CN209017320U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
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- CN209017320U CN209017320U CN201822092345.0U CN201822092345U CN209017320U CN 209017320 U CN209017320 U CN 209017320U CN 201822092345 U CN201822092345 U CN 201822092345U CN 209017320 U CN209017320 U CN 209017320U
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- ground plane
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- wiring board
- chip
- ground area
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- 239000003990 capacitor Substances 0.000 claims description 30
- 238000003466 welding Methods 0.000 claims description 10
- 230000008676 import Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of MEMS microphone, wherein, MEMS microphone includes interior wiring board, shielding case, chip, the first ground area and the second ground area for being embedded with signals layer, and shielding case covers at wiring board, and shielding case and the wiring board are enclosed accommodating space；Chip；First ground area and the second ground area are set on the wiring board, and different location of first ground area with second ground area in the wiring board is mutually isolated, and the first ground area connects shielding case, and the second ground area connects chip.By making, the first ground area connects shielding case to the utility model MEMS microphone, the second ground area connects chip, and the first ground area and the different location of the second ground area assist side are mutually isolated, then shielding case has individual ground area, when shielding case receives outside electromagnetic interference, electromagnetism can import rapidly complete machine mainly, avoid being crosstalked into signal ground.
Description
Technical field
The utility model relates to speech processing device technical field, in particular to a kind of MEMS microphone.
Background technique
MEMS (Micro Electro Mechanical System, Micro Electro Mechanical System) microphone and traditional technology
Microphone compare due to the size with Bao Er little, the excellent characteristics such as high reliability, high temperature resistant and be widely used.Currently,
Metallic shield in MEMS microphone be usually and being signally connected of microphone together with, externally only one, thus
It when receiving outside electromagnetic interference on metallic shield, is easy to be crosstalked into signal ground, so that whole anti-electromagnetic-radiation ability is poor.
Therefore, it is necessary to be improved to the structure of existing MEMS microphone.
Utility model content
The main purpose of the utility model is to propose a kind of new solution of MEMS microphone.
To achieve the above object, the utility model proposes MEMS microphone, comprising:
Wiring board is embedded with signals layer in the wiring board；
Shielding case, covers at the wiring board, and the shielding case and the wiring board are enclosed accommodating space；
Chip is set in the accommodating space；And
First ground area and the second ground area, be set to the wiring board on, first ground area with it is described
Second ground area is mutually isolated in the different location of the wiring board, and first ground area connects the shielding case,
Second ground area connects the chip.
Optionally, first ground area includes the first main ground plane and the patch to connect with the shielding case ground connection
Layer, for the patch ground plane between the signals layer and the chip, second ground area includes the second main ground connection
Layer and the ground pad being electrically connected with the chip；
The wiring board has the first side far from the chip, the first main ground plane and the described second main ground plane
It is set to the first side of the wiring board, the first main ground plane and the second main ground plane same layer and mutually isolated.
Optionally, the first side of the wiring board is equipped with welding ground plane, and the welding ground plane is equipped with fault trough with shape
At the described first main ground plane and the second main ground plane.
Optionally, the chip includes the MEMS chip and asic chip of electrical connection；The asic chip has for ground connection
The tie point of pad connection, the tie point are located remotely from the side of the fault trough.
Optionally, the wiring board further includes buried capacitor ground plane, the patch ground plane, the signals layer, the buried capacitor
Ground plane and the first main ground plane are set gradually, and mutually isolated by dielectric layer between adjacent two layers.
Optionally, it is electrically connected between the patch ground plane and the described first main ground plane by the first conductive hole, it is described
Signals layer and the buried capacitor ground plane offer the first signal avoid holes and second around first conductive hole respectively
Signal avoid holes.
Optionally, it is electrically connected between the ground pad and the described second main ground plane by the second conductive hole, the letter
Number floor and the buried capacitor ground plane offer third signal avoid holes and the 4th letter respectively around first conductive hole
Number avoid holes.
