CN205015813U - Little server of 3U high density - Google Patents

Little server of 3U high density Download PDF

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Publication number
CN205015813U
CN205015813U CN201520664889.3U CN201520664889U CN205015813U CN 205015813 U CN205015813 U CN 205015813U CN 201520664889 U CN201520664889 U CN 201520664889U CN 205015813 U CN205015813 U CN 205015813U
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China
Prior art keywords
power module
server
radiator fan
module
high density
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Active
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CN201520664889.3U
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Chinese (zh)
Inventor
赵勇
黄涛
刘胜明
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Shenzhen Tong Yi Yi Information Technology Co., Ltd.
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Shenzhen Guo Xinheng Space Science And Technology Ltd
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Priority to CN201520664889.3U priority Critical patent/CN205015813U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The utility model provides a little server of 3U high density, 12 server nodes, power module, quick -witted case backplate, power module keysets and radiator fan module are drawn together to the machine case and bag, the server node with machine case backplate is connected, power module with the power module keysets is connected, power module keysets, radiator fan module with machine case backplate is connected, the server node is erect in quick -witted incasement portion, power module, power module keysets are located 12 the centre of individual server node, machine case backplate is located the server node with between the radiator fan module, the radiator fan module is located the afterbody of machine case. The technical scheme of the utility model realize 12 nodes at 3U machine incasement, and all node serve wares, radiator fan module and power module can both the hot plugs, improve warpout case space utilization and power module conversion efficiency, have higher price / performance ratio.

