CN208904996U - A kind of small size LoRa radio frequency mould group - Google Patents
A kind of small size LoRa radio frequency mould group Download PDFInfo
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- CN208904996U CN208904996U CN201821505618.3U CN201821505618U CN208904996U CN 208904996 U CN208904996 U CN 208904996U CN 201821505618 U CN201821505618 U CN 201821505618U CN 208904996 U CN208904996 U CN 208904996U
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- radio frequency
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- lora
- mould group
- lora radio
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Abstract
The utility model discloses a kind of small size LoRa radio frequency mould group, belongs to wireless communication field.It includes LoRa radio frequency chip, using or integrated LoRa modulation technique chip；RF switch chip, according to the output level of the LoRa radio frequency chip, changes its connection type when radio frequency mould group is in difference and sends and receives state.Wherein, LoRa radio frequency chip is matched by radio-frequency transmissions and filter circuit is connected with RF switch chip；RF switch chip is matched by radio frequency reception and filter circuit is connected with LoRa radio frequency chip.Radio-frequency transmissions matching and filter circuit include LC match circuit and second level pi type filter, and radio frequency reception matching and filter circuit include two stage filter circuit.Small size LoRa radio frequency mould group emphasis solves the technical issues of different frequent points need disparate modules, is guaranteeing propagation distance and while low-power so that can frequency point select it is more sufficient.
Description
Technical field
The utility model relates to wireless communication technology field, in particular to a kind of small size Lora radio frequency mould group.
Background technique
LoRa is a kind of long range wireless communication technology of Semtech company research and development, reachable in field spread scope
10km.By the interconnection between disparate modules node, self networking, by its powerful transmission capacity, radio meter register,
On the directions such as security protection, agricultural, industry using more and more extensive.
The optional frequency range of the LoRa communication technology is wider, and traditional design scheme is designed mainly for single-frequency point, causes answering
It is less with optional frequency range in the process, also there is the functional module of varied different frequent points, leads to resource significant wastage.
Utility model content
The purpose of this utility model is to provide a kind of small size LoRa radio frequency mould groups, are needed not with solving current different frequent points
Same module, the problem of leading to resource significant wastage.
In order to solve the above technical problems, the utility model provides a kind of small size LoRa radio frequency mould group, comprising:
LoRa radio frequency chip, using or integrated LoRa modulation technique chip；
RF switch chip, when radio frequency mould group is in difference and sends and receives state, according to the LoRa radio frequency chip
Output level, change its connection type；
Wherein, the LoRa radio frequency chip passes through radio-frequency transmissions matching and filter circuit and the RF switch chip phase
Even；The RF switch chip is matched by radio frequency reception and filter circuit is connected with the LoRa radio frequency chip；
The radio-frequency transmissions matching and filter circuit include LC match circuit and second level pi type filter, the radio frequency reception
Matching and filter circuit include two stage filter circuit.
Optionally, the small size LoRa radio frequency mould group further includes crystal oscillator match circuit and power filter and decoupling circuit,
It is connected with the LoRa radio frequency chip.
Optionally, the RXTX pin of the LoRa radio frequency chip connects digital triode.
Optionally, the small size LoRa radio frequency mould group uses half bore technique, and metallic shield surrounds entire radio frequency
The circuit of mould group.
Optionally, the RF switch chip is the single-pole double-throw switch (SPDT) chip of a pair of of multichannel.
Optionally, the crystal oscillator match circuit is 32MHz crystal oscillator match circuit.
Optionally, the 32MHz crystal oscillator match circuit provides crystal oscillation signal to the LoRa radio frequency chip.
Optionally, the metallic shield uses quadrangle, with a thickness of 1.8mm~2.2mm.
In small size LoRa radio frequency mould group provided by the utility model, including LoRa radio frequency chip, using or it is integrated
The chip of LoRa modulation technique；RF switch chip, when radio frequency mould group is in difference and sends and receives state, according to described
The output level of LoRa radio frequency chip changes its connection type.Wherein, LoRa radio frequency chip is matched and is filtered by radio-frequency transmissions
Circuit is connected with RF switch chip；RF switch chip passes through radio frequency reception matching and filter circuit and LoRa radio frequency chip phase
Even；Radio-frequency transmissions matching and filter circuit include LC match circuit and second level pi type filter, so that guaranteeing transmitting in transmitting signal
While performance, the excessive situation of harmonic wave can be avoided to the greatest extent；Radio frequency reception matching and filter circuit include two-stage
Filter circuit can reduce radio frequency chip for the reception for being applicable in frequency range with external signal to the greatest extent, reduce to the greatest extent
Rate of false alarm of the radio frequency chip due to other signals.Small size LoRa radio frequency mould group emphasis, which solves different frequent points, needs disparate modules
The technical issues of, guaranteeing propagation distance and while low-power so that can frequency point select it is more sufficient.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the small size LoRa radio frequency mould group that the utility model embodiment one provides；
Fig. 2 is the schematic diagram of mould group shape；
Fig. 3 is the schematic diagram of mould group pad.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of small size LoRa radio frequency mould group make into
One step is described in detail.According to following explanation and claims, will be become apparent from feature the advantages of the utility model.It should be noted
It is that attached drawing is all made of very simplified form and using non-accurate ratio, only to facilitate, lucidly aid in illustrating this reality
With the purpose of new embodiment.
Embodiment one
The utility model provides a kind of small size LoRa radio frequency mould group, and structure is as shown in Figure 1.The small size LoRa
Radio frequency mould group includes LoRa radio frequency chip 1 and RF switch chip 5, and the LoRa radio frequency chip 1 uses or integrated LoRa modulation
In frequency range 400MHz-520MHz, using single frequency point or multiple frequency points, it is exportable that 20dBm is arranged in the chip of technology
19 ± 1dBm signal strength solves the drawbacks of different frequency range is using different circuit parameters；The RF switch chip 5 is
The single-pole double-throw switch (SPDT) chip of a pair of of multichannel is penetrated when radio frequency mould group is in difference and sends and receives state according to the LoRa
The output level of frequency chip 1 changes its connection type.Specifically, the LoRa radio frequency chip 1 is by penetrating please continue to refer to Fig. 1
It takes place frequently and penetrates matching and filter circuit 2 and be connected with the RF switch chip 5；The RF switch chip 5 passes through radio frequency reception
Match and filter circuit 3 is connected with the LoRa radio frequency chip 1.The radio-frequency transmissions matching and filter circuit 2 and the radio frequency connect
The signal that receipts matching and filter circuit 3 send or receive the LoRa radio frequency chip 1 is filtered and matches.The radio frequency hair
Matching and filter circuit 2 are penetrated in 400MHz-520MHz, can utmostly reduce the decaying of radiofrequency signal, it is enough to guarantee
Transmission power；The radio frequency reception matching and filter circuit 3 can utmostly reduce input in 400MHz-520MHz
The decaying of wireless signal guarantees the enough lowest resolutions of chip.Further, the radio-frequency transmissions matching and filter circuit 2
Including LC match circuit and second level pi type filter, so that while emitting signal guarantee emitting performance, it can be maximum
Avoid the situation that harmonic wave is excessive；The radio frequency reception matching and filter circuit 3 include two stage filter circuit, can be maximum
Radio frequency chip is reduced for being applicable in frequency range with the reception of external signal, reduces radio frequency chip to the greatest extent due to the mistake of other signals
Report rate.
Specifically, the small size LoRa radio frequency mould group further includes crystal oscillator match circuit 4 and power filter and decoupling circuit
6, it is connected with the LoRa radio frequency chip 1.Cost is greatly reduced, power consumption is reduced, improves transmission performance.The crystal oscillator
Match circuit 4 is preferably 32MHz crystal oscillator match circuit, provides crystal oscillation signal to the LoRa radio frequency chip 1.The LoRa radio frequency
The RXTX pin of chip 1 can be high level in transmitting automatically according to chip functions in transmitting and reception state automatically,
It is automatically low level when reception state.The RXTX pin of the LoRa radio frequency chip 1 connects digital triode, so that in RXTX high electricity
Usually, digital triode exports low level, and in RXTX low level, digital triode exports high level, it is possible thereby to pass through number
The connection type of word triode and RXTX pin control RF switch chip, reaches outputting and inputting for radio frequency.
