CN208738191U - The exhaust monitoring system of semiconductor manufacturing facility - Google Patents
The exhaust monitoring system of semiconductor manufacturing facility Download PDFInfo
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- CN208738191U CN208738191U CN201821595020.8U CN201821595020U CN208738191U CN 208738191 U CN208738191 U CN 208738191U CN 201821595020 U CN201821595020 U CN 201821595020U CN 208738191 U CN208738191 U CN 208738191U
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- pressure
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- expulsion
- monitoring system
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Abstract
The utility model discloses a kind of exhaust monitoring systems of semiconductor manufacturing facility, the exhaust monitoring system includes pressure at expulsion monitoring device and transacter, the pressure at expulsion monitoring device is made of pressure gauge and alarm, alarm issues alarm signal when actual exhaust air pressure value exceeds default pressure at expulsion upper limit value or default pressure at expulsion lower limit value, operator is reminded to check, the exhaust pressure detection means are also connect with transacter simultaneously, upload actual exhaust air pressure value in real time to transacter.The exhaust monitoring system of the utility model can monitor the situation of board pressure at expulsion in real time, and abnormal gas exhaust situation is enabled to be found and correct in time.
Description
Technical field
The utility model relates to technical field of semiconductors, the exhaust more particularly to a kind of semiconductor manufacturing facility monitors system
System.
Background technique
In many processes of semiconductors manufacture, discharge gas is required.By taking semiconductor etching process as an example, wafer has been etched
Cheng Hou need to rest on purification storage area, carry out degasification movement, that is, extract the gas in purification storage area (Purge Storage),
Avoid residual gas in subsequent work to reduce the remaining gas of crystal column surface so that purification storage area obtains certain vacuum degree
Phenomena such as gas condensation (gas condense) occurs in sequence, influences product yield.
In existing exhaust system, gas exhaust piping is provided on every board, the gas of board discharge passes through exhaust pipe
Road discharge influences subsequent machining technology if when the capacity exception of board, it is higher to will lead to crystal column surface gas residual quantity, benefit
When with yields test macro testing product yields, product yield can be reduced.If more boards are arranged in exhaust system, this
The gas exhaust piping of a little boards is connect with factory service end exhaust pipe, and after starting work, the gas of each board discharge passes through total air escape pipe
Discharge, when production, the rated discharge pressure (Required Stabile Pressure) of gas exhaust piping is in board on every board
It is set before starting work.In practical manufacturing process, if the board negligible amounts of starting work, the practical row of board
A possibility that atmospheric pressure is equal or close with rated discharge pressure is higher, but if starter motor number of units amount is more, due to always arranging
Tracheae capacity is limited, causes the possibility of the capacity reduction of separate unit board very high, the actual exhaust air pressure of exhaust area is lower than
Rated discharge pressure more causes crystal column surface gas residual quantity higher, influences subsequent machining technology, and later use yields reduces
Product yield.
Current exhaust system is difficult to find whether board is in the presence of that capacity is abnormal in time, and capacity is caused to reduce
When, wafer can still carry residual gas and be directly entered subsequent handling, cause defect, influence yields, cause economic loss;Simultaneously
Also it is difficult to determine that the defect whether because of capacity caused by abnormal, can not quickly and effectively find generation after causing product to be abnormal
The reason of product exception.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of semiconductor manufacturing facilities
Exhaust monitoring system whether can check the defect so that the situation of abnormal gas exhaust can be found, and after defect generation
Because of capacity caused by abnormal.
To achieve the above objectives, the present invention adopts the following technical solutions:
A kind of exhaust monitoring system of semiconductor manufacturing facility, comprising:
On the board that pressure at expulsion monitoring device, including pressure gauge, the pressure at expulsion monitoring device and needs are vented
Gas exhaust piping is connected;
Transacter, with the pressure at expulsion monitoring device communication connection.
Optionally, the exhaust monitoring system of the semiconductor manufacturing facility further includes alarm, and the alarm is in the pressure
It is sent out when the range that the actual exhaust air pressure value of power table measurement exceeds between default pressure at expulsion upper limit value and pressure at expulsion lower limit value
Warning message out.
Optionally, the pressure gauge includes electro connecting pressure gauge.
Optionally, exhaust regulating valve is housed on the gas exhaust piping.
Optionally, in the exhaust monitoring system of above-mentioned semiconductor manufacturing facility, the board for needing to be vented at least 2, often
The pressure at expulsion monitoring device is provided on the gas exhaust piping of platform board.
Optionally, the transacter also with yields test macro communication connection-
The utility model can monitor board in real time by installing pressure at expulsion monitoring device on the gas exhaust piping of board
The number of actual displacement, enables the situation of abnormal gas exhaust to be found in time;And after defect generation, investigation can be passed through
Whether actual exhaust air pressure value determines the defect because capacity causes extremely.
Detailed description of the invention
Fig. 1 is shown as being vented the illustrative structural schematic diagram of monitoring system one in the utility model.
Fig. 2 is shown as the illustrative structural schematic diagram of the utility model pressure at expulsion monitoring device one.
Piece mark explanation
1 board
2 gas exhaust pipings
3 factory service end exhaust pipes
4 pressure at expulsion monitoring devices
5 transacters
6 exhaust regulating valves
11 purification storage areas
41 power switch buttons
42 all clear buttons
43 power supply indicators
44 buzzers
45 warning lamps
46 pressure gauges
Specific embodiment
In the following description, a large amount of concrete details are given more thoroughly to manage in order to provide to the utility model
Solution.It is, however, obvious to a person skilled in the art that the utility model may not need it is one or more of these thin
It saves and is carried out.In other examples, in order to avoid obscuring with the utility model, for more well known in the art
Technical characteristic is not described.
It should be understood that the utility model can be implemented in different forms, and should not be construed as being limited to mention here
Embodiment out.Disclosure will be made thoroughly and complete and the scope of the utility model is complete on the contrary, providing these embodiments
Ground passes to those skilled in the art.In the accompanying drawings, same reference numerals indicate identical element from beginning to end.
In order to thoroughly understand the utility model, detailed step and detailed structure will be proposed in following description,
So as to illustrate the utility model proposes technical solution.The exemplary embodiment of the utility model is described in detail as follows, however
Other than these detailed descriptions, the utility model can also have other embodiments.
Referring to Fig. 1, the exhaust monitoring system of the utility model is illustrated, which is applied to exhaust
In semiconductor manufacturing facility, which includes pressure at expulsion monitoring device 4 and transacter 5.
Wherein, pressure at expulsion monitoring device 4 includes pressure gauge 46, the pressure at expulsion monitoring device and the board for needing to be vented
Gas exhaust piping 2 on 1 is connected;
Wherein, transacter 5 and 4 communication connection of pressure at expulsion monitoring device, so that pressure at expulsion monitoring device 4 will
The actual exhaust air pressure value real-time monitored is transmitted to transacter and is stored.In the actual implementation process, data are received
Acquisition means 5 can be wire communication with pressure at expulsion monitoring device 4 and connect, and be also possible to wireless telecommunications connection, can be realized remote
Range monitoring.Specifically, the actual exhaust air pressure value of corresponding product batch is by pressure at expulsion monitoring device 4 when the board 1 runs goods
Measurement, while being uploaded to transacter 5.For example, pressure at expulsion monitoring device 4 is surveyed when product batches A runs goods on board 1
Obtaining actual exhaust air pressure value is -92Pa, and when product batches B runs goods on board 1, pressure at expulsion monitoring device 4 measures actual exhaust air
Pressure value is -90Pa, when product batches C runs goods on board 1, pressure at expulsion monitoring device 4 measure actual exhaust air pressure value be -
95Pa, it is respectively -92Pa, -90Pa that transacter 5, which collects the actual exhaust air pressure value of A, B and C of storage on board 1,
With -95Pa.