Optionally, it is electrically connected between the buried capacitor ground plane and the described second main ground plane by third conductive hole.
Optionally, the wiring board has second side close to the chip, and the patch ground plane and the ground connection are welded
Disk is set to described second side, the patch ground plane and the ground pad same layer and mutually isolated.
Optionally, the signals layer is buried capacitor layer, buries resistance layer or buried capacitor buries resistance layer.
By making, the first ground area connects shielding case to the utility model MEMS microphone, the second ground area connects core
Piece, and the first ground area and the different location of the second ground area assist side are mutually isolated so that shielding case with
Chip to other places with being divided into signal ground and shell, then shielding case have individual ground area, thus when complete machine application when
Shielding case is directly connected to the main ground of complete machine, and when shielding case receives outside electromagnetic interference, electromagnetism can import rapidly complete machine
Mainly, avoid being crosstalked into signal ground, improve the anti-electromagnetic-radiation ability of complete machine.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model MEMS microphone；
Fig. 2 is the structural schematic diagram of another embodiment of the utility model MEMS microphone.
Drawing reference numeral explanation:
| Label | Title | Label | Title | Label | Title |
| 1 | Wiring board | 15 | First conductive hole | 42 | Asic chip |
| 11 | Signals layer | 16 | Second conductive hole | 421 | Tie point |
| 111 | First signal avoid holes | 17 | Third conductive hole | 5 | First ground area |
| 112 | Third signal avoid holes | 18 | Dielectric layer | 51 | First main ground plane |
| 12 | Buried capacitor ground plane | 19 | Weld ground plane | 52 | Patch ground plane |
| 121 | Second signal avoid holes | 2 | Shielding case | 6 | Second ground area |
| 122 | Fourth signal avoid holes | 3 | Accommodating space | 61 | Second main ground plane |
| 13 | First side | 4 | Chip | 62 | Ground pad |
| 14 | Second side | 41 | MEMS chip |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that if related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction is only used for explaining opposite between each component under a certain particular pose (as shown in the picture)
Positional relationship, motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, if relating to the description of " first ", " second " etc. in the utility model embodiment, " first ", " the
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.In addition, the meaning of the "and/or" occurred in full text is, and including three schemes arranged side by side, by taking " A and/or B " as an example,
The scheme met simultaneously including A scheme or B scheme or A and B.In addition, the technical solution between each embodiment can be mutual
In conjunction with, but must be based on can be realized by those of ordinary skill in the art, when mutual lance occurs in the combination of technical solution
Shield or cannot achieve when, will be understood that the combination of this technical solution is not present, also not in the protection scope of the requires of the utility model
Within.
The utility model proposes a kind of MEMS microphones.
In the utility model embodiment, as shown in Figure 1, the MEMS microphone, comprising:
Wiring board 1 is embedded with signals layer 11 in wiring board 1；
Shielding case 2, covers at wiring board 1, and shielding case 2 and wiring board 1 are enclosed accommodating space 3；
Chip 4 is set in accommodating space 3；And
First ground area 5 and the second ground area 6 are set on wiring board 1, the first ground area 5 and the second ground connection
The different location of 6 assist side 1 of region is mutually isolated, and the first ground area 5 connects shielding case 2, the connection of the second ground area 6
Chip 4.
In the present embodiment, inbuilt signals layer 11 is passive device signals layer 11 in assist side 1, which can
To be buried capacitor layer, bury resistance layer or buried capacitor buries resistance layer, make the performance of wiring board 1 more excellent by the interior signals layer 11 that buries, such as can
With integrality, the noise effect for reducing power plane, the area for reducing wiring board 1 etc. for improving power supply.It is understood that screen
Covering cover 2 is metallic shield 2, can be by being welded to connect in assist side 1.Chip 4 generally comprises MEMS chip 4 and ASIC core
Piece 4, by that can be respectively set in assist side 1, be also possible to be stacked in assist side 1 in attachment assist side 1,
Specifically, the second ground area 6 is electrically connected with asic chip 4, and is bound between MEMS chip 4 and asic chip 4 by gold thread
Form electrical connection.Multiple acoustic aperture are offered on shielding case 2 or wiring board 1, external sound is passed to by acoustic aperture to MEMS chip 4
Film on, MEMS chip 4 can be realized the conversion from acoustical signal to electric signal, and asic chip 4 is for detecting MEMS capacitor quantitative change
Change, and be converted into electric signal, is then passed to back-end processing device.
