CN113821097A - Electromagnetic relay capable of being immersed in liquid cooling environment and relay device - Google Patents

Abstract

The invention discloses an electromagnetic relay capable of being immersed in a liquid cooling environment and a relay device, wherein the electromagnetic relay comprises a shell part and a plurality of lead-out pins penetrating through the shell part; the sealing element is arranged on the shell part and at least surrounds the plurality of leading-out pins, or the number of the sealing elements is a plurality, and each sealing element respectively surrounds at least one leading-out pin; the sealing element protrudes out of one end of the shell part, which is provided with the leading-out pins, and the protruding end of the sealing element is used for being in sealing fit with the PCB connected with the leading-out pins, so that a sealing cavity containing the joint parts of the leading-out pins and the shell part is formed between the shell part and the PCB. When the invention is combined with the PCB and applied to a liquid environment, the liquid can be prevented from permeating into the electromagnetic relay from the combination part of the leading-out pin and the shell part, so that the invention is suitable for being immersed in the liquid cooling environment.

Description

Electromagnetic relay capable of being immersed in liquid cooling environment and relay device

Technical Field

The present invention relates to a relay, and more particularly, to an electromagnetic relay and a relay device that can be immersed in a liquid-cooled environment.

Background

The power supply is a power source of all electronic products, has various types and wide application, and puts higher requirements on the performance of the power supply and the equipment of the whole machine under the background of the new era of high efficiency, energy conservation, environmental protection and continuous innovation and transformation. The traditional power supply and the whole machine are in indoor or outdoor working environment, and in order to reduce the power consumption of the whole machine and improve the operation efficiency, the circuit is optimally designed at the beginning of design, low-power-consumption electronic devices are selected as far as possible, and a cooling fan and other modes are installed. For some equipment which is provided with a power supply and needs to operate for a long time, such as a data center server system, the operation noise, the heat productivity, the equipment failure rate and the like of the equipment are correspondingly increased, so that the energy efficiency level of the whole equipment is low, and the concept of high efficiency, energy conservation and environmental protection can not be met. For this purpose, liquid cooling is proposed.

By adopting liquid cooling, especially a flowing liquid cooling mode, the equipment loss can be reduced to a greater extent, the equipment operation efficiency is improved, and the concept of energy conservation and environmental protection is also met. The immersion liquid cooling mode helps to improve the heat dissipation design of the whole machine by directly immersing the whole machine in liquid (the liquid is insulating liquid and cannot cause short circuit of devices). The heat generated by electronic components inside the power supply is directly and efficiently transferred to the liquid, thereby reducing the need for active cooling of the main components such as heat-conducting interface materials, radiators and fans. These improvements increase energy efficiency while allowing higher packing densities to be employed. The realization of the power supply immersion type liquid cooling heat dissipation mode also provides powerful support for other complete equipment matched with the power supply, such as the improvement of the energy efficiency level of a data center server, the reduction of the failure rate, the reduction of the noise of a machine room and the reduction of the maintenance cost.

The power supply is directly immersed in the liquid, and for components in the power supply, including devices such as an electromagnetic relay, a resistor, an inductor, a power semiconductor, a rectifier bridge, a transformer, a current transformer and the like, due to the high insulation and the heat dissipation effect of the liquid, the closed device immersed in the liquid can have the same working capacity in the atmosphere, meanwhile, the heat dissipation of the device is enhanced, and the power density can be improved. However, for a mechanically operated switch device such as an electromagnetic relay to be immersed in liquid for a long time, it is necessary to prevent the liquid from penetrating into the electromagnetic relay, otherwise, the liquid may cause the switch to be in poor contact and delay operation, which may cause the power supply to fail to work normally. Through practical verification, some non-mechanical action type devices, such as resistors, power semiconductors, inductors, transformers and the like, are not influenced by liquid resistance factors, and can normally work in liquid by adopting common packaging treatment. However, in the conventional electromagnetic relay, in the wave soldering, reflow soldering and other soldering processes, the sealant at the joint of the lead-out pin of the relay and the shell part is easily heated and melted, so that a micro gap may occur, and the relay is not sealed tightly. Therefore, when the electromagnetic relay is immersed in a liquid-cooled environment for a long time, there is a risk that liquid penetrates into the relay interior. When liquid enters the electromagnetic relay, the liquid resistance can directly influence the contact, action and release of the electromagnetic relay, and further influence the normal work of a power supply.

Disclosure of Invention

Aiming at the technical problems in the prior art, the invention provides an electromagnetic relay capable of being immersed in a liquid cooling environment and a relay device, which can meet the requirement of being immersed in the liquid cooling environment for a long time.

The technical scheme adopted by the invention for solving the technical problems is as follows: an electromagnetic relay capable of being immersed in a liquid cooling environment comprises a shell part and a plurality of lead-out pins penetrating through the shell part; the sealing element is arranged on the shell part and at least surrounds the plurality of leading-out pins, or the number of the sealing elements is a plurality, and each sealing element respectively surrounds at least one leading-out pin; the sealing element protrudes out of one end of the shell part, which is provided with the leading-out pins, and the protruding end of the sealing element is used for being in sealing fit with the PCB connected with the leading-out pins, so that a sealing cavity containing the joint parts of the leading-out pins and the shell part is formed between the shell part and the PCB.

The shell part comprises a first part and a second part, the first part is a shell second part with an opening at one end, the second part is arranged at the opening of the shell, and the plurality of leading-out pins are respectively arranged on the second part in a penetrating way; the sealing element is arranged on the shell and surrounds the second component and the plurality of leading-out pins, so that after the sealing element is in sealing fit with the PCB, a joint part containing the periphery of the shell and the second component and a sealing cavity containing the joint part of the second component and each leading-out pin are formed between the shell part and the PCB.

Furthermore, the sealing element is of a frame-shaped structure with the periphery closed.

Further, the sealing element and the housing are molded into an integral structure through insert injection molding, or the sealing element and the housing are connected in a sealing mode.

Furthermore, the bottom end of the shell is provided with a fixing groove which is located at the periphery of the second component and is in a frame shape, and the sealing element is embedded in the fixing groove in a sealing mode.

Furthermore, the sealing element and the periphery of the fixing groove are fixed in a dispensing mode.

Further, the sealing element is polygonal or annular; the second part is a bottom plate, a side plate, a top plate, a base or a cover body.

Further, the sealing element is a metal material which can be welded on the PCB, or the sealing element is a sealing ring which can be extruded to generate deformation, so that the sealing ring can be attached and sealed with the PCB through deformation.

Further, the sealing element is a copper frame.

The invention further provides a relay device, which comprises a PCB and the electromagnetic relay which can be immersed in the liquid cooling environment, wherein the plurality of leading-out pins are respectively and electrically connected to the PCB, the periphery of the sealing element is welded on the PCB, and/or the periphery of the sealing element is completely attached and sealed with the PCB, so that the sealing cavity is formed between the shell part and the PCB.

Compared with the prior art, the invention has the following beneficial effects:

1. the invention also comprises a sealing element which is arranged on the shell part and surrounds the plurality of leading-out pins, or the number of the sealing elements is a plurality, and each sealing element respectively surrounds at least one leading-out pin; the sealing element protrudes out of one end of the shell part, which is provided with the leading-out pins, and the protruding end of the sealing element is used for being in sealing fit with the PCB connected with the leading-out pins so as to form a sealing cavity containing the joint parts of the leading-out pins and the shell part between the shell part and the PCB.

