CN208904045U - It is a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer - Google Patents
It is a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer Download PDFInfo
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- CN208904045U CN208904045U CN201821212519.6U CN201821212519U CN208904045U CN 208904045 U CN208904045 U CN 208904045U CN 201821212519 U CN201821212519 U CN 201821212519U CN 208904045 U CN208904045 U CN 208904045U
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- plate
- gaily decorated
- decorated basket
- rectangular slab
- exchanging
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, including gaily decorated basket ontology, gaily decorated basket ontology includes foreboard, back plate, side plate and bottom plate, foreboard is divided into the first rectangular slab, second rectangular slab and trapezoidal plate, the width of first rectangular slab is greater than the second rectangular slab, the top margin of trapezoidal plate is bonded with the second rectangular slab, bottom edge length is less than top margin length, back plate and foreboard are symmetrical arranged, side plate is rectangular side panels, and side plate is fixed with the side of first rectangular slab on one side, another side and the side of back plate are fixed, side wall inner surfaces are uniformly provided with vertical wafer teeth；Bottom plate is rectangular base plate, and bottom plate is fixed with the bottom edge of trapezoidal plate on one side, and the bottom edge of another side and back plate is fixed.The utility model can be realized the function that disk is exchanged between ornamental work of iron basket and the quartzy gaily decorated basket, and the ornamental work of iron basket after avoiding baking is directly contacted with the quartzy gaily decorated basket, reduce between the gaily decorated basket and the gaily decorated basket, artificial damage between disk and disk, it is easy to operate without expensive equipment, it is low in cost.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, and in particular to a kind of for exchanging in semiconductor crystal wafer
Between the gaily decorated basket.
Background technique
In field of semiconductor manufacture, the whole process of disk is target complicated, that high yield is always pursued, is added
The lower require during work the artificial damage of disk the better.
It in baking and gluing technique, needs to be poured into disk in ornamental work of iron basket, is sent into baking oven and toasts, toasted certainly
It so after cooling a period of time, needs to imported into wafer in the quartzy gaily decorated basket, directly using ornamental work of iron basket and quartzy gaily decorated basket reviewing, be easy
The gouge quartz gaily decorated basket, reviewing process are also not very smoothly, are needed to borrow an intermediate gaily decorated basket at this time, are realized reviewing between the two.
Utility model content
The purpose of this utility model is to provide a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, the intermediate gaily decorated basket
It can be realized the function that disk is exchanged between ornamental work of iron basket and the quartzy gaily decorated basket, the ornamental work of iron basket after avoiding baking directly connects with the quartzy gaily decorated basket
Touching improves production efficiency convenient for disk to be importing directly into the quartzy gaily decorated basket, reduces between the gaily decorated basket and the gaily decorated basket, between disk and disk
Artificial damage；Whole process does not need expensive equipment, and material is the time, easy to operate, low in cost.
To achieve the goals above, the technical solution of the utility model is:
It is a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, including gaily decorated basket ontology, the gaily decorated basket ontology include foreboard,
Back plate, the side plate and bottom plate that two sides are set, the foreboard be divided into the first rectangular slab from top to bottom, the second rectangular slab and
Trapezoidal plate, the width of first rectangular slab are greater than the width of second rectangular slab, the top margin of the trapezoidal plate and described the
The bottom edge of two rectangular slabs is bonded, and the bottom edge length of trapezoidal plate is less than top margin length, and the back plate and the foreboard are symmetrical arranged,
The side plate is rectangular side panels, and side plate is fixed with the side of first rectangular slab on one side, the side of another side and the back plate
While fixing, the side wall inner surfaces are uniformly provided with vertical wafer teeth；The bottom plate be rectangular base plate, and bottom plate on one side with it is described
The bottom edge of trapezoidal plate is fixed, and another side and the bottom edge of the back plate are fixed.
Compared with prior art, the utility model has the beneficial effects that
First rectangular slab of the utility model foreboard, the second rectangular slab, trapezoidal board width successively reduce, side plate both sides and the
One rectangular slab and back plate are fixed, and side wall inner surfaces are uniformly provided with vertical wafer teeth, the bottom plate bottom with trapezoidal plate and back plate respectively
While fix, when use, lays flat the gaily decorated basket, and top opening be bonded with ornamental work of iron basket opening, directly by the gaily decorated basket of chip push-in centre,
Top opening is bonded with quartzy gaily decorated basket opening later, chip is directly pushed into the quartzy gaily decorated basket by the emptying aperture of bottom plate two sides, operation
It is efficient and convenient, it avoids ornamental work of iron basket and the quartzy gaily decorated basket directly contacts, while being also convenient for for disk being importing directly into the quartzy gaily decorated basket,
Production efficiency is improved, is reduced between the gaily decorated basket and the gaily decorated basket, the artificial damage between disk and disk.
Further, the gaily decorated basket bodies top is also equipped with circle top plate used for positioning.
By using above scheme, it is additionally provided with top plate at the top of the gaily decorated basket, can quickly be positioned by top plate, guarantees that chip is primary
Property be inserted into the intermediate gaily decorated basket, and while releasing chip, is disposably pushed into the quartzy gaily decorated basket.
Further, location hole is offered on the top plate.
By using above scheme, location hole, which facilitates, to be positioned between the gaily decorated basket by passing through the locating rod of location hole, is kept away
Exempt from when exchanging chip, gaily decorated basket displacement leads to damage to wafers.
Further, stabilizer blade is also equipped with below the bottom plate.
Further, observation panel is also provided on the foreboard.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described.In all the appended drawings, similar
Element or part are generally identified by similar appended drawing reference.In attached drawing, each element or part might not be according to actual ratios
It draws.
Fig. 1 is the structural schematic diagram of the embodiments of the present invention.
Fig. 2 is the right view of Fig. 1.
Fig. 3 is the top view of Fig. 1.
Fig. 4 is the bottom view of Fig. 1.
It is as shown in the figure:
1, foreboard；101, the first rectangular slab；102, the second rectangular slab；103, trapezoidal plate；104, observation panel；
2, back plate；
3, side plate；301, wafer teeth；
4, bottom plate；
5, top plate；501, location hole.
Specific embodiment
It is described in detail below in conjunction with embodiment of the attached drawing to technical solutions of the utility model.Following embodiment is only
For clearly illustrating the technical solution of the utility model, therefore it is only used as example, and it is originally practical to cannot be used as a limitation limitation
Novel protection scope.
It should be noted that unless otherwise indicated, technical term or scientific term used in this application should be this reality
The ordinary meaning understood with novel one of ordinary skill in the art.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the device or member of indication or suggestion meaning
Part must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply relatively important
Property or implicitly indicate the quantity of indicated technical characteristic.The meaning of " plurality " is two in the description of the present invention,
More than, unless otherwise specifically defined.
In this application unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In this application unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Fig. 1 is the structural schematic diagram of the embodiments of the present invention.
Fig. 2 is the right view of Fig. 1.
Fig. 3 is the top view of Fig. 1.
Fig. 4 is the bottom view of Fig. 1.
As shown in Figs 1-4, provided in this embodiment a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, including the gaily decorated basket
Ontology, the gaily decorated basket ontology include foreboard 1, back plate 2, the side plate 3 and bottom plate 4 that two sides are arranged in.
Foreboard 1 divides for the first rectangular slab 101, the second rectangular slab 102 and trapezoidal plate 103 from top to bottom.
The width of first rectangular slab 101 is greater than the width of the second rectangular slab 102, the top margin of trapezoidal plate 103 and the second rectangle
The bottom edge of plate 102 is bonded, and the bottom edge length of trapezoidal plate 103 is less than top margin length.
Observation panel 104 is also provided on foreboard 1.
Back plate 2 and foreboard 1 are symmetrical arranged, and side plate 3 is rectangular side panels, and the side on 3 one side of side plate and the first rectangular slab 101
Fixed, another side and the side of back plate 2 are fixed.
3 inner surface of side plate is uniformly provided with vertical wafer teeth 301.
Bottom plate 4 is rectangular base plate, and 4 one side of bottom plate and the bottom edge of trapezoidal plate 103 are fixed, the bottom edge of another side and back plate 2
It is fixed.
4 bottom of bottom plate is also symmetrically arranged with four stabilizer blades 6.
Gaily decorated basket bodies top is also equipped with circle top plate 5 used for positioning, offers location hole 501 on top plate 5.
