CN208857381U - A kind of electroplating device with honeycomb baffle - Google Patents
A kind of electroplating device with honeycomb baffle Download PDFInfo
- Publication number
- CN208857381U CN208857381U CN201821435965.3U CN201821435965U CN208857381U CN 208857381 U CN208857381 U CN 208857381U CN 201821435965 U CN201821435965 U CN 201821435965U CN 208857381 U CN208857381 U CN 208857381U
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- CN
- China
- Prior art keywords
- electroplate
- honeycomb
- jet pipe
- baffle
- honeycomb baffle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of electroplating devices with honeycomb baffle, for electroplate to be electroplated, it is characterized in that, including plating cylinder, anode, jet pipe and honeycomb baffle, electroplate, anode, jet pipe and honeycomb baffle are set in plating cylinder along the vertical direction, jet pipe is set to electroplate two sides, each jet pipe is equipped with several nozzles, nozzle is from top to bottom uniformly distributed on jet pipe, and two side nozzle ejection end be respectively perpendicular and be right against corresponding electroplate two sides, anode is set to electroplate two sides, and honeycomb baffle is located at electroplate and wherein between an anode.Honeycomb baffle facilitates the convection current between medical fluid and ion in the electroplating device, make medical fluid from all quarter flow through honeycomb baffle after reach streamlined flow effect；Plating attachment is uniform on electroplate.
Description
Technical field
The utility model relates to the technical field of electroplating device, in particular to a kind of electroplating device with honeycomb baffle.
Background technique
Electroplating device is applied to pcb board field and produces HDI plate, and existing electroplating device has the following disadvantages:
For nozzle when spraying medical fluid, medical fluid and the ion concentration in cylinder are variant in electroplating device, now only through medical fluid from
The convection current that jet pipe generates, is stirred, and what this convection effects can be generated with jet pipe penetrates pressure and change, when jet pipe is penetrated in difference
In the case where pressure, electroplating effect can be influenced, so single convection effects generated through nozzle, are not able to satisfy high-end production
Plate.
Due to making and assembling existing error, it cannot be guaranteed that the medical fluid that nozzle is sprayed is absolute vertical spray to electroplate
It penetrates, so that the flow direction of the ion pair plate in medical fluid is the directive along nozzle and upper electroplate is electroplated, average attachment effect is not achieved
Fruit, so that plating plate uniformity is difficult to ensure.
For this purpose, we have proposed a kind of electroplating devices with honeycomb baffle.
Utility model content
The main purpose of the utility model is to provide a kind of electroplating device with honeycomb baffle, have medical fluid with from
Have the advantages that preferable convection effects, plating attachment is uniform on electroplate between son.
To achieve the above object, the utility model provides a kind of electroplating device with honeycomb baffle, for plating
Plate is electroplated, including plating cylinder, several anodes, several jet pipes and honeycomb baffle, the electroplate, the anode, the spray
Pipe and the honeycomb baffle are set in the plating cylinder along the vertical direction, and each pair of jet pipe is respectively arranged on the electroplate
Two sides, each jet pipe are equipped with several nozzles, and the nozzle is from top to bottom uniformly distributed on the jet pipe, and two sides
The nozzle ejection end, which is respectively perpendicular, is right against the corresponding electroplate two sides, and each pair of anode is respectively arranged on the electricity
Plate two sides are plated, the honeycomb baffle is located at the electroplate and wherein between an anode.
Preferably, the honeycomb baffle is a slide plate, and the slide plate is equipped with an at least hole, when the slide plate is
When porous plate, the slide plate is equipped with the honeycomb of several dense regulars arrangement shape.
Preferably, the honeycomb is equilateral polygon, circle or grid-shaped.
Preferably, the height of the honeycomb baffle is greater than the height of the electroplate.
Preferably, the electroplating device with honeycomb baffle further includes hanger, and the electroplate hangs on the extension
Has bottom.
Preferably, the honeycomb baffle is located at close to the jet pipe side of the electroplate, is located at the jet pipe and institute
It states between electroplate；Or the honeycomb baffle be located at close to the anode the jet pipe side, be located at the jet pipe with it is described
Between anode.
Compared with prior art, the utility model has the following beneficial effects: honeycomb baffle is located at electricity in the electroplating device
It plates between plate and anode, under conditions of difference penetrates pressure or different angle is sprayed, honeycomb baffle facilitates between medical fluid and ion
Convection current, make medical fluid from all quarter flow through honeycomb baffle after reach streamlined flow effect；And the ion between medical fluid
The medical fluid that can be exported through honeycomb baffle with nozzle swaps, and the ion concentration for reaching the different zones in cylinder is average, makes
It is uniform to obtain plating attachment on electroplate.
Detailed description of the invention
Fig. 1 is that there is the utility model first embodiment the electroplating device of honeycomb baffle to make when electroplate is electroplated
Use state diagram.
The structure chart of Fig. 2 is the honeycomb of the utility model first embodiment when being hexagon honeycomb baffle.
The structure chart of Fig. 3 is the honeycomb of the utility model first embodiment when being circle honeycomb baffle.
Fig. 4 is the structure chart of honeycomb baffle when the honeycomb of the utility model first embodiment is square.
Fig. 5 is that there is the utility model second embodiment the electroplating device of honeycomb baffle to make when electroplate is electroplated
Use state diagram.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
Electroplating device is used to plate setting for the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle
Standby, the utility model provides a kind of electroplating device 100 with honeycomb baffle for electroplate 200 to be electroplated, and leads to
Crossing the honeycomb baffle 30 being added makes plating attachment on electroplate 200 uniform.Fig. 1 is that the utility model first embodiment has bee
Usage state diagram when electroplate is electroplated in the electroplating device of nest baffle, as shown in Figure 1, the present embodiment has honeycomb gear
The electroplating device 100 of plate includes plating cylinder (not shown), anode 10, jet pipe 20 and honeycomb baffle 30.
The positional relationship between all parts is described in detail below:
Referring to Fig. 1, the electroplate 200 of the present embodiment, anode 10, jet pipe 20 and honeycomb baffle 30 are set along the vertical direction
In in plating cylinder.Wherein, jet pipe 20 be set to 200 two sides of electroplate, each jet pipe 20 be equipped with several nozzles 21, nozzle 21 by
It is uniformly distributed under on jet pipe 20, and two side nozzles, 21 ejection end is respectively perpendicular and is right against corresponding 200 two sides of electroplate
Face.Then, nozzle 21 sprays medical fluid on electroplate 200.
Furthermore anode 10 be set to 200 two sides of electroplate, honeycomb baffle 30 be located at electroplate 200 and wherein an anode 10 it
Between, electroplate 200 is cathode plate.Honeycomb baffle 30 is fixed, but to fixed form without limiting.The quantity of anode 10
Related to the width of electroplate 200: when electroplate 200 is wider, the quantity of anode 10 is more；When electroplate 200 is relatively narrow, sun
The negligible amounts of pole 10, but it is at least a pair of.Furthermore the quantity of jet pipe 20 is consistent with the quantity of anode 10.
Please continue to refer to Fig. 1, the honeycomb baffle 30 of the present embodiment is a slide plate, and slide plate is equipped with an at least hole, when
When slide plate is porous plate, slide plate is equipped with the honeycomb 31 of several dense regulars arrangement shape, it is preferred that honeycomb 31 is
Equilateral polygon, circle or grid-shaped, Fig. 2 is the honeycomb of the utility model first embodiment honeycomb baffle when being hexagon
Structure chart, the structure chart of Fig. 3 is the honeycomb of the utility model first embodiment when being circle honeycomb baffle, Fig. 4 is that this is practical
The structure chart of honeycomb baffle when the honeycomb of novel first embodiment is square.Then, there is the honeycomb gear of fine and close honeycomb 31
Plate 30 is attached between anode and cathode, and under conditions of difference penetrates pressure or different angle is sprayed, honeycomb baffle 30 facilitates medicine
Convection current between liquid and ion, the ion concentration for reaching the different zones in cylinder is average, keeps the flow direction of medical fluid from all quarter logical
Reach streamlined flow effect after crossing honeycomb baffle 30.
Furthermore the height of honeycomb baffle 30 is greater than the height of electroplate 200, i.e. honeycomb baffle 30 can be with all standing electroplate
200, avoid the electroplating surface that not can't stop on electroplate 200 in the plating process uneven.
Please continue to refer to Fig. 1, the electroplating device 100 with honeycomb baffle of the present embodiment further includes hanger 40, electroplate
200 hang on 40 bottom of hanger, and hanger 40 is used for the fixed function to electroplate 200.
Please continue to refer to Fig. 1, the honeycomb baffle 30 of the present embodiment is located at close to 20 side of jet pipe of electroplate 200, honeycomb
Before baffle 30 is located at jet pipe 20, between jet pipe 20 and electroplate 200.But the position of honeycomb baffle 30 is not limited thereto,
Fig. 5 is use state when there is the utility model second embodiment the electroplating device of honeycomb baffle electroplate to be electroplated
Figure, the electroplating device 100' with honeycomb baffle of second embodiment and the electroplating device with honeycomb baffle of first embodiment
100 other parts are consistent, and the difference of the two is only that the position of honeycomb baffle 30 is different: as shown in figure 5, the bee of the present embodiment
Nest baffle 30' is located at close to 20 side of jet pipe of anode 10, after honeycomb baffle 30' is located at jet pipe 20, is located at jet pipe 20 and anode
Between 10, honeycomb baffle 30' is still located between anode and cathode.
Compared with prior art, the utility model has the following beneficial effects: honeycomb baffle in the electroplating device (30 or
30') between electroplate 200 and anode 10, under conditions of difference is penetrated pressure or different angle and is sprayed, honeycomb baffle (30 or
30') facilitate the convection current between medical fluid and ion, make medical fluid from all quarter flow through honeycomb baffle (30 or 30') after
Reach streamlined flow effect；And the medical fluid that the ion between medical fluid can be exported through honeycomb baffle (30 or 30') and nozzle 21
It swaps, the ion concentration for reaching the different zones in cylinder is average, so that plating attachment is uniform on electroplate 200.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (6)
1. a kind of electroplating device with honeycomb baffle, for electroplate to be electroplated, which is characterized in that including plating cylinder,
Anode, jet pipe and honeycomb baffle, the electroplate, the anode, the jet pipe and the honeycomb baffle are set along the vertical direction
In in the plating cylinder, the jet pipe is set to the electroplate two sides, and each jet pipe is equipped with several nozzles, the spray
Mouth is from top to bottom uniformly distributed on the jet pipe, and nozzle ejection end described in two sides is respectively perpendicular and is right against the corresponding electricity
Plate two sides are plated, the anode is set to the electroplate two sides, and the honeycomb baffle is located at the electroplate and wherein described in one
Between anode.
2. the electroplating device according to claim 1 with honeycomb baffle, which is characterized in that the honeycomb baffle is one flat
Straight panel, the slide plate are equipped with an at least hole, and when the slide plate is porous plate, the slide plate is equipped with several rules
The honeycomb of densification arrangement shape.
3. the electroplating device according to claim 2 with honeycomb baffle, which is characterized in that the honeycomb is equilateral more
Side shape, circle or grid-shaped.
4. the electroplating device according to claim 1 with honeycomb baffle, which is characterized in that the height of the honeycomb baffle
Greater than the height of the electroplate.
5. the electroplating device according to claim 1 with honeycomb baffle, which is characterized in that it further include hanger, the electricity
Plating plate hangs on the hanger bottom.
6. the electroplating device according to claim 1 with honeycomb baffle, which is characterized in that the honeycomb baffle, which is located at, to be leaned on
The jet pipe side of the nearly electroplate, between the jet pipe and the electroplate；Or the honeycomb baffle be located at lean on
The jet pipe side of the nearly anode, between the jet pipe and the anode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821435965.3U CN208857381U (en) | 2018-08-31 | 2018-08-31 | A kind of electroplating device with honeycomb baffle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821435965.3U CN208857381U (en) | 2018-08-31 | 2018-08-31 | A kind of electroplating device with honeycomb baffle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208857381U true CN208857381U (en) | 2019-05-14 |
Family
ID=66416662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821435965.3U Expired - Fee Related CN208857381U (en) | 2018-08-31 | 2018-08-31 | A kind of electroplating device with honeycomb baffle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208857381U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112609232A (en) * | 2020-11-13 | 2021-04-06 | 吴勇军 | Electroplating equipment |
| CN113279043A (en) * | 2020-02-20 | 2021-08-20 | 株式会社荏原制作所 | Stirrer, processing device provided with stirrer, and method for manufacturing stirrer |
-
2018
- 2018-08-31 CN CN201821435965.3U patent/CN208857381U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113279043A (en) * | 2020-02-20 | 2021-08-20 | 株式会社荏原制作所 | Stirrer, processing device provided with stirrer, and method for manufacturing stirrer |
| US20210262111A1 (en) * | 2020-02-20 | 2021-08-26 | Ebara Corporation | Paddle, processing apparatus having the paddle, and method of producing the paddle |
| US11891715B2 (en) * | 2020-02-20 | 2024-02-06 | Ebara Corporation | Paddle, processing apparatus having the paddle, and method of producing the paddle |
| CN112609232A (en) * | 2020-11-13 | 2021-04-06 | 吴勇军 | Electroplating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190514 Termination date: 20200831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |