CN208970435U - A kind of solid-state relay of sealing structure - Google Patents
A kind of solid-state relay of sealing structure Download PDFInfo
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- CN208970435U CN208970435U CN201821628539.1U CN201821628539U CN208970435U CN 208970435 U CN208970435 U CN 208970435U CN 201821628539 U CN201821628539 U CN 201821628539U CN 208970435 U CN208970435 U CN 208970435U
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- pedestal
- solid
- sealing structure
- fool proof
- state relay
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Abstract
The utility model relates to a kind of solid-state relays of sealing structure, pedestal and leading foot use integrated injection molding scheme, sealing function can be played, pedestal design simultaneously has error-proof structure, it can only be assembled on a locality with shell when assembling pedestal, pcb board does not need to carry out fool-proof design again, can increase the usable floor area of pcb board.Pedestal is provided with gas vent, after encapsulating heat-conducting glue encapsulating, in baking process, is discharged through the exhausting-gas hole internal gas, and after baking, gas vent can be sealed by rivet hot, i.e. guarantee processing quality, and guarantees sealing effect.The heat of component can be thermally conductive by the progress of encapsulating heat-conducting glue, while playing the protective effect to component.The surface of pedestal can be carved with mould in the position of corresponding leading foot or the definition of pin position of laser marking leading foot identifies, client is facilitated to use.In addition, the solid-state relay of sealing structure described in the utility model, is equipped with pedestal and designs, appearance is better than the relay of the direct encapsulating of casting glue.
Description
Technical field
The utility model relates to a kind of solid-state relays, more specifically to a kind of solid-state relay of sealing structure.
Background technique
The relay of the prior art mostly uses greatly the direct encapsulating of casting glue, i.e. leading foot is welded on pcb board, by pcb board
It is assembled in shell, then carries out encapsulating, until casting glue is concordant with surface of shell；Existed using the relay of the structure as follows
Deficiency,
1, protection lacked to casting glue, casting glue directly it is exposed outside, if be chronically in rugged environment, be easy old
Change, influences the performance of relay；
2, it when necessary, needs that fool proof mouth is arranged in pcb board, occupies certain pcb board space, reduce can be used for pcb board
Area, and influence the layout designs of component；
3, leading foot is surrounded by casting glue entirely, can not form mark by modes such as Mo Ke or laser markings on casting glue
Know.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of and shell and form sealing structure, prevent
Only casting glue is exposed, and can utilize the solid-state relay of the sealing structure of the usable floor area of pcb board to greatest extent.
The technical solution of the utility model is as follows:
A kind of solid-state relay of sealing structure, including shell, pcb board, pedestal, leading foot, leading foot and pedestal are one
The integral structure of body injection molding, leading foot are threaded through on pedestal, and it is a certain amount of that pcb board is assembled to encapsulating after connecting with leading foot
In the shell of encapsulating heat-conducting glue；Gas vent is offered on pedestal, it is heated in the internal gas of baking process for encapsulating heat-conducting glue
Discharge, after baking, seal vents.
Preferably, the side wall of pedestal is provided with fool proof notch, the inner wall of shell corresponds to fool proof notch and is provided with fool proof muscle
Item.
Preferably, the side wall of pedestal correspond to fool proof notch on along the surface of position or pedestal correspond to fool proof notch
Position, offer mark notch.
Preferably, fool proof notch is not through pedestal.
Preferably, two face of pedestal or more than side wall be arranged fool proof notch, the fool proof breach quantity of each surface side wall
It is different.
Preferably, the inner wall of shell is provided with limit ribs, the height of limit ribs is lower than fool proof rib, limit ribs
It is less than the length of fool proof notch with fool proof rib difference in height.
Preferably, the surface of pedestal, which corresponds to leading foot setting, is defined mark, definition is identified as through Mo Ke or laser
The mark of mark formation concaveconvex structure.
Preferably, the frustum penetrated through centered on gas vent, the position that frustum is arranged forms sink deck, and frustum is set to
Sink deck.
