CN209435223U - A kind of LoRa transparent transmission mould group - Google Patents

Abstract

The utility model discloses a kind of LoRa transparent transmission mould group, belongs to wireless communication field.Chip is handled including low-power consumption, the low-power consumption processing chip is connected with LoRa radio frequency chip, radio-frequency transmissions matching and filter circuit and RF switch chip in turn, the radio-frequency transmissions matching and filter circuit include LC match circuit and second level pi type filter, radio frequency reception matching and filter circuit are also connected between the LoRa radio frequency chip and RF switch chip, the radio frequency reception matching and filter circuit include two stage filter circuit.In a kind of LoRa transparent transmission mould group provided by the utility model, emphasis solves in practical applications due to hypertelorism, lead to that the problem of gateway uploads data and receives data can not be communicated or can not be precisely connected between LoRa product, while guaranteeing transmitting and receiving power, frequency point diversification is selected, meet the compatibility of different manufacturers difference LoRa product, the distance of LoRa signal transmission can be improved to the greatest extent.

Description

A kind of LoRa transparent transmission mould group

Technical field

The utility model relates to wireless communication technique field, in particular to a kind of LoRa transparent transmission mould group.

Background technique

LoRa is a kind of long range wireless communication technology of Semtech company research and development, reachable in field spread scope 10km.By the interconnection between disparate modules node, self networking, by its powerful transmission capacity, radio meter register, On the directions such as security protection, agricultural, industry using more and more extensive.

The optional frequency range of the LoRa communication technology is wider, and farther out, but in some cases, LoRa product uses ring to propagation distance Border is more severe, greatly shortens signal transmission distance, for the reliability for guaranteeing signal transmission, needs to increase level-one LoRa biography It is defeated.And the diversification of the LoRa product frequency point due to different manufacturers factory, when designing LoRa transparent transmission, it is possible to cause a variety of The different mould group of the frequency point of multiplicity, leads to resource significant wastage.

Utility model content

The purpose of this utility model is to provide a kind of LoRa transparent transmission mould group, with solve LoRa product use environment more When severe, signal transmission distance is greatly shortened, and for the reliability for guaranteeing signal transmission, needs to increase level-one LoRa transmission；And Due to the diversification of the LoRa product frequency point of different manufacturers factory, when designing LoRa transparent transmission, it is possible to cause diversified The different mould group of frequency point, the problem of leading to resource significant wastage.

In order to solve the above technical problems, the utility model provides a kind of LoRa transparent transmission mould group, including low-power consumption handles core Piece, the low-power consumption processing chip are connected with LoRa radio frequency chip, radio-frequency transmissions matching and filter circuit and RF switch in turn Chip, the radio-frequency transmissions matching and filter circuit include LC match circuit and second level pi type filter, the LoRa radio frequency chip Radio frequency reception matching and filter circuit, the radio frequency reception matching and filter circuit packet are also connected between RF switch chip Include two stage filter circuit.

Optionally, low-power consumption processing chip be also connected with 32.768KHz crystal oscillator match circuit, ESD protection circuit and First power filter and decoupling circuit, the LoRa radio frequency chip are also connected with 32MHZ crystal oscillator match circuit and second source filter Involve decoupling circuit.

Optionally, the low-power consumption processing chip is that the low-power consumption of STM8L series handles chip.

Optionally, the RF switch chip is the SPDTSwitch chip of a pair of of multichannel.

Optionally, the outside of the LoRa transparent transmission mould group is equipped with metallic shield, and the metallic shield surrounds entirely The circuit of LoRa transparent transmission mould group.

Optionally, the metallic shield with a thickness of 1.8mm~2.2mm.

In a kind of LoRa transparent transmission mould group provided by the utility model, emphasis is solved in practical applications due to apart from mistake Far, lead to that the problem of gateway uploads data and receives data can not be communicated or can not be precisely connected between LoRa product, While guaranteeing transmitting and receive power, frequency point diversification is selected, the simultaneous of different manufacturers difference LoRa product is met Capacitive can improve the distance of LoRa signal transmission to the greatest extent.

Detailed description of the invention

Fig. 1 is a kind of LoRa transparent transmission mould group functional block diagram provided by the utility model；

Fig. 2 is a kind of LoRa transparent transmission mould group appearance schematic diagram provided by the utility model；

Fig. 3 is a kind of schematic diagram of LoRa transparent transmission mould group pad provided by the utility model.

Specific embodiment

Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of LoRa transparent transmission mould group make further it is detailed It describes in detail bright.According to following explanation and claims, will be become apparent from feature the advantages of the utility model.It should be noted that attached Figure is all made of very simplified form and using non-accurate ratio, only to convenient, lucidly aid illustration is originally practical new The purpose of type embodiment.

The utility model provides a kind of LoRa transparent transmission mould group, including low-power consumption handles chip 7, preferably, described low It is that the low-power consumption of STM8L series handles chip that power consumption, which handles chip 7, and the low-power consumption processing chip 7 is connected with LoRa radio frequency in turn Chip 1, radio-frequency transmissions matching and filter circuit 2 and RF switch chip 5, preferably, the LoRa radio frequency chip 1 is to use Or the chip of integrated LoRa modulation technique, in frequency range 400MHz-520MHz or its sub- frequency range collection, using single frequency Exportable 19 ± 1dBm the signal strength of 20dBm is arranged in point or multiple frequency points, solves and uses different circuit parameters in different frequency range The drawbacks of；Preferably, the RF switch chip 5 is the SPDTSwitch chip of a pair of of multichannel, at LoRa transparent transmission mould group When difference sends and receives state, according to the output level of the LoRa radio frequency chip 1 and low-power consumption processing chip 7, change Its connection type；Radio frequency reception matching and filter circuit are also connected between the LoRa radio frequency chip 1 and RF switch chip 5 3, radio frequency reception matching and filter circuit 3 include two stage filter circuit, can reduce to the greatest extent radio frequency chip for Frequency range is applicable in the reception of external signal, reduces radio frequency chip to the greatest extent due to the rate of false alarm of other signals.The radio frequency hair It penetrates matching and filter circuit 2 and radio frequency reception matching and filter circuit 3 sends or receives the LoRa radio frequency chip 1 Signal is filtered and matches.The radio-frequency transmissions matching and filter circuit 2 are in 400MHz-520MHz or its sub- frequency range It is interior, the decaying of radiofrequency signal can be reduced, utmostly to guarantee enough transmission powers；The radio frequency reception matching and filtering Circuit 3 can utmostly reduce the decaying of input wireless signal in 400MHz-520MHz or its sub- frequency range, guarantee The enough lowest resolutions of chip.Further, the radio-frequency transmissions matching and filter circuit 2 include LC match circuit and second level Pi type filter, so that while emitting signal and guaranteeing emitting performance, the situation that harmonic wave can be avoided to the greatest extent excessive；

The low-power consumption processing chip 7 is also connected with 32.768KHz crystal oscillator match circuit 8, ESD protection circuit 9 and first Power filter and decoupling circuit 10, the LoRa radio frequency chip 1 are also connected with 32MHZ crystal oscillator match circuit 4 and second source filter Involve decoupling circuit 6.The 32MHZ crystal oscillator match circuit 4 provides crystal oscillation signal to the LoRa radio frequency chip 1.The LoRa The PB7 pin of RXTX pin and low-power consumption processing chip inside radio frequency chip 1, can be according to application in transmitting and reception state Required transmitting or receive capabilities automatic adjustment pin export low and high level, the high electricity of RXTX pin output in the state of transmission Flat, PB3 pin configuration exports high level, is connected to so that RF switch chip output pin be made to send match circuit by radio frequency The radio frequency of LoRa radio frequency chip sends pin, and in reception state, RXTX pin output low level, PB3 pin export high level, To the radio frequency reception pin for making RF switch chip output pin be connected to LoRa radio frequency chip by receiving match circuit.By This connection type can reach outputting and inputting for radio frequency.

The LoRa transparent transmission mould group uses 2mm spacing half bore and through-hole welding procedure, combines via hole welding procedure, number Amount can either paste reflow soldering process using the faster machine of speed as shown in Fig. 2, make mould group in use, also can be in condition Straight cutting welding procedure is used in limited situation, improves mould group installation effectiveness in production.

The outside of the LoRa transparent transmission mould group is equipped with metallic shield, and the metallic shield surrounds entire LoRa transparent transmission mould Group circuit, the metallic shield with a thickness of 1.8mm~2.2mm.Shape is quadrangle, using the same mould of multiple spot pad mode Group welding is completed, and is kept its installation easier, is more favorable for producing and processing.Mould group pad is as shown in figure 3, its interface function defines Figure is as shown in table 1.In performance, metallic shield maximum likelihood reduce mould group in use external environment to mould The influence of group itself also greatly reduces mould group radio circuit to extraneous radiation effect.

Pin symbol	Function declaration
		VCC	Mould group power pins
GND	Mould group grounding pin
		RXD	Mould group communications pins
TXD	Mould group communications pins
		SETA	Pin is arranged in mould group function
SETB	Pin is arranged in mould group function
		STAT	Mould group working condition pin
NRST	Mould group reset pin
		NC	Mould group reserves pin
RF	Mould group radio frequency transmits and receives pin

Table 1

Foregoing description is only the description to the utility model preferred embodiment, not to any limit of the scope of the utility model Fixed, any change, the modification that the those of ordinary skill in the utility model field does according to the disclosure above content belong to right and want Seek the protection scope of book.

Claims (6)

1. a kind of LoRa transparent transmission mould group, which is characterized in that handle chip (7) including low-power consumption, the low-power consumption handles chip (7) It is connected with LoRa radio frequency chip (1), radio-frequency transmissions matching and filter circuit (2) and RF switch chip (5), the radio frequency in turn Transmitting matching and filter circuit (2) include LC match circuit and second level pi type filter, the LoRa radio frequency chip (1) and radio frequency Radio frequency reception matching and filter circuit (3), the radio frequency reception matching and filter circuit are also connected between switch chip (5) It (3) include two stage filter circuit.

2. a kind of LoRa transparent transmission mould group according to claim 1, which is characterized in that low-power consumption processing chip (7) is also It is connected with 32.768KHz crystal oscillator match circuit (8), ESD protection circuit (9) and the first power filter and decoupling circuit (10), institute It states LoRa radio frequency chip (1) and is also connected with 32MHZ crystal oscillator match circuit (4) and second source filtering and decoupling circuit (6).

3. a kind of LoRa transparent transmission mould group according to claim 1, which is characterized in that the low-power consumption handles chip (7) and is STM8L series low-power consumption handles chip.

4. a kind of LoRa transparent transmission mould group according to claim 1, which is characterized in that the RF switch chip (5) is one To the SPDT Switch chip of multichannel.

5. a kind of LoRa transparent transmission mould group according to claim 1, which is characterized in that the outside of the LoRa transparent transmission mould group is set There is metallic shield, the metallic shield surrounds the circuit of entire LoRa transparent transmission mould group.

6. a kind of LoRa transparent transmission mould group according to claim 5, which is characterized in that the metallic shield with a thickness of 1.8mm~2.2mm.