CN208908512U - A kind of double-layered circuit board - Google Patents

A kind of double-layered circuit board Download PDF

Info

Publication number
CN208908512U
CN208908512U CN201820804344.1U CN201820804344U CN208908512U CN 208908512 U CN208908512 U CN 208908512U CN 201820804344 U CN201820804344 U CN 201820804344U CN 208908512 U CN208908512 U CN 208908512U
Authority
CN
China
Prior art keywords
main body
wiring board
board main
via hole
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820804344.1U
Other languages
Chinese (zh)
Inventor
刘长松
查红平
文伟峰
龙文卿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Redboard Technology Co Ltd
Original Assignee
Ji'an City Jun Map Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ji'an City Jun Map Technology Co Ltd filed Critical Ji'an City Jun Map Technology Co Ltd
Priority to CN201820804344.1U priority Critical patent/CN208908512U/en
Application granted granted Critical
Publication of CN208908512U publication Critical patent/CN208908512U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model discloses a kind of double-layered circuit boards, including wiring board main body, the quadrangle of wiring board main body is provided with through-hole, the bosom position of wiring board main body is provided with contact chip, if the surface of contact chip is provided with dry contact, contact is evenly distributed on contact chip surface, the bottom of contact chip is provided with mounting seat, pin seat is provided at left and right sides of mounting seat, several jacks are evenly distributed with inside pin seat, one end of pin seat is provided with connecting wire, the other end of connecting wire is L-type bus, the end of L-type bus is provided with via hole, the side of L-type bus is provided with capacitor mounting base, the both ends of capacitor mounting base are also equipped with via hole, two pairs of latches piece is provided at left and right sides of wiring board main body, it is not interfere with each other between the via hole on upper layer and the via hole of lower layer, so that the circuit that front or reverse side is arranged in can be with It works independently, there is no interference between each other, so that the utilization rate of entire plank greatly improves.