The small size LoRa radio frequency mould group uses 2mm spacing half bore technique, does not use via hole welding, half hole number is such as
Shown in Fig. 2, make mould group in use, reflow soldering process can be pasted using the faster machine of speed, improve mould in production
Group installation effectiveness.Metallic shield surrounds the circuit of entire radio frequency mould group.The metallic shield with a thickness of 1.8mm~2.2mm,
Using quadrangle, multiple spot pad mode is completed with mould group welding, keeps its installation easier, be more favorable for producing and processing.Mould group
Pad as shown in figure 3, its interface function to define figure as shown in table 1.In performance, metallic shield maximum likelihood reduces
Influence of the external environment to mould group itself in use of mould group also greatly reduces mould group radio circuit to extraneous radiation
It influences.
| Pin symbol | Function declaration |
| MISO | Module SPI Serial Communication Function pin |
| MOSI | Module SPI Serial Communication Function pin |
| NSS | Module SPI Serial Communication Function pin |
| SCK | Module SPI Serial Communication Function pin |
| GND | Module ground pin |
| RF | Module radio frequency inputs input function pin |
| REST | Module resets functional pin |
| DIO0 | Module LoRa chip functions pin |
| DIO1 | Module LoRa chip functions pin |
| DIO2 | Module LoRa chip functions pin |
| DIO3 | Module LoRa chip functions pin |
| DIO5 | Module LoRa chip functions pin |
| VCC | Modular power source pin |
Table 1
Foregoing description is only the description to the utility model preferred embodiment, not to any limit of the scope of the utility model
Fixed, any change, the modification that the those of ordinary skill in the utility model field does according to the disclosure above content belong to right and want
Seek the protection scope of book.
Claims (7)
1. a kind of small size LoRa radio frequency mould group characterized by comprising
LoRa radio frequency chip, using or integrated LoRa modulation technique chip；
RF switch chip, when radio frequency mould group is in difference and sends and receives state, according to the defeated of the LoRa radio frequency chip
Level out changes its connection type；
Wherein, the LoRa radio frequency chip is matched by radio-frequency transmissions and filter circuit is connected with the RF switch chip；Institute
It states RF switch chip and is connected by radio frequency reception matching and filter circuit with the LoRa radio frequency chip；
The radio-frequency transmissions matching and filter circuit include LC match circuit and second level pi type filter, the radio frequency reception matching
And filter circuit includes two stage filter circuit；
The RXTX pin of the LoRa radio frequency chip connects digital triode.
2. small size LoRa radio frequency mould group as described in claim 1, which is characterized in that the small size LoRa radio frequency mould group is also
Including crystal oscillator match circuit and power filter and decoupling circuit, it is connected with the LoRa radio frequency chip.
3. small size LoRa radio frequency mould group as claimed in claim 1 or 2, which is characterized in that the small size LoRa radio frequency mould
Group uses half bore technique, and metallic shield surrounds the circuit of entire radio frequency mould group.
4. small size LoRa radio frequency mould group as described in claim 1, which is characterized in that the RF switch chip is one-to-many
The single-pole double-throw switch (SPDT) chip on road.
5. small size LoRa radio frequency mould group as claimed in claim 2, which is characterized in that the crystal oscillator match circuit is 32MHz
Crystal oscillator match circuit.
6. small size LoRa radio frequency mould group as claimed in claim 5, which is characterized in that the 32MHz crystal oscillator match circuit pair
The LoRa radio frequency chip provides crystal oscillation signal.
7. small size LoRa radio frequency mould group as claimed in claim 3, which is characterized in that the metallic shield uses four sides
Shape, with a thickness of 1.8mm~2.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821505618.3U CN208904996U (en) | 2018-09-14 | 2018-09-14 | A kind of small size LoRa radio frequency mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821505618.3U CN208904996U (en) | 2018-09-14 | 2018-09-14 | A kind of small size LoRa radio frequency mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208904996U true CN208904996U (en) | 2019-05-24 |
Family
ID=66572399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821505618.3U Active CN208904996U (en) | 2018-09-14 | 2018-09-14 | A kind of small size LoRa radio frequency mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208904996U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594137A (en) * | 2021-07-26 | 2021-11-02 | 上海艾为电子技术股份有限公司 | Wafer level packaging structure and packaging method |
-
2018
- 2018-09-14 CN CN201821505618.3U patent/CN208904996U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594137A (en) * | 2021-07-26 | 2021-11-02 | 上海艾为电子技术股份有限公司 | Wafer level packaging structure and packaging method |
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| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214000 Jiangsu province Binhu District of Wuxi City Liyuan Development Zone 06-4 block (DiCui Road No. 100) 9 Building 2 layer Patentee after: ZHONGKEXIN INTEGRATED CIRCUIT Co.,Ltd. Address before: 214000 Jiangsu province Binhu District of Wuxi City Liyuan Development Zone 06-4 block (DiCui Road No. 100) 9 Building 2 layer Patentee before: CHINA KEY SYSTEM & INTEGRATED CIRCUIT Co.,Ltd. |