CN208903073U - Gelatinizing developer - Google Patents
Gelatinizing developer Download PDFInfo
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- CN208903073U CN208903073U CN201821542299.3U CN201821542299U CN208903073U CN 208903073 U CN208903073 U CN 208903073U CN 201821542299 U CN201821542299 U CN 201821542299U CN 208903073 U CN208903073 U CN 208903073U
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Abstract
The utility model provides a kind of gelatinizing developer, the detection device including wafer carrying platform and the photoresist layer for detecting wafer frontside；Detection device is located at the top of wafer.The gelatinizing developer of the utility model can carry out at the first time on-line checking to the wafer for completing jet-coating photoresit, to find that existing photoresist is coated with bad problem in time, it adopts remedial measures as early as possible convenient for staff, for example it re-starts coating and/or carries out overhaul of the equipments, it avoids in the prior art because that can not find that photoresist coating is bad at the first time, cause it is subsequent do over again workload increase, and thus cause equipment output capacity decline, fraction defective increase, production cost rise the problems such as.The gelatinizing developer structure of the utility model is simple, easy to use.Using the gelatinizing developer of the utility model, photoresist coating quality is helped to improve, improves production yield.
Description
Technical field
The utility model relates to a kind of semiconductor manufacturing facilities, more particularly to a kind of gelatinizing developer.
Background technique
Photoetching process be semiconductor chip manufacture in very important one of technique, it be by photoresist (also known as
Photoresist) it in the pattern transfer to substrate on mask plate, will generally undergo substrate surface cleaning, drying, linging, photoresist to apply
Cloth, it is soft dry, alignment exposure, it is rear dry, development, it is hard dry, etching, the processes such as detection.Among these, photoresist coating is it in weight again
Weight, the photoresist of even spread predetermined amount only on substrate could be that subsequent pattern transfer is laid a good foundation.But
During actual jet-coating photoresit, there are various unexpected factors to cause the coating appearance of photoresist bad, such as glue amount deficiency,
Photoresist pipeline has bubble, gluing menu is abnormal, carry out piece exception and photoresist pipeline is bent etc..Photoresist is coated with bad phenomenon
Including there is bubble etc. in local photoresist coating missing, photoresist coating weight deficiency and photoresist layer.No matter it is any not
It is good, can all cause in subsequent developing process occur imaging it is bad, easily cause device performance decline even fail.Existing light
In photoresist coating apparatus, the detection of photoresist layer can not be carried out immediately after the completion of photoresist coating, the quality monitoring of gluing is logical
After the completion of often need to waiting until entire photoetching process, relevant batch product is passed into measurement website, gluing quality can just be detected.
But this detection is usually to detect (after development inspection, abbreviation ADI) after developing, i.e., to wafer
Carried out exposure development, at this time if it find that photoresist coating is bad, also can only by do over again (Rework) remedied, but return
Work not only takes time and effort, and causes equipment output capacity to decline, and the fragment rate of process of rework and fraction defective are relatively high, cause not
Necessary production cost rises.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of gelatinizing developer,
For solving to lead to workload increase of doing over again because that cannot find that in time jet-coating photoresit is bad in the prior art, thus cause
The problems such as decline of equipment output capacity, fraction defective increase, production cost rises.
In order to achieve the above objects and other related objects, the utility model provides a kind of gelatinizing developer, including carrying
The detection device of the photoresist layer of the wafer carrying platform and detection wafer frontside of wafer；The detection device is located at the crystalline substance
Round top.
Optionally, the detection device is located at the surface of the wafer.
Optionally, the detection device includes for grabbing the wafer frontside image after being coated with the photoresist layer
CCD camera or CMOS camera.
More optionally, the gelatinizing developer further includes the analysis analyzed the testing result of the detection device
Device, positioned at the periphery of the cup body, and the analytical equipment is connected with the detection device.
Optionally, the gelatinizing developer further includes warning device, and the warning device is connected with the analytical equipment
It connects.
In another optinal plan, the detection device includes the thickness sensing of multiple measurement photoresist layer thickness
Device.
More optionally, the gelatinizing developer further includes that the testing result of multiple thickness transducers is compared
Comparator.
Optionally, the gelatinizing developer further includes warning device, and the warning device is connected with the comparator.
Optionally, the gelatinizing developer further includes the bracket of the fixed detection device, positioned at the outer of the cup body
It encloses, the detection device is located on the bracket.
Optionally, the gelatinizing developer further includes the driving device for driving the bracket mobile, with the bracket phase
Connection.
Optionally, the gelatinizing developer further includes the back side detection detected to the photoresist of the backside of wafer
Device is located in the wafer carrying platform.
As described above, the gelatinizing developer of the utility model, has the advantages that the gluing of the utility model is aobvious
Shadow board immediately can detect the photoresist layer after coating after the completion of photoresist is coated with, it is possible thereby to find in time
The problems such as photoresist coating is bad avoids in the prior art because can not so that staff can take counter-measure at the first time
The coating of discovery photoresist is bad at the first time, leads to subsequent workload increase of doing over again, and the equipment output capacity thus caused
The problems such as decline, fraction defective increase, production cost rises.
Detailed description of the invention
Fig. 1 to Fig. 3 is shown as the structural schematic diagram of the gelatinizing developer of the utility model.
Component label instructions
11 wafers
12 wafer carrying platforms
13 cup bodies
14 detection devices
15 warning devices
16 brackets
17 analytical equipments
18 driving devices
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
It please refers to Fig.1 to Fig.3.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, is not intended to limit the utility model
Enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all still fall in the utility model
In the range of revealed technology contents can be covered.Meanwhile in this specification it is cited as "upper", "lower", " left side ",
The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model
Range, relativeness are altered or modified, implementable when being also considered as the utility model under the change of no substantial technological content
Scope.
As shown in Figure 1 to Figure 3, the utility model provides a kind of gelatinizing developer, and the wafer including carrying wafer 11 is held
Microscope carrier 12 and the detection device 14 for detecting the positive photoresist layer of the wafer 11；The detection device 14 is located at the wafer 11
Top.The wafer 11 that the utility model passes through 14 pairs of the detection device completion jet-coating photoresits added carries out online at the first time
Detection is adopted remedial measures, such as heavy as early as possible with finding the problems such as existing photoresist coating is bad in time convenient for staff
It is newly coated and/or carried out overhaul of the equipments, avoids leading because that can not find that photoresist coating is bad at the first time in the prior art
Subsequent workload increase of doing over again is caused, and the decline of equipment output capacity, fraction defective increase, production cost rising for thus causing etc.
Problem.Using the gelatinizing developer of the utility model, photoresist coating quality is helped to improve, improves production yield.
As an example, the gelatinizing developer further includes cup body 13, in the gelatinizing developer course of work, hold
The wafer carrying platform 12 for being loaded with wafer 11 is located in the cup body 13.The cup body 13 has upper and lower corresponding opening,
In the course of work of the gelatinizing developer, the upper surface of the cup body 13 is higher than the horizontal plane where the wafer 11, with
During avoiding jet-coating photoresit, photoresist liquid overflows the cup body 13.It certainly, can be with after puddle development technique
Decline the cup body 13, in order to the taking-up of the wafer 11.
The photoresist that the detection device 14 is used to detect the wafer 11 positive (one side that production has device) applies cloth
Amount, thus the detection device 14 is higher than the horizontal plane at 11 place of wafer and by adjusting the detection of the detection device 14
Angle is to ensure that the detection device 14 can detect the overall condition of 11 upper surface of wafer.Although the detection device 14
Specific installation site according to the type of the detection device 14 of selection is different and/or the layout difference of equipment itself can have
Different selections, but the detection device 14 is preferably set to the surface of the wafer 11, to ensure the detection device
14 can carry out complete detection to the situation in 11 front of wafer.In the photoresist for completing 11 surface of wafer by intended flow
After spraying, the detection device 14 starts to detect the photoresist layer that 11 surface of wafer is coated with immediately, reaches real-time
The effect of on-line checking.
As an example, the detection device 14 includes for grabbing 11 front of the wafer after being coated with the photoresist layer
CCD (the Charge coupled Device charge coupled cell) camera or CMOS (Complementary Metal of image
Oxide Semiconductor complementary metal oxide semiconductor) camera is CCD camera or CMOS in the detection device 14
In the case where camera, as an example, the gelatinizing developer further includes dividing the testing result of the detection device 14
The analytical equipment 17 of analysis is connected positioned at the periphery of the cup body 13, and with the detection device 14.Select CCD camera or
CMOS camera is mainly because it has many advantages, such as that image taking speed is fast, and image quality height and high resolution, in other words, other have
The camera of such advantage is equally applicable, is not particularly limited in the present embodiment.It, will after CCD camera or CMOS camera crawl image
For image transmitting to the analytical equipment 17, the analytical equipment 17 will be pre- in 11 photo of wafer of shooting and the analytical equipment 17
The wafer photo first stored compares, and generates defect map, then identifies whether judge gluing state with this to defect map
Normally.Certainly, the analytic process can also rule of thumb be judged by staff or be carried out using other modes, for changing
It, does not do stringent limitation whether in the present embodiment to the setting of the analytical equipment 17.As an example, the settable and analysis
The warning device 15 that device 17 is connected reminds staff with the alert when judging the gluing abnormal state
Take counter-measure as early as possible, for example carry out secondary coating etc., it has avoided the undesirable product of coating from flowing into next process, has caused not
Necessary production cost rises.The warning device 15 can be audible alarm unit, photoelectric alarm device and/or with communication
The warning device of function sends warning message with the mobile phone on duty to staff/duty computer.Certainly, those skilled in the art
Member is also possible to the main control computer existing using equipment it is easily understood that the analytical equipment 17 can be separately provided, important
Be the corresponding analysis software of installation in advance and to be previously stored with picture as reference standard in main control computer.The inspection
It surveys device 14 and the analytical equipment 17 can also be two units of the same instrument, for example be similar to the figure of film thickness analyzer
As picking unit and analytical unit.
In another example, the detection device 14 includes the thickness transducer of multiple measurement photoresist layer thickness,
Theoretically the quantity of the thickness transducer is The more the better, but considers cost problem, can rule of thumb be existed by staff
Corresponding be easy to appear above the wafer 11 of gluing bad position installs the thickness transducer, these usual regions include the crystalline substance
The central area of circle 11 and fringe region.The thickness transducer not only can directly detect corresponding 11 front of the wafer
Whether photoresist is coated with, moreover it is possible to detect the thickness of photoresist layer directly to judge whether photoresist coating weight is enough, detect
Visual result is illustrated.The testing result of multiple thickness transducers can be directly output to main control computer (not shown), work
Personnel can directly know whether gluing situation is normal according to the film thickness data of detection, can also install and the multiple thickness
The comparator (not shown) that degree sensor is connected, is compared, into one with the testing result to multiple thickness transducers
Step ground, can also install the warning device being connected with the comparator, to send out in the comparison result exception of the comparator
Warning message out.The selection of the warning device please refers to foregoing teachings, and details are not described herein again.
It being described above, the layout according to the type of the detection device 14 of selection difference and/or equipment itself is different,
The installation site of the detection device 14 can have different selections, for example, if the gelatinizing developer is per se with lid
Body, then the detection device 14 is mountable on the lid.But in the present embodiment, as an example, the gelatinizing developer
It further include the bracket 16 of the fixed detection device 14, positioned at the periphery of the cup body 13, the detection device 14 is located at described
Different according to the concrete type of the detection device 14 on bracket 16, the structure of the bracket 16 can have different type, such as
If the detection device 14 is only single CCD camera or CMOS camera, as long as the bracket 16 has one can support institute
The pillar of CCD camera or CMOS camera is stated, such as shown in Figures 1 and 2；If the detection device 14 includes multiple thickness
Sensor is spent, then the bracket 16 preferably also has a support disk being connected with the bracket, by multiple thickness
Degree sensor is fixed on the support disk, such as shown in Figure 3.
As an example, the gelatinizing developer further includes the driving device 18 for driving the bracket 16 mobile, the drive
Dynamic device 18 is connected with the bracket 16, in unnecessary situation, the detection device 14 to be removed.
As an example, the gelatinizing developer further includes back side detection device (not shown), it is located at the wafer carrying
On platform 12, detected for the back side to the wafer 11.The preferred sensor of back side detection device, and it is not limited to thickness
Sensor is spent, other kinds of sensor is also feasible.Because typically, the photoresist at 11 back side of wafer is unnecessary
, therefore whether the back side that the detection at the back side need to only detect the wafer 11 has a photoresist, and be coated with photoresist place and
It is not coated with the reflection difference for being furnished with the place of photoresist to light or sound, thus can use photoelectric sensor or ultrasonic sensor
It is detected, when detecting that there is photoresist at the back side of the wafer 11, staff is reminded to clean as early as possible, therefore accordingly
The warning device 15 being connected with the back side detection device can also be set.The installation of warning device 15 can refer in aforementioned
Hold, is no longer developed in details herein.
Other unmentioned structures of the gelatinizing developer of the utility model, such as the spray of jet-coating photoresit device, developer solution
Coating device etc., it is identical as gelatinizing developer in the prior art, since this partial content is ripe for industry technical staff
Know and unrelated with the inventive point of the utility model, therefore does not introduce for purposes of brevity herein.Certainly, the painting of the utility model
Glue developing machine platform can also detect after to crystal column surface spraying developer solution, the content class recorded in detection process and embodiment
Seemingly, specifically not reinflated.
In conclusion the utility model provides a kind of gelatinizing developer, including wafer carrying platform and the detection wafer
The detection device of positive photoresist layer；The detection device is located at the top of the wafer.The puddle development of the utility model
Board can carry out at the first time on-line checking to the wafer for completing jet-coating photoresit, to find existing photoresist coating in time
The problems such as bad, adopts remedial measures as early as possible convenient for staff, for example re-starts coating and/or carry out overhaul of the equipments, keeps away
Exempt to lead to subsequent workload increase of doing over again, Yi Jiyou because that can not find that photoresist coating is bad at the first time in the prior art
The problems such as this equipment output capacity caused decline, fraction defective increase, production cost rises.The gelatinizing developer of the utility model
Structure is simple, easy to use, using the gelatinizing developer of the utility model, helps to improve photoresist coating quality, improves
Production yield.So the utility model effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (8)
1. a kind of gelatinizing developer characterized by comprising
Carry the wafer carrying platform of wafer；
The detection device for detecting the photoresist layer of the wafer frontside, positioned at the top of the wafer；
The detection device include CCD camera for grabbing the wafer frontside image after being coated with the photoresist layer or
CMOS camera, the gelatinizing developer further include the analytical equipment analyzed the testing result of the detection device, institute
Analytical equipment is stated to be connected with the detection device；Or,
The detection device includes the thickness transducer of multiple measurement photoresist layer thickness.
2. gelatinizing developer according to claim 1, it is characterised in that: the detection device is being located at the wafer just
Top.
3. gelatinizing developer according to claim 1, it is characterised in that: the gelatinizing developer further includes alarm dress
It sets, the warning device is connected with the analytical equipment.
4. gelatinizing developer according to claim 1, it is characterised in that: the gelatinizing developer further includes will be multiple
The comparator that the testing result of the thickness transducer is compared, the comparator are connected with multiple thickness transducers
It connects.
5. gelatinizing developer according to claim 4, it is characterised in that: the gelatinizing developer further includes alarm dress
It sets, the warning device is connected with the comparator.
6. gelatinizing developer according to claim 1, it is characterised in that: the gelatinizing developer further includes fixed institute
The bracket of detection device is stated, the detection device is located on the bracket.
7. gelatinizing developer according to claim 6, it is characterised in that: the gelatinizing developer further includes driving institute
The mobile driving device of bracket is stated, is connected with the bracket.
8. gelatinizing developer according to claim 1, it is characterised in that: the gelatinizing developer further includes to described
The back side detection device that backside of wafer is detected is located in the wafer carrying platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821542299.3U CN208903073U (en) | 2018-09-20 | 2018-09-20 | Gelatinizing developer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821542299.3U CN208903073U (en) | 2018-09-20 | 2018-09-20 | Gelatinizing developer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208903073U true CN208903073U (en) | 2019-05-24 |
Family
ID=66573188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821542299.3U Active CN208903073U (en) | 2018-09-20 | 2018-09-20 | Gelatinizing developer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208903073U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115487998A (en) * | 2021-06-17 | 2022-12-20 | 上海集成电路材料研究院有限公司 | High-flux photoresist matching and exposure integrated equipment and photoetching process |
| WO2024007463A1 (en) * | 2022-07-04 | 2024-01-11 | 江苏时代新能源科技有限公司 | Coating quality inspection method, inspection apparatus and inspection system, and storage medium |
-
2018
- 2018-09-20 CN CN201821542299.3U patent/CN208903073U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115487998A (en) * | 2021-06-17 | 2022-12-20 | 上海集成电路材料研究院有限公司 | High-flux photoresist matching and exposure integrated equipment and photoetching process |
| WO2024007463A1 (en) * | 2022-07-04 | 2024-01-11 | 江苏时代新能源科技有限公司 | Coating quality inspection method, inspection apparatus and inspection system, and storage medium |
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