The first rectangular slab 101, the second rectangular slab 102,103 width of trapezoidal plate of the present embodiment foreboard 1 successively reduce, side plate
3 both sides and the first rectangular slab 101 and back plate 2 are fixed, and 3 inner surface of side plate is uniformly provided with vertical wafer teeth 301, and bottom plate 4 is distinguished
It is fixed with the bottom edge of trapezoidal plate 103 and back plate 2, when use lays flat the gaily decorated basket, top opening is bonded with ornamental work of iron basket opening, directly
Chip is pushed into the intermediate gaily decorated basket, is later bonded top opening with quartzy gaily decorated basket opening, the gap by 4 two sides of bottom plate is straight by chip
It connects in the quartzy gaily decorated basket of push-in, it is swift and convenient to operate, it avoids ornamental work of iron basket and the quartzy gaily decorated basket directly contacts, while being also convenient for disk
It is importing directly into the quartzy gaily decorated basket, improves production efficiency, reduce between the gaily decorated basket and the gaily decorated basket, the artificial damage between disk and disk.
It is additionally provided with top plate 5 at the top of the present embodiment gaily decorated basket, can quickly be positioned by top plate 5, guarantee that chip is disposably inserted into
It is disposably pushed into the quartzy gaily decorated basket in the intermediate gaily decorated basket, and when release chip.
Location hole 501 is offered on the present embodiment top plate 5, location hole 501 facilitates between the gaily decorated basket by passing through location hole
Locating rod is positioned, and is avoided when exchanging chip, and gaily decorated basket displacement leads to damage to wafers.
In the specification of the utility model, numerous specific details are set forth.It is to be appreciated, however, that the reality of the utility model
Applying example can practice without these specific details.In some instances, well known method, knot is not been shown in detail
Structure and technology, so as not to obscure the understanding of this specification.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row combination and combination.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type, should all cover in the claim of the utility model and the range of specification.
Claims (5)
1. a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, which is characterized in that including gaily decorated basket ontology, the gaily decorated basket ontology
Including foreboard, back plate, the side plate and bottom plate that two sides are arranged in, the foreboard is divided into the first rectangular slab from top to bottom, second
Rectangular slab and trapezoidal plate, the width of first rectangular slab are greater than the width of second rectangular slab, the top of the trapezoidal plate
Side is bonded with the bottom edge of second rectangular slab, and the bottom edge length of trapezoidal plate be less than top margin length, the back plate and it is described before
Plate is symmetrical arranged, and the side plate is rectangular side panels, and side plate is fixed with the side of first rectangular slab on one side, another side and institute
The side for stating back plate is fixed, and the side wall inner surfaces are uniformly provided with vertical wafer teeth；The bottom plate is rectangular base plate, and bottom plate
It is fixed on one side with the bottom edge of the trapezoidal plate, another side and the bottom edge of the back plate are fixed.
2. according to claim 1 a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, which is characterized in that the flower
Basket bodies top is also equipped with circle top plate used for positioning.
3. according to claim 2 a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, which is characterized in that the top
Location hole is offered on plate.
4. according to claim 1 a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, which is characterized in that the bottom
Stabilizer blade is also equipped with below plate.
5. according to claim 1 a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer, which is characterized in that before described
Observation panel is also provided on plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821212519.6U CN208904045U (en) | 2018-07-27 | 2018-07-27 | It is a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821212519.6U CN208904045U (en) | 2018-07-27 | 2018-07-27 | It is a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208904045U true CN208904045U (en) | 2019-05-24 |
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ID=66568345
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821212519.6U Active CN208904045U (en) | 2018-07-27 | 2018-07-27 | It is a kind of for exchanging the intermediate gaily decorated basket of semiconductor crystal wafer |
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| CN (1) | CN208904045U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111045149A (en) * | 2019-12-30 | 2020-04-21 | 浙江大学 | Method for continuously manufacturing glass-based ion exchange buried optical waveguide |
-
2018
- 2018-07-27 CN CN201821212519.6U patent/CN208904045U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111045149A (en) * | 2019-12-30 | 2020-04-21 | 浙江大学 | Method for continuously manufacturing glass-based ion exchange buried optical waveguide |
| CN111045149B (en) * | 2019-12-30 | 2020-09-15 | 浙江大学 | Method for continuously manufacturing glass-based ion exchange buried optical waveguide |
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