Preferably, the apical side height of frustum is not higher than the surface of pedestal.
Preferably, gas vent is sealed by rivet hot.
The beneficial effects of the utility model are as follows:
The solid-state relay of sealing structure described in the utility model, pedestal and leading foot use integrated injection molding side
Case can play sealing function, while pedestal design has error-proof structure, can only be with shell a position side when assembling pedestal
Assembly, pcb board do not need to carry out fool-proof design again upwards, can increase the usable floor area of pcb board.Pedestal is provided with gas vent,
After encapsulating heat-conducting glue encapsulating, in baking process, it is discharged through the exhausting-gas hole internal gas, after baking, gas vent can lead to
It crosses rivet hot to be sealed, i.e. guarantee processing quality, and guarantees sealing effect.The heat of component can be carried out by encapsulating heat-conducting glue
It is thermally conductive, while playing the protective effect to component.The surface of pedestal can be carved with mould in the position of corresponding leading foot or laser is beaten
The definition of pin position mark for marking leading foot, facilitates client to use.
In addition, the solid-state relay of sealing structure described in the utility model, is equipped with pedestal and designs, appearance is better than filling
The relay of the direct encapsulating of sealing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the Structure explosion diagram of the utility model；
Fig. 3 is that pcb board, pedestal, leading foot assemble the structural schematic diagram that is integrated；
Fig. 4 is the partial section enlarged view for being vented hole site；
In figure: 10 be shell, and 11 be fool proof rib, and 12 be limit ribs, and 20 be pcb board, and 30 be pedestal, and 31 be exhaust
Hole, 32 be sink deck, and 33 be to define mark, and 34 be fool proof notch, and 35 be mark notch, and 40 be leading foot.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and embodiments.
Encapsulating heat-conducting glue of the existing technology is exposed, pcb board utilization rate is low, can not carry out in order to solve for the utility model
The deficiencies of definition mark production, a kind of solid-state relay of sealing structure is provided, increases setting pedestal, carried out with pedestal and shell
Sealing is realized in cooperation, prevents encapsulating heat-conducting glue exposed, and pedestal can be used for being arranged the definition mark of leading foot, be easy to use；
Error-proof structure can also be set on the base, improve the utilization rate of pcb board.
As shown in Figure 1, Figure 2, Figure 3 shows, the solid-state relay of sealing structure described in the utility model, including shell 10, PCB
Plate 20, pedestal 30, leading foot 40, leading foot 40 and pedestal 30 are integrated the integral structure of injection molding, and leading foot 40 is threaded through
On pedestal 30, i.e., the welding ends of leading foot 40 is located at 30 inside of pedestal, for connecting with pcb board 20, the other end of leading foot 40
It is set to 30 outside of pedestal.In the present embodiment, leading foot 40 uses the filling-in bit terminal of ISO requirement.Pcb board 20 and leading foot 40 connect
It is assembled to after connecing in the shell 10 of a certain amount of encapsulating heat-conducting glue of encapsulating, encapsulating heat-conducting glue becomes by baking-curing to be had excellent performance
Thermosetting polymer insulating materials.In order to during baking-curing encapsulating heat-conducting glue be smoothly discharged, internal gas,
Guarantee technological quality, in the utility model, gas vent 31 is offered on pedestal 30, for encapsulating heat-conducting glue in baking process
The heated discharge of internal gas, after baking, seal vents 31 obtain finished product.
In the present embodiment, pedestal 30 is fixed on shell 10 by encapsulating encapsulating heat-conducting glue, and shell 10 is made of metal material,
The thermal coefficient of encapsulating heat-conducting glue is greater than or equal to 1, and the heat generated on pcb board 20 is transmitted to metal by encapsulating heat-conducting glue
Shell 10 on, and then pass in external environment, can be improved the heat resistance of relay.