Description

A kind of double-layered circuit board
Technical field
The utility model relates to wiring board technology field, specially a kind of double-layered circuit board.
Background technique
Various electrical components are integrated on wiring board, general wiring board is single sided board, and only one side can pacify Fill component, With the development and progress of science and technology, single sided board can no longer meet actual needs, the following dual platen and Multi-panel comes into being, but the public via hole of general dual platen tow sides, and tow sides circuit can not complete independently There is interference in work, so that entire plank service efficiency is lower between each other.
So how to design a kind of double-layered circuit board, becoming us will currently be solved the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of double-layered circuit board, with solve it is mentioned above in the background art still The general public via hole of dual platen tow sides, tow sides circuit can not complete independently work, exist between each other dry It disturbs, so that the problem that entire plank service efficiency is lower.
To achieve the above object, the utility model provides the following technical solutions: a kind of double-layered circuit board, including wiring board master Body, the quadrangle of the wiring board main body are provided with through-hole, and the bosom position of the wiring board main body is provided with contact chip, institute If the surface for stating contact chip is provided with dry contact, the contact is evenly distributed on the contact chip surface, the bottom of the contact chip Portion is provided with mounting seat, and the mounting seat is respectively provided at left and right sides of the mounting seat using made of plastic material There is pin seat, several jacks is evenly distributed with inside the pin seat, one end of the pin seat is provided with connecting wire, described The other end of connecting wire is L-type bus, and the end of the L-type bus is provided with via hole, the side setting of the L-type bus There is capacitor mounting base, the both ends of the capacitor mounting base are also equipped with via hole, are provided at left and right sides of the wiring board main body Two pairs of latches piece, the plug blades are made of brass material.
Further, the wiring board main body is divided into upper layer and lower layer, and the upper layer is by top plate, copper foil layer and EMI electromagnetism Shielded layer is constituted, and the lower layer is made of EMI electro-magnetic screen layer, copper foil layer and bottom.
Further, substrate film is provided between the upper layer and the lower layer, the substrate film is answered by macromolecule Condensation material is made.
Further, the side of the via hole is provided with patch, and the patch is made by brass material.
Further, the via hole is disposed through top plate, copper foil layer and EMI electro-magnetic screen layer, the mistake on the upper layer It is not interfere with each other between hole and the via hole of the lower layer.
Compared with prior art, the utility model has the beneficial effects that
1. not interfere with each other between the via hole on the upper layer and the via hole of the lower layer, so that being arranged in positive or reverse side Circuit can work independently, and there is no interference between each other, so that the utilization rate of entire plank greatly improves, while via hole Surface is provided with patch made of copper, and the Connected degree between component's feet and via hole can be enhanced.
2. the two sides of assist side main body are provided with two pairs of latches piece, so that entire wiring board main body is non-during the installation process It is often convenient.
3. assist side body interior is provided with EMI electro-magnetic screen layer, wiring board main body can protect not by external electromagnetic It influences, while substrate film can play the role of insulation protection.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model;
Fig. 2 is the schematic diagram of internal structure of the utility model;
Fig. 3 is the structural schematic diagram of the utility model contact chip;
In figure: 1- capacitor mounting base;2- connecting wire;3- wiring board main body;4- through-hole;5- plug blades;6- contact chip;7- Mounting seat;8- pin seat;9- via hole;10- top plate;11- patch;12- copper foil layer;13-EMI electro-magnetic screen layer;14- substrate glue Piece;15- bottom;The contact 16-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of double-layered circuit board, including wiring board main body 3, the quadrangle of the wiring board main body 3 is provided with through-hole 4, and screw easy to use is fixed, the inside of the wiring board main body 3 Middle position is provided with contact chip 6, if the surface of the contact chip 6 is provided with dry contact 16, the contact 16 is evenly distributed on 6 surface of contact chip, facilitates and installs related chip in assist side main body 3, and the bottom of the contact chip 6 is provided with installation bottom Seat 7, for the mounting seat 7 using made of plastic material, the left and right sides of the mounting seat 7 is provided with pin seat 8, institute It states and is evenly distributed with several jacks inside pin seat 8, one end of the pin seat 8 is provided with connecting wire 2, the connecting wire 2 other end is L-type bus, and the end of the L-type bus is provided with via hole 9, and the side of the L-type bus is provided with capacitor Mounting base 1, the both ends of the capacitor mounting base 1 are also equipped with via hole 9, and the left and right sides of the wiring board main body 3 is provided with two To plug blades 5, the plug blades 5 are made of brass material.The above constitutes the utility model basic structure.
The utility model uses such structure setting, and the two sides of wiring board main body 3 are provided with two pairs of latches piece 5, So that entire wiring board main body 3 is very convenient during the installation process.Assist side main body 3 is internally provided with EMI electro-magnetic screen layer 13, it can protect wiring board main body 3 not by external electromagnetic influences, while substrate film 14 can play the role of insulation protection, It is not interfere with each other between the via hole 9 on the upper layer and the via hole 9 of the lower layer, so that the circuit that front or reverse side is arranged in can be with It works independently, there is no interference between each other, so that the utilization rate of entire plank greatly improves, while the surface of via hole 9 is set It is equipped with patch 11 made of copper, the Connected degree between component's feet and via hole can be enhanced.
More specifically, the wiring board main body 3 is divided for upper layer and lower layer, the upper layer by top plate 10, copper foil layer 12 and EMI electro-magnetic screen layer 13 is constituted, and the lower layer is made of EMI electro-magnetic screen layer 13, copper foil layer 12 and bottom 15, it is preferred that So that 3 upper layer and lower layer of wiring board main body can work independently, it does not interfere with each other.
More specifically, it is provided with substrate film 14 between the upper layer and the lower layer, the substrate film 14 is by height Molecular composite material is made, it is preferred that plays the role of insulation protection.
Working principle: firstly, two pairs of latches piece 5 is provided with by the two sides of wiring board main body 3, so that entire wiring board master Body 3 is very convenient during the installation process.Assist side main body 3 is internally provided with EMI electro-magnetic screen layer 13, can protect wiring board Main body 3 is not by external electromagnetic influences, while substrate film 14 can play the role of insulation protection, the via hole 9 on the upper layer with It is not interfere with each other between the via hole 9 of the lower layer, the circuit that front or reverse side is arranged in is worked independently, between each other There is no interference, so that the utilization rate of entire plank greatly improves, while the surface of via hole 9 is provided with patch 11 made of copper, The Connected degree between component's feet and via hole can be enhanced.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of double-layered circuit board, including wiring board main body (3), it is characterised in that: the quadrangle of the wiring board main body (3) is arranged Have through-hole (4), the bosom position of the wiring board main body (3) is provided with contact chip (6), the surface of the contact chip (6) If being provided with dry contact (16), the contact (16) is evenly distributed on the contact chip (6) surface, the bottom of the contact chip (6) Portion is provided with mounting seat (7), and the mounting seat (7) uses made of plastic material, the left and right two of the mounting seat (7) Side is provided with pin seat (8), is evenly distributed with several jacks inside the pin seat (8), one end of the pin seat (8) is set It is equipped with connecting wire (2), the other end of the connecting wire (2) is L-type bus, and the end of the L-type bus was provided with Hole (9), the side of the L-type bus are provided with capacitor mounting base (1), and the both ends of the capacitor mounting base (1) were also equipped with Hole (9) is provided with two pairs of latches piece (5) at left and right sides of the wiring board main body (3), and the plug blades (5) use brass material Material is made.
2. a kind of double-layered circuit board according to claim 1, it is characterised in that: the wiring board main body (3) is divided into up and down Two layers, the upper layer of the wiring board main body (3) is made of top plate (10), copper foil layer (12) and EMI electro-magnetic screen layer (13), institute The lower layer for stating wiring board main body (3) is made of EMI electro-magnetic screen layer (13), copper foil layer (12) and bottom (15).
3. a kind of double-layered circuit board according to claim 2, it is characterised in that: the upper layer of the wiring board main body (3) with It is provided with substrate film (14) between the lower layer of the wiring board main body (3), the substrate film (14) is by macromolecule composite wood Material is made.
4. a kind of double-layered circuit board according to claim 2, it is characterised in that: the side of the via hole (9) is provided with patch Piece (11), the patch (11) are made by brass material.
5. a kind of double-layered circuit board according to claim 4, it is characterised in that: the via hole (9) is disposed through top plate (10), copper foil layer (12) and EMI electro-magnetic screen layer (13), the via hole (9) and the line on the upper layer of the wiring board main body (3) It is not interfere with each other between the via hole (9) of the lower layer of road plate main body (3).
CN201820804344.1U 2018-05-28 2018-05-28 A kind of double-layered circuit board Active CN208908512U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820804344.1U CN208908512U (en) 2018-05-28 2018-05-28 A kind of double-layered circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820804344.1U CN208908512U (en) 2018-05-28 2018-05-28 A kind of double-layered circuit board

Publications (1)

Publication Number Publication Date
CN208908512U true CN208908512U (en) 2019-05-28

Family

ID=66612132

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820804344.1U Active CN208908512U (en) 2018-05-28 2018-05-28 A kind of double-layered circuit board

Country Status (1)

Country Link
CN (1) CN208908512U (en)

Similar Documents

Publication Publication Date Title
CN208908512U (en) A kind of double-layered circuit board
CN205902213U (en) Take anti -static function's circuit board drilling apron
CN207835925U (en) A kind of wiring board facilitating installation
CN206365131U (en) A kind of circuit board of quick heat radiating
CN206061373U (en) The package assembly of power module
CN204721711U (en) A kind of multilayer circuit board
CN214757110U (en) A picture peg frame for inserting put printed circuit board
CN209497666U (en) A kind of heat radiating type board structure of circuit
CN206932459U (en) A kind of environmentally-friendly multi-layer insulation base circuit board
CN204680854U (en) Usb plug circuit board
CN206908946U (en) A kind of high wiring density printed circuit board (PCB)
CN207783285U (en) A kind of integral type HDI wiring boards
CN207305054U (en) A kind of LED display wiring board for preventing short circuit
CN103415153A (en) Steel disc ground production method of FPC silver paste pouring hole
CN206210499U (en) A kind of Anti-inclining piezo-resistance
CN206728381U (en) Surface Mount power module
CN206282996U (en) A kind of attachment structure of printed circuit board
CN206402519U (en) A kind of FPC circuit board structures suitable for multilayer jigsaw
CN208428398U (en) A kind of glued board with electro-magnetic screen function
CN205648177U (en) High insulating circuit board that is used for resistant high voltage ring border
CN206713150U (en) A kind of one side pcb board
CN204733462U (en) A kind of circuit board based on ceramic material
CN206947574U (en) A kind of combined type pcb board
CN207783243U (en) A kind of electrode structure for positioning and being electrically connected
CN207947948U (en) A kind of glass fibre laminated PCB copper-clad plates of light two-sided

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20200428

Address after: 343100 No. 281 Jingjiu Avenue, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province

Patentee after: RED BOARD (JIANGXI) Co.,Ltd.

Address before: 343600 No. 281 Beijing Kowloon Road, Jinggangshan national economic and Technological Development Zone, Ji'an, Jiangxi

Patentee before: JI'AN JUNTU TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
CP01 Change in the name or title of a patent holder

Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100

Patentee after: Jiangxi hongban Technology Co.,Ltd.

Address before: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100

Patentee before: RED BOARD (JIANGXI) Co.,Ltd.

CP01 Change in the name or title of a patent holder