When exhaust, the gas of discharge first through gas exhaust piping 2, is discharged after entering back into factory service end exhaust pipe 3, the pressure at expulsion
Device measures the actual exhaust air pressure value of board 1, and the actual exhaust air pressure value measured is sent to data analysis collection device 5,
When product generates defect, the actual exhaust air pressure value disk that collection device 5 is collected can be analyzed by data and judged whether by being vented
Caused by pressure anomaly, when due to caliber being definite value, capacity is directly proportional to pressure at expulsion, and pressure at expulsion is abnormal to be namely vented
Amount is abnormal.For example, on board 1 product batches A run goods when, pressure at expulsion monitoring device 4 measure actual exhaust air pressure value be-
92Pa, when product batches B runs goods on board 1, it is -60Pa that pressure at expulsion monitoring device 4, which measures actual exhaust air pressure value, by lacking
It falls into detection board discovery B and generates defect, there is no problem by A, show that the pressure at expulsion of B leads to the generation of defect extremely.
In the actual implementation process, the quantity of board 1 can be any amount, it can is one, is also possible to two
More than, as long as being respectively connected with pressure at expulsion monitoring device on the gas exhaust piping 2 of every board, the corresponding exhaust of every board
The quantity of pressure monitoring device is unlimited.When needing the board quantity being vented to be at least two, using the exhaust of the utility model
Monitoring system can not only find abnormal gas exhaust, and when defect generates, additionally it is possible to pass through the actual exhaust air pressure of investigation storage
Force value, judging faster is defect caused by which platform board abnormal gas exhaust.For example, product batches A runs goods on board X
When, it is -92Pa that pressure at expulsion monitoring device 4, which measures actual exhaust air pressure value, when product batches B runs goods on board Y, pressure at expulsion
It is -60Pa that monitoring device 4, which measures actual exhaust air pressure value, finds that B generates defect by defect checking machine platform, there is no problem by A, obtains
The pressure at expulsion of board Y leads to the generation of defect extremely out.
Illustratively, referring to Fig. 1, such as six etching machine bench, the corresponding purification storage area 11 of every etching machine bench are set
It is provided with a such as gas exhaust piping 2, a such as pressure at expulsion monitoring device 4 is installed on every gas exhaust piping 2, with real-time
The actual exhaust air pressure value of every board is monitored, is provided with pressure gauge 46 on the pressure monitoring device 4 of every board.
Illustratively, referring to fig. 2, the exhaust monitoring system of the semiconductor manufacturing facility further includes alarm, works as pressure gauge
It, should when the actual exhaust air pressure value of measurement exceeds the range between the default pressure at expulsion upper limit value and pressure at expulsion lower limit value
Alarm alert.Specifically, the default pressure at expulsion upper limit value and pressure at expulsion lower limit value are according to engineering experiment
It obtains.The alarm can use warning lamp 45 and/or buzzer 44.When pressure at expulsion exception, the alarm can more and
When, more effectively remind staff, reduce defect, reduce economic loss.In specific implementation process, alarm be can be set
On pressure at expulsion monitoring device, it can also be independently arranged or be arranged in other equipment, in application process, exhaust monitoring is
System can not only be applied to etching procedure, moreover it is possible to applied to acid row, emission reduction etc. other exhaust in need process in.When the alarm
When device is mounted in pressure at expulsion monitoring device 4, alarm can more effectively remind field engineering in pressure at expulsion exception
Teacher, and the alarm be more convenient for field engineer judgement be any platform board abnormal gas exhaust.
As an example, referring to fig. 2, pressure at expulsion monitoring device 4 further includes power switch button 41, all clear button
42, power supply indicator 43.
Illustratively, which can be electro connecting pressure gauge, and in the actual implementation process, which also uses
Pressure data can be transmitted to transacter 5 by digital pressure gauge, electric resistance manometer or differential pressure gage etc..The pressure
Pressure at expulsion upper limit value and pressure at expulsion lower limit value can be arranged using electro connecting pressure gauge in power table directly on pressure gauge, operate
It is convenient, and field engineer can more intuitively observe whether real-time ventilation pressure exceeds pressure at expulsion upper limit value and exhaust pressure
Range between power lower limit value.
