CN208781844U - 一种双垫块光电传感器封装结构 - Google Patents
一种双垫块光电传感器封装结构 Download PDFInfo
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- CN208781844U CN208781844U CN201821533834.9U CN201821533834U CN208781844U CN 208781844 U CN208781844 U CN 208781844U CN 201821533834 U CN201821533834 U CN 201821533834U CN 208781844 U CN208781844 U CN 208781844U
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- chip
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- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000002313 adhesive film Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 230000006698 induction Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 208000024172 Cardiovascular disease Diseases 0.000 description 1
- 102000001554 Hemoglobins Human genes 0.000 description 1
- 108010054147 Hemoglobins Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 210000000748 cardiovascular system Anatomy 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035479 physiological effects, processes and functions Effects 0.000 description 1
- 208000037920 primary disease Diseases 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
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Application Number | Priority Date | Filing Date | Title |
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CN201821533834.9U CN208781844U (zh) | 2018-09-19 | 2018-09-19 | 一种双垫块光电传感器封装结构 |
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CN201821533834.9U CN208781844U (zh) | 2018-09-19 | 2018-09-19 | 一种双垫块光电传感器封装结构 |
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CN208781844U true CN208781844U (zh) | 2019-04-23 |
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CN201821533834.9U Withdrawn - After Issue CN208781844U (zh) | 2018-09-19 | 2018-09-19 | 一种双垫块光电传感器封装结构 |
Country Status (1)
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CN (1) | CN208781844U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109003973A (zh) * | 2018-09-19 | 2018-12-14 | 华天科技(西安)有限公司 | 一种双垫块光电传感器封装结构及其封装方法 |
-
2018
- 2018-09-19 CN CN201821533834.9U patent/CN208781844U/zh not_active Withdrawn - After Issue
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109003973A (zh) * | 2018-09-19 | 2018-12-14 | 华天科技(西安)有限公司 | 一种双垫块光电传感器封装结构及其封装方法 |
CN109003973B (zh) * | 2018-09-19 | 2023-11-28 | 华天科技(西安)有限公司 | 一种双垫块光电传感器封装结构及其封装方法 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huatian Science and Technology (Nanjing) Co.,Ltd. Assignor: HUATIAN TECHNOLOGY (XI'AN) Co.,Ltd. Contract record no.: X2021610000004 Denomination of utility model: A packaging structure of photoelectric sensor with double cushion blocks Granted publication date: 20190423 License type: Common License Record date: 20210526 |
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AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20190423 Effective date of abandoning: 20231128 |
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AV01 | Patent right actively abandoned |
Granted publication date: 20190423 Effective date of abandoning: 20231128 |