CN208854405U - Grinding head and grinding wafer machine - Google Patents

Abstract

The utility model relates to semiconductor processing equipment technical fields, disclose a kind of grinding head and the grinding wafer machine with the grinding head, grinding head includes and the first surface of wafer contacts and the second surface opposite with the first surface, grinding head further includes shield, which is arranged to prominent to stop particle to fall from second surface from the second surface of grinding head.By the way that shield is arranged on grinding head, shield can effectively stop particle to fall on grinding pad from the second surface of grinding head, to avoid particle damage grinding pad and wafer, reduce wafer defect, improve grinding quality.

Description

Grinding head and grinding wafer machine

Technical field

The utility model relates to semiconductor processing equipment technical field, in particular to a kind of reduction particle falls to grinding pad On grinding head and grinding wafer machine.

Background technique

Grinding wafer (Back Grinding), is also " grinding back surface " or " thinning back side ".As its name suggests, mainly Make its thickness control in certain range by the back side polishing wafer.In grinding wafer technique, the equipment of grinding crystal wafer Make grinding wafer machine.Generally, grinding wafer machine includes grinding plate, the grinding pad being set on grinding plate and grinding Head.When grinding crystal wafer, the front of the fixed absorption wafer of grinding head, and the back side of wafer is pressed on grinding pad, pass through The back side of wafer is ground in the relative motion of grinding head and grinding plate.

But in practical applications, as shown in Figure 1, the grinding head is telescopically arranged in shell (not shown), shell The bottom of body is formed with bottom tray, and there are gaps between bottom tray and the rotation axis for driving grinding head rotation.Wherein, bottom A large amount of particle can be accumulated on pallet, and with the progress of grinding wafer, shell is influenced and possibility by the rotation axis rotated Vibration is generated, particle is fallen to vibration on the upper surface of grinding head, the meeting again of the particle on the upper surface of grinding head It is fallen on grinding pad with the movement of grinding head.The particle packing fallen can make on the surface of grinding pad (not shown) Grinding pad loses the ability of grinding, and the clast on grinding pad can also reach the surface of wafer and scratch wafer, causes wafer Defect reduces grinding quality.

Utility model content

In order to solve the above-mentioned technical problem the utility model proposes, and it is an object of the present invention to provide a kind of grinding head.By grinding Shield is set on bistrique, effectively particle is stopped to fall on grinding pad from second surface, that is, upper surface of grinding head, to keep away Exempt from particle damage grinding pad and wafer, reduce wafer defect, improves grinding quality.

Specifically, the utility model provides a kind of grinding head, for the grinding of wafer, including with wafer contacts One surface and the second surface opposite with the first surface, the grinding head further include shield, which is arranged to It can be prominent to stop particle to fall from the second surface from the second surface of the grinding head.

Compared to existing technologies, grinding head provided by the utility model, by the way that shield is arranged, which can be with Stop particle to fall on grinding pad from the second surface of grinding head, reduce and fall to particle on grinding pad, and then can be with It avoids the particle packing fallen from damaging grinding pad on the surface of grinding pad, protects grinding pad, extend the service life of grinding pad. The particle fallen on grinding pad is reduced, the surface of wafer can also be reached to avoid the particle fallen and scratches wafer, is reduced brilliant Discount vibram outlet is fallen into, and improves the performance of formed device, improves grinding quality.

In addition, the shield is located at preferably, offering opening portion on the second surface of the grinding head It can be moved in the opening portion and up and down under the driving of driving mechanism relative to the second surface.

When grinding crystal wafer, shield protrudes from second surface from opening portion, and shield is to falling to second surface Particle stopped, avoid the particle on second surface from falling on grinding pad and damage grinding pad and wafer.Work as end When grinding, shield be may return in opening portion, keep the second surface of grinding head smooth, convenient on grinding head Grain is cleared up, and grinding quality is improved.

Further, preferably, the driving mechanism includes the cylinder assembly with piston rod, the piston rod and institute Shield is stated to be fixedly connected.

According to the preferred embodiment, driving mechanism includes cylinder assembly, when cylinder assembly work, drives the work of cylinder assembly Stopper rod is flexible, so that the shield being fixedly connected with piston rod be driven to move up and down, cylinder assembly drives shield to move up and down Mode is simple, driving high efficient and flexible.

In addition, preferably, the driving mechanism includes the transmission component being made of gear and rack gear, the rack gear and institute Shield is stated to be fixedly connected.

According to the preferred embodiment, when transmission component work, gear is rotated and is moved up and down with carry-over bar, so that and rack gear The shield being fixedly connected moves up and down, the mode letter that the transmission component driving shield being made of gear and rack gear moves up and down Single, driving high efficient and flexible.

Further, preferably, the inner peripheral in the opening portion is provided with elastic seal ring.

According to the preferred embodiment, the gap between shield and the opening portion of grinding head is carried out using elastic seal ring Sealing, can fall in opening portion to avoid particle, and then mitigate the difficulty of later period cleaning particle, improve efficiency.

In addition, preferably, the shield integrally annularly wraps on the second surface or the protection Cover is formed by multiple fan blades and is wrapped on the second surface.

According to the preferred embodiment, shield is integrally annularly wrapped on a second surface, on second surface Particle carries out 360 ° of obstruction, can further avoid the particle being located on second surface from falling on grinding pad, protection is ground Mill pad and wafer improve grinding quality.Shield can also be formed by multiple fan blades and be wrapped on a second surface, to being located at Particle on second surface is stopped comprehensively, and the particle being located on second surface is avoided to fall on grinding pad, protection grinding Pad and wafer improve grinding quality.

In addition, preferably, being partially toward the second surface from the second surface is outstanding in the shield Central axis inclination.

According to the preferred embodiment, the central axis of shield towards second surface is tilted, it is possible to reduce particle is from shield Rebound the probability onto grinding pad, protects grinding pad and wafer, improves grinding quality.

In addition, preferably, the edge of the second surface is arranged in the shield.

According to the preferred embodiment, the edge of second surface is arranged in shield, increases the pretective acreage of shield, into one Step avoids the particle being located on second surface from falling on grinding pad, protects grinding pad and wafer, improves grinding quality.

In addition, preferably, in the shield from second surface height outstanding be 15cm.

According to the preferred embodiment, the height of the prominent second surface of shield is 15cm, can effectively be stopped from second surface The particle to fly out, while avoiding waste material and increasing cost.

The utility model additionally provides a kind of grinding wafer machine, including grinding plate and is set on the grinding plate Grinding pad, further include the grinding head in any scheme described above.

Compared to existing technologies, grinding wafer machine provided by the utility model, when grinding crystal wafer, grinding head The front of fixed absorption wafer, and the back side of wafer is pressed on grinding pad, pass through the relative motion of grinding head and grinding plate The back side of wafer is ground.When the particle on the second surface for falling to grinding head wants to fly out second surface, The shield of grinding head stops particle, and particle is avoided to fall on grinding pad from second surface, so as to reduce Fall to the particle on grinding pad.The particle fallen on grinding pad is reduced, so as to avoid the particle packing fallen from grinding It grinds the surface of pad and damages grinding pad, protect grinding pad, extend the service life of grinding pad.The particle fallen on grinding pad subtracts It is few, so as to avoid the particle fallen from reaching the surface of wafer and scratch wafer, wafer defect is reduced, formed device is improved Performance, improve grinding quality.

Detailed description of the invention

Fig. 1 is the structural schematic diagram for grinding head assembly in the prior art；

Fig. 2 is the structural schematic diagram of the utility model first embodiment；

Fig. 3 is the structural schematic diagram of the utility model second embodiment；

Fig. 4 is the structural schematic diagram of the utility model third embodiment；

Fig. 5 is the structural schematic diagram of the 4th embodiment of the utility model.

Description of symbols:

1, first surface；2, second surface；3, snap ring；4, shield；5, opening portion；6, cylinder assembly；61, cylinder； 61a, cylinder body；61b, piston rod；62, pressure control unit；7, elastic seal ring；8, transmission component；81, gear；82, rack gear； 83, driving motor；10, grinding head；11, rotary electric machine；12, rotation axis；13, bottom tray；20, grinding plate；21, it grinds Pad.

Specific embodiment

With reference to the accompanying drawings of the specification, the utility model is described in further detail.It is schematically simple in attached drawing Change shows grinding head and the structure of grinding wafer machine etc..

In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "left", "right", The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.

Embodiment one

Shown in Figure 2, grinding head assembly includes shell (not shown), grinding head 10, turn for driving grinding head 10 to rotate Dynamic motor 11 and rotation axis 12.Wherein, rotary electric machine 11 is located in shell, and one end of rotation axis 12 and rotary electric machine 11 are driven Connection, the other end are stretched out shell and are fixedly connected with grinding head 10.The bottom of shell is formed with bottom tray 13, bottom tray 13 There are gap between rotation axis 12, the particle being accumulated in bottom tray 13 be easy in grinding crystal wafer because of the movement of component and Vibration is influenced and is fallen on the upper surface (following second surfaces 2) of wafer.

The first embodiment of the utility model provides a kind of grinding head, shown in Figure 2, including first surface 1 with And the second surface 2 opposite with the first surface 1.Wherein, snap ring 3, snap ring 3 are provided on the first surface 1 of grinding head 10 Wafer is limited on the first surface 1 of grinding head 10, wafer is avoided to slip during grinding.Grinding head 10 further includes preventing Shield 4, which is arranged to protrude from the second surface 2 of grinding head 10, to stop particle from second surface 2 It falls.

Compared to existing technologies, grinding head 10 provided by the utility model, by the way that shield 4, the shield 4 is arranged Particle can be stopped to be fallen on grinding pad 21 (referring to Fig. 5) from the second surface 2 of grinding head 10, fallen so as to reduce Particle onto grinding pad 21.The particle fallen on grinding pad 21 is reduced, so as to avoid the particle packing fallen from grinding It grinds the surface of pad 21 and damages grinding pad 21, protect grinding pad 21, extend the service life of grinding pad 21.Fall to grinding pad 21 On particle reduce, so as to avoid the particle fallen reach wafer surface and scratch wafer, reduce wafer defect, improve The performance of formed device improves grinding quality.

In addition, particle can also be concentrated on the second surface 2 of grinding head 10 using the shield 4 of setting, after convenient Phase concentration clears up particle.

In general, grinding head 10 is central portion, and correspondingly, shield 4 is whole annularly to be wrapped second On surface 2,360 ° of obstruction is carried out to the particle being located on second surface 2, can further avoid being located on second surface 2 Particle fall on grinding pad 21, protect grinding pad 21 and wafer, improve grinding quality.

The circular area of shield 4 is bigger, and the protective range of shield 4 is bigger.In present embodiment, shield 4 is arranged At the edge of second surface 2, the protective range of shield 4 is increased, the particle for further avoiding being located on second surface 2 is fallen Onto grinding pad 21, grinding pad 21 and wafer are protected, improves grinding quality.

It particularly, is 15cm from the height outstanding of second surface 2 in shield 4, shield 4 at this time can effectively stop The particle to fly out from second surface 2, while avoiding waste material and increasing cost.Certainly, prominent from second surface 2 in shield 4 Height out is not limited to 15cm, can also be any appropriate height according to the size conversion of grinding head 10.

As shown in Fig. 2, offering opening portion 5 on the second surface 2 of grinding head 10, shield 4 is located in opening portion 5 simultaneously It can be moved up and down under the driving of driving mechanism relative to second surface 2.Shield 4 is arranged to can be relative to grinding head 10 move up and down, and shield 4 can be prominent from the second surface 2 of grinding head 10 or be located inside grinding head 10.When grinding is brilliant When circle, driving mechanism drives shield 4 to stretch out second surface 2 from opening portion 5, and shield 4 is to falling to second surface 2 Particle is stopped, and the particle on second surface 2 is avoided to fall on grinding pad 21 and damage grinding pad 21 and wafer.Work as knot When beam is ground, driving mechanism can drive shield 4 to return in opening portion 5 (preferably with the flush of opening portion 5), protect The second surface 2 for holding grinding head 10 is smooth, convenient to clear up the particle on grinding head 10, improves grinding quality.

In the present embodiment, as shown in Fig. 2, driving mechanism is cylinder assembly 6.Cylinder assembly 6 include by cylinder body 61a and The cylinder 61 and pressure control unit 62 of piston rod 61b composition, pressure control unit 62 are connected with the cylinder body 61a of cylinder 61 Logical, shield 4 is fixedly connected with the piston rod 61b of cylinder 61.When driving mechanism drives work, pressure control unit 62 is to cylinder It it is passed through air in 61 cylinder body 61a perhaps extracts air out and form positive pressure or negative pressure in cylinder body 61a, piston rod 61b is in air pressure Drive under stretch, so that the shield 4 fixed with piston rod 61b be driven to move up and down, the driving shield of cylinder assembly 6 The modes of 4 up and down motions are simple, drive high efficient and flexible.Cylinder assembly 6 can be set multiple, be separately positioned on and shield 4 The corresponding position of different parts and make 4 uniform force of shield.

There is gap between shield 4 and grinding head 10, particle is easy to fall in opening portion 5 from the gap, give Later period cleaning particle brings difficulty.In order to avoid particle is fallen in opening portion 5, as shown in Fig. 2, the inner peripheral in opening portion 5 It is provided with elastic seal ring 7, elastic seal ring 7 is sealed above-mentioned gap, mitigates the difficulty of later period cleaning particle, improves Efficiency.Meanwhile the particle that can not be fallen in opening portion 5 is able to concentrate and remain on the second surface 2 of grinding head 10, convenient pair Particle is focused on.

Embodiment two

The second embodiment of the utility model provides a kind of grinding head, and second embodiment is to first embodiment Further improvement, not doing the part illustrated includes appended drawing reference and verbal description, identical with first embodiment, This is repeated no more.

Second embodiment mainly thes improvement is that second in the utility model is real relative to first embodiment It applies in mode, from the point of view of Fig. 3, driving mechanism includes the transmission component being made of gear 81, rack gear 82 and driving motor 83 8.Wherein, gear 81 is engaged with rack gear 82, and the gear shaft of gear 81 is connect with the shaft of driving motor 83, the top of rack gear 82 with The bottom end of shield 4 connects.When driving mechanism drives work, the starting band moving gear 81 of driving motor 83 is rotated, and gear 81 rotates Drive rack 82 moves up and down, thus drive with rack gear 82 fixation shield 4 move up and down, by gear 81, rack gear 82 and The mode that the transmission component 8 that driving motor 83 is constituted drives shield 4 to move up and down is simple, drives high efficient and flexible.

Embodiment three

The third embodiment of the utility model provides a kind of grinding head, and third embodiment is to first embodiment Further improvement, not doing the part illustrated includes appended drawing reference and verbal description, identical with first embodiment, This is repeated no more.

Third embodiment is mainly theed improvement is that relative to first embodiment, real in the third of the utility model It applies in mode, from the point of view of Fig. 4, inclines in shield 4 from the central axis outstanding for being partially toward second surface 2 of second surface 2 Tiltedly.The second surface 2 at this point, shield 4 that the particle to fly out is inclined by rebounds back, thus reduce particle from shield 4 rebound to Probability on grinding pad 21 protects grinding pad 21 and wafer, improves grinding quality.In this embodiment, shield 4 inclines Inclined portion point does not recede into opening portion 5 after terminating grinding.

As shown in figure 4, particularly, shield 4 is formed by multiple fan blades, multiple fan blades are wrapped on second surface 2, contraposition It is stopped comprehensively in the particle on second surface 2, the particle being located on second surface 2 is avoided to fall on grinding pad 21, protected Grinding pad 21 and wafer are protected, grinding quality is improved.

Embodiment four

4th embodiment of the utility model provides a kind of grinding wafer machine, from the point of view of Fig. 5, including grinding plate 20, grinding pad 21 and as previously described first any grinding head assembly into third embodiment, grinding pad 21 are located at grinding The top of platform.The first surface 1 of grinding head 10 in grinding head assembly faces grinding pad 21, and the shield 4 of grinding head 10 is right The particle fallen on second surface 2 is stopped, and particle is avoided to fall on grinding pad 21, protects grinding pad 21 and crystalline substance Circle.

Compared to existing technologies, grinding wafer machine provided by the utility model, when grinding crystal wafer, grinding head The front of 10 fixed absorption wafers, the snap ring of grinding head 10 limit wafer.The back side of wafer is simultaneously pressed in by grinding head 10 On grinding pad 21, the back side of wafer is ground by the relative motion of grinding head 10 and grinding plate 20.It is ground when falling to Particle on the second surface 2 of bistrique 10 want to fly out second surface 2 when, the shield 4 of grinding head 10 carries out particle Stop, avoids particle from being fallen on grinding pad 21 from second surface 2, so as to reduce fallen on grinding pad 21 Grain.The particle fallen on grinding pad 21 is reduced, so as to avoid the particle packing fallen from damaging on the surface of grinding pad 21 Hurt grinding pad 21, protect grinding pad 21, extends the service life of grinding pad 21.The particle fallen on grinding pad 21 is reduced, from And the surface of wafer can be reached to avoid the particle fallen and scratch wafer, wafer defect is reduced, the property of formed device is improved Can, improve grinding quality.

To those skilled in the art, in the range of the utility model technical idea can as needed and for Each step of above-mentioned control method is deleted or sequence adjusts.

It will be understood by those skilled in the art that in above-mentioned each embodiment, in order to keep reader more preferably geographical It solves the application and proposes many technical details.But even if without these technical details and based on the respective embodiments described above Various changes and modifications can also realize each claim of the application technical solution claimed substantially.Therefore, in reality In, can to above embodiment, various changes can be made in the form and details, without departing from the spirit of the utility model And range.

Claims (10)

1. a kind of grinding head, for the grinding of wafer, including with wafer contacts first surface and with the first surface phase Pair second surface, which is characterized in that the grinding head further includes shield, which is arranged to from the grinding head The second surface it is prominent to stop particle to fall from the second surface.

2. grinding head according to claim 1, which is characterized in that offered on the second surface of the grinding head Opening portion, the shield are located in the opening portion and can be under the drivings of driving mechanism relative on the second surface It is lowerly mobile.

3. grinding head according to claim 2, which is characterized in that the driving mechanism includes the air cylinder group with piston rod Part, the piston rod are fixedly connected with the shield.

4. grinding head according to claim 2, which is characterized in that the driving mechanism includes being made of gear and rack gear Transmission component, the rack gear are fixedly connected with the shield.

5. the grinding head according to any one of claim 2-4, which is characterized in that the inner peripheral in the opening portion is set It is equipped with elastic seal ring.

6. grinding head according to claim 1, which is characterized in that the shield is integrally annularly wrapped described the On two surfaces or the shield is formed by multiple fan blades and is wrapped on the second surface.

7. grinding head according to claim 1, which is characterized in that from second surface portion outstanding in the shield The central axis towards the second surface is divided to tilt.

8. grinding head described in any one of -4 or 7 according to claim 1, which is characterized in that the shield is arranged in institute State the edge of second surface.

9. grinding head described in any one of -4 or 7 according to claim 1, which is characterized in that from described in the shield Second surface height outstanding is 15cm.

10. a kind of grinding wafer machine, exists including grinding plate and the grinding pad being set on the grinding plate, feature In further including the grinding head as described in any one of claim 1-9.