CN208765351U - A kind of foam ice coffin double-condenser top air-out negative pressure radiator - Google Patents
A kind of foam ice coffin double-condenser top air-out negative pressure radiator Download PDFInfo
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- CN208765351U CN208765351U CN201821388905.0U CN201821388905U CN208765351U CN 208765351 U CN208765351 U CN 208765351U CN 201821388905 U CN201821388905 U CN 201821388905U CN 208765351 U CN208765351 U CN 208765351U
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- heat dissipation
- double
- negative pressure
- dissipation tank
- top air
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Abstract
The utility model relates to field of mechanical technique, in particular a kind of foam ice coffin double-condenser top air-out negative pressure radiator, including heat dissipation tank, water cooling tube is installed in heat dissipation tank, the rear surface two sides of heat dissipation tank are mounted on support plate, several sliding slots are equipped in each support plate, and each sliding slot runs through support plate, pulley is equipped in each sliding slot, fixed block is equipped with groove, semiconductor chilling plate is equipped in groove, the foam ice coffin double-condenser top air-out negative pressure radiator on heat dissipation tank by being equipped with water cooling tube, vent window and semiconductor chilling plate improve its heat dissipation effect, fan can extract the hot-air in heat dissipation tank out, cold water is injected out of water cooling tube water inlet pipe simultaneously, improve the heat dissipation effect of heat dissipation tank, semiconductor chilling plate is installed by way of with fixed block grafting, convenient for its installation and removal, increase its heat dissipation effect Fruit, structure is simple, easy to use, solves the problems, such as that the heat dissipation of foam ice coffin double-condenser top air-out negative pressure radiator is inapparent.
Description
Technical field
The utility model relates to field of mechanical technique, specially a kind of foam ice coffin double-condenser top air-out negative pressure heat dissipation dress
It sets.
Background technique
Ice coffin also known as crystal sarcophagus or cold coffin, ice coffin and peaceful cabinet are all the representative products of funeral and interment equipment, are usually applied to
Freezen protective corpse is common in the funeral parlor and hospital, and the development of current ice coffin is greatly improved and improves, and pall is by initial
Acrylic board be namely commonly called as the substance of organic glass and forge, what the rapid development and user however as science and technology required
It is continuously improved, present pall mostly uses polycarbonate hydro-forming, polycarbonate i.e. PC force-bearing plate, with good
Hydraulic processes have the good result of impact resistance and high-low temperature resistant, and refrigeration system is one of Major Systems construction of ice coffin,
It is made of compressor, condenser, device for drying and filtering, capillary, five major part of radiator, realizes the refrigeration effect of ice coffin.
At work, internal element can generate heat to the refrigeration system of ice coffin, such as radiate, be likely to result in not in time
The damage of internal component, existing foam ice coffin double-condenser top air-out negative pressure radiator are only radiated using water cooling,
Although cost is relatively low, heat dissipation effect is not significant, and when foam ice coffin use can still generate amount of heat, reduces foam ice coffin
Service life, in consideration of it, it is proposed that a kind of foam ice coffin double-condenser top air-out negative pressure radiator.
Utility model content
The purpose of this utility model is to provide a kind of foam ice coffin double-condenser top air-out negative pressure radiators, to solve
The inapparent problem of foam ice coffin double-condenser top air-out negative pressure radiator heat dissipation mentioned above in the background art.
To achieve the above object, the utility model provides the following technical solutions:
A kind of foam ice coffin double-condenser top air-out negative pressure radiator, including heat dissipation tank, the interior installation of the heat dissipation tank
There is a water cooling tube, the top of the water cooling tube is equipped with water inlet pipe, and the bottom end of the water cooling tube is equipped with outlet pipe, before the heat dissipation tank
Surface is equipped with strainer, and the heat dissipation tank, which is located at the position of the strainer, is equipped with vent window, the rear surface two sides of the heat dissipation tank
It is mounted on support plate, several sliding slots are equipped in each support plate, and each sliding slot runs through the support plate,
Pulley is equipped in each sliding slot, and the pulley is slidably connected by the sliding slot and the support plate, the pulley
One end be equipped with shaft, the shaft far from the pulley one end be equipped with fixed block, the fixed block be equipped with groove, it is described
Semiconductor chilling plate is equipped in groove, and the semiconductor chilling plate is mating by the groove and the fixed block.
Preferably, the vent window is equipped with several fixing bolts, and the vent window passes through the fixing bolt and institute
It states heat dissipation tank to be fixedly connected, is also equipped with fan in the vent window.
Preferably, the upper and lower surfaces of the heat dissipation tank are equipped with several heat release holes, and the heat release hole runs through institute
Heat dissipation tank is stated, the two sides of the heat dissipation tank are additionally provided with installation bolt.
Preferably, the water inlet pipe and the outlet pipe run through the water cooling tube and are in communication with the outside.
Preferably, one end of the shaft is connect with the pulley rotation, the other end of the shaft and the fixed block
Close welding.
Preferably, the sliding slot is equipped with 4-10, and linear equidistant arrangement.
Preferably, the heat release hole is equipped with 6-12, and linear equidistant arrangement.
Compared with prior art, the utility model has the beneficial effects that the foam ice coffin double-condenser top air-out negative pressure dissipates
Thermal improves its heat dissipation effect by being equipped with water cooling tube, vent window and semiconductor chilling plate on heat dissipation tank, and fan can will dissipate
Hot-air extraction in hot tank, while cold water is injected out of water cooling tube water inlet pipe, improve the heat dissipation effect of heat dissipation tank, semiconductor
Cooling piece is installed by way of with fixed block grafting, and convenient for its disassembly and replacement, while fixed block is turned by shaft and pulley
Dynamic connection, so that every block semiconductor cooling piece is adjustable its angle, pulley can slide up and down in sliding slot again, change semiconductor
Gap between cooling piece increases its heat dissipation effect, and structure is simple, easy to use, and it is negative to solve foam ice coffin double-condenser top air-out
Press the inapparent problem of radiator heat dissipation.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is that the structure of heat dissipation tank in the utility model splits schematic diagram；
Fig. 3 is the structural schematic diagram of support plate in the utility model；
Fig. 4 is schematic enlarged-scale view at A in the utility model Fig. 3；
Fig. 5 is the structural schematic diagram of the utility model middle pulley and fixed block.
In figure: 1, heat dissipation tank；11, water cooling tube；111, water inlet pipe；112, outlet pipe；12, strainer；13, heat release hole；14, pacify
Fill bolt；2, vent window；21, fixing bolt；22, fan；3, support plate；31, sliding slot；32, pulley；321, shaft；33, fixed
Block；331, groove；34, semiconductor chilling plate.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
In the description of the present invention, it should be understood that term " center ", " length ", " width ", " thickness ",
The orientation of the instructions such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" or
Positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description,
Rather than the equipment or element of indication or suggestion meaning must have a particular orientation, is constructed and operated in a specific orientation, because
This should not be understood as limiting the present invention.
In addition, " several " are meant that two or more in the description of the present invention, unless otherwise clearly having
The restriction of body.
Fig. 1-5 is please referred to, the utility model provides a kind of technical solution:
A kind of foam ice coffin double-condenser top air-out negative pressure radiator as described in Fig. 1, Fig. 3, Fig. 4 and Fig. 5, including dissipates
Hot tank 1, the interior of heat dissipation tank 1 are equipped with water cooling tube 11, and the top of water cooling tube 11 is equipped with water inlet pipe 111, and the bottom end of water cooling tube 11 is set
There is outlet pipe 112, the front surface of heat dissipation tank 1 is equipped with strainer 12, and heat dissipation tank 1, which is located at the position of strainer 12, is equipped with vent window 2, dissipates
The rear surface two sides of hot tank 1 are mounted on support plate 3, several sliding slots 31 are equipped in each support plate 3, and each sliding slot 31 is equal
Through support plate 3, pulley 32 is equipped in each sliding slot 31, and pulley 32 is slidably connected by sliding slot 31 with support plate 3, pulley
32 one end is equipped with shaft 321, and shaft 321 is equipped with fixed block 33 far from one end of pulley 32, and fixed block 33 is equipped with groove
331, groove 331 is interior to be equipped with semiconductor chilling plate 34, and semiconductor chilling plate 34 is matched by groove 331 and 33 grafting of fixed block
It closes.
In the present embodiment, heat dissipation tank 1 is whole to use stainless steel material, which has good abrasion and corrosion resistance, and
The advantages that stabilized structure, good heat conduction effect, extends the service life of heat dissipation tank 1.
Further, water inlet pipe 111 and outlet pipe 112 are in communication with the outside through water cooling tube 11, are convenient for from water inlet pipe 111
Cold water is inputted, and is exported from outlet pipe 112, circulation injection increases its heat dissipation effect.
In addition to this, the upper and lower surfaces of heat dissipation tank 1 are equipped with several heat release holes 13, and heat release hole 13 is through heat dissipation
Case 1, the two sides of heat dissipation tank 1 are additionally provided with installation bolt 14, and heat release hole 13 is convenient in time dissipating the heat generated in heat dissipation tank 1 outward
Out, while cooperating the work of fan 22.
It is worth noting that heat release hole 13 is equipped with 6-12, and linear equidistant arrangement, heat release hole 13 in the present embodiment
Number is preferably 10, and the diameter of heat release hole 13 is preferably 3cm, convenient for heat dissipation.
In the present embodiment, one end of shaft 321 and pulley 32 are rotatablely connected, and the other end and fixed block 33 of shaft 321 are tight
Close welding increases the gap between semiconductor chilling plate 34, makes heat dissipation effect convenient for adjusting the placed angle of semiconductor chilling plate 34
It is more significant.
Further, sliding slot 31 is equipped with 4-10, and linear equidistant arrangement, and the number of sliding slot 31 is excellent in the present embodiment
8 are selected as, is easily installed multiple semiconductor chilling plates 34, while between capable of being changed between semiconductor chilling plate 34 by sliding slot 31
Gap increases its heat dissipation effect.
As depicted in figs. 1 and 2, vent window 2 be equipped with several fixing bolts 21, and vent window 2 by fixing bolt 21 with
Heat dissipation tank 1 is fixedly connected, and fan 22 is also equipped in vent window 2.
In the present embodiment, the model D14BH-12 of fan 22, the model fan has revolving speed fast, good heat dissipation effect, and
The advantages that cost is relatively low.
Further, the number of fixing bolt 21 is preferably 4 in the present embodiment, convenient for the installation of vent window 2, improves dress
The stability set.
The foam ice coffin double-condenser top air-out negative pressure radiator of the present embodiment when in use, by heat dissipation tank 1
Its heat dissipation effect is improved equipped with water cooling tube 11, vent window 2 and semiconductor chilling plate 34, specifically: by fan 22 and semiconductor system
The extraneous power supply of cold 34 connection makes its work, fan 22 can extract the hot-air in heat dissipation tank 1 out, at the same from water cooling tube 11 into
Cold water is injected in water pipe 111, and is discharged from outlet pipe 112 by the cold water after refrigeration, is carried out recycling water, is improved heat dissipation tank 1
Heat dissipation effect, semiconductor chilling plate 34 are installed by way of with 33 grafting of fixed block, convenient for its disassembly and replacement, meanwhile, Gu
Determine block 33 to be rotatablely connected by shaft 321 and pulley 32, so that every block semiconductor cooling piece 34 is adjustable its angle, pulley 32
It can be slided up and down in sliding slot 31 again, change the gap between semiconductor chilling plate 34, increase its heat dissipation effect, structure is simple, makes
With conveniently, solving the problems, such as that the heat dissipation of foam ice coffin double-condenser top air-out negative pressure radiator is inapparent, convenient for universal and popularization.
Basic principles, main features, and advantages of the present invention has been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Be only the utility model preference, be not intended to limit the utility model, do not departing from the spirit and scope of the utility model
Under the premise of, the utility model also has various changes and improvements, these changes and improvements both fall within claimed it is practical
In novel range.The protection scope of the present invention is defined by the appended claims and their equivalents.
Claims (7)
1. a kind of foam ice coffin double-condenser top air-out negative pressure radiator, including heat dissipation tank (1), it is characterised in that: described to dissipate
It is equipped with water cooling tube (11) in hot tank (1), the top of the water cooling tube (11) is equipped with water inlet pipe (111), the water cooling tube (11)
Bottom end be equipped with outlet pipe (112), the front surface of the heat dissipation tank (1) is equipped with strainer (12), and the heat dissipation tank (1) is located at described
Vent window (2) are equipped at the position of strainer (12), the rear surface two sides of the heat dissipation tank (1) are mounted on support plate (3), each
It is equipped with several sliding slots (31) on the support plate (3), and each sliding slot (31) runs through the support plate (3), each
It is equipped with pulley (32) in the sliding slot (31), and the pulley (32) is sliding by the sliding slot (31) and the support plate (3)
One end of dynamic connection, the pulley (32) is equipped with shaft (321), and the shaft (321) sets far from the one end of the pulley (32)
Have fixed block (33), the fixed block (33) is equipped with groove (331), and semiconductor chilling plate is equipped in the groove (331)
(34), and the semiconductor chilling plate (34) is mating by the groove (331) and the fixed block (33).
2. foam ice coffin double-condenser top air-out negative pressure radiator according to claim 1, it is characterised in that: described logical
Air regulator (2) is equipped with several fixing bolts (21), and the vent window (2) passes through the fixing bolt (21) and the heat dissipation tank
(1) it is fixedly connected, is also equipped with fan (22) in the vent window (2).
3. foam ice coffin double-condenser top air-out negative pressure radiator according to claim 1, it is characterised in that: described to dissipate
The upper and lower surfaces of hot tank (1) are equipped with several heat release holes (13), and the heat release hole (13) runs through the heat dissipation tank
(1), the two sides of the heat dissipation tank (1) are additionally provided with installation bolt (14).
4. foam ice coffin double-condenser top air-out negative pressure radiator according to claim 1, it is characterised in that: it is described into
Water pipe (111) and the outlet pipe (112) are in communication with the outside through the water cooling tube (11).
5. foam ice coffin double-condenser top air-out negative pressure radiator according to claim 1, it is characterised in that: described turn
One end and the pulley (32) of axis (321) are rotatablely connected, and the other end of the shaft (321) and the fixed block (33) are tight
Close welding.
6. foam ice coffin double-condenser top air-out negative pressure radiator according to claim 1, it is characterised in that: the cunning
Slot (31) is equipped with 4-10, and linear equidistant arrangement.
7. foam ice coffin double-condenser top air-out negative pressure radiator according to claim 3, it is characterised in that: described to dissipate
Hot hole (13) is equipped with 6-12, and linear equidistant arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821388905.0U CN208765351U (en) | 2018-08-28 | 2018-08-28 | A kind of foam ice coffin double-condenser top air-out negative pressure radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821388905.0U CN208765351U (en) | 2018-08-28 | 2018-08-28 | A kind of foam ice coffin double-condenser top air-out negative pressure radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208765351U true CN208765351U (en) | 2019-04-19 |
Family
ID=66132921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821388905.0U Expired - Fee Related CN208765351U (en) | 2018-08-28 | 2018-08-28 | A kind of foam ice coffin double-condenser top air-out negative pressure radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208765351U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110911989A (en) * | 2019-12-12 | 2020-03-24 | 苗改燕 | Heat dissipation electric power cabinet based on new energy technology and heat dissipation method |
-
2018
- 2018-08-28 CN CN201821388905.0U patent/CN208765351U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110911989A (en) * | 2019-12-12 | 2020-03-24 | 苗改燕 | Heat dissipation electric power cabinet based on new energy technology and heat dissipation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190419 Termination date: 20190828 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |