CN208954976U - Heat sink with insulation effect - Google Patents
Heat sink with insulation effect Download PDFInfo
- Publication number
- CN208954976U CN208954976U CN201821952287.8U CN201821952287U CN208954976U CN 208954976 U CN208954976 U CN 208954976U CN 201821952287 U CN201821952287 U CN 201821952287U CN 208954976 U CN208954976 U CN 208954976U
- Authority
- CN
- China
- Prior art keywords
- insulation effect
- radiating piece
- base portion
- pin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000694 effects Effects 0.000 title claims abstract description 48
- 238000009413 insulation Methods 0.000 title claims description 40
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 230000004308 accommodation Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 4
- 238000004513 sizing Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000005538 encapsulation Methods 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a heat dissipation piece with insulating effect, be applicable to bond at the base plate, and with the base plate defines out accommodation space, accommodation space is applicable to and supplies the wafer to hold, heat dissipation piece contain with wafer looks spaced basal portion, bond in at least a foot of base plate, connect in the basal portion with between at least a foot and with the basal portion is the connecting portion of contained angle, and at least one coating is in the part of the medial surface of connecting portion with the insulating layer of the internal surface of basal portion. Therefore, by utilizing the accommodating space defined by the heat dissipation piece and the substrate and the insulating layer coated on the base part and the connecting part, under the condition of not expanding the height or the volume of the heat dissipation piece, any part in the heat dissipation piece is prevented from being contacted with the wafer or two wires electrically connecting the substrate and the wafer, so that the insulating effect can be really achieved, and moreover, because the pin part is not coated with the insulating layer, the electric characteristic can be kept, and the heat dissipation effect can be improved.
Description
Technical field
The utility model relates to a kind of radiating pieces, more particularly to a kind of radiating piece with insulation effect of encapsulation.
Background technique
Refering to fig. 1, a kind of existing packaging system 1, for encapsulating a chip 2.The packaging system 1 includes to pass through two
Wiring 20 is electrically connected to a substrate 11 of the chip 2,12 (such as conductive silver of a layer sizing being coated on the substrate 11
Glue or scolding tin), and the radiating piece 13 for being bonded with the substrate 11 by the sizing material 12 and not contacted with the chip 2.
Whereby, reach the encapsulation chip 2, and the purpose to radiate by metal radiating piece 13.
Only, since the radiating piece 13 and 2 gap of chip are minimum, therefore, it is very easy in the radiating piece 13 or institute
It states during chip 2 expands with heat and contract with cold, or has the improper feelings for compeling to squeeze the radiating piece 13 or the improper bending substrate 11 of external force
It when shape, contacts metal radiating piece 13 with chip 2 or the wiring 20, and short circuit or chip 2 is caused to damage.
Summary of the invention
The purpose of this utility model is to provide one kind can actually reach insulation effect, and keeps electrical characteristic and promoted
The radiating piece with insulation effect of heat dissipation effect.
The radiating piece with insulation effect of the utility model is defined suitable for being bonded in substrate, and with the substrate
Accommodation space, at least chip that the accommodation space is suitable for being electrically connected to the substrate accommodate, and the radiating piece includes:
Base portion, at least a pin portion, interconnecting piece and insulating layer.
The base portion includes the inner surface towards the substrate and with the chip separately.
An at least pin portion, the joint surface including being bonded in the substrate.
The interconnecting piece is connected to around the base portion between an at least pin portion and with the base portion in angle, and
Including towards the substrate and being connected to the medial surface of the inner base surface Yu the joint surface.
The insulating layer is at least coated on the part of the medial surface of the interconnecting piece and the inner surface of the base portion.
The radiating piece with insulation effect of the utility model, the insulating layer extend to institute by the inner surface of the base portion
The medial surface of interconnecting piece is stated, and separately with the joint surface.
The radiating piece with insulation effect of the utility model, an at least pin portion further includes being in reverse to the engagement
The pin face in face, and it is connected to the naked surface on the joint surface Yu the pin face, the naked surface has for sizing material by described
Notch of the joint surface towards pin face direction overflow.
The radiating piece with insulation effect of the utility model, the radiating piece with insulation effect include four pins
Portion, and the pin portion follows the configuration of square type profile in four corners of the radiating piece.
The radiating piece with insulation effect of the utility model, each notch are arc.
The radiating piece with insulation effect of the utility model, the interconnecting piece further include be in reverse to the medial surface outer
Side, and follow the configuration of square type profile in four corners and four of the medial surface are extended to by the lateral surface wear mouth, it is described
Lateral surface is connected to the outer surface of the base portion and the pin face in an at least pin portion.
