CN208767038U - A kind of conductive film, electronic building brick and electronic product - Google Patents
A kind of conductive film, electronic building brick and electronic product Download PDFInfo
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- CN208767038U CN208767038U CN201820746218.5U CN201820746218U CN208767038U CN 208767038 U CN208767038 U CN 208767038U CN 201820746218 U CN201820746218 U CN 201820746218U CN 208767038 U CN208767038 U CN 208767038U
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- conductive film
- conductive
- conductive sheet
- protective film
- flexbile base
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- 239000011469 building brick Substances 0.000 title claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims abstract description 75
- 239000010410 layer Substances 0.000 claims description 36
- 239000012528 membrane Substances 0.000 claims description 26
- 238000005728 strengthening Methods 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000004146 energy storage Methods 0.000 claims description 4
- -1 oxyphenisatin acetal Chemical class 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 2
- 229920006332 epoxy adhesive Polymers 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229960003241 oxyphenisatine Drugs 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- BSPSZRDIBCCYNN-UHFFFAOYSA-N phosphanylidynetin Chemical compound [Sn]#P BSPSZRDIBCCYNN-UHFFFAOYSA-N 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 19
- 239000006071 cream Substances 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- YWIHFOITAUYZBJ-UHFFFAOYSA-N [P].[Cu].[Sn] Chemical compound [P].[Cu].[Sn] YWIHFOITAUYZBJ-UHFFFAOYSA-N 0.000 description 2
- 238000009954 braiding Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229910001074 Lay pewter Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000009955 starching Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of conductive film, electronic building brick and electronic product, is related to conducting element technical field, designs to improve the broad applicability of conductive film.The conductive film includes flexbile base；Conductive sheet and protective film are provided on a surface of the flexbile base; the protective film can be removed; and in the case where the protective film is removed; flexbile base can be folded to the conductive sheet on a side surface of the flexbile base by the part that the protective film covers, and connect with the conductive sheet.Conductive film, electronic building brick and electronic product provided by the utility model are for improving broad applicability and versatility.
Description
Technical field
The utility model relates to conducting element technical field more particularly to a kind of conductive films, electronic building brick and electronic product.
Background technique
There is a kind of conductive film at present, as depicted in figs. 1 and 2, conductive film includes conductive sheet 102, is arranged in conductive sheet 102
The flexbile base 101 of upper and lower two sides, wherein the both ends of conductive sheet 102 have exposed region, this region is for connecting
The electrical connection area of two electronic components, the deficiency of the conductive film is: since the distance between two electrical connection areas are to immobilize
, but in actual use, the connection distance between two electronic components is not all equal, then just needs according to two electronics
Connection distance between element customizes dedicated conductive film, not only reduces the practicability of the conductive film of the structure in this way, increases
Production cost.
Utility model content
The embodiments of the present invention provide a kind of conductive film, electronic building brick and electronic product, the conductive film can be according to need
Connection distance between two electronic components to be connected cuts the flexbile base for being provided with protective film, finally makes to cut
Conductive film afterwards meets connection request, has broad applicability.
In order to achieve the above objectives, the embodiments of the present invention adopt the following technical scheme that
A kind of conductive film, comprising:
Flexbile base；
It is provided with conductive sheet and protective film on a surface of the flexbile base, the protective film can be removed, and
In the case where the protective film is removed, flexbile base can be folded to the conductive sheet by the part that the protective film covers and carry on the back
From on a side surface of the flexbile base, and it is connect with the conductive sheet.
Preferably, the conductive film is passing through the extending direction along the conductive film to the flexibility for being provided with the protective film
The both ends of base layer region cut out notch, remove the protective film, deviate to having flexbile base jaggy towards the conductive sheet
After one side surface of the flexbile base turns down and connect with conductive sheet, the both ends of the conductive sheet are exposed to the flexbile base
Outside, electrical connection area is formed.
Conductive film provided by the embodiment of the utility model can connect the company between two electronic components of conducting as needed
It connects distance and corresponding cutting is carried out to the flexbile base covered by protective film, remove, make by the protective film by protective film
The part of covering can be folded to conductive sheet and deviate from a side surface of the flexbile base, and connect with the conductive sheet, finally make
The distance between exposed two of them electrical connection area meets connection requirement on conductive sheet, which has generally applicable
Property, it the phenomenon that avoiding the difference for the connection distance between two electronic components from being customized dedicated conductive film, reduces
Manufacturing cost.