Since error-proof structure is arranged on pcb board 20, certain space will be occupied, that is, reduces the sky for arranging component
Between, increase design difficulty, the utility model is converted from pcb board 20 to pedestal on the basis of pedestal 30 are arranged, by error-proof structure
On 30, that is, the side wall of pedestal 30 is provided with fool proof notch 34, the inner wall of shell 10 corresponds to fool proof notch 34 and is provided with fool proof muscle
Item 11 realizes the fool proof installation of pedestal 30 by the cooperation of fool proof notch 34 and fool proof rib 11.Due to leading foot 40 and pedestal
30 are structure as a whole, and pcb board 20 is fixedly welded with leading foot 40, and in turn, the fool proof installation of pedestal 30 is the fool proof of pcb board 20
Installation is realized while guaranteeing to install convenience, increases the usable floor area of pcb board 20.
It, then can be in pedestal 30 in order to more easily recognize the position of fool proof notch 34, and then convenient for differentiating installation direction
Side wall correspond to fool proof notch on the position of fool proof notch is corresponded to along the surface of position or pedestal 30, offer mark notch
35, the quantity of mark notch 35 matches with position and fool proof notch 34.In turn, in assembling process, can more easily divide
The position for distinguishing fool proof notch 34 avoids overturning pedestal 30 that from capable of just finding fool proof notch 34 in which side.Also, pass through difference
The mark notch 35 of quantity can intuitively judge the assembly direction of pedestal 30.In the present embodiment, mark notch 35 is arranged the bottom of at
The top surface seamed edge of seat 30 can be considered that mark notch 35 through the side wall of pedestal 30 and the crossover position on surface, visually more holds
Easily discovery, and it is not take up the space on too many side and surface.
Preferably, in order to realize more preferably fool proof effect, 30 2 face of pedestal or more than side wall be arranged fool proof notch 34,
34 quantity of fool proof notch of each surface side wall is different.In the present embodiment, a fool proof is respectively set in opposite both sidewalls
34, two fool proof notches 34 of notch.
For the guarantee leakproofness of pedestal 30, prevents from forming gap between fool proof notch 34 and pedestal 30, cause ponding, powder
The sundries such as dirt enter and corrode encapsulating heat-conducting glue, and then influence leakproofness and complete appearance and beauty, and fool proof notch 34 does not pass through
Wear pedestal 30, and then lift-off seal.
Compared with prior art, the utility model is not due to using the direct encapsulating of encapsulating heat-conducting glue, thus, in order to realize bottom
Seat 30 is flushed with shell 10, and in the present embodiment, the inner wall of shell 10 is provided with limit ribs 12, by limit ribs 12 to pedestal
30 form contact limit, and the height of limit ribs 12 is lower than fool proof rib 11.The height of limit ribs 12 determines pcb board 20 in shell
Mounting height in body 10, when it is implemented, the height of limit ribs 12 and the thickness of pedestal 30 can be arranged according to demand is implemented
Degree controls mounting height of the pedestal 30 in shell 10, as the surface of pedestal 30 is flushed with shell 10.
Another effect of pedestal 30 is to facilitate setting foot bit identification, and the surface of pedestal 30, which corresponds to leading foot 40 and is provided with, determines
Justice mark 33.Wherein, definition mark 33 is to pass through the mark of Mo Ke or laser marking formation concaveconvex structure.
In the present embodiment, as shown in figure 4, the frustum penetrated through centered on gas vent 31, gas vent 31 is sealed by rivet hot；If
The position for setting frustum forms sink deck 32, and frustum is set to sink deck 32, and the apical side height of frustum is not higher than pedestal 30
Surface.The structure of the gas vent 31 is convenient for scalding riveting sealing, avoids because of 31 unsealing of gas vent, the accumulation of the external impurities such as steam
And corrode encapsulating heat-conducting glue, and then influence leakproofness.
Above-described embodiment is intended merely to illustrate the utility model, and is not used as the restriction to the utility model.As long as
According to the technical essence of the utility model, above-described embodiment is changed, modification etc. will all fall in the right of the utility model
In the range of it is required that.