Illustratively, which also communicates to connect with yields test macro.- actual exhaust air can then be compared
Pressure value and product yield information obtain optimum discharge pressure value.Specifically, the product can be found according to the product of best yield
Actual exhaust air pressure value on board, the actual exhaust air pressure value are optimum discharge pressure value.For example, in 100 products,
The yield of 80 products on 95%, corresponding actual exhaust air pressure in -92Pa, the yields of 20 products 95% it
Under, for corresponding actual exhaust air pressure in -100Pa, obtaining optimum discharge pressure value is -92Pa.
In process of production, if it is known that actual exhaust air pressure value, then can be adjusted to best row by optimum discharge pressure value
Air pressure force value can also preset default pressure at expulsion upper limit value and pressure at expulsion lower limit value again according to optimum discharge pressure value,
It can be improved product yield.
Illustratively, referring to Fig. 1, exhaust regulating valve 6 is housed on gas exhaust piping 2, which can adjust reality
Exhaust pressure value can make actual exhaust air pressure value approach or be equal to optimum discharge pressure value by adjusting the exhaust regulating valve,
So that defect is reduced, product yield is improved.
In the description of the present invention, it should be understood that the orientation or positional relationship of the instructions such as term " on ", "lower"
To be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage
Solution is limitations of the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to
Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above "
One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.
The purpose of term as used herein is only that description specific embodiment and the limitation not as the utility model.?
This is in use, " one " of singular, "one" and " described/should " be also intended to include plural form, unless context understands finger
Other mode out.Be also to be understood that term " composition " and/or " comprising ", when being used in this specification, determine the feature,
The presence of integer, step, operations, elements, and/or components, but it is not excluded for one or more other features, integer, step, behaviour
Make, the presence or addition of component, assembly unit and/or group.Herein in use, term "and/or" includes any of related listed item
And all combinations.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (6)
1. a kind of exhaust monitoring system of semiconductor manufacturing facility characterized by comprising
The exhaust on board that pressure at expulsion monitoring device, including pressure gauge, the pressure at expulsion monitoring device and needs are vented
Pipeline is connected;
Transacter, with the pressure at expulsion monitoring device communication connection.
2. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1, it is characterised in that:
It further include alarm, the alarm exceeds in default pressure at expulsion in the actual exhaust air pressure value of the gauge measurement
Alert when range between limit value and pressure at expulsion lower limit value.
3. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1, it is characterised in that:
The pressure gauge includes electro connecting pressure gauge.
4. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1, it is characterised in that:
Exhaust regulating valve is housed on the gas exhaust piping.
5. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1-4, it is characterised in that:
It is described to need be vented board at least 2, the pressure at expulsion monitoring is provided on the gas exhaust piping of every board
Device.
6. the exhaust monitoring system of semiconductor manufacturing facility according to claim 5, it is characterised in that:
The transacter is also communicated to connect with yields test macro, and the yields test macro provides product yield
Information.
Priority Applications (1)
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CN201821595020.8U CN208738191U (en) | 2018-09-26 | 2018-09-26 | The exhaust monitoring system of semiconductor manufacturing facility |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201821595020.8U CN208738191U (en) | 2018-09-26 | 2018-09-26 | The exhaust monitoring system of semiconductor manufacturing facility |
Publications (1)
Publication Number | Publication Date |
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CN208738191U true CN208738191U (en) | 2019-04-12 |
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ID=66035675
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CN201821595020.8U Active CN208738191U (en) | 2018-09-26 | 2018-09-26 | The exhaust monitoring system of semiconductor manufacturing facility |
Country Status (1)
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CN (1) | CN208738191U (en) |
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2018
- 2018-09-26 CN CN201821595020.8U patent/CN208738191U/en active Active
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