CN208758831U - A kind of sn-bi alloy extrusion forming device - Google Patents

A kind of sn-bi alloy extrusion forming device Download PDF

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Publication number
CN208758831U
CN208758831U CN201821016935.9U CN201821016935U CN208758831U CN 208758831 U CN208758831 U CN 208758831U CN 201821016935 U CN201821016935 U CN 201821016935U CN 208758831 U CN208758831 U CN 208758831U
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pipe sleeve
pressure ram
extrusion forming
alloy
forming device
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CN201821016935.9U
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Chinese (zh)
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王虎
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Shaanxi Turing Electronics Technology Co Ltd
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Shaanxi Turing Electronics Technology Co Ltd
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Abstract

The utility model discloses a kind of sn-bi alloy extrusion forming devices, it is related to alloy casting field, including pipe sleeve, the pressure ram being set in pipe sleeve inner cavity, the upper cover and lower cover that are connect with pipe sleeve with inner cavity, the upper cover and pipe sleeve detachable connection, one end of the pressure ram are connected with tube core, and the tube core is set in the inner cavity of pipe sleeve, the inner wall sliding of pipe sleeve can be bonded, the lower cover offers discharge gate, and the lower cover is connected to pipe sleeve, is provided with electric calorifie installation on the pipe sleeve inner wall.The utility model realizes charging by opening upper cover;Then sn-bi alloy is put into sn-bi alloy extrusion forming device, sn-bi alloy is molten into sn-bi alloy liquid by heating;Sn-bi alloy liquid is discharged into mold from discharge gate by pressure ram again.

Description

A kind of sn-bi alloy extrusion forming device
Technical field
The utility model relates to alloy casting field, especially a kind of sn-bi alloy extrusion forming device.
Background technique
With the particularity of increasingly accurate, the integrated and certain welding procedure of electronic component, existing tin cream, tin silk etc. Electronic component increasingly higher demands are unable to satisfy, thus preformed solder comes into being, and preformed solder has shape Multiplicity, the spy that molding is accurate, (solder and scaling powder) dosage is accurate, welding quality is stable, easy to use, production is simple and efficient Point is widely used in chip welding, optical fibre device welding, connector and terminal device welding, printing circuit board assembling and electricity The fields such as son encapsulation, are increasingly subject to the favor of electronics industry.
But in the preformed solder of the prior art often including metallic lead, such as China CN200380108665.4 discloses one Kind soldered ball, welding powder and coating composition of preformed solder and its preparation method and application include metallic lead in solder.Tin bismuth closes Gold is a kind of unleaded environment-friendly type alloy, is in solid-state under room temperature, and fusing point is 138 DEG C.Sn-bi alloy has solid-liquid volume simultaneously Shrinking percentage is 0.051%, has many advantages, such as stronger permeability, coating whether there is or not whisker, fusing point is low, solderability is good, external big Amount promotes and applies, and research and application at home is then less.
Sn-bi alloy multi-pass is crossed the mode poured and is produced in the prior art, but due to preformed solder dosage essence Standard, so solder size also very little (about 1mm), can not be produced by directly pouring.Existing preformed solder multi-pass Overshoot pressure carries out processing synthesis, but sn-bi alloy, since its brittleness is higher, punching press is unable to get appearance and size qualification Tin bismuth preformed solder.
Utility model content
The purpose of this utility model is that: in view of the above problems, a kind of sn-bi alloy extrusion forming device is provided, Solve the problems, such as that the small processing of sn-bi alloy preformed solder size is complicated.
The technical solution adopted in the utility model is as follows:
A kind of sn-bi alloy extrusion forming device, including with inner cavity pipe sleeve, be set in pipe sleeve inner cavity pressure ram, The upper cover and lower cover connecting with pipe sleeve, the upper cover and pipe sleeve detachable connection, one end of the pressure ram are connected with tube core, institute It states tube core to be set in the inner cavity of pipe sleeve, the inner wall sliding of pipe sleeve can be bonded, the lower cover offers openable and closable discharge gate, institute It states lower cover to be connected to pipe sleeve, is provided with electric calorifie installation on the pipe sleeve inner wall.
Since using the above structure, the detachable setting of upper cover realizes charging by opening upper cover;Then by sn-bi alloy It is put into sn-bi alloy extrusion forming device, sn-bi alloy is molten into sn-bi alloy liquid by heating;Pass through pressure ram again Sn-bi alloy liquid is discharged into mold from discharge gate.
Further, the driving device that driving pressure ram moves up and down is provided on the pressure ram.
Further, one end of the pressure ram extends upward through upper cover and is connected with handle.
Due to using the above structure, squeezing work by the completion of manual control pressure ram.
Further, the length of the pressure ram is greater than the length of pipe sleeve.
Further, the pressure ram is threadedly coupled with upper cover.
Further, the electric calorifie installation is connected with temperature controller.
Since using the above structure, the difference of temperature, adjusts the temperature of electric calorifie installation in pipe sleeve according to actual needs.
Further, the discharge port of the lower cover is gradually reduced along discharging direction.
Due to that using the above structure, can more accurately control the extrusion output of sn-bi alloy, while sn-bi alloy discharges More at the uniform velocity.
Further, the lower cover and pipe sleeve detachable connection.
Since using the above structure, lower cover detachable connection can according to need difference, can replace with different sizes The lower cover of discharge gate.It is convenient to the cleaning to lower cover and pipe sleeve inner cavity simultaneously.
Further, it is connected between the pressure ram and tube core by fixing piece.
Further, the tube core and fixing piece detachable connection.
Since the replacement of tube core using the above structure, may be implemented, the service life of product is improved.
In conclusion by adopting the above-described technical solution, the beneficial effects of the utility model are:
1, the utility model realizes charging by opening upper cover;Then sn-bi alloy is put into sn-bi alloy extrusion forming dress In setting, sn-bi alloy is molten into sn-bi alloy liquid by heating;Again by pressure ram by sn-bi alloy liquid from discharge gate It is discharged into mold, a small amount of sn-bi alloy may be implemented, reduce the cost of production, while the processing of the utility model is more It is convenient and safe to add.
2, the discharge port of lower cover is gradually reduced along discharging direction in the utility model, can more accurately control tin bismuth The extrusion output of alloy, while sn-bi alloy discharging is more at the uniform velocity.
Detailed description of the invention
The utility model will illustrate by example and with reference to the appended drawing, in which:
Fig. 1 is the schematic diagram of sn-bi alloy extrusion forming device;
1- handle, 2- pressure ram, 3- fixing piece, 4- tube core, 5- upper cover, 6- pipe sleeve, 7- lower cover, 8- electric calorifie installation, 9- temperature Spend controller.
Specific embodiment
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive Feature and/or step other than, can combine in any way.
Embodiment 1
Such as Fig. 1, provide a kind of sn-bi alloy extrusion forming device, including with inner cavity pipe sleeve 6, be set in pipe sleeve 6 Pressure ram 2 in inner cavity, the upper cover 5 connecting with pipe sleeve 6 and lower cover 7, upper cover 5 and 6 detachable connection of pipe sleeve are set on pressure ram 2 It is equipped with the driving device that driving pressure ram 2 moves up and down, the driving device is that hydraulic cylinder (in other embodiments, can be it He can do the device of straight reciprocating motion), one end of pressure ram 2 is connected with tube core 4, and tube core 4 is set in the inner cavity of pipe sleeve 6 In, the inner wall that can be bonded pipe sleeve 6 slides up and down, and 4 outer diameter of tube core is 0.03mm smaller than 6 internal diameter of pipe sleeve, and lower cover 7, which offers, to be opened The discharge gate of conjunction, lower cover 7 are connected to pipe sleeve 6, and electric calorifie installation 8 is provided on 6 inner wall of pipe sleeve, and the electric calorifie installation 8 is electrothermal resistance Silk (in other embodiments, can be the device for passing through electricity and improving temperature), electric calorifie installation 8 is connected with temperature controller 9.Lower cover 7 It is gradually reduced with the discharge port of pipe sleeve detachable connection, lower cover 7 along discharging direction.
The working principle of the present embodiment are as follows:
Upper cover 5 is opened in use process, sn-bi alloy is put into pipe sleeve 6, closes upper cover 5;Discharge gate is to close at this time Closed state;9 set temperature of opening temperature controller is 140 DEG C, until the sn-bi alloy in pipe sleeve 6 is molten into melt, the time according to 6 size of pipe sleeve and addition sn-bi alloy determine;Then the exhaust outlet for opening lower cover 7 is transported downwards by Driven by Hydraulic Cylinder pressure ram 2 It is dynamic, sn-bi alloy melt is expressed into mold.
Embodiment 2
The present embodiment be it is further on the basis of embodiment 1 improved, specifically:
One end of pressure ram 2 extends upward through upper cover 2 and is connected with handle 1, and pressure ram 2 is threadedly coupled with upper cover 5, pressure ram 2 Length be greater than pipe sleeve 6 length.
Embodiment 3
The present embodiment be it is further on the basis of embodiment 1-2 improved, specifically:
2 lower end of pressure ram is provided with fixing piece 3, and the fixing piece 3 is to be matched with pressure ram 2 (in other embodiments In, can be the other structures that can fix tube core), fixing piece 3 will fixed tube core 4 and 2 detachable connection of pressure ram.
Any feature disclosed in this specification (including any accessory claim, abstract), unless specifically stated, It is replaced by other equivalent or with similar purpose alternative features.That is, unless specifically stated, each feature is a series of An example in equivalent or similar characteristics.
The utility model is not limited to specific embodiment above-mentioned.The utility model expands to any in this specification The new feature of middle disclosure or any new combination, and disclose any new method or process the step of or any new group It closes.

Claims (10)

1. a kind of sn-bi alloy extrusion forming device, which is characterized in that including with inner cavity pipe sleeve (6), be set in pipe sleeve (6) Pressure ram (2) in inner cavity, the upper cover (5) connecting with pipe sleeve (6) and lower cover (7), the upper cover (5) and pipe sleeve (6) are detachable Connection, one end of the pressure ram (2) are connected with tube core (4), and the tube core (4) is set in the inner cavity of pipe sleeve (6), can be bonded The inner wall of pipe sleeve (6) slides up and down, and the lower cover (7) offers openable and closable discharge gate, and the lower cover (7) and pipe sleeve (6) are even It is logical, electric calorifie installation (8) are provided on pipe sleeve (6) inner wall.
2. sn-bi alloy extrusion forming device according to claim 1, which is characterized in that be arranged on the pressure ram (2) The driving device for thering are driving pressure ram (2) to move up and down.
3. sn-bi alloy extrusion forming device according to claim 1 or 2, which is characterized in that the one of the pressure ram (2) End extends upward through upper cover (5) and is connected with handle (1).
4. sn-bi alloy extrusion forming device according to claim 3, which is characterized in that the length of the pressure ram (2) Greater than the length of pipe sleeve (6).
5. sn-bi alloy extrusion forming device according to claim 4, which is characterized in that the pressure ram (2) and upper cover (5) it is threadedly coupled.
6. sn-bi alloy extrusion forming device according to claim 1, which is characterized in that electric calorifie installation (8) connection There are temperature controller (9).
7. sn-bi alloy extrusion forming device according to claim 1, which is characterized in that the discharge port of the lower cover (7) It is gradually reduced along discharging direction.
8. sn-bi alloy extrusion forming device according to claim 1 or claim 7, which is characterized in that the lower cover (7) and pipe sleeve Detachable connection.
9. sn-bi alloy extrusion forming device according to claim 1, which is characterized in that pressure ram (2) lower end is set It is equipped with fixing piece (3), fixed tube core (4) are connect by the fixing piece (3) with pressure ram (2).
10. sn-bi alloy extrusion forming device according to claim 9, which is characterized in that the tube core (4) and fixing piece (3) detachable connection.
CN201821016935.9U 2018-06-29 2018-06-29 A kind of sn-bi alloy extrusion forming device Active CN208758831U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821016935.9U CN208758831U (en) 2018-06-29 2018-06-29 A kind of sn-bi alloy extrusion forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821016935.9U CN208758831U (en) 2018-06-29 2018-06-29 A kind of sn-bi alloy extrusion forming device

Publications (1)

Publication Number Publication Date
CN208758831U true CN208758831U (en) 2019-04-19

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111482578A (en) * 2020-04-14 2020-08-04 惠州市天维五金制品有限公司 Tin ring casting method and equipment
CN115283778A (en) * 2022-10-09 2022-11-04 靖江天元爱尔瑞电子科技有限公司 Welding device for surface mounting of flexible circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111482578A (en) * 2020-04-14 2020-08-04 惠州市天维五金制品有限公司 Tin ring casting method and equipment
CN111482578B (en) * 2020-04-14 2022-02-11 惠州市天维五金制品有限公司 Tin ring casting equipment and method
CN115283778A (en) * 2022-10-09 2022-11-04 靖江天元爱尔瑞电子科技有限公司 Welding device for surface mounting of flexible circuit board
CN115283778B (en) * 2022-10-09 2023-01-10 靖江天元爱尔瑞电子科技有限公司 Welding device for surface mounting of flexible circuit board

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