CN209086895U - A kind of 24 Node distribution formula high-density memory systems - Google Patents
A kind of 24 Node distribution formula high-density memory systems Download PDFInfo
- Publication number
- CN209086895U CN209086895U CN201821836730.5U CN201821836730U CN209086895U CN 209086895 U CN209086895 U CN 209086895U CN 201821836730 U CN201821836730 U CN 201821836730U CN 209086895 U CN209086895 U CN 209086895U
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- CN
- China
- Prior art keywords
- node
- mould group
- cabinet
- fan mould
- distribution formula
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1492—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having electrical distribution arrangements, e.g. power supply or data communications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
- H05K7/1445—Back panel mother boards with double-sided connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a kind of 24 Node distribution formula high-density memory systems, including fan mould group and cabinet, the fan mould group is mounted in the middle part of cabinet, back board system is also equipped on the inside of the cabinet of the fan mould group bottom, node is installed in the cabinet of fan mould group two sides, the node is connected on back board system, the node bottom is equipped with power supply interchange mode group, the node two sides are equipped with power panel, and the node, fan mould group and power supply exchange Mo Zu are electrically connected with back board system respectively.The 24 Node distribution formula high-density memory system makees controller using low-power-consumption embedded monolithic system hard disk, mechanism is at using two-way to inserting structure, good maintainability and ideal node density can be provided, data safety and use cost problem in Mass storage are preferably resolved.
Description
Technical field
The utility model relates to a kind of 24 Node distribution formula high-density memory systems.
Background technique
Present Mass storage technology is broadly divided into both direction:
1. the centralised storage based on disk array and sas extension cabinet (raid+sas expander) technology is in this side
To storage in large-scale storage system formed by the disk extension cabinet that controller (head) combines different number, store
Medium can be mechanical hard disk (sas or sata), ssd solid state hard disk.
2. the distributed storage based on traditional server framework generallys use common clothes in the memory technology in this direction
Business device adds a small amount of sata hard disk or ssd hard disk to realize every server control hard disk negligible amounts (12 or so) of.Pass through distribution
Algorithm provides storage system redundancy.
The shortcomings that above-mentioned two direction memory technology, is as follows:
1. is being used in the centralised storage based on disk array and sas extension cabinet (raid+sas expander) technology
Controller redundancy feature (sas hard disk is supported two controllers while being accessed), controller combination mode can be used when sas hard disk
1+1, the relatively low system complicated composition of redundancy, data, which synchronize, between controller needs special-purpose software to solve, and software and hardware cost of implementation is high
For high when using the ssd hard disk of sata hard disk and sata interface, hardware cost is lower, does not support redundancy, and single node failure is prominent
Once controller failure will cause data on entire controller and go offline out, the very high whole system bandwidth of of application risk is limited to
Sas controller (raid card or hba card) bandwidth, it is lower to play all hard disk performance Single Cabinet storage densitys completely, one
Too many hard disk is arranged in order to increase density in a cabinet in a little schemes, system radiating is excessively poor, hard disk service life is influenced,
System deployment is difficult, on-line maintenance of having no way, and is difficult to replace after hard disk corruptions.
2. because of every section for distributed memory system in distributed storage this scheme based on traditional server framework
The contained hard disk of point is too many, and the every node hard disk of performance that number of nodes can not play distributed memory system completely very little is single too much
Still very serious causes use cost higher to point failure because traditional server power consumption is higher simultaneously.
Utility model content
The purpose of the utility model is to overcome above-mentioned the deficiencies in the prior art, provide a kind of 24 Node distribution formula high density
Storage system makees controller using low-power-consumption embedded monolithic system hard disk, and mechanism is two-way to inserting structure at using, and can provide
Good maintainability and ideal node density, preferably resolve data safety and use cost problem in Mass storage.
The utility model is realized in this way a kind of 24 Node distribution formula high-density memory systems, including fan mould group and
Cabinet, the fan mould group are mounted in the middle part of cabinet, are also equipped with back board system, wind on the inside of the cabinet of the fan mould group bottom
It fans in the cabinet of mould group two sides and node is installed, the node is removably mounted on back board system, the node bottom installation
Have a power supply interchange mode group, the node two sides are equipped with power panel, the node, fan mould group and power supply exchange Mo Zu respectively with
Back board system is electrically connected.
Preferably, the node is equipped with 24 and rectangular array is distributed.
Preferably, the fan mould group includes that 2 rows 5 arrange totally 10 independent fan units.
Preferably, the back board system is made of 3 pieces of different pcb boards.
Preferably, the power supply interchange mode group be 2 groups of independent CRPS power supplys, 2 exchange template groups at.
A kind of 24 Node distribution formula high-density memory system provided by the utility model, innovation use low-power consumption embedding
Enter formula monolithic system hard disk and make controller, mechanism is to inserting structure, can providing good maintainability and ideal using two-way
Node density preferably resolves data safety and use cost problem in Mass storage, and 24 node modules are in cabinet
Two rows are lined up in front-end and back-end, and a node module is parallel to each other, and the distance between any two node is equal, and result in formation of neat
Array.Each node module shell is using semi-enclosed shell and housing bottom surface opens certain heat release hole, in this way can be
Form certain gap between two adjacent node modules, maximizing reduces when node module is set as closely spaced array state
System wind resistance, the heat dissipation of more conducively each node module and other component.
Detailed description of the invention
It, below will be to attached drawing needed in the embodiment in order to illustrate more clearly of the technical solution of the utility model
It is briefly described, it should be apparent that, the drawings in the following description are merely some embodiments of the present invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is a kind of external structure of 24 Node distribution formula high-density memory system provided by the embodiment of the utility model
Figure.
Fig. 2 is a kind of internal structure of 24 Node distribution formula high-density memory system provided by the embodiment of the utility model
Figure.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe.
As shown in Figs. 1-2, a kind of high-density storage system, including node 1, fan mould group 2, cabinet 3, power supply interchange mode
Group 4, back board system 5, power panel 6.Node 1, fan mould group 2, power supply interchange mode group 4, back board system 5, power panel 6 are mounted on machine
Inside case 3.Cabinet 3 is 19 " cabinets of 2.5U height.Back board system 5 is mounted on the middle part of cabinet 3, by 3 pieces of different pcb boards
Composition, is provided with the connector interface for connecting different mould groups.
Node 1 is the memory module arranged with array manner.High-density memory system can accommodate 24 node modules.24
A node module lines up two rows in 3 Inner Front End of cabinet and rear end, and a node module is parallel to each other, the distance between any two node
Equal, result in formation of neat arrays.Each node module shell is opened centainly using semi-enclosed shell and housing bottom surface
Heat release hole, certain gap can be formed between two adjacent node modules in this way, maximization reduces node module and sets
It is set to system wind resistance when closely spaced array state, the heat dissipation of more conducively each node module and other component.Every node module is set
Independent locking device is set, can be inserted on back board system 5 or back board system 5 and be extracted by horizontal direction.Meanwhile for the ease of inserting
Jointing point module is provided with guide rail in cabinet 3.
Fan mould group 2 is provided between front two rows node module.Fan mould group 2 includes that 2 rows 5 arrange totally 10 independent wind
Unit is fanned, is equipped with a fan in each fan unit, fan mould group 2 can be to front and rear row node module wind-cooling heat dissipating.Fan
Mould group 2 is Redundancy Design, and the stability of storage system operation is still ensured that after any fan failure.Each fan unit helps
Pulling device tool-free from vertical direction can be installed on back board system 5 or remove from back board system 5.
Power supply interchange mode group 4 is set at left and right sides of 3 rear portion of cabinet.Power supply interchange mode group 4 is 2 groups of independent CRPS power supplys
The set of 2 exchange templates, power supply are run by 1+1 mode, and the power supply of system is still ensured that after single power failure.Every group
It is both provided with aid-pulling device on independent current source, tool-free can plug.Power board outer end is provided with the interface with PERCOM peripheral communication.Electricity
Source plate 6 is rectangle, is connected to the side of power panel 6, power supply by 2 groups of connectors close to 4,2 groups of independent current sources of power supply mould group
The other side of plate 6 is symmetrical arranged 2 groups of connectors and connect with back board system 5.Built-in Switching Module realizes network between cabinet interior nodes
Interconnection, and upper connecting port is provided, while the terminal that two modules are provided to cabinet interior nodes connects, Switching Module reality can be passed through
Now to the long-range management of node, Switching Module realization monitors and controls two power supply mould groups and cabinet internal fan, realizes electricity
The maximization of source efficiency and radiating efficiency, two modules are redundant configuration, and individual module failure does not influence complete machine operation, this power supply
The setting of interchange mode group helps plug and self-locking device to realize tool-free maintenance.
Have certain gap between fan mould group 2 and front and rear row node, front and back backboard each fan air inlet and go out
Air port avoids completely, and the front and back of a standard is formed between such fan mould group, back board system and front and rear row node memory module
Air duct.The air duct has certain volume, is very beneficial for the heat dissipation of node hard disk and master chip.
From the above, it can be seen that node 1, fan mould group 2, power supply interchange mode group 4, all direct or indirect and backboard
System 5 connects, and each component is connect using slot or high speed connector with back board system 5, is designed using no cableization, in cabinet 3
Portion is integrally relatively more succinct, and windage is small, good heat dissipation effect.Meanwhile this connection type is capable of providing more efficiently data transmission speed
Degree, to improve the storage performance of node memory module.Node 1, fan mould group 2, power supply interchange mode group 4, which are both provided with to help, pulls out dress
It sets, realizes that different components are mutually indepedent and tool-free maintenance.
A kind of 24 Node distribution formula high-density memory system provided by the utility model, innovation use low-power consumption embedding
Enter formula monolithic system hard disk and make controller, mechanism is to inserting structure, can providing good maintainability and ideal using two-way
Node density preferably resolves data safety and use cost problem in Mass storage, and 24 node modules are in cabinet
Two rows are lined up in front-end and back-end, and a node module is parallel to each other, and the distance between any two node is equal, and result in formation of neat
Array.Each node module shell is using semi-enclosed shell and housing bottom surface opens certain heat release hole, in this way can be
Form certain gap between two adjacent node modules, maximizing reduces when node module is set as closely spaced array state
System wind resistance, the heat dissipation of more conducively each node module and other component.
It is preferred embodiments of the present invention above, it is noted that for those skilled in the art
For, without departing from the principle of this utility model, several improvements and modifications can also be made, these improvements and modifications
It is considered as the protection scope of the utility model.
Claims (5)
1. a kind of 24 Node distribution formula high-density memory systems, including fan mould group and cabinet, which is characterized in that the fan mould
Group is mounted in the middle part of cabinet, is also equipped with back board system, the machine of fan mould group two sides on the inside of the cabinet of the fan mould group bottom
Node is installed in case, the node is removably mounted on back board system, and the node bottom is equipped with power supply interchange mode group,
The node two sides are equipped with power panel, and the node, fan mould group and power supply exchange Mo Zu electrically connect with back board system respectively
It connects.
2. a kind of 24 Node distribution formula high-density memory system according to claim 1, which is characterized in that the node is set
There are 24 and rectangular array is distributed.
3. a kind of 24 Node distribution formula high-density memory system according to claim 1, which is characterized in that the fan mould
Group includes 2 rows 5 column totally 10 independent fan units.
4. a kind of 24 Node distribution formula high-density memory system according to claim 1, which is characterized in that the back plate series
System is made of 3 pieces of different pcb boards.
5. a kind of 24 Node distribution formula high-density memory system according to claim 1, which is characterized in that the power supply is handed over
Mold changing group be 2 groups of independent CRPS power supplys, 2 exchange template groups at.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821836730.5U CN209086895U (en) | 2018-11-08 | 2018-11-08 | A kind of 24 Node distribution formula high-density memory systems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821836730.5U CN209086895U (en) | 2018-11-08 | 2018-11-08 | A kind of 24 Node distribution formula high-density memory systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209086895U true CN209086895U (en) | 2019-07-09 |
Family
ID=67123105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821836730.5U Expired - Fee Related CN209086895U (en) | 2018-11-08 | 2018-11-08 | A kind of 24 Node distribution formula high-density memory systems |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209086895U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769639A (en) * | 2019-10-31 | 2020-02-07 | 苏州浪潮智能科技有限公司 | Cold storage device |
| CN112181102A (en) * | 2020-10-28 | 2021-01-05 | 英业达科技有限公司 | Expansion assembly of server hard disk |
| WO2021143534A1 (en) * | 2020-01-16 | 2021-07-22 | 华为技术有限公司 | Case and storage device |
-
2018
- 2018-11-08 CN CN201821836730.5U patent/CN209086895U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769639A (en) * | 2019-10-31 | 2020-02-07 | 苏州浪潮智能科技有限公司 | Cold storage device |
| CN110769639B (en) * | 2019-10-31 | 2020-10-02 | 苏州浪潮智能科技有限公司 | Cold storage device |
| WO2021143534A1 (en) * | 2020-01-16 | 2021-07-22 | 华为技术有限公司 | Case and storage device |
| JP2023511100A (en) * | 2020-01-16 | 2023-03-16 | 華為技術有限公司 | Housing and storage device |
| EP4075236A4 (en) * | 2020-01-16 | 2023-06-07 | Huawei Technologies Co., Ltd. | Case and storage device |
| JP7431983B2 (en) | 2020-01-16 | 2024-02-15 | 華為技術有限公司 | Housing and storage device |
| CN112181102A (en) * | 2020-10-28 | 2021-01-05 | 英业达科技有限公司 | Expansion assembly of server hard disk |
| CN112181102B (en) * | 2020-10-28 | 2022-03-29 | 英业达科技有限公司 | Expansion assembly of server hard disk |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190709 Termination date: 20191108 |