2. The shell part comprises the shell and a second part, the plurality of leading-out pins are respectively arranged on the second part in a penetrating mode, the sealing element is arranged on the shell and surrounds the second part and the plurality of leading-out pins, after the sealing element is in sealing fit with the PCB, a combined part of the shell and the periphery of the second part and a sealing cavity of the combined part of the second part and each leading-out pin are formed between the shell part and the PCB, and therefore when the electromagnetic relay is applied to a liquid cooling environment in a combined mode, liquid can be prevented from permeating into the electromagnetic relay from the combined part of the shell and the periphery of the second part (small gaps are easy to occur under the condition that glue amount around the shell and the second part is thin), the effect of omnibearing sealing protection is achieved for the whole electromagnetic relay, and the electromagnetic relay can normally work after being immersed in the liquid cooling environment for a long time.

3. The sealing element is of a frame-shaped structure with the periphery sealed, so that the sealing element is simple in structure, low in cost and easy to arrange in the shell.

4. The sealing piece with the shell passes through insert injection moulding formula structure as an organic whole, perhaps, the sealing piece with shell sealing connection can ensure that sealing piece and shell realize sealed cooperation. When the sealing element is connected with the shell in a sealing manner, the sealing element is more convenient and reliable to connect with the shell due to the arrangement of the fixing grooves.

5. The sealing element is a metal material which can be welded on the PCB, or the sealing element is a sealing ring which can be extruded to generate deformation, so that the sealing element and the PCB are combined more conveniently and reliably.

The invention is further explained in detail with the accompanying drawings and the embodiments; however, the electromagnetic relay and the relay apparatus submergible in a liquid-cooled environment according to the present invention are not limited to the embodiments.

Drawings

FIG. 1 is a schematic perspective view (with the base facing upwards) of the present invention according to one embodiment;

FIG. 2 is a schematic perspective view of a copper frame according to an embodiment of the present invention;

FIG. 3 is a schematic perspective view of a housing according to the first embodiment of the present invention;

FIG. 4 is a front view of the PCB board in a mated state in accordance with one embodiment of the present invention;

FIG. 5 is a schematic perspective view of the present invention according to a second embodiment (with the base facing upward);

FIG. 6 is a schematic perspective view of a seal ring according to a second embodiment of the present invention;

FIG. 7 is a schematic perspective view of the outer case of the second embodiment of the present invention;

FIG. 8 is a front view of the second embodiment of the present invention in a state of being engaged with a PCB (including an auxiliary tool or a press block);

wherein, 1, a shell, 11, a fixed groove, 111 and a glue filling gap; 12. the PCB comprises a shell bottom surface, a bottom plate, a base plate, a lead-out pin, a copper frame bottom surface, a PCB 5, 6/7, soldering tin, 8, a sealing ring, 9 and an auxiliary tool or a pressing block.

Detailed Description

Example one

Referring to fig. 1 to 4, an electromagnetic relay capable of being immersed in a liquid cooling environment according to the present invention includes a housing portion, a plurality of lead-out pins 3 penetrating the housing portion, and a hollow sealing member disposed on the housing portion and surrounding the plurality of lead-out pins 3; the sealing element protrudes out of one end of the shell part, which is provided with the leading-out pins 3, and the protruding part of the sealing element is used for being in sealing fit with the PCB connected with the leading-out pins 3, so that a sealing cavity containing the joint parts of the leading-out pins 3 and the shell part is formed between the shell part and the PCB. In other embodiments, the number of the sealing elements is several, and each sealing element surrounds at least one lead-out pin, and each lead-out pin is surrounded by the corresponding sealing element. By enclosed is meant that one part surrounds the other part, e.g. the seal surrounds the pin-out.

In this embodiment, the housing portion includes a first component and a second component, the first component is a housing 1 with an opening at one end, the second component blocks the opening of the housing 1, and the plurality of pins 3 are respectively inserted into the second component; the sealing element is arranged on the shell 1 and surrounds the second component and the plurality of leading-out pins 3, so that after the sealing element is in sealing fit with the PCB, a sealing cavity containing the periphery of the shell 1 and the second component and the periphery of the leading-out pins 3 is formed between the shell part and the PCB. The end of the housing with the opening is a bottom end, and the second member is specifically a bottom plate, but not limited thereto, and may also be a side plate, a top plate, a base, a cover, or the like. In other embodiments, the housing portion includes a first member and a second member, the first member is a housing having an opening at one end, the second member blocks the opening of the housing, the plurality of pins respectively penetrate through the housing, and the second member is a bottom plate, a side plate, a top plate, a base, a cover, or the like. The joint between the housing 1 and the periphery of the second member is a part between the housing 1 and the periphery of the second member, and the joint between the second member and each lead-out pin 3 is a part between a part of the second member through which the lead-out pin 3 passes and each lead-out pin.

In this embodiment, the sealing element is a frame-shaped structure with a closed periphery, and the sealing element is polygonal or annular, for example, the sealing element may be quadrilateral, triangular, circular, elliptical, or the like.

In this embodiment, the sealing element is a metal material that can be welded to the PCB, and specifically, the sealing element is specifically, but not limited to, the copper frame 4. The copper frame 4 is a quadrangle, but is not limited thereto. The sealing member (i.e., the copper frame 4) is sealingly connected to the housing 1, but not limited thereto, and in other embodiments, the sealing member and the housing are formed as a single-piece structure by insert injection molding.

In this embodiment, the bottom end of the housing 1 is provided with a fixing groove 11 located at the periphery of the bottom plate 2 and in a frame shape, the sealing element (i.e., the copper frame 4) is embedded in the fixing groove 11 in a sealing manner, specifically, the sealing element (i.e., the copper frame 4) and the periphery of the fixing groove 11 are fixed by dispensing, the periphery of the fixing groove 11 is respectively provided with a filling gap 111, and the filling gap 111 is located on the inner side wall of the fixing groove 11 close to the bottom plate 1. Therefore, the copper frame 4 can be prevented from falling off, and the gap between the copper frame 4 and the fixing groove 11 can be effectively sealed by using the plastic sealing glue. After the copper frame 4 is assembled, the bottom surface 41 of the copper frame protrudes from the bottom surface 12 of the shell.

The electromagnetic relay capable of being immersed in a liquid cooling environment is used in combination with a PCB (printed circuit board) when in application, specifically, a plurality of leading-out pins 3 (including a movable spring leading-out pin, a static spring leading-out pin and a coil leading-out pin) of the electromagnetic relay are respectively welded on the PCB 5 (each leading-out pin 3 respectively penetrates through a corresponding welding hole on the PCB 5, and soldering tin 6 is filled in the welding hole to enable liquid to not pass through the welding hole), one end of a copper frame 4 protruding out of a shell 1 is completely attached to the PCB 5 and is fixed on the PCB 5 through the soldering tin 7, as shown in figure 4. In this way, the sealed cavity is formed between the housing part and the PCB board 5. When the combined PCB 5 is immersed in liquid (insulating liquid) to work, the liquid is blocked at the periphery by the copper frame 4, meanwhile, the sealing cavity protects the joint part b of the periphery of the shell 1 and the bottom plate 2 and the joint part a of the bottom plate 2 and each lead-out pin 3, so that the liquid can only flow outside the electromagnetic relay and cannot permeate into the electromagnetic relay, as shown in FIG. 4, and the arrow in the figure indicates the flow direction of the liquid.

Referring to fig. 1 to 4, a relay device according to the present invention includes a PCB 5, and further includes an electromagnetic relay according to the first embodiment of the present invention, which can be immersed in a liquid-cooled environment, wherein the plurality of lead-out pins 3 are respectively electrically connected to the PCB 5, and the periphery of the sealing element (i.e., the copper frame 4) is welded to the PCB 5, so that the sealing cavity is formed between the housing portion and the PCB 5, and thus, when the relay device is applied to the liquid-cooled environment, liquid (i.e., insulating liquid) can only flow outside the electromagnetic relay and cannot permeate into the electromagnetic relay. Specifically, the plurality of lead-out pins 3 are respectively welded to the PCB board 5: the PCB 5 is provided with a plurality of welding holes which are in one-to-one butt joint with the leading-out pins 3, and after each leading-out pin 3 respectively penetrates through the corresponding welding hole, gaps between the leading-out pins 3 and the welding holes are filled with soldering tin 6.

When the invention is applied to the liquid cooling power supply, the work of the immersed liquid cooling power supply can be ensured, the traditional form that the liquid cooling power supply can only rely on air cooling for heat dissipation is broken, the power supply and the complete machine matched with the power supply are reduced, and the operation efficiency of the power supply and the complete machine matched with the power supply is improved.

Example two

Referring to fig. 5-8, an electromagnetic relay according to the present invention, which can be immersed in a liquid-cooled environment, is different from the first embodiment in that: the sealing member is a sealing ring 8 which can be extruded to generate deformation, so that the sealing ring 8 can be attached and sealed with the PCB through deformation. The seal ring 8 is specifically made of a rubber material, but is not limited thereto. The sealing ring 8 is annular, but is not limited thereto.

In this embodiment, 1 bottom of shell is equipped with equally and is located 2 peripheries of bottom plate and be the fixed slot 11 of frame shape, sealing member (sealing washer 8) is sealed to be embedded in this fixed slot 11, specifically, sealing washer 8 with fixed slot 11 is fixed to the point is glued all around, so, not only can avoid sealing washer 8 to drop, can also utilize the plastic sealing to carry out effective sealing to the clearance between sealing washer 8 and the fixed slot 11. The periphery of the fixing groove 11 is respectively provided with a glue filling gap 111, and the glue filling gap 111 is located on the inner side wall of the fixing groove 11 close to the bottom plate 1. The fixing groove 11 is square, but since the sealing ring 8 is deformable, although the initial shape (ring shape) of the sealing ring 8 is not identical to the fixing groove 11, the sealing ring 8 is not prevented from being fitted into the fixing groove 11. After the sealing ring 8 is assembled, the sealing ring partially protrudes out of the bottom surface 12 of the shell so as to be matched with the PCB 5 in a sealing mode.

The electromagnetic relay capable of being immersed in a liquid cooling environment is used in combination with a PCB (printed circuit board) 5 during application, specifically, after each leading-out pin 3 (including a movable spring leading-out pin, a static spring leading-out pin and a coil leading-out pin) of the electromagnetic relay respectively passes through a corresponding welding hole on the PCB 5, a sealing ring 8 is completely contacted with the PCB 5, at the moment, pressure F is applied to an auxiliary tool or a pressing block 9 at the top of the electromagnetic relay to enable the sealing ring 8 to be extruded to generate deformation, and then a gap between each leading-out pin 3 and the welding hole on the PCB 5 is filled with soldering tin 6, so that liquid cannot permeate through the gap between the leading-out pin 3 and the welding hole; finally, the auxiliary tool or press block 9 on the top of the electromagnetic relay is removed. At this moment, each leading-out pin 3 of the electromagnetic relay is already welded on the PCB 5, and before the sealing ring 8 is extruded and cannot be restored to be deformed, the sealing ring 8 is completely attached to the PCB 5, so that a sealing cavity is formed between the electromagnetic relay and the PCB 5. Therefore, when the present invention is applied to a liquid-cooled environment, liquid (referred to as insulating liquid) is blocked outside the sealed cavity and cannot penetrate into the electromagnetic relay through the joint portion between the housing 1 and the bottom plate 2 and the joint portion between the bottom plate 2 and the lead pin 3.

