CN208738191U - The exhaust monitoring system of semiconductor manufacturing facility - Google Patents

Abstract

The utility model discloses a kind of exhaust monitoring systems of semiconductor manufacturing facility, the exhaust monitoring system includes pressure at expulsion monitoring device and transacter, the pressure at expulsion monitoring device is made of pressure gauge and alarm, alarm issues alarm signal when actual exhaust air pressure value exceeds default pressure at expulsion upper limit value or default pressure at expulsion lower limit value, operator is reminded to check, the exhaust pressure detection means are also connect with transacter simultaneously, upload actual exhaust air pressure value in real time to transacter.The exhaust monitoring system of the utility model can monitor the situation of board pressure at expulsion in real time, and abnormal gas exhaust situation is enabled to be found and correct in time.

Description

The exhaust monitoring system of semiconductor manufacturing facility

Technical field

The utility model relates to technical field of semiconductors, the exhaust more particularly to a kind of semiconductor manufacturing facility monitors system System.

Background technique

In many processes of semiconductors manufacture, discharge gas is required.By taking semiconductor etching process as an example, wafer has been etched Cheng Hou need to rest on purification storage area, carry out degasification movement, that is, extract the gas in purification storage area (Purge Storage), Avoid residual gas in subsequent work to reduce the remaining gas of crystal column surface so that purification storage area obtains certain vacuum degree Phenomena such as gas condensation (gas condense) occurs in sequence, influences product yield.

In existing exhaust system, gas exhaust piping is provided on every board, the gas of board discharge passes through exhaust pipe Road discharge influences subsequent machining technology if when the capacity exception of board, it is higher to will lead to crystal column surface gas residual quantity, benefit When with yields test macro testing product yields, product yield can be reduced.If more boards are arranged in exhaust system, this The gas exhaust piping of a little boards is connect with factory service end exhaust pipe, and after starting work, the gas of each board discharge passes through total air escape pipe Discharge, when production, the rated discharge pressure (Required Stabile Pressure) of gas exhaust piping is in board on every board It is set before starting work.In practical manufacturing process, if the board negligible amounts of starting work, the practical row of board A possibility that atmospheric pressure is equal or close with rated discharge pressure is higher, but if starter motor number of units amount is more, due to always arranging Tracheae capacity is limited, causes the possibility of the capacity reduction of separate unit board very high, the actual exhaust air pressure of exhaust area is lower than Rated discharge pressure more causes crystal column surface gas residual quantity higher, influences subsequent machining technology, and later use yields reduces Product yield.

Current exhaust system is difficult to find whether board is in the presence of that capacity is abnormal in time, and capacity is caused to reduce When, wafer can still carry residual gas and be directly entered subsequent handling, cause defect, influence yields, cause economic loss；Simultaneously Also it is difficult to determine that the defect whether because of capacity caused by abnormal, can not quickly and effectively find generation after causing product to be abnormal The reason of product exception.

Summary of the invention

In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of semiconductor manufacturing facilities Exhaust monitoring system whether can check the defect so that the situation of abnormal gas exhaust can be found, and after defect generation Because of capacity caused by abnormal.

To achieve the above objectives, the present invention adopts the following technical solutions:

A kind of exhaust monitoring system of semiconductor manufacturing facility, comprising:

On the board that pressure at expulsion monitoring device, including pressure gauge, the pressure at expulsion monitoring device and needs are vented Gas exhaust piping is connected；

Transacter, with the pressure at expulsion monitoring device communication connection.

Optionally, the exhaust monitoring system of the semiconductor manufacturing facility further includes alarm, and the alarm is in the pressure It is sent out when the range that the actual exhaust air pressure value of power table measurement exceeds between default pressure at expulsion upper limit value and pressure at expulsion lower limit value Warning message out.

Optionally, the pressure gauge includes electro connecting pressure gauge.

Optionally, exhaust regulating valve is housed on the gas exhaust piping.

Optionally, in the exhaust monitoring system of above-mentioned semiconductor manufacturing facility, the board for needing to be vented at least 2, often The pressure at expulsion monitoring device is provided on the gas exhaust piping of platform board.

Optionally, the transacter also with yields test macro communication connection-

The utility model can monitor board in real time by installing pressure at expulsion monitoring device on the gas exhaust piping of board The number of actual displacement, enables the situation of abnormal gas exhaust to be found in time；And after defect generation, investigation can be passed through Whether actual exhaust air pressure value determines the defect because capacity causes extremely.

Detailed description of the invention

Fig. 1 is shown as being vented the illustrative structural schematic diagram of monitoring system one in the utility model.

Fig. 2 is shown as the illustrative structural schematic diagram of the utility model pressure at expulsion monitoring device one.

Piece mark explanation

1 board

2 gas exhaust pipings

3 factory service end exhaust pipes

4 pressure at expulsion monitoring devices

5 transacters

6 exhaust regulating valves

11 purification storage areas

41 power switch buttons

42 all clear buttons

43 power supply indicators

44 buzzers

45 warning lamps

46 pressure gauges

Specific embodiment

In the following description, a large amount of concrete details are given more thoroughly to manage in order to provide to the utility model Solution.It is, however, obvious to a person skilled in the art that the utility model may not need it is one or more of these thin It saves and is carried out.In other examples, in order to avoid obscuring with the utility model, for more well known in the art Technical characteristic is not described.

It should be understood that the utility model can be implemented in different forms, and should not be construed as being limited to mention here Embodiment out.Disclosure will be made thoroughly and complete and the scope of the utility model is complete on the contrary, providing these embodiments Ground passes to those skilled in the art.In the accompanying drawings, same reference numerals indicate identical element from beginning to end.

In order to thoroughly understand the utility model, detailed step and detailed structure will be proposed in following description, So as to illustrate the utility model proposes technical solution.The exemplary embodiment of the utility model is described in detail as follows, however Other than these detailed descriptions, the utility model can also have other embodiments.

Referring to Fig. 1, the exhaust monitoring system of the utility model is illustrated, which is applied to exhaust In semiconductor manufacturing facility, which includes pressure at expulsion monitoring device 4 and transacter 5.

Wherein, pressure at expulsion monitoring device 4 includes pressure gauge 46, the pressure at expulsion monitoring device and the board for needing to be vented Gas exhaust piping 2 on 1 is connected；

Wherein, transacter 5 and 4 communication connection of pressure at expulsion monitoring device, so that pressure at expulsion monitoring device 4 will The actual exhaust air pressure value real-time monitored is transmitted to transacter and is stored.In the actual implementation process, data are received Acquisition means 5 can be wire communication with pressure at expulsion monitoring device 4 and connect, and be also possible to wireless telecommunications connection, can be realized remote Range monitoring.Specifically, the actual exhaust air pressure value of corresponding product batch is by pressure at expulsion monitoring device 4 when the board 1 runs goods Measurement, while being uploaded to transacter 5.For example, pressure at expulsion monitoring device 4 is surveyed when product batches A runs goods on board 1 Obtaining actual exhaust air pressure value is -92Pa, and when product batches B runs goods on board 1, pressure at expulsion monitoring device 4 measures actual exhaust air Pressure value is -90Pa, when product batches C runs goods on board 1, pressure at expulsion monitoring device 4 measure actual exhaust air pressure value be - 95Pa, it is respectively -92Pa, -90Pa that transacter 5, which collects the actual exhaust air pressure value of A, B and C of storage on board 1, With -95Pa.

When exhaust, the gas of discharge first through gas exhaust piping 2, is discharged after entering back into factory service end exhaust pipe 3, the pressure at expulsion Device measures the actual exhaust air pressure value of board 1, and the actual exhaust air pressure value measured is sent to data analysis collection device 5, When product generates defect, the actual exhaust air pressure value disk that collection device 5 is collected can be analyzed by data and judged whether by being vented Caused by pressure anomaly, when due to caliber being definite value, capacity is directly proportional to pressure at expulsion, and pressure at expulsion is abnormal to be namely vented Amount is abnormal.For example, on board 1 product batches A run goods when, pressure at expulsion monitoring device 4 measure actual exhaust air pressure value be- 92Pa, when product batches B runs goods on board 1, it is -60Pa that pressure at expulsion monitoring device 4, which measures actual exhaust air pressure value, by lacking It falls into detection board discovery B and generates defect, there is no problem by A, show that the pressure at expulsion of B leads to the generation of defect extremely.

In the actual implementation process, the quantity of board 1 can be any amount, it can is one, is also possible to two More than, as long as being respectively connected with pressure at expulsion monitoring device on the gas exhaust piping 2 of every board, the corresponding exhaust of every board The quantity of pressure monitoring device is unlimited.When needing the board quantity being vented to be at least two, using the exhaust of the utility model Monitoring system can not only find abnormal gas exhaust, and when defect generates, additionally it is possible to pass through the actual exhaust air pressure of investigation storage Force value, judging faster is defect caused by which platform board abnormal gas exhaust.For example, product batches A runs goods on board X When, it is -92Pa that pressure at expulsion monitoring device 4, which measures actual exhaust air pressure value, when product batches B runs goods on board Y, pressure at expulsion It is -60Pa that monitoring device 4, which measures actual exhaust air pressure value, finds that B generates defect by defect checking machine platform, there is no problem by A, obtains The pressure at expulsion of board Y leads to the generation of defect extremely out.

Illustratively, referring to Fig. 1, such as six etching machine bench, the corresponding purification storage area 11 of every etching machine bench are set It is provided with a such as gas exhaust piping 2, a such as pressure at expulsion monitoring device 4 is installed on every gas exhaust piping 2, with real-time The actual exhaust air pressure value of every board is monitored, is provided with pressure gauge 46 on the pressure monitoring device 4 of every board.

Illustratively, referring to fig. 2, the exhaust monitoring system of the semiconductor manufacturing facility further includes alarm, works as pressure gauge It, should when the actual exhaust air pressure value of measurement exceeds the range between the default pressure at expulsion upper limit value and pressure at expulsion lower limit value Alarm alert.Specifically, the default pressure at expulsion upper limit value and pressure at expulsion lower limit value are according to engineering experiment It obtains.The alarm can use warning lamp 45 and/or buzzer 44.When pressure at expulsion exception, the alarm can more and When, more effectively remind staff, reduce defect, reduce economic loss.In specific implementation process, alarm be can be set On pressure at expulsion monitoring device, it can also be independently arranged or be arranged in other equipment, in application process, exhaust monitoring is System can not only be applied to etching procedure, moreover it is possible to applied to acid row, emission reduction etc. other exhaust in need process in.When the alarm When device is mounted in pressure at expulsion monitoring device 4, alarm can more effectively remind field engineering in pressure at expulsion exception Teacher, and the alarm be more convenient for field engineer judgement be any platform board abnormal gas exhaust.

As an example, referring to fig. 2, pressure at expulsion monitoring device 4 further includes power switch button 41, all clear button 42, power supply indicator 43.

Illustratively, which can be electro connecting pressure gauge, and in the actual implementation process, which also uses Pressure data can be transmitted to transacter 5 by digital pressure gauge, electric resistance manometer or differential pressure gage etc..The pressure Pressure at expulsion upper limit value and pressure at expulsion lower limit value can be arranged using electro connecting pressure gauge in power table directly on pressure gauge, operate It is convenient, and field engineer can more intuitively observe whether real-time ventilation pressure exceeds pressure at expulsion upper limit value and exhaust pressure Range between power lower limit value.

Illustratively, which also communicates to connect with yields test macro.- actual exhaust air can then be compared Pressure value and product yield information obtain optimum discharge pressure value.Specifically, the product can be found according to the product of best yield Actual exhaust air pressure value on board, the actual exhaust air pressure value are optimum discharge pressure value.For example, in 100 products, The yield of 80 products on 95%, corresponding actual exhaust air pressure in -92Pa, the yields of 20 products 95% it Under, for corresponding actual exhaust air pressure in -100Pa, obtaining optimum discharge pressure value is -92Pa.

In process of production, if it is known that actual exhaust air pressure value, then can be adjusted to best row by optimum discharge pressure value Air pressure force value can also preset default pressure at expulsion upper limit value and pressure at expulsion lower limit value again according to optimum discharge pressure value, It can be improved product yield.

Illustratively, referring to Fig. 1, exhaust regulating valve 6 is housed on gas exhaust piping 2, which can adjust reality Exhaust pressure value can make actual exhaust air pressure value approach or be equal to optimum discharge pressure value by adjusting the exhaust regulating valve, So that defect is reduced, product yield is improved.

In the description of the present invention, it should be understood that the orientation or positional relationship of the instructions such as term " on ", "lower" To be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, without referring to Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage Solution is limitations of the present invention.

In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it "lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above " One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.

The purpose of term as used herein is only that description specific embodiment and the limitation not as the utility model.? This is in use, " one " of singular, "one" and " described/should " be also intended to include plural form, unless context understands finger Other mode out.Be also to be understood that term " composition " and/or " comprising ", when being used in this specification, determine the feature, The presence of integer, step, operations, elements, and/or components, but it is not excluded for one or more other features, integer, step, behaviour Make, the presence or addition of component, assembly unit and/or group.Herein in use, term "and/or" includes any of related listed item And all combinations.

The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.

Claims (6)

1. a kind of exhaust monitoring system of semiconductor manufacturing facility characterized by comprising

The exhaust on board that pressure at expulsion monitoring device, including pressure gauge, the pressure at expulsion monitoring device and needs are vented Pipeline is connected；

Transacter, with the pressure at expulsion monitoring device communication connection.

2. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1, it is characterised in that:

It further include alarm, the alarm exceeds in default pressure at expulsion in the actual exhaust air pressure value of the gauge measurement Alert when range between limit value and pressure at expulsion lower limit value.

3. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1, it is characterised in that:

The pressure gauge includes electro connecting pressure gauge.

4. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1, it is characterised in that:

Exhaust regulating valve is housed on the gas exhaust piping.

5. the exhaust monitoring system of semiconductor manufacturing facility according to claim 1-4, it is characterised in that:

It is described to need be vented board at least 2, the pressure at expulsion monitoring is provided on the gas exhaust piping of every board Device.

6. the exhaust monitoring system of semiconductor manufacturing facility according to claim 5, it is characterised in that:

The transacter is also communicated to connect with yields test macro, and the yields test macro provides product yield Information.