On the other hand the utility model additionally provides a kind of electronic building brick, be exposed to including both ends described above described soft
Property base outside, formed both ends have electrical connection area conductive film and at least two electronic components, wherein two neighboring electronic component
There is the conductive film connection in electrical connection area by both ends.
On the other hand the utility model additionally provides a kind of electronic product, including electronic building brick described above.
Electronic building brick and electronic product technical effect achieved provided by the embodiment of the utility model is the same as above-mentioned conductive film
Technical effect, do not describing herein.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing conductive film；
Fig. 2 is the A-A sectional view of Fig. 1；
Fig. 3 is a kind of structural schematic diagram of conductive film provided by the embodiment of the utility model；
Fig. 4 is the structural schematic diagram after being cut, being turned down to Fig. 3；
Fig. 5 is the X-X sectional view of Fig. 4；
Fig. 6 is the Y-Y sectional view of Fig. 4；
Fig. 7 provides the structural schematic diagram after the cutting of another conductive film, fold for the utility model embodiment；
Fig. 8 is the structural schematic diagram of conductive sheet provided by the embodiment of the utility model
Fig. 9 is that the positional relationship of conductive sheet provided by the embodiment of the utility model, protective film, strengthening membrane and flexbile base is shown
It is intended to；
Figure 10 is the top view of Fig. 9；
Figure 11 is a kind of flow diagram of the application method of conductive film provided by the embodiment of the utility model；
Figure 12 is top view when electronic building brick provided by the embodiment of the utility model is in unfolded state；
Figure 13 is main view when electronic building brick shown in Figure 12 is in unfolded state；
Figure 14 is main view when electronic building brick shown in Figure 12 is in folded state.
Specific embodiment
It is led with reference to the accompanying drawing to the utility model embodiment conductive film, preparation method and its application method and comprising this
The electronic building brick of electrolemma is described in detail.
Term " first ", " second " are used for description purposes only in the description of the present invention, and should not be understood as indicating
Or it implies relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second " are defined as a result,
Feature can explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise
Illustrate, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection of two element inner segments.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
The utility model embodiment provides a kind of conductive film, and referring to Fig. 3, Fig. 5, Fig. 6 and Fig. 7, which includes soft
Property base 12, is provided with conductive sheet 11 and protective film 14, the protective film 14 can on a surface of the flexbile base 12
It is removed, and in the case where the protective film 14 is removed, flexbile base 12 can be folded to by the part that protective film 14 covers
Conductive sheet 11 deviates from a side surface of the flexbile base 12, and links together with the conductive sheet 11.
In the specific implementation, as shown in figure 4, according to the interim demand in scene to the flexbile base for being provided with protective film 14
12 carry out corresponding cutting, and then turning down after bonding, at least there are two exposed to be electrically connected on the conductive sheet 11 of conductive film 1
Area q is met, the distance between two electrical connection area q meet the connection requirement of two electronic components, in this way expand the conductive film
The scope of application avoids the case where being only applicable to a kind of behaviour in service, and versatility possessed by the conductive film is effectively reduced connection and leads
The manufacturing cost of logical two electronic components.
Exemplary, the thickness of the conductive sheet 11 is less than or equal to 12 μm, and preferably 6~12 μm, further preferably 8~
10 μm, the conductive film 1 in this way is formed the structure similar to flexible circuit board, the conductive sheet in the utility model conductive film 1
11 are equivalent to the conductive layer in flexible circuit board, and the flexbile base 12 in the utility model conductive film is equivalent in flexible circuit board
Overlay film, the empirical equation of the minimum radius bend R of the permission of flexible circuit board: R=(c/2) [(100-EB)/EB]-D,
In, c be conductive layer thickness, unit be μm, D be overlay film thickness, unit μm, EB be conductive layer maximum allowable deflection,
With reference to the empirical equation, experiments verify that, in the conductive film of the utility model, conductive sheet 11 is thinner, and the permission of conductive film is most
Small radius bend is smaller, and fold resistant ability is bigger, therefore the thickness of the fold resistant ability of conductive film 1 and conductive sheet 11 is in negative
It closes, in the prior art, is limited by the application field and industry technique of flexible circuit board, flexible circuit board is usually only with thickness
The conductive layer that degree is 12 μm or more, and since the thickness of conductive sheet 11 in the conductive film of the utility model 1 is less than or equal to 12 μ
M, and conductive film 1 only plays the role of electrical connection, without carrying out microetch, brownification and Darkening process on conductive sheet 11, therefore
The permission minimum radius bend of flexible circuit board in compared with the prior art, the utility model conductive film is smaller, folding resistance
It can be more excellent.Moreover, verifying through crease-flex test, the conductive film of the utility model is able to bear 3000 times or more, even 10000 times
Above, more even 15000 times or more foldings.Such as in conductive sheet 11 with a thickness of 12 μm, minimum radius bend in 0~1mm
Between when, be able to bear 3000 foldings, conductive sheet 11 with a thickness of 6 μm, minimum radius bend between 0~1mm when,
Even it is able to bear 15000 times or more foldings, and unbearable 1000 foldings of existing braiding copper strips, therefore practical
The braiding copper strips of the folding resistance of novel conductive film than in the prior art is big, and conductive sheet 11 is flat configuration, compiles without overlapping
It knits, therefore the slimming design that can be realized conductive film can be improved electricity thus when the conductive film is applied to electronic product
The folding feel of sub- product.
The flexbile base 12 can only include layer of material, also may include multilayer material, be not specifically limited herein.
When flexbile base 12 only includes layer of material, which can be set to by techniques such as lamination, hot pressing, coatings and be led
On electric piece 11；When flexbile base 12 includes multilayer material, it is preferred that referring to Fig. 3 and Fig. 7, flexbile base 12 may include edge
Close to conductive sheet 11 direction be cascading insulating protective film main body 121, the first glue-line 122, in this way, flexbile base 12
It can be bonded together by the first glue-line 122 with conductive sheet 11, and protective film 14 can also pass through the first glue-line 122 and flexibility
Base 12 is bonded together, the bonding strength between flexbile base 12 and conductive sheet 11, between flexbile base 12 and protective film 14
It is higher.
Insulating protective film main body 121 can be polyimide film, polyetherimde films, polyester film, polyethylene film, gather inclined two
Fluoride film, polytetrafluoroethylene film etc., are not specifically limited herein.Preferably, insulating protective film main body 121 is polyimides
The electrical insulating property of film or polyetherimde films, polyimide film and polyetherimde films is more excellent, conductive sheet 11 can be played compared with
Good insulation protection.
It should be understood that the thickness of insulating protective film main body 121 can be 10 μm, 20 μm, 30 μm etc., herein not
It is specifically limited.Preferably, the thickness of insulating protective film main body 121 can be 15~25 μm, it is further preferred that insulation protection
Film main body 121 with a thickness of 18~23 μm, when the thickness of insulating protective film main body 121 within this range when, insulating protective film master
Body 121 can play preferably insulation protection to conductive sheet 11, meanwhile, be advantageously implemented conductive film slimming design with
Conductive film is avoided to influence the appearance of electronic product in the surface of electronic product formation convex closure when being applied to electronic product.First
Glue-line 122 can be layer of silica gel, epoxy adhesive layer (modified epoxy), acrylic acid glue-line (acrylic) or oxyphenisatin acetal
Glue-line (Phenolic Butyrals) etc., is not specifically limited herein.Preferably, the first glue-line 122 is layer of silica gel, silica gel
Flexibility and photostability it is preferable, therefore can be improved the folding resistance of conductive film and fold feel, while enabling conductive film
Enough solar power generation products etc. that is applied to work in the electronic product under high luminous environment.It is further preferred that the first glue
Layer 122 is that the temperature being able to bear is more than or equal to 160 DEG C of layer of silica gel, in this way, the high-temperature stability of the first glue-line 122
Preferably, it can be connected in electronic product by laminating technology, or preferred, the first glue-line 122 is the temperature being able to bear
Layer of silica gel more than or equal to 200 DEG C can be connected in this way, the high-temperature stability of the first glue-line 122 is preferable by heat pressing process
It is connected in electronic product.
The thickness of first glue-line 122 can be 5~7 μm, 8~10 μm, 10~15 μm, 6~15 μm etc., not do herein
It is specific to limit.Preferably, the first glue-line 122 with a thickness of 5~15 μm, it is further preferred that the first glue-line 122 with a thickness of 6
~12 μm, when the thickness of the first glue-line 122 within this range when, can guarantee the connection between flexbile base 12 and conductive sheet 11
Intensity, meanwhile, it is capable to avoid generating largely excessive glue phenomenon in extrusion process due to the first glue-line 122 is blocked up.
Flexbile base 12 with a thickness of 20~40 μm, it is further preferred that flexbile base 12 with a thickness of 24~35 μm, ginseng
It is admitted to the empirical equation for stating the minimum radius bend R of permission of flexible circuit board, experiments verify that, the thickness of flexbile base 12 is got over
Greatly, allow minimum radius bend smaller, the fold resistant ability of conductive film is bigger, therefore the fold resistant ability of conductive film and flexible base
Layer 12 thickness be positively correlated, when the thickness of flexbile base 12 within this range when, the folding resistance energy of conductive film can be taken into account
With slimming design requirement.
The structure of conductive sheet 11 may include following two embodiment:
The first embodiment: conductive sheet 11 only includes conductive sheet main body 111.This structure is simple, is easy production, should
When conductive sheet main body 111 is welded in electronic product, tin cream can be coated in welding position, plating applies tin solder or sn-bi alloy
Solder etc., conductive sheet 11 is welded in electronic product.
Second of embodiment: referring to Fig. 8, conductive sheet 11 includes conductive sheet main body 111 and is covered in the conductive sheet main body
Solder layer 112 on 111 opposite two surfaces.In this way, being convenient for the welding of conductive sheet main body 111, while can be to conductive sheet master
Body 111 carries out corrosion protection.
In the first above-mentioned embodiment and second of embodiment, conductive sheet main body 111 can be copper foil or copper
Content is 99wt% or more alcu alloy film.Wherein, copper foil can be electrolytic copper foil, rolled copper foil or high ductibility rolled copper foil
(that is to say HA copper foil), it is preferred that copper foil is HA copper foil, and compared to cathode copper and calendering copper, the ductility of HA copper foil is preferable,
It can be improved the folding resistance energy of conductive film；Additionally, it is preferred that alcu alloy film is gun-metal piece, phosphor copper piece or phosphor tin copper
Alloy sheet, preferably, ductility is more excellent, can further increase and lead for the elasticity of gun-metal, phosphor copper and phosphor tin copper alloy
The folding resistance of electrolemma.In addition, solder layer 112 can be tin layers, sn-bi alloy layer, leypewter layer etc., do not do herein specific
It limits.Preferably, solder layer 112 is tin layers or sn-bi alloy layer, and tin and sn-bi alloy are common solder, easy to accomplish, and
Welding performance is more excellent.
The thickness of solder layer 112 can be 0.2~1.2 μm, 0.4~0.8 μm, 0.8~1 μm, be not specifically limited herein.
Preferably, the thickness of solder layer 112 be less than or equal to 1.2 μm, it is further preferred that solder layer 112 with a thickness of 0.8~1 μm,
Solder layer 112 can be realized effective welding in this thickness range, while can guarantee the structural strength of conductive sheet 11.
Solder layer 112 technological formings such as can handle in conductive sheet main body 111 using plating, vacuum coating, starching,
This is not specifically limited.
When the conductive sheet main body 111 selects HA copper foil, since the HA copper foil is very thin, and conductive sheet 11 is very thin, makes
It is not easy to operate at 11 poor in processability of conductive sheet, referring to Fig. 3, the one of the flexbile base 12 can be deviated from the conductive sheet 11
Side surface is provided with tearable strengthening membrane 13, and the tensile strength of strengthening membrane 13 is the more superior and more good, referring to Fig. 3, the strengthening membrane 13
Including strengthening membrane main body 131 and the second glue-line 132 being set on a surface of the strengthening membrane main body 131, the reinforcement
Film 13 is adhered on a side surface of the conductive sheet 11 by second glue-line 132, the peel strength 6 of the strengthening membrane 13
~30 gram/inchs, preferably 7~25 gram/inchs, further preferably 10~20 gram/inchs, are arranged the work of the strengthening membrane 13
With are as follows: it (1) plays a supporting role to the conductive sheet 11, improves processing performance；(2) the conductive sheet 11 is protected, prevents from being scratched
Even damage；(3) low viscosity is convenient for before being folded by its torn fast, and will not damage to conductive sheet 11.
When it is implemented, the edge wheel profile of the strengthening membrane 13 and the edge wheel profile of the conductive sheet 11 coincide,
I.e. strengthening membrane 13 can cover the conductive sheet 11, and the edge wheel profile of the strengthening membrane 13 is more than the edge of the conductive sheet 11
Contour line is also within the protection scope of the utility model.
Referring to Fig. 3, protective film 14 is provided on the flexbile base 12, and the protective film 14 can remove, when the protection
After film 14 is removed, the part adhesive for being turned down flexbile base 12 by the first glue-line 122 is on conductive sheet 11, specific implementation
When, the flexbile base 12 for being covered with protective film 14 is cut, at least two notches are cut out, which is to cover
It is by the notch that electrical connection area q is naked on conductive sheet 11 after thering is the flexbile base 12 of protective film 14 to turn down on conductive sheet 11
Dew, and then exposed electrical connection area q is made to meet the connection request between two electronic components, protective film 14 is to described first
Glue-line 122 has protective effect, prevents from being contaminated by dust when the first glue-line 122 is exposed, and then influence adhesive property, it is preferred that
First glue-line 122 is covered in using release film, it is further preferred that using fluorine element release film.
It is exemplary, referring to Fig. 9, the thickness h of the protective film 141With the thickness of the strengthening membrane 13 and the conductive sheet 11
The sum of h2Relationship are as follows:
Preferably,
It is further preferred that
It is further preferred that h1=h2.Wherein, h1=h2For optimal case, when specifically pasting, the conductive sheet 11
It is arranged on the flexbile base 12 by the first glue-line 122, and by protective film 14 and the conductive sheet 11 for being connected with strengthening membrane 13
It is covered on flexbile base 12 parallel, when the thickness h of protective film 141, it is bonded with the sum of the thickness of conductive sheet 11 of strengthening membrane 13 h2
When meeting above-mentioned requirements, protective film 14 can be guaranteed to the active force of the first glue-line 122 with the conductive sheet for being connected with strengthening membrane 13
The active force of 11 pair of first glue-line 122 is suitable, guarantees to be bonded with the conductive sheet 11 of strengthening membrane 13 and the caking property of flexbile base 12
Energy and folding property, meanwhile, the entire conductive film surfacing after bonding can also guarantee good appearance degree.
It is exemplary, referring to Fig. 9 and Figure 10, have gap d for example, gap between the protective film 14 and the conductive sheet 11
Width w4 range be 00.08mm~0.2mm, preferably 0.08mm~0.1mm, further preferably 0.09mm~0.1mm, this
The technical effect that sample design generates are as follows: when specific cutting, cut convenient for crop tool, if not set gap, crop tool
It may be cropped to conductive sheet 11, or even the conductive film is caused to fail.
It is exemplary, referring to Fig.1 0, the surface edge zone of the flexbile base 12 also has adhesive area p, the adhesive area p
It is located on the same surface of the flexbile base 12 with the conductive sheet 11 and protective film 14, and the adhesive area p is located remotely from
The side of the protective film 14, flexbile base 12 is connect with the adhesive area p under fold state, using produced by adhesive area p
Beneficial effect be: can avoid conductive sheet 11 edge exposure, cause leakage risk.
It should be noted that the conductive film 1 of the utility model can be strip, rectangle planar, round planar or web-like etc.
Deng being not specifically limited herein.
Referring to Fig.1 0, when the conductive film 1 is in a strip shape, the width of the width w0 of the flexbile base 12, the protective film 14
Spend relationship of the width of w1, the conductive sheet 11 between w2, the width w3 of the adhesive area p and the width w4 in the gap
Meet: w0=w1+w2+w3+w4, w1=w2+w3, and w3 >=0, length, the length of the protective film 13 of the conductive sheet 11
It is all the same with the length of the flexbile base 12.Make entire 1 edge of conductive film relatively concordant in this way and is covered by protective film 14 soft
Property base 12 turn down after can cover conductive sheet 11 and adhesive area p.
When conductive film 1 is in web-like, clip can be carried out along the length direction of conductive film 1 as needed.
The utility model embodiment additionally provides a kind of preparation method of conductive film, which includes:
Conductive sheet and protective film are set on the same surface of flexbile base, wherein the protective film can be removed, and
The mode of the setting meets: in the case where the protective film is removed, part that flexbile base is covered by the protective film
The conductive sheet can be folded on a side surface of the flexbile base, and connect with the conductive sheet.
The utility model provides the preparation method of above-mentioned conductive film, is desirable by the conductive film that this method is prepared
The flexbile base covered by protective film is carried out according to the connection distance between two electronic components of practical connection conducting opposite
The cutting answered, removes by protective film, makes to be folded to conductive sheet by the part that the protective film covers away from the flexible base
One side surface of layer, and connect with the conductive sheet, finally make on conductive sheet between exposed two of them electrical connection area
Distance meet connection requirement, the conductive film have broad applicability.
Exemplary, the mode of the setting also meets: having gap between the protective film and the conductive sheet；And/or
The mode of the setting also meets: the surface edge zone of the flexbile base also has adhesive area, the sealing
Area is located on the same surface of the flexbile base with the conductive sheet and protective film, and the adhesive area is located remotely from the guarantor
The side of cuticula, flexbile base is connect with the adhesive area under fold state, is had between the protective film and the conductive sheet
There is the adhesive area effect achieved of gap and surface edge zone that flexbile base is set with when foregoing description conductive film pairs
The description of the part, is not described in detail herein.
The utility model embodiment additionally provides the application method of above-mentioned conductive film, and referring to Fig.1 1, the application method packet
It includes:
S1, the both ends cutting along the extending direction of the conductive film, in the flexbile base region for being provided with the protective film
Notch out；
S2, the removal protective film will have flexbile base jaggy towards the conductive sheet away from the flexbile base
The fold of one side surface so that the conductive sheet exposes from the indentation, there, and makes the flexbile base and the conductive sheet of fold
Connection, the conductive film for electrical connection is made.
When it is implemented, being provided with the guarantor according to the connection distance between the two of conducting to be connected electronic components
It is cut on the flexbile base of cuticula, and is at least cut at two, there is notch on the flexbile base after cutting with protective film.
If by adhesive layer cover flexbile base cover the conductive sheet just after fold, first covered by adhesive layer it is soft
Property base measure equidistant two points of connection between two electronic components of conducting to be connected, and along two points
Edge is cut, and needs to enable the notch area formed after cutting to guarantee firmly to connect two electronic components, then will be by
The tool flexbile base jaggy of protective film covering is turned down towards the conductor strip away from a side surface of the flexbile base, and is led to
It crosses the first glue-line to connect with the conductive sheet, such conductive sheet can connect two electronics from two parts that two indentation, theres are exposed
Element, and the distance between two electronic components for connecting conducting also meet connection request.
The case where being provided with the strengthening membrane that can be removed on a side surface of the conductive sheet away from the flexbile base
Under, the application method further include: before turning down flexbile base, remove the strengthening membrane.
Exemplary, the application method further includes that the conductive film for being used to be electrically connected is connected to the two of conducting to be connected
Between a electronic component, specific connection type is that perhaps wherein crimping will using laminating technology or heat pressing process for crimping for welding
The conductive film for electrical connection be crimped on two described in conducting to be connected two electronic components between.
When specific connection, if not covering solder layer in the conductive sheet main body of conductive sheet, when being welded, need in institute
State the electrical connection area surface coating tin cream of the conductive film for electrical connection, wherein the electrical connection area is the conductive sheet from institute
The region for stating indentation, there exposing, when using laminar manner connection, the tin cream need to use low temperature tin cream, when using hot pressing mode
When connection, the tin cream uses low temperature tin cream, medium temperature tin cream or high temperature tin cream.
The utility model embodiment additionally provides a kind of leading for electrical connection being prepared by above-mentioned application method
Electrolemma, as shown in Figure 4.
The utility model embodiment provides a kind of electronic building brick, since the conductive film 1 for including in the electronic building brick is such as
Therefore the conductive film of the production of production method described in conductive film described in upper any embodiment or any embodiment as above is compared
In the prior art, the fold resistant better performances of the electronic building brick of the utility model, electrical connection properties are more excellent, and it is preferable to fold feel.
In the above-described embodiments, conductive film 1 can be connected to two neighboring electricity by techniques such as welding, lamination or hot pressing
Between subcomponent, it is not specifically limited herein, wherein it is connected compared to using laminating technology, when being connected using welding procedure
Connective stability and reliability are more excellent.
In addition, electronic component can be solar battery, display panel, keyboard, electronic organ etc., specific limit is not done herein
It is fixed.
Optionally, as shown in Figure 12, Figure 13 and Figure 14, electronic component is solar battery 2.
In the above-described embodiments, in order to carry out the protection that blocks water to solar battery 2, it is preferred that solar battery includes too
Positive energy battery main body 21 and opposite two surfaces for being set to solar-electricity tank main body 21 are equipped with the film 22 that blocks water, the film 22 that blocks water
It can be set on solar-electricity tank main body 21 by techniques such as vacuum lamination, hot pressing or gluings, it is further preferred that blocking water
Film 22 is set on solar-electricity tank main body 21 by vacuum lamination.In order to reinforce the protection that blocks water to solar battery, preferably
, as shown in figure 13, the film 22 that blocks water is adhered on solar-electricity tank main body 21 by third glue-line 23, and third glue-line 23 can be close
The gap between moisture film 22 and solar-electricity tank main body 21 is blockaded, to strengthen the protection that blocks water to solar battery 2.Its
In, third glue-line 23 can be hot melt adhesive layer.
In order to guarantee the aesthetics of solar battery 2, it is preferred that opposite two surfaces of solar battery 2 are equipped with such as
The appearance materials (not shown) such as cloth, to guarantee the aesthetics of solar battery 2.Wherein, appearance material can pass through layer
Pressure or heat pressing process are set to opposite two surfaces of solar battery.
In order to continuously export electric energy, optionally, electronic building brick further includes energy-storage module (not shown), the energy storage
Module is electrically connected with solar battery.In such manner, it is possible to the electric energy that solar battery generates be stored into energy-storage module, with can
Continuous output electric energy.
The utility model embodiment additionally provides a kind of electronic product, including electronics group described in any embodiment as above
Part.
A kind of electronic product provided by the utility model, since electronic product includes electronics described in any embodiment as above
Component, compared with prior art, the fold resistant better performances of electronic building brick, electrical connection properties are more excellent, and folding feel is preferable, therefore
The fold resistant better performances of electronic product, electrical connection properties are more excellent, and it is preferable to fold feel.
In the description of this specification, particular features, structures, materials, or characteristics can be real in any one or more
Applying can be combined in any suitable manner in example or example.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (25)
1. a kind of conductive film characterized by comprising
Flexbile base；
It is provided with conductive sheet and protective film on a surface of the flexbile base, the protective film can be removed, and in institute
It states in the case that protective film is removed, flexbile base can be folded to the conductive sheet away from institute by the part that the protective film covers
It states on a side surface of flexbile base, and is connect with the conductive sheet.
2. conductive film according to claim 1, which is characterized in that the conductive film is by the extension along the conductive film
Direction cuts out notch to the both ends in the flexbile base region for being provided with the protective film, removes the protective film, lacks to having
It is described to lead after the flexbile base of mouth is connect towards the conductive sheet away from the fold of a side surface of the flexbile base and with conductive sheet
The both ends of electric piece are exposed to outside the flexbile base, form electrical connection area.
3. conductive film according to claim 1 or 2, which is characterized in that the conductive sheet deviates from the one of the flexbile base
The strengthening membrane that can be removed is provided on side surface,
Preferably, the edge wheel profile of the strengthening membrane coincides with the edge wheel profile of the conductive sheet.
4. conductive film according to claim 3, which is characterized in that the thickness h of the protective film1With the strengthening membrane and institute
State the sum of the thickness of conductive sheet h2Relationship are as follows:Preferably,It is further preferred thatIt is further preferred that h1=
h2。
5. conductive film according to claim 1 or 2, which is characterized in that the thickness of the conductive sheet is less than or equal to 12 μm,
Preferably 6~12 μm, further preferably 8~10 μm.
6. conductive film according to claim 1 or 2, which is characterized in that the conductive sheet includes conductive sheet main body, or
The conductive sheet includes conductive sheet main body and the solder layer that is covered on opposite two surfaces of the conductive sheet main body,
The conductive sheet main body be the copper foil alcu alloy film solder layer that perhaps copper content is 99wt% or more be tin layers or
Sn-bi alloy layer, the alcu alloy film are preferably gun-metal piece, phosphor copper piece or phosphor tin alcu alloy film.
7. conductive film according to claim 6, which is characterized in that the solder layer with a thickness of 0~1.2 μm, preferably
0.8~1 μm.
8. conductive film according to claim 1 or 2, which is characterized in that the flexbile base includes along close to the conduction
Insulating protective film main body that the direction of piece is set gradually, the first glue-line.
9. conductive film according to claim 8, which is characterized in that the insulating protective film main body be polyimide film or
Polyetherimde films.
10. conductive film according to claim 8, which is characterized in that the insulating protective film main body with a thickness of 15~25 μ
M, preferably 18~23 μm.
11. conductive film according to claim 8, which is characterized in that first glue-line is layer of silica gel, epoxy adhesive layer, third
Olefin(e) acid glue-line or oxyphenisatin acetal glue-line.
12. conductive film according to claim 8, which is characterized in that first glue-line with a thickness of 5~15 μm, preferably
It is 6~12 μm.
13. conductive film according to claim 1 or 2, which is characterized in that the protective film is release film, preferably fluorine element
Release film.
14. conductive film according to claim 1 or 2, which is characterized in that have between the protective film and the conductive sheet
Gap.
15. conductive film according to claim 14, which is characterized in that the width w4 in the gap is 0.08mm~0.2mm,
Preferably 0.08mm~0.1mm, further preferably 0.09mm~0.1mm.
16. conductive film according to claim 15, which is characterized in that the surface edge zone of the flexbile base also has
Adhesive area, the adhesive area is located on the same surface of the flexbile base with the conductive sheet and protective film, and the sealing
Area is located remotely from the side of the protective film, and flexbile base is connect with the adhesive area under fold state.
17. conductive film according to claim 1 or 2, which is characterized in that the conductive film is in the form of sheets or web-like.
18. conductive film according to claim 16, which is characterized in that when the conductive film is in a strip shape, the flexbile base
Width w0, the width w1 of the protective film, the conductive sheet width be w2, the width w3 of the adhesive area and the gap
Width w4 between relationship meet: w0=w1+w2+w3+w4, w1=w2+w3, and w3 >=0.
19. conductive film according to claim 17, which is characterized in that the conductive film in the form of sheets when, the conductive sheet
Length, the length of the protective film and the length of the flexbile base are all the same.
20. conductive film according to claim 3, which is characterized in that the strengthening membrane includes strengthening membrane main body and is set to
The second glue-line on one surface of the strengthening membrane main body, the strengthening membrane are adhered to the conduction by second glue-line
On one side surface of piece.
21. conductive film according to claim 20, which is characterized in that the peel strength of the strengthening membrane is 6~30 grams/English
It is very little, preferably 7~25 gram/inchs, further preferably 10~20 gram/inchs.
22. a kind of electronic building brick, which is characterized in that including at least two electronic components；
Both ends as claimed in claim 2 are exposed to outside the flexbile base, form the conductive film that both ends have electrical connection area；
Wherein, two neighboring electronic component has the conductive film connection in electrical connection area by the both ends.
23. electronic building brick according to claim 22, which is characterized in that the electronic component is solar battery.
24. electronic building brick according to claim 23, which is characterized in that further include the energy-storage module of electrical connection, the storage
Energy module is electrically connected with the solar battery.
25. a kind of electronic product, which is characterized in that including electronic building brick described in any one of claim 22~24.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746218.5U CN208767038U (en) | 2018-05-18 | 2018-05-18 | A kind of conductive film, electronic building brick and electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746218.5U CN208767038U (en) | 2018-05-18 | 2018-05-18 | A kind of conductive film, electronic building brick and electronic product |
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| Publication Number | Publication Date |
|---|---|
| CN208767038U true CN208767038U (en) | 2019-04-19 |
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ID=66126209
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504048A (en) * | 2018-05-18 | 2019-11-26 | 汉能移动能源控股集团有限公司 | Conductive film, preparation method and use method thereof, electronic assembly and electronic product |
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2018
- 2018-05-18 CN CN201820746218.5U patent/CN208767038U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504048A (en) * | 2018-05-18 | 2019-11-26 | 汉能移动能源控股集团有限公司 | Conductive film, preparation method and use method thereof, electronic assembly and electronic product |
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