Referring to fig. 5-8, a relay device according to the present invention includes a PCB 5 and an electromagnetic relay according to the second embodiment of the present invention, wherein the plurality of lead-out pins 3 are respectively welded to the PCB 5, and the sealing ring 8 is deformed by being pressed and completely attached to the PCB 5, so as to form a sealed cavity between the housing portion and the PCB 5. Therefore, when the electromagnetic relay is applied to a liquid environment, liquid can only flow outside the electromagnetic relay and cannot permeate into the electromagnetic relay, so that the effect of omnibearing sealing protection on the whole electromagnetic relay is achieved, and the electromagnetic relay can normally work when being immersed in the liquid cooling environment for a long time.

The electromagnetic relay and the relay device which can be immersed in the liquid cooling environment are the same as or can be realized by adopting the prior art.

The above embodiments are only used to further illustrate the electromagnetic relay and the relay device of the present invention, which can be immersed in a liquid cooling environment, but the present invention is not limited to the embodiments, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention fall within the protection scope of the technical solution of the present invention.

Claims (10)

1. An electromagnetic relay capable of being immersed in a liquid cooling environment comprises a shell part and a plurality of lead-out pins penetrating through the shell part; the method is characterized in that: the sealing element is arranged on the shell part and at least surrounds the plurality of leading-out pins, or the number of the sealing elements is a plurality, and each sealing element respectively surrounds at least one leading-out pin; the sealing element protrudes out of one end of the shell part, which is provided with the leading-out pins, and the protruding end of the sealing element is used for being in sealing fit with the PCB connected with the leading-out pins, so that a sealing cavity containing the joint parts of the leading-out pins and the shell part is formed between the shell part and the PCB.

2. The electromagnetic relay submersible in a liquid-cooled environment of claim 1, wherein: the shell part comprises a first part and a second part, the first part is a shell with an opening at one end, the second part is arranged at the opening of the shell, and the plurality of leading-out pins are respectively arranged on the second part in a penetrating way; the sealing element is arranged on the shell and surrounds the second component and the plurality of leading-out pins, so that after the sealing element is in sealing fit with the PCB, a joint part containing the periphery of the shell and the second component and a sealing cavity containing the joint part of the second component and each leading-out pin are formed between the shell part and the PCB.

3. The electromagnetic relay submersible in a liquid-cooled environment of claim 2, wherein: the sealing element is of a frame-shaped structure with the periphery closed.

4. An electromagnetic relay submersible in a liquid-cooled environment according to claim 3, wherein: the sealing piece and the shell are molded into an integral structure through insert injection molding, or the sealing piece is connected with the shell in a sealing mode.

5. The electromagnetic relay submersible in a liquid-cooled environment of claim 4, wherein: the end of the shell, which is provided with an opening, is provided with a fixing groove which is positioned on the periphery of the second component and is in a frame shape, and the sealing element is partially embedded in the fixing groove in a sealing manner.

6. The electromagnetic relay submersible in a liquid-cooled environment of claim 5, wherein: the sealing element and the periphery of the fixing groove are fixed in a dispensing mode.

7. An electromagnetic relay submersible in a liquid-cooled environment according to any one of claims 1-6, wherein: the sealing element is a metal material which can be welded on the PCB, or the sealing element is a sealing ring which can be extruded to generate deformation, so that the sealing ring can be attached and sealed with the PCB through deformation.

8. The electromagnetic relay submersible in a liquid-cooled environment of claim 8, wherein: the sealing element is a copper frame.

9. An electromagnetic relay submersible in a liquid-cooled environment according to any one of claims 2-6, wherein: the sealing element is polygonal or annular; the second part is a bottom plate, a side plate, a top plate, a base or a cover body.

10. A relay device, includes the PCB board, its characterized in that: the electromagnetic relay immersed in a liquid cooling environment as recited in any of claims 1-9, wherein said plurality of pins are electrically connected to the PCB, and the periphery of said sealing member is welded to the PCB, and/or the periphery of said sealing member is completely attached to and sealed with said PCB, such that said sealed cavity is formed between the housing portion and the PCB.

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