9. quantum chip stereo packaging system according to claim 8, which is characterized in that the connector (10) includes bullet
Spring needle (101) and needle guard (100)；
Spring needle (101) setting is in the needle guard (100), and the spring needle (101) one end can be electrically connected the amount
Sub- chip (7), described spring needle (101) one end can be electrically connected the circuit board (4).
10. quantum chip stereo packaging system according to claim 4, which is characterized in that the quantum chip stereo envelope
Assembling device further includes connector (8)；
The connector (8) is fixed on the auxiliary packaging part (3), and is electrically connected the circuit board (4).
11. quantum chip stereo packaging system according to claim 10, which is characterized in that the auxiliary packaging part (3)
At least a pair of first fixing groove (34) is provided on the axial surface of the parallel guide post (6)；
One first fixing groove (34) is for fixing the connector (8).
12. a kind of quantum chip stereo packaging method is encapsulated using the quantum chip stereo as described in claim 1-11 is any
Device, which comprises the following steps:
Guide post (6), datum plate (1), support adjustment plate (2) and alignment sheets (5) are provided, by the datum plate (1), the support
Adjustment plate (2) and the alignment sheets (5) pass through first pilot hole (11), second pilot hole (21), described the respectively
Five pilot holes (51) are successively threaded through on the guide post (6) so that the datum plate (1), the support adjustment plate (2) and institute
State placement above the average under alignment sheets (5) three is in；
The position of adjustment plate (2) relatively described guide post (6) is supported to make described in the alignment patterns alignment described in horizontal adjustment
It is directed at profiled orifice, then the support adjustment plate (2) is fixed on the datum plate (1) by bolt and the fixation hole.
13. quantum chip stereo packaging method according to claim 12, which is characterized in that propped up described in the horizontal adjustment
The position of support adjustment plate (2) relatively described guide post (6) makes the alignment patterns be directed at the profiled orifice, then passes through bolt
After the support adjustment plate (2) is fixed on the datum plate (1) with the fixation hole, further includes:
The alignment sheets (5) are removed.
14. quantum chip stereo packaging method according to claim 13, which is characterized in that described by the alignment sheets
(5) after removing, further includes:
Auxiliary packaging part (3) is provided, the auxiliary packaging part (3) is threaded through the guide post by third pilot hole (31)
(6) on, so that the auxiliary packaging part (3) is located at the support adjustment plate (2) and obtain side away from datum plate (1), auxiliary is encapsulated
Part (3) is bolted on datum plate (1).
15. quantum chip stereo packaging method according to claim 14, which is characterized in that assist encapsulating in the offer
The auxiliary packaging part (3) is threaded through on the guide post (6) by third pilot hole (31), seals the auxiliary by part (3)
Dress (3) be located at the support adjustment plate (2) deviate from datum plate (1) obtain side after, further includes:
It provides connector (10), connector (10) is set in the first via hole (32), connector (10) is made to obtain bottom electrical connection
On the surface of quantum chip (7)；
It provides circuit board (4), is fixed on after the circuit board (4) are threaded through on guide post (6) by the 4th pilot hole (41)
The connection assist (3) obtains the second groove (33) interior bottom, wherein the bottom surface of circuit board (4) and the connector (10)
Upper end electrical connection.
16. quantum chip stereo packaging method according to claim 15, which is characterized in that the quantum chip stereo envelope
Dress method further include:
It provides connector (8), the connector (8) is fixed in the first fixing groove (34) of auxiliary packaging part (3), and
The connector (8) are electrically connected the circuit board (4).
17. quantum chip stereo packaging method according to claim 16, which is characterized in that the quantum chip stereo envelope
Dress method further include:
It provides cover board (9), the cover board (9) lid is located in second groove (33), the cover board (9) and described second recessed
The top opening clearance fit of slot (33).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811552470.3A CN109509717B (en) | 2018-12-19 | 2018-12-19 | Quantum chip three-dimensional packaging device and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811552470.3A CN109509717B (en) | 2018-12-19 | 2018-12-19 | Quantum chip three-dimensional packaging device and packaging method |
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| CN109509717B CN109509717B (en) | 2024-06-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110492274A (en) * | 2019-07-23 | 2019-11-22 | 中国科学技术大学 | Signal connection structure and its assembly method, Package boxes based on shape protection |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735678A (en) * | 2018-07-27 | 2018-11-02 | 合肥本源量子计算科技有限责任公司 | A kind of quantum bare chip stereo encapsulation structure and its packaging method |
| CN108767404A (en) * | 2018-07-02 | 2018-11-06 | 合肥本源量子计算科技有限责任公司 | A kind of cryrogenic coupler and its application method |
| CN209199886U (en) * | 2018-12-19 | 2019-08-02 | 合肥本源量子计算科技有限责任公司 | A kind of quantum chip stereo packaging system |
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2018
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108767404A (en) * | 2018-07-02 | 2018-11-06 | 合肥本源量子计算科技有限责任公司 | A kind of cryrogenic coupler and its application method |
| CN108735678A (en) * | 2018-07-27 | 2018-11-02 | 合肥本源量子计算科技有限责任公司 | A kind of quantum bare chip stereo encapsulation structure and its packaging method |
| CN209199886U (en) * | 2018-12-19 | 2019-08-02 | 合肥本源量子计算科技有限责任公司 | A kind of quantum chip stereo packaging system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110492274A (en) * | 2019-07-23 | 2019-11-22 | 中国科学技术大学 | Signal connection structure and its assembly method, Package boxes based on shape protection |
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| CN109509717B (en) | 2024-06-14 |
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Address after: 230008 6th floor, building E2, phase II, pioneering Industrial Park, Hefei hi tech Zone, Hefei City, Anhui Province Applicant after: Benyuan Quantum Computing Technology (Hefei) Co.,Ltd. Address before: 230008 6th floor, building E2, phase II, pioneering Industrial Park, Hefei hi tech Zone, Hefei City, Anhui Province Applicant before: ORIGIN QUANTUM COMPUTING COMPANY, LIMITED, HEFEI |
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