Claims (10)
1. a kind of solid-state relay of sealing structure, which is characterized in that including shell, pcb board, pedestal, leading foot, leading foot with
Pedestal is integrated the integral structure of injection molding, and leading foot is threaded through on pedestal, and pcb board is assembled to encapsulating after connecting with leading foot
In the shell of a certain amount of encapsulating heat-conducting glue；Gas vent is offered on pedestal, for encapsulating heat-conducting glue in the inside of baking process
The heated discharge of gas, after baking, seal vents.
2. the solid-state relay of sealing structure according to claim 1, which is characterized in that the side wall of pedestal is provided with fool proof
Notch, the inner wall of shell correspond to fool proof notch and are provided with fool proof rib.
3. the solid-state relay of sealing structure according to claim 2, which is characterized in that the side wall of pedestal corresponds to fool proof and lacks
The position for corresponding to fool proof notch on mouth along the surface of position or pedestal, offers mark notch.
4. the solid-state relay of sealing structure according to claim 2, which is characterized in that fool proof notch is not through pedestal.
5. the solid-state relay of sealing structure according to claim 2, which is characterized in that two face of pedestal or more than side
Fool proof notch is arranged in wall, and the fool proof breach quantity of each surface side wall is different.
6. the solid-state relay of sealing structure according to claim 2, which is characterized in that the inner wall of shell is provided with limit
The height of rib, limit ribs is lower than fool proof rib.
7. the solid-state relay of sealing structure according to claim 1, which is characterized in that the surface of pedestal corresponds to leading foot
Setting is defined mark, and definition is identified as the mark that concaveconvex structure is formed by Mo Ke or laser marking.
8. the solid-state relay of sealing structure according to claim 1, which is characterized in that the cone penetrated through centered on gas vent
Platform, the position that frustum is arranged form sink deck, and frustum is set to sink deck.
9. the solid-state relay of sealing structure according to claim 8, which is characterized in that the apical side height of frustum is not higher than
The surface of pedestal.
10. the solid-state relay of sealing structure according to claim 8, which is characterized in that gas vent is sealed by rivet hot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821628539.1U CN208970435U (en) | 2018-10-08 | 2018-10-08 | A kind of solid-state relay of sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821628539.1U CN208970435U (en) | 2018-10-08 | 2018-10-08 | A kind of solid-state relay of sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208970435U true CN208970435U (en) | 2019-06-11 |
Family
ID=66759083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821628539.1U Active CN208970435U (en) | 2018-10-08 | 2018-10-08 | A kind of solid-state relay of sealing structure |
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| CN (1) | CN208970435U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555255A (en) * | 2021-03-18 | 2021-10-26 | 厦门宏发电声股份有限公司 | Canned type relay |
| CN113821097A (en) * | 2021-09-10 | 2021-12-21 | 厦门宏发电声股份有限公司 | Electromagnetic relay capable of being immersed in liquid cooling environment and relay device |
| EP4210083A3 (en) * | 2021-12-15 | 2023-09-13 | Xiamen Hongfa Electroacoustic Co., Ltd. | Relay with an injection molded body and packaging method of a relay |
-
2018
- 2018-10-08 CN CN201821628539.1U patent/CN208970435U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555255A (en) * | 2021-03-18 | 2021-10-26 | 厦门宏发电声股份有限公司 | Canned type relay |
| CN113555255B (en) * | 2021-03-18 | 2024-02-20 | 厦门宏发电声股份有限公司 | Sealed relay |
| CN113821097A (en) * | 2021-09-10 | 2021-12-21 | 厦门宏发电声股份有限公司 | Electromagnetic relay capable of being immersed in liquid cooling environment and relay device |
| EP4210083A3 (en) * | 2021-12-15 | 2023-09-13 | Xiamen Hongfa Electroacoustic Co., Ltd. | Relay with an injection molded body and packaging method of a relay |
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