Description

A kind of 3U high density microserver
Technical field
The utility model relates to computer server field, particularly relates to a kind of 3U high density microserver.
Background technology
The rack 3U altitude server system of existing market is all generally place a slice server master board at cabinet inside, inserts CPU, internal memory, and hard disk is again after installing operating system, forms a system server with certain application function and is placed in frame and uses.From the angle of server cluster system, this 3U server, in numerous server system, it is a node (Node).This 3U altitude server, has certain advantage in the early stage of development of server, and such as space is large, and good heat dissipation, can insert more hard disk.But more focusing on the present stage of energy-conserving and environment-protective and machine room space availability ratio and later stage thereof, there is following defect in this 3U system server: chassis space utilization factor is low; Power supply conversion efficiency stack loss is large, and energy-saving effect is poor.
Utility model content
For above technical matters, the utility model provides a kind of 3U high density microserver, the utility model is from this kind of brand-new Barebone server design thinking, inner in existing rack 3U altitude server, insert 12 server master boards, form 12 server nodes, and these server master boards share same group of power module, this design substantially increases space availability ratio and power module conversion efficiency; And these 12 server nodes support hot plug.
To this, the technical scheme that the utility model adopts is:
A kind of 3U high density microserver, comprise cabinet, described cabinet comprises 12 server nodes, power module, case back plate, power module card extender and radiator fan module, described server node is connected with described case back plate, described power module is connected with described power module card extender, and described power module card extender, radiator fan module are connected with described case back plate; Described server node is erected in cabinet inside, described power module, power module card extender are positioned at the centre of described server node, described case back plate is between described server node and described radiator fan module, and described radiator fan module is positioned at the afterbody of described cabinet.
Adopt this technical scheme, described power module is at cabinet inside, the centre of described server node, be used for powering to all node servers and radiator fan module, described power module limits due to length, can not directly contact with backboard, adopt and be connected with backboard by Power conversion board, like this, power module first all signal transmission on Power conversion board, then Power conversion board and backboard carry out interconnected, the basis that AC powers is given to all node servers power, then dispelled the heat to cabinet inside Servers-all node by radiator fan module, the signal of power module is all delivered on case back plate simultaneously, thus communicates with node server, employing server node, radiator fan module are connected with described case back plate, realize the hot plug of server node and radiator fan module, are convenient to safeguard, meanwhile, power module is connected with backboard by Power conversion board, also achieves the hot plug of power module, is convenient to safeguard.
As further improvement of the utility model, each server node comprises server master board, memory disc and Signals Transfer Board, and described server master board is connected with memory disc, Signals Transfer Board respectively, and described Signals Transfer Board is connected with described case back plate.Adopt this technical scheme, after node server internal components is all assembled, directly insert inside cabinet, by carrying out power taking with backboard, and and the equipment such as power supply communicated by backboard, convenient and simple, be conducive to raising density.
As further improvement of the utility model, the length of described server master board is 118 ~ 122mm, and wide is 335 ~ 340mm.Adopt this technical scheme, achieve the high-density city of 3U cabinet.
Preferred further, the length of described server master board is 119.84mm, and wide is 337.18mm.
As further improvement of the utility model, described memory disc comprises the hard disk of 2 3.5 inches or the hard disk of 4 2.5 inches.
As further improvement of the utility model, described power module is two, and described two power modules are arranged above and below, and are positioned at the middle part of described cabinet.Namely the mode of two power module employing stacked on top, is positioned at the middle part of described cabinet, and the space which reducing surface level is taken up an area.
As further improvement of the utility model, the quantity of described radiator fan module is at least two.
As further improvement of the utility model, described radiator fan module is connected with case back plate by golden finger.Adopt this technical scheme, realize carrying out hot plug to radiator fan module, maintain easily.
As further improvement of the utility model, each fan module includes two fans and a Fan Transit Unit, and described two fans are connected with Fan Transit Unit respectively, and described Fan Transit Unit is connected with backboard.
As further improvement of the utility model, described power module inside is provided with power supply heat sinking fan.Adopt this technical scheme, take full advantage of air channel isolation, better realize heat radiation.
Compared with prior art, the beneficial effects of the utility model are:
The first, adopt the technical solution of the utility model, achieve the high-density city of 3U cabinet, realize 12 node servers.
The second, adopt 12 server nodes to be connected with same group of power module respectively, substantially increase space availability ratio and power module conversion efficiency, power supply conversion efficiency stack loss is little, good energy-conserving effect.
3rd, adopt the technical solution of the utility model, be connected with case back plate by radiator fan module, server node, achieve the hot plug of server node and radiator fan module, be convenient to safeguard; Meanwhile, power module is connected with backboard by Power conversion board, also achieves the hot plug of power module, is convenient to safeguard; Traditional server relatively, has greatly improved, reduces cost in workability, maintainability.
Accompanying drawing explanation
Fig. 1 is the mounting structure schematic diagram of a kind of embodiment of the utility model.
Fig. 2 is the structural representation of a kind of embodiment of the utility model.
Embodiment
Below in conjunction with accompanying drawing, preferably embodiment of the present utility model is described in further detail.
Embodiment 1
A kind of 3U high density microserver, comprise cabinet 1, described cabinet comprises 12 server nodes 2, power module 3, case back plate 4, power module card extender 5 and radiator fan module 6, described server node 2 is connected with described case back plate 4, described power module 3 is connected with described power module card extender 5, described power module card extender 5 is connected with described case back plate 4, and described radiator fan module 6 is connected with described case back plate 4; It is inner that described server node 2 is erected in cabinet 1, and described power module 3, power module card extender 5 are positioned at the centre of described 12 server nodes 2, and respectively there are five server nodes 2 on its left side and the right; Described case back plate 4 is between described server node 2 and described radiator fan module 6, and described radiator fan module 6 is positioned at the afterbody of described cabinet 1.Described server node 2 is drawer-type structure, arranges the inside with described cabinet 1.
Each server node comprises server master board 21, memory disc 22 and Signals Transfer Board 23, and described server master board 21 is connected with memory disc 22, Signals Transfer Board 23 respectively, and described Signals Transfer Board 23 is connected with described case back plate 4.The length of described server master board is 118 ~ 122mm, and wide is 335 ~ 340mm; Described memory disc 22 comprises the hard disk of 2 3.5 inches or the hard disk of 4 2.5 inches.
Described power module 3 is two, and two power modules are arranged above and below, and are positioned at the middle part of described cabinet.The quantity of described radiator fan module 6 is at least two.Described radiator fan module 6 is connected with case back plate 4 by golden finger.Each fan module 6 includes two fans and a Fan Transit Unit, and described two fans are connected with Fan Transit Unit respectively, and described Fan Transit Unit is connected with case back plate 4.Described power module 3 inside is provided with power supply heat sinking fan.Described cabinet is provided with power extending line 7 and supply socket, and it is anterior that described cabinet is located in described supply socket; One end of described power extending line 7 is connected with supply socket, and the other end of described power extending line 7 is connected with described power module 3, and described power module 3 is the configuration of 1+1 redundant power module at cabinet inside.
The embodiment of the above is better embodiment of the present utility model; not limit concrete practical range of the present utility model with this; scope of the present utility model comprises and is not limited to this embodiment, and the equivalence change that all shapes according to the utility model, structure are done is all in protection domain of the present utility model.

Claims (9)

1. a 3U high density microserver, comprise cabinet, it is characterized in that: described cabinet comprises 12 server nodes, power module, case back plate, power module card extender and radiator fan module, described server node is connected with described case back plate, described power module is connected with described power module card extender, and described power module card extender, radiator fan module are connected with described case back plate; Described server node is erected in cabinet inside, described power module, power module card extender are positioned at the centre of described 12 server nodes, described case back plate is between described server node and described radiator fan module, and described radiator fan module is positioned at the afterbody of described cabinet.
2. 3U high density microserver according to claim 1, it is characterized in that: each server node comprises server master board, memory disc and Signals Transfer Board, described server master board is connected with memory disc, Signals Transfer Board respectively, and described Signals Transfer Board is connected with described case back plate.
3. 3U high density microserver according to claim 2, is characterized in that: the length of described server master board is 118 ~ 122mm, and wide is 335 ~ 340mm.
4. 3U high density microserver according to claim 2, is characterized in that: described memory disc comprises the hard disk of 2 3.5 inches or the hard disk of 4 2.5 inches.
5. the 3U high density microserver according to claim 1 ~ 4 any one, is characterized in that: described power module is two, and described two power modules are arranged above and below, and are positioned at the middle part of described cabinet.
6. 3U high density microserver according to claim 5, is characterized in that: the quantity of described radiator fan module is at least two.
7. 3U high density microserver according to claim 6, is characterized in that: described radiator fan module is connected with described case back plate by golden finger.
8. 3U high density microserver according to claim 7, is characterized in that: each fan module includes two fans and a Fan Transit Unit, and described two fans are connected with Fan Transit Unit respectively, and described Fan Transit Unit is connected with backboard.
9. 3U high density microserver according to claim 8, is characterized in that: described power module inside is provided with power supply heat sinking fan.
CN201520664889.3U 2015-08-28 2015-08-28 Little server of 3U high density Active CN205015813U (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105824375A (en) * 2016-04-05 2016-08-03 浪潮电子信息产业股份有限公司 Server
CN107479656A (en) * 2017-08-18 2017-12-15 郑州云海信息技术有限公司 A kind of high density server based on fusion extension framework
CN108009120A (en) * 2017-12-25 2018-05-08 上海海得控制系统股份有限公司 Cabinet-type cloud computing all-in-one machine
CN108874102A (en) * 2018-07-26 2018-11-23 郑州云海信息技术有限公司 A kind of smart rack node server radiator
CN112394780A (en) * 2020-11-19 2021-02-23 北京比特大陆科技有限公司 Server and data center with same
CN113238629A (en) * 2021-05-17 2021-08-10 英业达科技有限公司 Server

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105824375A (en) * 2016-04-05 2016-08-03 浪潮电子信息产业股份有限公司 Server
CN107479656A (en) * 2017-08-18 2017-12-15 郑州云海信息技术有限公司 A kind of high density server based on fusion extension framework
CN108009120A (en) * 2017-12-25 2018-05-08 上海海得控制系统股份有限公司 Cabinet-type cloud computing all-in-one machine
CN108874102A (en) * 2018-07-26 2018-11-23 郑州云海信息技术有限公司 A kind of smart rack node server radiator
CN112394780A (en) * 2020-11-19 2021-02-23 北京比特大陆科技有限公司 Server and data center with same
CN113238629A (en) * 2021-05-17 2021-08-10 英业达科技有限公司 Server

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Effective date of registration: 20170505

Address after: 518000 Guangdong city of Shenzhen province Nanshan District Guangdong streets Park seven Shenzhen Digital Technology Park B1 building 3 floor C District

Patentee after: Shenzhen Tong Yi Yi Information Technology Co., Ltd.

Address before: 518000 Guangdong province Shenzhen city Nanshan District high tech park, seven Shenzhen City Digital Technology Park B1 building 3 floor C District

Patentee before: Shenzhen Guo Xinheng space Science and Technology Ltd.