CN208862018U - A kind of light-emitting assembly packaging structure - Google Patents
A kind of light-emitting assembly packaging structure Download PDFInfo
- Publication number
- CN208862018U CN208862018U CN201821480911.9U CN201821480911U CN208862018U CN 208862018 U CN208862018 U CN 208862018U CN 201821480911 U CN201821480911 U CN 201821480911U CN 208862018 U CN208862018 U CN 208862018U
- Authority
- CN
- China
- Prior art keywords
- optical lens
- light
- frame
- open end
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of light-emitting assembly packaging structure a comprising optical lens;One frame is equipped with one first open end and one second open end, and optical lens setting is engaged in first open end, and the optical lens is engaged with the setting of the first open end and constituted with the engagement of insert molding technique;One substrate is engaged with the second open end of the frame, which is equipped with a light emitting source, which covers at the light emitting source.The utility model, which reaches, to be avoided fixing so that being coated with bonding between optical lens and frame with viscose, and it avoids so that the assembling between optical lens and frame engages out-of-flatness, therefore structure can be made more firm, and the cost of material is low without using viscose event, and the secondary operation program of the gluing between optical lens and frame, assembling is saved, reach effect.
Description
Technical field
The utility model relates to a kind of encapsulating structure more particularly to a kind of light-emitting assembly packaging structures.
Background technique
In light emitting module, common application be light emitting diode (Light-emitting diode) or two pole of laser
Manage the luminescence component of (Laser diode), and such as vertical cavity surface emitting laser (VCSEL) (Vertical of laser diode form
Cavity Surface Emitting Laser, VCSEL) luminescence component.In such VCSEL luminescence component, the common tool of structure
There are a substrate (substrate), a frame (holder) and an optical mirror slip (optical lens), and frame also can be one kind
Lid (cap) form.
In this technical solution, the assembling between frame and optical mirror slip is engaged, and the prior art is often with viscose by frame
It is mutually binded with optical lens, since the amount of its viscose coating when viscose, which is coated with, to be binded may be unequal, uneven, it will so that
Assembling between frame and optical mirror slip makes structure built on the sand when engaging out-of-flatness and bad gluing, and when viscose is by the time
Weathering be easy to cause frame to separate with optical mirror slip, and has the problems such as glueing material at high cost, complex procedures.
Utility model content
In view of described in the prior art, thus the utility model aims to solve and improve the problems of the prior art with
For the purpose of defect.
In order to reach the above object, the utility model provides a kind of light-emitting assembly packaging structure comprising: an optical lens
Mirror;One frame is equipped with one first open end and one second open end, and optical lens setting is engaged in first open end, and
The optical lens is engaged with the setting of the first open end to be constituted with the engagement of insert molding technique;One substrate, second with the frame
Open end engages, which is equipped with a light emitting source, which covers at the light emitting source.
Wherein preferably, the optical lens is optical diffusion sheet.
Preferably, the light emitting source is vertical cavity surface emitting laser (VCSEL) component.
Preferably, the lower surface of the optical lens is equipped with a microlens array.
Therefore, the utility model can be made to reach to avoid fixing so that being coated with bonding between optical lens and frame with viscose,
And it avoids so that the assembling between optical lens and frame engages out-of-flatness, therefore it is more firm to make structure, and does not use
The cost of material is low for viscose event, and saves the secondary operation program of the gluing between optical lens and frame, assembling, reaches effect.
Detailed description of the invention
The schematic diagram of the section structure of the light-emitting assembly packaging structure of Fig. 1 the utility model preferred embodiment.
The light projection operating principle schematic diagram of the light-emitting assembly packaging structure of Fig. 2 the utility model preferred embodiment.
The light-emitting assembly packaging structure of Fig. 3 the utility model preferred embodiment is further provided with the section knot of microlens array
Structure and light projection operating principle schematic diagram.
Description of symbols
1 optical lens
2 frames
21 first open ends
22 second open ends
3 substrates
4 light emitting sources
100 light beams
200 diffusion light
300 light beams
10 lower surfaces
5 microlens arrays.
Specific embodiment
In order to further have a clear understanding of the content of the utility model, added with the following example collocation attached drawing and symbol
It, please be refering to explanation.
Referring to Fig. 1, the utility model provides a kind of light-emitting assembly packaging structure comprising: an optical lens 1, a frame
Frame 2 and a substrate 3.
The optical lens 1 can be common glass or plastics, preferably, the optical lens 1 is optical diffusion sheet
(diffuser lens).The frame 2 is equipped with one first open end 21 and one second open end 22, the optical lens 1 setting engagement
In first open end 21, and the optical lens 1 is engaged with the setting of the first open end 21 with insert molding technique (Insert
Molding) engagement is constituted.The substrate 3 is engaged with the second open end 22 of the frame 2, which is equipped with a light emitting source 4,
The frame 2 covers at the light emitting source 4.In the present embodiment, which is vertical cavity surface emitting laser (VCSEL) component, the component
It can be light source chip pattern.
Please continue to refer to Fig. 2, the wherein setting of the optical lens 1 of the utility model and frame 2 (the first open end 21)
Engagement is constituted with the engagement of insert molding technique, by insert is, for example, that optical lens 1 is placed in die cavity, then with certain material example
If plastics filling die cavity constitutes for example, frame 2, so that optical lens 1 is integrated with frame 2, avoided in order to this creation can be made to reach
It is fixed so that being coated with bonding between optical lens 1 and frame 2 with viscose, and avoids the group so that between optical lens 1 and frame 2
Out-of-flatness is closed in attaching, therefore structure can be made more firm, and without using viscose event, the cost of material is low, and saves optical lens 1
The secondary operation program of gluing, assembling between frame 2, reaches effect.And the utility model insert molding technique is existing
Technique is repeated no more in this.Therefore one is projected in the operating principle of the utility model, when can make 4 VCSEL of light emitting source vertically
Light beam 100, the light beam 100 are projected by optical lens 1 again, and when optical lens 1 is optical diffusion sheet, then can allow light beam
100 are formed as uniform or specific intensity distribution diffusion light 200.
Preferably, referring again to Fig. 3, wherein the lower surface 10 of the optical lens 1 is equipped with 5 (Micro of a microlens array
Lens Array), which can be the array of convex lens.Therefore, by means of the setting of microlens array 5, this can be made
The utility model light emitting source 4 light beam 100 emitted when being VCSEL increases it by penetrating for light beam 300, so as to promoting brightness.
Obviously, described embodiment is only a part of the embodiment of the utility model, instead of all the embodiments.
Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, fall within the protection scope of the utility model.
Claims (4)
1. a kind of light-emitting assembly packaging structure, characterized in that it comprises:
One optical lens;
One frame is equipped with one first open end and one second open end, and optical lens setting is engaged in first open end, and
The optical lens is engaged with the setting of the first open end to be constituted with the engagement of insert molding technique;
One substrate is engaged with the second open end of the frame, which is equipped with a light emitting source, which covers at this and shine
Source.
2. light-emitting assembly packaging structure as described in claim 1, which is characterized in that the optical lens is optical diffusion sheet.
3. light-emitting assembly packaging structure as described in claim 1, which is characterized in that the light emitting source is vertical cavity surface emitting type
Laser member.
4. light-emitting assembly packaging structure as described in claim 1, which is characterized in that it is micro- that the lower surface of the optical lens is equipped with one
Lens array.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821480911.9U CN208862018U (en) | 2018-09-11 | 2018-09-11 | A kind of light-emitting assembly packaging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821480911.9U CN208862018U (en) | 2018-09-11 | 2018-09-11 | A kind of light-emitting assembly packaging structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208862018U true CN208862018U (en) | 2019-05-14 |
Family
ID=66417540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821480911.9U Active CN208862018U (en) | 2018-09-11 | 2018-09-11 | A kind of light-emitting assembly packaging structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208862018U (en) |
-
2018
- 2018-09-11 CN CN201821480911.9U patent/CN208862018U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9169980B2 (en) | Lighting device and display device | |
CN103547963A (en) | Light conversion member and display device having the same | |
CN102509759A (en) | Light emitting device and light source module | |
KR20100110389A (en) | Optical element and manufacturing method therefor | |
JP6253949B2 (en) | LED light emitting device | |
CN104344333A (en) | Optical lens and light-emitting element applying same | |
CN103681983B (en) | A kind of light-emitting component applies method and the air jet system of phosphor powder layer | |
US9115866B2 (en) | LED unit with rectangular lens | |
US20140146558A1 (en) | Light guide stick and light source assembly having light emitting diode and light guide stick | |
US11171123B2 (en) | Method of producing an optoelectronic lighting device and optoelectronic lighting device | |
CN208862018U (en) | A kind of light-emitting assembly packaging structure | |
CN202886723U (en) | Light-emitting device and relevant projection system | |
JP3144867U (en) | Light emitting diode package structure | |
JP2015176946A (en) | Led light emitting device | |
CN204373777U (en) | Optical property measuring device | |
KR101641205B1 (en) | The manufacturing method for LED light module contained adjustable Emitting angle | |
CN103868016A (en) | Optical lens and light-emitting component using same | |
CN110970539A (en) | Light emitting unit | |
KR102107526B1 (en) | A light emitting package device | |
JP6021485B2 (en) | Semiconductor light emitting device with optical member | |
US20130270590A1 (en) | Led module | |
JP2015187624A (en) | Optical member and manufacturing method thereof | |
CN104806901A (en) | Light source module | |
KR20140127063A (en) | Light emitting diode package | |
TWM571605U (en) | Light-emitting element package structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |