CN209012825U

CN209012825U - A kind of LED lamp panel

Info

Publication number: CN209012825U
Application number: CN201821865824.5U
Authority: CN
Inventors: 张从峰; 杨宏
Original assignee: Nanjing Bode New Energy Technology Co Ltd
Current assignee: Nanjing Bode New Energy Technology Co Ltd
Priority date: 2018-11-13
Filing date: 2018-11-13
Publication date: 2019-06-21
Anticipated expiration: 2028-11-13

Abstract

A kind of LED lamp panel, including lamp bead and aluminum substrate have circuit layer, insulating layer and metal-based layer on aluminum substrate, have lamp bead pad on circuit layer, lamp bead is welded on the circuit layer of aluminum substrate, which is characterized in that on the circuit layer, lamp bead pad is connected with netted functional areas.Netted functional areas on circuit layer are interwoven by warp and weft；The preferred line width of warp is between 0.2 millimeter and 2 millimeters, and the preferred line width of weft is between 0.2 millimeter and 2 millimeters, and the preferred distance between warp is between 0.2 millimeter and 2 millimeters, and the preferred distance between weft is between 0.2 millimeter and 2 millimeters.Preferably, the netted functional areas are evenly distributed on the circuit layer.

Description

A kind of LED lamp panel

Technical field

This application involves field of LED illumination, more specifically to a kind of LED lamp panel.

Background technique

Currently, LED light source is widely applied.With the continuous improvement of LED lamp power, in order to reinforce radiating, function Rate generallys use aluminum substrate as circuit board in 100 watts or more of LED lamp, and aluminum substrate is a kind of with good heat radiating function Metal-based copper-clad plate, general single sided board are made of three-decker, are circuit layer (copper foil), insulating layer and metal-based layer respectively； The metal-based layer of aluminum substrate is close together with radiator, and the heat that LED lamp bead generates passes through the circuit layer of aluminum substrate, insulation Layer, metal-based layer reach radiator, and are transmitted in air.

In order to reinforce radiating, the insulating layer of aluminum substrate can be done as far as possible in the case where guaranteeing dielectric strength it is thin, meanwhile, circuit The layout area of layer is big as far as possible, and the heat of lamp bead is spread apart by the copper foil of circuit layer to reach better heat dissipation Effect；In this way, being formed the capacitor of usually several nF magnitudes between the circuit layer and metal-based layer of aluminum substrate.Aluminum substrate Metal-based layer is connected with radiator, and radiator can be connected to the earth, so, it is usually between the circuit layer and the earth of aluminum substrate The capacitor of several nF magnitudes.

With further increasing for LED lamp power, need to select greater area of aluminum substrate, the circuit layer of aluminum substrate with The capacitance of capacitor between the earth can also correspondingly increase, after the capacitor reaches 15nF or more, with the exchange of 2500V to lamp plate into Row electric leakage current test, leakage current can reach 10 milliamperes, more than some indexs or the upper limit of requirement.

LED drive power, which is generally divided into isolated power supply, (has high frequency transformer between input AC electricity and output DC voltage Carry out electrical isolation) and non-isolated power supply, it is driven when the lamp plate that leakage current is more than 10 milliamperes with non-isolated LED drive power When, the leakage current of this system will be more than 10 milliamperes, and there are security risks.

Utility model content

In view of this, the application provides a kind of LED lamp panel, for solving the leakage of high power LED lamp panel in the prior art Electric current problem bigger than normal.

To achieve the goals above, it is proposed that scheme it is as follows:

A kind of LED lamp panel, including lamp bead and aluminum substrate have circuit layer, insulating layer and metal-based layer, circuit layer on aluminum substrate On have lamp bead pad, lamp bead is welded on the circuit layer of aluminum substrate, which is characterized in that on the circuit layer, lamp bead pad and net Shape functional areas are connected.The netted functional areas on circuit layer are interwoven by warp and weft；The preferred line width of warp between Between 0.2 millimeter and 2 millimeters, between 0.2 millimeter and 2 millimeters, the preferred distance between warp is situated between the preferred line width of weft Between 0.2 millimeter and 2 millimeters, the preferred distance between weft is between 0.2 millimeter and 2 millimeters.Preferably, described netted Functional areas are evenly distributed on the circuit layer.

The heat that lamp bead generates has fraction to be directly delivered to the air around lamp bead, is largely transferred to lamp bead pad, In heat on lamp bead pad a part is transmitted to the insulating layer of aluminum substrate, and another part is then transmitted to be connected with lamp bead pad Netted functional areas, the heat of netted functional areas are transmitted to exhausted below the air above netted functional areas or netted functional areas again Edge layer.

Meanwhile this reticular structure of netted functional areas, the layout area of aluminum substrate circuit layer can be reduced, to reduce Capacitor between the circuit layer and the earth of aluminum substrate.

As it can be seen that can solve the leakage current of high power LED lamp panel in the prior art in technical solution disclosed in the present application Problem bigger than normal.

Detailed description of the invention

Fig. 1 show the schematic diagram for the structure arrangement that three kinds different on the circuit layer of aluminum substrate.

Fig. 2 show the temperature for the structure arrangement that three kinds different on the circuit layer of aluminum substrate in Fig. 1 that simulation software obtains Distribution map.

Specific embodiment

The embodiments of the present invention are described in detail below in conjunction with attached drawing.

In circuit layer shown in the 101 of Fig. 1,6 lamp beads, are D1, D2, D3, D4, D5, D6, are located in dashed box altogether (dashed box is not the wiring of circuit layer just to identify the position of lamp bead), D1, D2, D3 are in parallel, and D4, D5, D6 are in parallel, so Two groups of lamp beads in parallel are connected again afterwards, and lamp bead bonding pad area is only slightly larger than the pin area of surface mount lamp bead, lamp bead The bonding pad area of cathode is bigger, and positive bonding pad area is smaller, and lamp bead pad is electrically connected by lead.

In circuit layer shown in the 102 of Fig. 1, there are 6 lamp beads altogether in position identical with 101, after the parallel connection of 6 lamp beads Concatenated connection type is also identical as 101；Unlike 101, lamp bead pad is connected with netted functional areas, the institute on circuit layer It states netted functional areas to be interwoven by warp and weft, 0.2 millimeter of the line width of warp, 0.2 millimeter of the line width of weft, between warp 0.8 millimeter of distance, 0.8 millimeter of the distance between weft.

In circuit layer shown in the 103 of Fig. 1, there are 6 lamp beads altogether in position identical with 101, after the parallel connection of 6 lamp beads Concatenated connection type is also identical as 101；Unlike 101, there is large area to apply copper around lamp bead pad.

In Fig. 1, it is assumed that the layout area of circuit layer shown in 103 is 1, then corresponding, the wiring of circuit layer shown in 101 Area is about 0.08, and the layout area of circuit layer shown in 102 is about 0.5；Assuming that circuit layer and aluminum substrate shown in 103 Metal-based layer between capacitor be 1, then corresponding, the capacitor between the metal-based layer of circuit layer and aluminum substrate shown in 101 About 0.08, the capacitor between the metal-based layer of circuit layer and aluminum substrate shown in 102 is about 0.5.

Fig. 2 show the temperature for the structure arrangement that three kinds different on the circuit layer of aluminum substrate in Fig. 1 that simulation software obtains Distribution map, lamp bead using common 9V/0.1A on the market lamp bead, 0.9 watt of input power, it is assumed that aluminium base plate temperature keep At 20 degrees Celsius of environment temperature.Wherein, 201 correspond to structure arrangement 101 in Fig. 1, and the maximum temperature of lamp bead is about 26.9 degree；Its In, 202 correspond to structure arrangement 102 in Fig. 1, and the maximum temperature of lamp bead is about 23.6 degree；Wherein, 203 correspond to structure in Fig. 1 Arrangement 103, the maximum temperature of lamp bead is about 23.1 degree.

It is done experiment with actual lamp plate, test result and simulation result are close.

As it can be seen that the 102 of Fig. 1 compare 103, capacitor is reduced to about original half, and lamp bead temperature rise only improves about 0.5 degree；101 compare 103, although capacitor very little, lamp bead temperature rise improves 3.8 degree, this will significantly reduce lamp bead Service life should not use.

In addition, lamp bead pad is connected with netted functional areas, netted functional areas are evenly distributed on the circuit layer, are conducive to electricity The even heat of road floor is distributed, and in the case where the thermal expansion coefficient of circuit layer and insulating layer is inconsistent, reduces circuit layer The deformation of copper foil, and strengthen the bonding strength of circuit layer and insulating layer.

It, can be with as it can be seen that reduce the capacitor between the circuit layer of aluminum substrate and the earth in technical solution disclosed in the present application Solve the problems, such as that the leakage current of high power LED lamp panel in the prior art is bigger than normal.

Above disclosed is only the preferred embodiments of the application, cannot limit the right model of the application with this certainly It encloses, therefore according to equivalent variations made by the claim of this application, still falls within the range that the application is covered.

Claims

1. a kind of LED lamp panel, including lamp bead and aluminum substrate, there are circuit layer, insulating layer and metal-based layer on aluminum substrate, on circuit layer Have lamp bead pad, lamp bead is welded on the circuit layer of aluminum substrate, which is characterized in that on the circuit layer, lamp bead pad with it is netted Functional areas are connected.

2. a kind of LED lamp panel according to claim 1, which is characterized in that the netted functional areas on circuit layer are by passing through Line is interwoven with weft；The preferred line width of warp is between 0.2 millimeter and 2 millimeters, and the preferred line width of weft is between 0.2 milli Between rice and 2 millimeters, the preferred distance between warp between 0.2 millimeter and 2 millimeters, preferred distance between weft between Between 0.2 millimeter and 2 millimeters.

3. a kind of LED lamp panel according to claim 1 or 2, which is characterized in that preferred, the netted functional areas are uniform It is distributed in the circuit layer.