By making, the first ground area 5 connects shielding case 2 to the utility model MEMS microphone, the second ground area 6 connects
Chip 4 is connect, and the different location of 6 assist side 1 of the first ground area 5 and the second ground area is mutually isolated, so that
Shielding case 2 separates other places with chip 4, so that shielding case 2 has individual ground area, to shield when complete machine application
Cover 2 is directly connected to the main ground of complete machine, and when shielding case 2 receives outside electromagnetic interference, electromagnetism can import rapidly complete machine
Mainly, it avoids being crosstalked into signal ground, improves the anti-electromagnetic-radiation ability of complete machine.
Further, the first ground area 5 includes the first main ground plane 51 and the patch ground plane to connect with shielding case 2
52, for patch ground plane 52 between signals layer 11 and chip 4, the second ground area 6 includes the second main ground plane 61 and and core
The ground pad 62 that piece 4 is electrically connected；
Wiring board 1 has the first side 13 far from chip 4, and the first main ground plane 51 and the second main ground plane 61 are set to line
First side 13 of road plate 1, the first main ground plane 51 and the second main 61 same layer of ground plane and mutually isolated.
In the present embodiment, defining side of the wiring board 1 far from chip 4 is the first side 13, is the close to the side of chip 4
Two sides.Patch ground plane 52 then can be avoided the crosstalk for occurring signal therebetween between signals layer 11 and chip 4.
It is understood that being conducted between the first main ground plane 51 and patch ground plane 52, the second main ground plane 61 and ground pad
It is conducted between 62.It is mutually isolated between patch ground plane 52 and ground pad 62, isolation can be realized by way of aperture,
The dielectric that insulation can also be arranged around ground pad 62 is isolated.First main ground plane 51 is connected directly between complete machine
Main ground, in this way, electromagnetic signal is by shielding case 2 through patch ground plane when metallic shield 2 receives outside electromagnetic interference
52, then the first main ground plane 51 is importing directly into the main ground of complete machine, then can be avoided electromagnetic crosstalk to the second main ground plane
61 and ground pad 62, and then improve the anti-electromagnetic-radiation ability of entire MEMS microphone.
Further, patch ground plane 52 and ground pad 62 are set to second side, patch ground plane 52 and ground pad
62 same layers and mutually isolated.In this way, patch ground plane 52 and 62 same layer of ground pad and mutually isolated, can be avoided between signal
Crosstalk.
Further, the first side 13 of wiring board 1 is equipped with welding ground plane 19, and welding ground plane is equipped with fault trough to be formed
First main ground plane 51 and the second main ground plane 61.
In the present embodiment, by the way that welding ground plane 19 is arranged on the first side 13, by being arranged on welding ground plane 9
Fault trough forms the first main ground plane 51 and the second main ground plane 61, then the first main ground plane 51 and the second main ground plane 61 are by same
Welding layer is formed, so that the welding procedure of wiring board 1 is simpler.
Further, chip 4 includes the MEMS chip 4 and asic chip 4 of electrical connection；Asic chip 4 has to be welded for ground connection
The tie point 421 that disk 62 connects, tie point 421 are located remotely from the side of fault trough.
In the present embodiment, the electric connection mode of asic chip 4 and ground pad 62 can there are many.Asic chip 4 can be with
It is electrically connected by gold thread with ground pad 62, wiring pin can be equipped on asic chip 4 at this time；Asic chip 4 can also lead to
The mode for crossing upside-down mounting is connected electrically on ground pad 62, such as asic chip 4 can be by planting tin ball bonding in ground pad 62
On.By making the tie point 421 of asic chip 4 and ground pad 62 far from the side of fault trough, so that the ground connection of shielding case 2 is remote
From tie point 421, then extraneous electromagnetic interference signal is remote apart from the tie point 421 of chip 4 and ground pad 62, so that entirely
The anti-electromagnetic effects of MEMS microphone are more preferable.
Further, wiring board 1 further includes buried capacitor ground plane 12, patch ground plane 52, signals layer 11, buried capacitor ground plane 12
And first main ground plane 51 set gradually, in this way, formed a complete circuit board.Pass through dielectric layer 18 between adjacent two layers
It is mutually isolated.The resistivity of dielectric layer 18 is higher, it is not easy to and it is conductive, so that electric between two layers adjacent on wiring board 1
Isolation.Each layer of specific thickness and size do not do specific restriction herein in the present embodiment, can be according to MEMS microphone
Specific design parameter is adjusted.
Further, it is electrically connected between buried capacitor ground plane 12 and the second main ground plane 61 by third conductive hole 17.Third
Conductive hole 17 conducts buried capacitor ground plane 12 and the second main ground plane 61, to realize the ground connection of buried capacitor ground plane 12.
Further, it is electrically connected between patch ground plane 52 and the first main ground plane 51 by the first conductive hole 15, signal
Layer 11 and buried capacitor ground plane 12 offer the first signal avoid holes 111 and second signal around the first conductive hole 15 respectively
Avoid holes 121.
In the present embodiment, it is to be understood that the first conductive hole 15 is punched by metal in assist side 1 and formed, energy
It is enough to be conducted between first main ground plane 51 and patch ground plane 52, to realize the ground connection of patch ground plane 52.Due to first
Conductive hole 15 needs the first signal avoid holes 111 and second signal across signals layer 11 and buried capacitor ground plane 12, opened up to avoid
Hole 121 can prevent the first conductive hole 15 to be electrically connected the first main ground plane 51 between signals layer 11 and buried capacitor signals layer 11.
In this way, conducting patch ground plane 52 only with the first main ground plane 51, then extraneous electromagnetic signal passes through patch ground plane
It is directly grounded after 52, interference will not be generated to signals layer 11 and chip 4.In order to enable preventing jamproof effect more preferable, such as Fig. 2
It is shown, it is preferable that the dielectric of insulation is set around the first signal avoid holes 111 and second signal avoid holes 121.
Further, it is electrically connected between ground pad 62 and the second main ground plane 61 by the second conductive hole 16, signals layer
11 and buried capacitor ground plane 12 offers third signal avoid holes 112 respectively around the first conductive hole 15 and fourth signal is kept away
Allow hole 122.
In the present embodiment, it is to be understood that the second conductive hole 16 is punched by metal in assist side 1 and formed, energy
It is enough to be conducted between second main ground plane 61 and ground pad 62, to be grounded the ground connection of pad 62.Due to the second conduction
The third signal avoid holes 112 and fourth signal avoid holes 122 that hole 16 needs to open up across signals layer 11 and buried capacitor ground plane 12
The second conductive hole 16 can be prevented to be electrically connected the second main ground plane 61 between signals layer 11 and buried capacitor signals layer 11.In this way,
So that ground pad 62 is only conducted with the second main ground plane 61, will not be electrically connected with signals layer 11 and buried capacitor ground plane 12, with
It avoids generating interference between unlike signal.In order to enable preventing the effect of signal cross-talk more preferable, as shown in Figure 2, it is preferable that third
The dielectric of insulation is set around signal avoid holes 112 and fourth signal avoid holes 122.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of MEMS microphone characterized by comprising
Wiring board is embedded with signals layer in the wiring board；
Shielding case, covers at the wiring board, and the shielding case and the wiring board are enclosed accommodating space；
Chip is set in the accommodating space；And
First ground area and the second ground area are set on the wiring board, first ground area and described second
Ground area is mutually isolated in the different location of the wiring board, and first ground area connects the shielding case, described
Second ground area connects the chip.
2. MEMS microphone as described in claim 1, which is characterized in that
First ground area includes the first main ground plane and the patch ground plane that connects with the shielding case, and the patch connects
Stratum between the signals layer and the chip, second ground area include the second main ground plane and with the chip
The ground pad of electrical connection；
The wiring board has the first side far from the chip, and the first main ground plane is all provided with the described second main ground plane
In the first side of the wiring board, the first main ground plane and the second main ground plane same layer and mutually isolated.
3. MEMS microphone as claimed in claim 2, which is characterized in that the first side of the wiring board is equipped with welding ground connection
Layer, the welding ground plane are equipped with fault trough to form the described first main ground plane and the second main ground plane.
4. MEMS microphone as claimed in claim 3, which is characterized in that the chip include electrical connection MEMS chip and
Asic chip；The asic chip has the tie point connected for ground pad, and the tie point is located remotely from the fault trough
Side.
5. MEMS microphone as claimed in claim 2, which is characterized in that the wiring board further includes buried capacitor ground plane, described
Patch ground plane, the signals layer, the buried capacitor ground plane and the first main ground plane are set gradually, and between adjacent two layers
It is mutually isolated by dielectric layer.
6. MEMS microphone as claimed in claim 5, which is characterized in that the patch ground plane and the described first main ground plane
Between be electrically connected by the first conductive hole, the signals layer and the buried capacitor ground plane are around first conductive hole point
The first signal avoid holes and second signal avoid holes are not offered.
7. MEMS microphone as claimed in claim 6, which is characterized in that the ground pad and the described second main ground plane it
Between be electrically connected by the second conductive hole, the signals layer and the buried capacitor ground plane around first conductive hole respectively
Offer third signal avoid holes and fourth signal avoid holes.
8. MEMS microphone as claimed in claim 5, which is characterized in that the buried capacitor ground plane and the described second main ground plane
Between be electrically connected by third conductive hole.
9. MEMS microphone as claimed in claim 2, which is characterized in that the wiring board has second close to the chip
Side, the patch ground plane and the ground pad are set to described second side, the patch ground plane and the ground pad
Same layer and mutually isolated.
10. MEMS microphone as described in claim 1, which is characterized in that the signals layer is buried capacitor layer, buries resistance layer or buried capacitor
Bury resistance layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822092345.0U CN209017320U (en) | 2018-12-13 | 2018-12-13 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822092345.0U CN209017320U (en) | 2018-12-13 | 2018-12-13 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209017320U true CN209017320U (en) | 2019-06-21 |
Family
ID=66843826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822092345.0U Active CN209017320U (en) | 2018-12-13 | 2018-12-13 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209017320U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111422818A (en) * | 2020-03-30 | 2020-07-17 | 歌尔微电子有限公司 | Sensor packaging structure and packaging method |
| CN114222215A (en) * | 2021-12-01 | 2022-03-22 | 北京百度网讯科技有限公司 | Anti-static microphone |
-
2018
- 2018-12-13 CN CN201822092345.0U patent/CN209017320U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111422818A (en) * | 2020-03-30 | 2020-07-17 | 歌尔微电子有限公司 | Sensor packaging structure and packaging method |
| CN111422818B (en) * | 2020-03-30 | 2024-01-23 | 歌尔微电子股份有限公司 | Sensor packaging structure and packaging method |
| CN114222215A (en) * | 2021-12-01 | 2022-03-22 | 北京百度网讯科技有限公司 | Anti-static microphone |
| CN114222215B (en) * | 2021-12-01 | 2023-03-10 | 北京百度网讯科技有限公司 | Anti-static microphone |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |