CN208722863U - A kind of high-accuracy package substrate - Google Patents
A kind of high-accuracy package substrate Download PDFInfo
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- CN208722863U CN208722863U CN201821414019.0U CN201821414019U CN208722863U CN 208722863 U CN208722863 U CN 208722863U CN 201821414019 U CN201821414019 U CN 201821414019U CN 208722863 U CN208722863 U CN 208722863U
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- substrate
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Abstract
The utility model discloses a kind of high-accuracy package substrates, including first substrate and the second substrate, the first substrate is set in the second substrate, the identical cavity of several sizes is provided on the first substrate, the cavity runs through first substrate, and each cavity is arranged in arrays, four angles of the cavity are respectively the identical arc angle of radian, the length and width of the cavity are equal, and the length and width of the cavity are 0.6~6.3mm, it is described it is each it is adjacent between cavity distance be greater than 0.2mm.The utility model is opened up several high-accuracy cavitys on the first substrate, first substrate is pressed in the second substrate by setting first substrate and the second substrate, and structure is simple, is easy production, low energy consumption.
Description
Technical field
The utility model relates to conductor package substrate and printed wiring board manufacturing field, more particularly to one kind are high-precision
Close package substrate.
Background technique
In the prior art, with the frivolous small development trend of electronic product, to printed wiring board and package substrate in volume
Upper requirement is smaller, and request signal transmission is higher, in product design, needs to encapsulate chip and electronic component embedment printing
In circuit substrate cavity, and most of most of chips or electronic component are rectangular configuration, cause cavity size necessary and core
Piece and component are adapted, and existing cavity body structure difficulty of processing is big, and cavity is not accurate enough, and size is larger, cannot be good
It is adapted with chip or electronic component.
Therefore, the prior art is defective, needs to improve.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of structure is simple, it is easy production, small high-precision of size
Close package substrate.
The technical solution of the utility model is as follows: a kind of high-accuracy package substrate, including first substrate and the second substrate, institute
First substrate is stated in the second substrate, the identical cavity of several sizes is provided on the first substrate, the cavity runs through
First substrate, each cavity is arranged in arrays, and four angles of the cavity are respectively the identical arc angle of radian, the cavity
Length is equal with width, and the length and width of the cavity are 0.6~6.3mm, it is described it is each it is adjacent between cavity distance greater than 0.2mm.
By adopting the above technical scheme, in the high-accuracy package substrate, four apex angles of the second substrate are set respectively
There is the identical positioning column of structure, four apex angles of the first substrate offer the positioning through hole being adapted to positioning column respectively.
Using above-mentioned each technical solution, in the high-accuracy package substrate, the first substrate with a thickness of 0.1~
10mm。
Using above-mentioned each technical solution, the utility model is by setting first substrate and the second substrate, in first substrate
On open up several high-accuracy cavitys, first substrate is pressed in the second substrate, structure is simple, be easy production, low energy consumption.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the cavity body structure schematic diagram of the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Present embodiments provide a kind of high-accuracy package substrate, including first substrate 1 and the second substrate 2, first base
Plate 1 is set in the second substrate 2, is provided with the identical cavity 11 of several sizes on the first substrate 1, and the cavity 11 is through the
One substrate 1, each cavity 11 is arranged in arrays, and four angles of the cavity 11 are respectively the identical arc angle 111 of radian, described
The length and width of cavity 11 are equal, and the length and width of the cavity 11 are 0.6~6.3mm, it is described it is each it is adjacent between 11 distance of cavity
For greater than 0.2mm.
As shown in Figure 1, the present embodiment setting first substrate 1 and the second substrate 2, first substrate 1 are pressed on the second substrate 2
On.The identical cavity 11 of several sizes is opened up on first substrate 1, each cavity 11 is arranged in arrays, convenient for cutting.The present embodiment
It bores nozzle by Lenno triangle to drill to first substrate 1, therefore, the precision of cavity 11 is higher, the cavity of the present embodiment
11 is long and wide in 0.6~6.3mm.Simultaneously it is each it is adjacent between cavity 11 apart from be greater than 0.2mm, convenient for cutting.As shown in Fig. 2,
It bores nozzle by Lenno triangle to drill to first substrate 1, making four angles of cavity 11 is respectively the identical arc angle 111 of radian, is mentioned
The collocation degree of high cavity 11 and electronic component.
Further, in order to quickly assemble first substrate 1 and the pressing of the second substrate 2, at four of the second substrate 2
Apex angle is respectively equipped with the identical positioning column 21 of structure, and four apex angles of the first substrate 1 offer suitable with positioning column 21 respectively
The positioning through hole 12 matched.The positioning through hole 12 of first substrate 1 and the positioning column 21 in the second substrate 2 are snapped connection, can be made
2 quick pressing of first substrate 1 and the second substrate improves production efficiency.
Further, in order to expand the scope of application of the present embodiment, the first substrate 1 with a thickness of 0.1~10mm, with
Meet the requirement of most of chip packages.
Using above-mentioned each technical solution, the utility model is by setting first substrate and the second substrate, in first substrate
On open up several high-accuracy cavitys, first substrate is pressed in the second substrate, structure is simple, be easy production, low energy consumption.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (3)
1. a kind of high-accuracy package substrate, it is characterised in that: including first substrate and the second substrate, the first substrate is set to the
On two substrates, the identical cavity of several sizes is provided on the first substrate, the cavity runs through first substrate, each chamber
Body is arranged in arrays, and four angles of the cavity are respectively the identical arc angle of radian, and the length and width of the cavity are equal, the chamber
The length of body and it is wide all be 0.6~6.3mm, it is described it is each it is adjacent between cavity distance be greater than 0.2mm.
2. high-accuracy package substrate according to claim 1, it is characterised in that: four apex angles of the second substrate are distinguished
Equipped with the identical positioning column of structure, four apex angles of the first substrate offer the positioning through hole being adapted to positioning column respectively.
3. high-accuracy package substrate according to claim 1, it is characterised in that: the first substrate with a thickness of 0.1~
10mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821414019.0U CN208722863U (en) | 2018-08-30 | 2018-08-30 | A kind of high-accuracy package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821414019.0U CN208722863U (en) | 2018-08-30 | 2018-08-30 | A kind of high-accuracy package substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208722863U true CN208722863U (en) | 2019-04-09 |
Family
ID=65980319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821414019.0U Active CN208722863U (en) | 2018-08-30 | 2018-08-30 | A kind of high-accuracy package substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208722863U (en) |
-
2018
- 2018-08-30 CN CN201821414019.0U patent/CN208722863U/en active Active
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