CN208929998U - A kind of CMP planarization equipment positioning fixture - Google Patents

Abstract

The utility model relates to a kind of CMP planarization equipment positioning fixtures, mouth is gripped including what outer housing and shell body front surface middle position opened up, described grip is provided with fixation kit in mouth, the fixation kit includes the first limit plate and the second limit plate, the first limit plate is welded on the inner wall for gripping mouth, the second limit plate is provided with below first limit plate, the CMP planarization equipment positioning fixture, pass through the spring on fixation kit, the structures such as the first square block of fixation kit side, different shape and size of semiconductor transistor elements chips can be clamped, prevent the type due to present semiconductor die element chip varied, the case where corresponding semiconductor die element chip could be gripped by needing replacing the positioning fixture of different model, increase the utility function of device , and cost needed for having saved the different positioning fixtures of replacement.

Description

A kind of CMP planarization equipment positioning fixture

Technical field

The utility model relates to positioning fixture technical field, specially a kind of CMP planarization equipment positioning fixture.

Background technique

With the continuous development of modern economy technology, a kind of CMP planarization equipment uses positioning fixture as applying to semiconductor A kind of clamping device on wafer material is also being continuously updated and is improving, in use CMP planarization equipment to semiconductor chip etc. When material is processed by shot blasting, the great success and breakthrough of acquirement, a part is the reason is that because the innovation and progress of technology, another Partly cause is exactly the use because of a kind of CMP planarization equipment positioning fixture, so as to the clamping ratio of semiconductor transistor elements material It is more stable, to improve the quality of product and the success rate of polishing.

Existing technology has the following problems: when using CMP planarization equipment positioning fixture to semiconductor transistor elements chip into When row clamping, since the type of semiconductor die element chip is different, shape size is also different, and existing grips mouth all It is fixed size, to carry out aid fixation to different types of semiconductor die element chip, then needs replacing different positioning Fixture, so that existing CMP planarization equipment has certain limitation with locating clip.

It due to the small volume of semiconductor die element chip, is not easy to take out, existing method is that operator directly uses hand Operation is taken out, but semiconductor die element chip is having remaining chemical agent with CMP planarization equipment processing rear surface, it is such to do Method is not only not easy to take out the semiconductor die element chip gripped in mouth, but also is easy to cause half due to the fault of staff The damage of conductor wafer chip.

Utility model content

In view of the deficiencies of the prior art, the utility model provides a kind of CMP planarization equipment positioning fixture, and having can press from both sides Hold different types of semiconductor die element chip, semiconductor die element chip easily takes out, semiconductor die element chip facilitates storage and replacement The advantages that, it solves and can not clamp different types of semiconductor die element chip, semiconductor die element chip is not easily taken out, semiconductor die Element chip is inconvenient to the problem of storing and replacing.

For realize it is above-mentioned clamp different types of semiconductor die element chip, semiconductor die element chip easily takes out, semiconductor Wafer chip facilitates storage and replacement purpose, and the utility model provides the following technical solutions: a kind of CMP planarization equipment locating clip Tool, grips mouth including what outer housing and shell body front surface middle position opened up, described grip in mouth is provided with Fixation kit, the fixation kit include the first limit plate and the second limit plate, are welded on the inner wall for gripping mouth First limit plate is provided with the second limit plate, first limit plate and second limit below first limit plate Spring is provided between plate, one end of the spring is bumped into the inside of first limit plate, and the other end is bumped into second limit The inside of position plate, the side of the shell body front surface are welded with square plate, and the side of square plate is provided with gripper assembly, described Gripper assembly includes clip and ring segment, and the front surface of the square plate is welded with ring segment, in the front surface of the square plate It is placed with clip, the clip interts into the ring segment.

Preferably, the fixation kit further includes connecting rod and the second fixed block, the top one of second limit plate Connecting rod is formed, the second fixed block is welded with above connecting rod, is welded with limited block on the surface of the second fixed block side, The shell body front surface is welded with the first square block close to the side for gripping mouth, in the front surface of the first square block Card slot is offered, the shape size of limited block is matched with the shape size in card slot.

Preferably, the gripper assembly further includes the first fixed block and air pump, the outer surface welding of the outer housing side There is the first fixed block, the front surface of the first fixed block has been bolted air pump, has been provided between air pump and the clip soft Pipe, one end of hose are interted into the clip, are connected together different from one end of the clip and the output end of the air pump Together.

Preferably, the outer housing upper surface is welded with two fixture blocks, is provided with collection box above the outer housing, receives Collect the both ends below box integrally formed with the second square block, collection box is snap-fited into fixture block by the second square block, before collection box The side on surface is welded with label, is bonded with label by glue on label, the front surface of collection box offers chip slot.

Preferably, there are two the spring is arranged altogether, and two springs are with the middle position for gripping mouth Symmetrically.

Preferably, the ring segment is metal component, and is in semicircular arc structure.

Preferably, the thickness of the clip is consistent with radius size semicircular in ring segment.

Compared with prior art, the utility model provides a kind of CMP planarization equipment positioning fixture, has following beneficial Effect:

1, the CMP planarization equipment positioning fixture, by the spring on fixation kit, the first of fixation kit side is rectangular Different shape and size of semiconductor transistor elements chips can be clamped, prevent due to present semiconductor transistor elements by the structures such as block The type of chip is varied, and the positioning fixture for needing replacing different model could press from both sides corresponding semiconductor die element chip It holds fixed situation to occur, increases the utility function of device, and cost needed for having saved the different positioning fixtures of replacement.

2, the CMP planarization equipment positioning fixture, the clip by the square plate of outer housing upper surface side, on square plate Etc. structures, operator semiconductor transistor elements chip is clamped using clip, prevent due to semiconductor transistor elements chip volume compared with It is small, it is not easy to take out, and there is remaining chemical agent on surface, directly takes out the case where be easy to causeing wafer damage generation, guarantee The quality of product, enables the CMP planarization process normally to carry out.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the utility model；

Fig. 2 is the enlarged diagram in Fig. 1 at A；

Fig. 3 is the collection box schematic diagram of the utility model；

Fig. 4 is the ring segment schematic diagram of the utility model.

In figure: 1, outer housing；2, mouth is gripped；3, the first limit plate；4, fixation kit；5, the second limit plate；6, block Block；7, collection box；8, label；9, it marks；10, chip slot；11, the first fixed block；12, air pump；13, gripper assembly；14, rectangular Plate；15, clip；16, spring；17, connecting rod；18, the second fixed block；19, the first square block；20, card slot；21, second is rectangular Block；22, ring segment.

Specific embodiment

In conjunction with Fig. 1-4, among a kind of CMP planarization equipment positioning fixture, including 1 front surface of outer housing 1 and outer housing What position opened up grips mouth 2, grips and is provided with fixation kit 4 in mouth 2, and fixation kit 4 includes 3 He of the first limit plate Second limit plate 5, grips and is welded with the first limit plate 3 on the inner wall of mouth 2, and the lower section of the first limit plate 3 is provided with second Limit plate 5, is provided with spring 16 between the first limit plate 3 and the second limit plate 5, one end of spring 16 is bumped into the first limit plate 3 Inside, the other end is bumped into the inside of the second limit plate 5, and the side of 1 front surface of outer housing is welded with square plate 14, square plate 14 Side be provided with gripper assembly 13, gripper assembly 13 includes clip 15 and ring segment 22, and the front surface of square plate 14 is welded with Ring segment 22 is placed with clip 15 in the front surface of square plate 14, and clip 15 interts into ring segment 22.

Further, fixation kit 4 further includes connecting rod 17 and the second fixed block 18, the top one of the second limit plate 5 Connecting rod 17 is formed, the top of connecting rod 17 is welded with the second fixed block 18, welds on the surface of 18 side of the second fixed block There is limited block, 1 front surface of outer housing is welded with the first square block 19 close to the side for gripping mouth 2, the first square block 19 Card slot 20 is offered in front surface, the shape size of limited block is matched with the shape size in card slot 20, can be to semiconductor die Element chip is preferably fixed, and gripper assembly 13 further includes the first fixed block 11 and air pump 12, the type of air pump 12 in the utility model It number is XGB-7, the outer surface of 1 side of outer housing is welded with the first fixed block 11, and the front surface of the first fixed block 11 passes through bolt It is fixed with air pump 12, hose is provided between air pump 12 and clip 15, one end of hose is interted into clip 15, different from clip 15 One end and the output end of air pump 12 be connected together together, be capable of taking to semiconductor transistor elements chip for safe ready, 1 upper surface of outer housing is welded with two fixture blocks 6, and the top of outer housing 1 is provided with collection box 7, the both ends one of 7 lower section of collection box The second square block 21 is formed, collection box 7 is snap-fited into fixture block 6 by the second square block 21, the side weldering of 7 front surface of collection box It is connected to label 8, label 9 is bonded with by glue on label 8, the front surface of collection box 7 offers chip slot 10, and spring 16 is set altogether There are two setting, and two springs 16 are symmetrical with the middle position for gripping mouth 2, and ring segment 22 is metal component, and are in semicircle Arcuate structure enables clip 15 preferably to intert into ring segment 22, semicircle in the thickness and ring segment 22 of clip 15 Radius size it is consistent.

Working principle: the utility model mainly by outer housing 1,1 upper surface middle position of outer housing grip mouth 2, Grip the fixation kit 4 on mouth 2, the first limit plate 3 for gripping 2 interior side of mouth, grip inside mouth 2 different from Spring 16, the first limit plate 3 between second limit plate 5 of 3 side of the first limit plate, the first limit plate 3 and the second limit plate 5 The connecting rod 17 of top, the second fixed block 18 of 17 top of connecting rod, 18 side of the second fixed block the first square block 19, first Clip 15 on the square plate 14 of card slot 20,1 upper surface side of outer housing on square block 19,14 front surface of square plate, clip Ring segment 22 on 15, the first fixed block 11 on 1 one side external surface of outer housing, the air pump in 11 front surface of the first fixed block 12, the hose between air pump 12 and clip 15, the fixture block 6 of 1 top two sides of outer housing, the top of fixture block 6 collection box 7 and collect The structure compositions such as chip slot 10 and label 8 on box 7, during use, since the type of semiconductor die element chip is different, Shape size is also different, to carry out aid fixation to different types of semiconductor die element chip, then needs replacing difference Positioning fixture, the second fixed block 18 can be pulled from card slot 20 with hand, semiconductor die element chip is then put into the first limit plate 3 In the square groove formed with the second limit plate 5, the second lifting upwards of fixed block 18 of 17 side of connecting rod is hand-pulled, so that partly leading Body wafer chip is clamped, and there is limited block in the side of the second fixed block 18, can be snap-fited into limited block in suitable card slot 20, Semiconductor die element chip is fixed, to be processed by shot blasting to it, prevents the class due to present semiconductor die element chip Type is varied, needs replacing what the positioning fixture of different model could grip corresponding semiconductor die element chip It happens, increases the utility function of device, and cost needed for having saved the different positioning fixtures of replacement, due to semiconductor die The small volume of element chip is not easy to take out, and semiconductor die element chip with CMP planarization equipment processing rear surface have it is residual The chemical agent stayed is directly taken out with hand and is easy so that wafer damage, clip 15 can be pulled out from ring segment 22 with hand come, Air pump 12 is powered, while being clamped to semiconductor transistor elements chip with clip 15, by the connection of hose, in clip 15 The tracheae in portion has gas blowout and goes out, and cleans up the remaining chemical agent of semiconductor transistor elements chip surface, ensure that the quality of product, make Obtaining CMP planarization process can normally carry out, and when carrying out the polishing of semiconductor die element chip, the chip that there are many meetings carries out simultaneously The semiconductor die element chip taken can be put into collection box by engaging and the collection box 7 in 1 side fixture block 6 of outer housing by processing In chip slot 10 on 7, and the side of 7 front surface of collection box is bonded with label 8 by glue, can be according to the label 9 on label 8 Replacement processing is rapidly performed by semiconductor transistor elements chip, is improved work efficiency.

Elaborate many details in the above description in order to fully understand the utility model.But above description It is only the preferred embodiment of the utility model, the utility model can be come with being much different from other way described herein Implement, therefore the utility model is not limited by specific implementation disclosed above.Any those skilled in the art exist simultaneously It does not depart under technical solutions of the utility model ambit, it is all practical new to this using the methods and technical content of the disclosure above Type technical solution makes many possible changes and modifications or equivalent example modified to equivalent change.It is all without departing from this The content of utility model technical solution any is simply repaired according to the technical essence of the utility model is made to the above embodiment Change, equivalent variations and modification, in the range of still falling within technical solutions of the utility model protection.

Claims (7)

1. a kind of CMP planarization equipment positioning fixture, including outer housing (1) and outer housing (1) front surface middle position open up Grip mouth (2), it is characterised in that: described grip is provided with fixation kit (4), the fixation kit in mouth (2) (4) include the first limit plate (3) and the second limit plate (5), be welded with the first limit plate on the inner wall for gripping mouth (2) (3), it is provided with the second limit plate (5) below first limit plate (3), first limit plate (3) and second limit It is provided with spring (16) between position plate (5), one end of the spring (16) is bumped into the inside of first limit plate (3), another End is bumped into the inside of second limit plate (5), and the side of outer housing (1) front surface is welded with square plate (14), rectangular The side of plate (14) is provided with gripper assembly (13), and the gripper assembly (13) includes clip (15) and ring segment (22), described The front surface of square plate (14) is welded with ring segment (22), is placed with clip (15), institute in the front surface of the square plate (14) Clip (15) is stated to intert into the ring segment (22).

2. a kind of CMP planarization equipment positioning fixture according to claim 1, it is characterised in that: the fixation kit (4) Further include connecting rod (17) and the second fixed block (18), the top of second limit plate (5) integrally formed with connecting rod (17), It is welded with above connecting rod (17) the second fixed block (18), is welded with limited block on the surface of the second fixed block (18) side, Outer housing (1) front surface is welded with the first square block (19), the first square block close to the side for gripping mouth (2) (19) it is offered in front surface card slot (20), the shape size of limited block is matched with the shape size in card slot (20).

3. a kind of CMP planarization equipment positioning fixture according to claim 1, it is characterised in that: the gripper assembly It (13) further include the first fixed block (11) and air pump (12), the outer surface of outer housing (1) side is welded with the first fixed block (11), the front surface of the first fixed block (11) has been bolted air pump (12), between air pump (12) and the clip (15) It is provided with hose, one end of hose is interted into the clip (15), one end and the air pump different from the clip (15) (12) output end is connected together together.

4. a kind of CMP planarization equipment positioning fixture according to claim 1, it is characterised in that: on the outer housing (1) Surface is welded with two fixture blocks (6), is provided with collection box (7) above the outer housing (1), the both ends below collection box (7) Integrally formed with the second square block (21), collection box (7) is snap-fited into fixture block (6) by the second square block (21), collection box (7) The side of front surface is welded with label (8), is bonded with label (9) on label (8) by glue, and the front surface of collection box (7) is opened Equipped with chip slot (10).

5. a kind of CMP planarization equipment positioning fixture according to claim 1, it is characterised in that: the spring (16) is altogether There are two settings, and two springs (16) are symmetrical with the middle position for gripping mouth (2).

6. a kind of CMP planarization equipment positioning fixture according to claim 1, it is characterised in that: the ring segment (22) It for metal component, and is in semicircular arc structure.

7. a kind of CMP planarization equipment positioning fixture according to claim 3, it is characterised in that: the clip (15) Thickness is consistent with semicircular radius size in ring segment (22).