The radiating piece with insulation effect of the utility model, it is triangular form that each, which wears mouth,.
The radiating piece with insulation effect of the utility model, the interconnecting piece further include being connected to the lateral surface and institute
State medial surface and with the naked surface loop around the naked side of the base portion.
The radiating piece with insulation effect of the utility model, the radiating piece with insulation effect also include at least one
Coating, and the base portion further includes the outer surface for being in reverse to the inner surface, an at least coating is formed in the base portion
Outer surface.
The radiating piece with insulation effect of the utility model, an at least coating is by the outer surface of the base portion through institute
The lateral surface for stating interconnecting piece extends to the pin face in the pin portion.
The radiating piece with insulation effect of the utility model, the radiating piece with insulation effect also include two platings
Layer, the coating are respectively formed at inner surface and the outer surface of the base portion.
The radiating piece with insulation effect of the utility model, the coating are passed through by the inner surface of the base portion and outer surface
The medial surface and lateral surface of the interconnecting piece extend to the joint surface and pin face in the pin portion.
The utility model has the beneficial effects that: the receiving defined using the radiating piece and the substrate of the utility model
Space, and it is coated on the insulating layer of the base portion Yu the interconnecting piece, in the feelings for the height or the volume of timber for not expanding the radiating piece
Under shape, avoids any one part inside the radiating piece and the chip or be electrically connected two of the substrate and the chip
Wire contacts, and insulation effect can be actually reached, furthermore, since the pin portion does not apply layer of cloth, can protect
Hold electrical characteristic and improving radiating effect.
Detailed description of the invention
Other features and effect of the utility model will be clearly presented in the embodiment referring to schema, in which:
Fig. 1 is a cross-sectional view, illustrates a kind of existing packaging system；
Fig. 2 is a cross-sectional view, illustrates that there is the utility model one embodiment of the radiating piece of insulation effect to be bonded in
One substrate and the multiple chips of encapsulation；
Fig. 3 is a perspective view of the embodiment；
Fig. 4 is a perspective view of another angle of embodiment；
Fig. 5 is an enlarged partial cross section of the embodiment and the substrate, the chip；And
Fig. 6 is analogous to an enlarged partial cross section of Fig. 5, but includes two coating.
Specific embodiment
Refering to Fig. 2, Fig. 3 and Fig. 4, Fig. 5, the utility model has one embodiment of the radiating piece 3 of insulation effect, for gold
Belong to material, defines an accommodation space 30 suitable for being bonded in a substrate 4, and with the substrate 4.In the present embodiment,
Multiple chips 5 that the accommodation space 30 is suitable for being electrically connected to the substrate 3 with a plurality of wiring 50 accommodate.The radiating piece 3
Including a base portion 31,32, one, four pin portion, 33, coating 34 of interconnecting piece and an insulating layer 35.
The base portion 31 includes an inner surface 311 for being separated by a gap d towards the substrate 4 and with the chip 5,
And it is in reverse to an outer surface 312 of the inner surface 311.The inner surface 311 has a groove 313.In the present embodiment
In, the base portion 31 is circle.
The pin portion 32 follows the configuration of square type profile in four corners of the radiating piece 3, and respectively include towards
It the substrate 4 and is bonded in a joint surface 321 of the substrate 4, is in reverse to a pin face 322 on the joint surface 321,
And it is connected to a naked surface 323 on the joint surface 321 and the pin face 322.The naked surface 323 has for bonding agent
(such as conductive silver glue, scolding tin) is by the joint surface 321 towards multiple notches 324 of the 322 direction overflow of pin face.In this implementation
In example, the notch 324 is arc.
It is worth noting that, multiple amounts in the pin portion 32 are four, it, can also in other change case of the present embodiment
To be one or two or three, when being not limited.
The interconnecting piece 33 is connected to around the base portion 31 between the pin portion 32 and with the base portion 31 in one
Angle, and a lateral surface in the pin face 322 in the outer surface 312 including being connected to the base portion 31 and the pin portion 32
331, it is in reverse to the lateral surface 331 and is connected to the inner surface 311 of the base portion 31 and the joint surface 321 in the pin portion 32
A medial surface 332, extend to by the lateral surface 331 four of the medial surface 332 and wear mouth 333, and be connected to described
Lateral surface 331 and the medial surface 332 and the naked side 334 that the base portion 31 is surround with the naked surface 323.It is described to wear
Mouth 333 follows a square type profile configuration in four corners respectively.In the present embodiment, the mouth 333 of wearing is triangular form.
The coating 34 is a kind of coat of metal, is formed in the outer surface 312 of the base portion 31, and by the base portion 31
Outer surface 312 extends to the pin face 322 in the pin portion 32 through the lateral surface 331 of the interconnecting piece 33.The coating 34 is used
In preventing from aoxidizing, and promote the aesthetics of entire appearance.
It is worth noting that, the coating 34 only has one layer, in other change case of the present embodiment, it is also possible to two layers
(as shown in Figure 6) is respectively formed at inner surface 311 and the outer surface 312 of the base portion 31, and by the inner surface of the base portion 31
311 extend to the joint surface in the pin portion 32 with medial surface 332 of the outer surface 312 through the interconnecting piece 33 and lateral surface 331
321 with pin face 322.Whereby, by being formed in the plating of the inner surface 311, the medial surface 332 and the joint surface 321
Layer 34, can equally prevent from aoxidizing.
The insulating layer 35 is coated in the groove 313 of the inner surface 311 of the base portion 31, and by the inner surface 311
The medial surface 332 of the interconnecting piece 33 is extended to around, and is separated by a space D with the joint surface 321.
When the radiating piece 3 is bonded in the substrate 4 with the joint surface 321 in the pin portion 32, on the substrate 4
Bonding agent can also overflow to the naked surface 323, and be pushed out in the notch 324, and by the joint surface 321 towards described
The 322 direction overflow of pin face bonds the radiating piece 3 by bonding agent and the substrate 4, and reaches the encapsulation chip 5
Purpose.
It, whereby, can be in any one chip 5 by the barrier of the insulating layer 35 refering to Fig. 3, Fig. 4 and Fig. 5 (or Fig. 6)
Or any bar wiring 50 and the base portion 31 reach insulation effect when contacting.
In addition, since the insulating layer 35 and the joint surface 321 are separated by the space D, and the pin portion 32 is naked
Therefore the naked side 334 on surface 323, joint surface 321 and the interconnecting piece 33 can pass through aforementioned space D without any coating
It quickly radiates with joint surface 321, naked surface 323, naked side 334, further improving radiating effect and radiating efficiency.
And it is worth noting that, the utility model main purpose is to avoid the radiating piece 3 and the chip 5 or described
Wiring 50 contacts and causes short circuit, or chip 5 is caused to damage, and therefore, when being coated with the insulating layer 35, mainly selection can be opposite
Or in the position of the chip 5, such as part of the groove 313 of the base portion 31, inner surface 311 or the interconnecting piece 33
Side 332, when being not limited.
Via above explanation, the advantages of previous embodiment, can be summarized as follows:
1, the utility model is mainly the receiving defined using the base portion 31, the interconnecting piece 33 and the substrate 4
Space 30, and be coated on the insulating layer 35 of the base portion 31 with the interconnecting piece 33, in the height for not expanding the radiating piece 3 or
In the case of the volume of timber, described any one part of radiating piece 3 is avoided to contact with any one chip 5 or any bar wiring 50, and can
Insulation effect is actually reached, is promoted and uses upper safety.
Furthermore 2, since the insulating layer 35 and the joint surface 321 are separated by the space D, and the pin portion 32
Therefore naked surface 323 and the naked side 334 of the interconnecting piece 33 can pass through aforementioned space D and naked surface without any coating
323, the naked quickly heat dissipation of side 334 is not only able to keep electrical characteristic, and can further improving radiating effect and heat dissipation imitate
Rate.
As described above, only the embodiments of the present invention, when the utility model implementation cannot be limited with this
Range, i.e., it is all according to simple equivalent changes and modifications made by the utility model claims book and description, all still belong to
The scope of the utility model.
Claims (12)
1. a kind of radiating piece with insulation effect defines accommodation space suitable for being bonded in substrate, and with the substrate, institute
It states accommodation space to be suitable for being electrically connected at least chip receiving of the substrate, the radiating piece includes:
Base portion, including the inner surface towards the substrate and with the chip separately；
An at least pin portion, the joint surface including being bonded in the substrate；
Interconnecting piece is connected to around the base portion between an at least pin portion and with the base portion in angle, and including face
To the substrate and it is connected to the medial surface of the inner base surface Yu the joint surface；And
It is characterized by:
Insulating layer is at least coated on the part of the medial surface of the interconnecting piece and the inner surface of the base portion.
2. the radiating piece according to claim 1 with insulation effect, it is characterised in that: the insulating layer is by the base portion
Inner surface extend to the medial surface of the interconnecting piece, and separately with the joint surface.
3. the radiating piece according to claim 1 with insulation effect, it is characterised in that: an at least pin portion is also wrapped
The pin face for being in reverse to the joint surface is included, and is connected to the naked surface on the joint surface Yu the pin face, the naked surface
With for sizing material by the joint surface towards the notch of pin face direction overflow.
4. the radiating piece according to claim 3 with insulation effect, it is characterised in that: the dissipating with insulation effect
Warmware includes four pin portions, and the pin portion follows the configuration of square type profile in four corners of the radiating piece.
5. the radiating piece according to claim 3 with insulation effect, it is characterised in that: each notch is arc.
6. the radiating piece according to claim 3 with insulation effect, it is characterised in that: the interconnecting piece further includes reversed
In the lateral surface of the medial surface, and the configuration of square type profile is followed in four corners of radiating piece and institute is extended to by the lateral surface
Four for stating medial surface wear mouth, and the lateral surface is connected to the outer surface of the base portion and the pin in an at least pin portion
Face.
7. the radiating piece according to claim 6 with insulation effect, it is characterised in that: it is triangular form that each, which wears mouth,.
8. the radiating piece according to claim 6 with insulation effect, it is characterised in that: the interconnecting piece further includes connection
In the lateral surface with the medial surface and with the naked surface loop around the naked side of the base portion.
9. the radiating piece according to claim 3 with insulation effect, it is characterised in that: the dissipating with insulation effect
Warmware also includes an at least coating, and the base portion further includes the outer surface for being in reverse to the inner surface, an at least coating,
It is formed in the outer surface of the base portion.
10. the radiating piece according to claim 9 with insulation effect, it is characterised in that: an at least coating is by institute
The outer surface for stating base portion extends to the pin face in the pin portion through the lateral surface of the interconnecting piece.
11. the radiating piece according to claim 9 with insulation effect, it is characterised in that: described with insulation effect
Radiating piece also includes two coating, and the coating is respectively formed at inner surface and the outer surface of the base portion.
12. the radiating piece according to claim 11 with insulation effect, it is characterised in that: the coating is by the base portion
Medial surface through the interconnecting piece of inner surface and outer surface and lateral surface extend to the joint surface and pin face in the pin portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107200969 | 2018-01-19 | ||
| TW107200969 | 2018-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208954976U true CN208954976U (en) | 2019-06-07 |
Family
ID=64399391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821952287.8U Active CN208954976U (en) | 2018-01-19 | 2018-11-26 | Heat sink with insulation effect |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208954976U (en) |
| TW (1) | TWM566908U (en) |
-
2018
- 2018-04-11 TW TW107204674U patent/TWM566908U/en unknown
- 2018-11-26 CN CN201821952287.8U patent/CN208954976U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM566908U (en) | 2018-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8946888B2 (en) | Package on packaging structure and methods of making same | |
| CN103378017A (en) | High density 3D package | |
| CN101073151A (en) | Semiconductor package structure having enhanced thermal dissipation characteristics | |
| CN104766843B (en) | A kind of high power semiconductor encapsulating structure mounted with SMT techniques | |
| CN108109927A (en) | Semiconductor devices and its manufacturing method | |
| JP2011044654A5 (en) | ||
| US10453780B2 (en) | Electronic circuit, production method thereof, and electronic component | |
| CN208954976U (en) | Heat sink with insulation effect | |
| CN105762127B (en) | Package substrate, semiconductor package and fabrication method thereof | |
| JP2009099905A5 (en) | ||
| TWI620258B (en) | Package structure and manufacturing process thereof | |
| CN203367261U (en) | Power module | |
| CN107305879A (en) | Semiconductor devices and corresponding method | |
| US9847279B2 (en) | Composite lead frame structure | |
| CN209401618U (en) | Heat sink for packaging | |
| TWI661509B (en) | A method and a structure for packaging a chip. | |
| CN110199387A (en) | Electronic device and connector | |
| CN207781576U (en) | A kind of chip-packaging structure | |
| KR102219689B1 (en) | Semiconductor device and method for manufacturing the same | |
| CN101894811A (en) | Quad flat package structure having exposed heat sink, electronic assembly and manufacturing methods thereof | |
| CN101685807B (en) | Heat radiating type semiconductor packaging element and manufacture method thereof | |
| CN206532770U (en) | The new SOP structures of chip package | |
| CN201229938Y (en) | Chip packaging structure | |
| CN101459154B (en) | Conductive wire rack and encapsulation construction applying the conductive wire rack | |
| CN212517192U (en) | Multi-base-island lead frame and chip packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |