CN208944685U - A kind of silicon chip cleaning device - Google Patents
A kind of silicon chip cleaning device Download PDFInfo
- Publication number
- CN208944685U CN208944685U CN201821218175.XU CN201821218175U CN208944685U CN 208944685 U CN208944685 U CN 208944685U CN 201821218175 U CN201821218175 U CN 201821218175U CN 208944685 U CN208944685 U CN 208944685U
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- China
- Prior art keywords
- service sink
- spray pipe
- arc groove
- silicon chip
- support base
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Abstract
The utility model relates to a kind of silicon chip cleaning devices, including a service sink, it is laid in the service sink there are two being arranged in parallel and along the spray pipe that service sink length direction extends, the spray pipe is provided with the hydro-peening hole of several equidistantly distributeds along the two sides of its center line；It is provided with support base on the spray pipe, the support base is equipped with an arc groove extended along service sink length direction, and the side of arc groove is concordant with the outer side edges of spray pipe is arranged；The outer end at the both ends of the arc groove is fixedly connected by support frame with support base, and the partition of several equidistantly distributeds is equipped in the arc groove, makes to form the cavity that can hold silicon wafer placement between adjacent separator and arc groove.Utility model has the advantages that the utility model silicon chip cleaning device can greatly improve Wafer Cleaning effect.
Description
Technical field
The utility model relates to be related to Wafer Cleaning equipment technical field, in particular to a kind of silicon chip cleaning device.
Background technique
With the development of large scale integrated circuit, the continuous improvement of integrated level, the continuous reduction of line width, to the quality of silicon wafer
It is required that it is also higher and higher, it is especially more and more tighter to the surface quality requirements of silicon wafer.This is primarily due in silicon wafer polishing face
Grain and metal impurities stain the quality and yield rate that can seriously affect device.In current integrated circuit production, Wafer Cleaning
It is not thorough, whole silicon wafers may be made to scrap, or the device performance manufactured is inferior, stability and reliability are very poor.
Current most domestic manufacturer generally combines cleaning by hand using single slot or multi-groove type, and silicon wafer is put into cleaning solution
It is impregnated, by silicon chip extracting after being soaked for a period of time.
Be between silicon wafer and cleaning solution under this cleaning way it is opposing stationary motionless, mutual collision friction is very
It is few, and then the effect of Wafer Cleaning is not very good.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of Wafer Cleaning dresses that can be improved Wafer Cleaning effect
It sets.
In order to solve the above technical problems, the technical solution of the utility model are as follows: a kind of silicon chip cleaning device, innovative point exist
In: it is laid with including a service sink, in the service sink there are two being arranged in parallel and along the spray pipe that service sink length direction extends,
The spray pipe is provided with the hydro-peening hole of several equidistantly distributeds along the two sides of its center line, and connects between two spray pipe
It is connected with water inlet pipe；
Support base is provided on the spray pipe, the support base is equipped with one along the extension of service sink length direction
Arc groove, and the side of arc groove is concordant with the outer side edges of spray pipe is arranged；The outer end at the both ends of the arc groove
It is fixedly connected by support frame with support base, and is equipped with the partition of several equidistantly distributeds in the arc groove, make phase
The cavity that can hold silicon wafer placement is formed between adjacent partition and arc groove.
Further, the upper end of the service sink is equipped with overflow port.
Further, the upper surface of the two sides overflow port is serrated distribution.
Utility model has the advantages that
(1) the utility model silicon chip cleaning device, there are two the interior layings of service sink is arranged in parallel and along cleaning pond length side
To the spray pipe of extension, each spray pipe is provided with the hydro-peening hole of several equidistantly distributeds along the two sides of its center line, and then makes
Obtaining hydro-peening route can be in waveguide route in water, be capable of the side of effectively cleaning silicon chip, meanwhile, pass through the leaching in entire service sink
Liquid is steeped to silicon wafer Integral cleaning, and hydro-peening is combined with the mode of static soak, further increases cleaning effect；
(2) the utility model silicon chip cleaning device, wherein being equipped with overflow port in the upper end of service sink can make to be mixed with impurity
Soak overflows outside service sink in time, guarantees that soak is clean in service sink；In addition, the upper surface of two sides overflow port is serrated
Distribution, the soak that each side can be enable to be mixed with impurity are uniformly discharged.
Detailed description of the invention
Utility model will be further described in detail below with reference to the attached drawings and specific embodiments.
Fig. 1 is the structural schematic diagram of the utility model silicon chip cleaning device.
Fig. 2 is the side view of Fig. 1 silicon chip cleaning device.
Specific embodiment
The following examples can make professional and technical personnel that the utility model be more fully understood, but therefore will not
The utility model is limited among the embodiment described range.
Embodiment
The present embodiment silicon chip cleaning device, as illustrated in fig. 1 and 2, including a service sink 1, there are two the interior layings of the service sink 1
It is arranged in parallel and along the spray pipe 2 that 1 length direction of service sink extends, spray pipe 2 is provided with several along the two sides of its center line
The hydro-peening hole of equidistantly distributed, and water inlet pipe 8 is communicated between two spray pipes 2；It is provided with support base 3 on spray pipe 2, supports
Pedestal 3 is equipped with an arc groove 4 extended along 1 length direction of service sink, and the side of arc groove 4 and spray pipe 2 is outer
Side is concordantly arranged；The outer end at the both ends of arc groove 4 is fixedly connected by support frame 5 with support base 3, and arc groove
It is equipped with the partition 6 of several equidistantly distributeds in 4, makes to form the sky that can hold silicon wafer placement between adjacent separator 6 and arc groove 4
Chamber.
In the present embodiment, in order to which the soak for being mixed with impurity can be made to overflow outside service sink in time, guarantee to impregnate in service sink
Liquid is clean, is equipped with overflow port 7 in the upper end of service sink 1；The distribution in addition, upper surface of overflow port 7 is serrated can make each side mixed
Having the soak of impurity can uniformly be discharged.
The present embodiment silicon chip cleaning device, there are two be arranged in parallel and prolong along 1 length direction of service sink the interior laying of service sink 1
The spray pipe 2 stretched, each spray pipe 2 are provided with the hydro-peening hole of several equidistantly distributeds along the two sides of its center line, so that
Hydro-peening route can be in waveguide route in water, be capable of the side of effective cleaning silicon chip, meanwhile, pass through the leaching in entire service sink 1
Liquid is steeped to silicon wafer Integral cleaning, and hydro-peening is combined with the mode of static soak, further increases cleaning effect.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.This
The technical staff of industry is retouched in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
That states only illustrates the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model
It will also have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.This is practical new
Type is claimed range and is defined by the appending claims and its equivalent thereof.
Claims (3)
1. a kind of silicon chip cleaning device, it is characterised in that: be arranged in parallel there are two being laid with including a service sink, in the service sink
And the spray pipe extended along service sink length direction, the spray pipe are provided with several equidistant point along the two sides of its center line
The hydro-peening hole of cloth, and water inlet pipe is communicated between two spray pipe；
Support base is provided on the spray pipe, the support base is equipped with an arc extended along service sink length direction
Groove, and the side of arc groove is concordant with the outer side edges of spray pipe is arranged；The outer end at the both ends of the arc groove passes through
Support frame is fixedly connected with support base, and the arc groove in be equipped with several equidistantly distributeds partition, make it is adjacent every
The cavity that can hold silicon wafer placement is formed between plate and arc groove.
2. silicon chip cleaning device according to claim 1, it is characterised in that: the upper end of the service sink is equipped with overflow port.
3. silicon chip cleaning device according to claim 2, it is characterised in that: the upper surface of the two sides overflow port is in sawtooth
Shape distribution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821218175.XU CN208944685U (en) | 2018-07-31 | 2018-07-31 | A kind of silicon chip cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821218175.XU CN208944685U (en) | 2018-07-31 | 2018-07-31 | A kind of silicon chip cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208944685U true CN208944685U (en) | 2019-06-07 |
Family
ID=66732860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821218175.XU Active CN208944685U (en) | 2018-07-31 | 2018-07-31 | A kind of silicon chip cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208944685U (en) |
-
2018
- 2018-07-31 CN CN201821218175.XU patent/CN208944685U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220304 Address after: No. 126, Lane 5469, Hunan highway, hangtou Town, Pudong New Area, Shanghai, 200120 Patentee after: SHANGHAI JINGFU ELECTROMECHANICAL TECHNOLOGY CO.,LTD. Address before: 226500 No.18, Xunchi Road, Changjiang Town, Rugao City, Nantong City, Jiangsu Province Patentee before: JIANGSU JING RUI PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Patentee before: Li Yizi |
|
| TR01 | Transfer of patent right |