CN208699383U - Wafer supporting sheet - Google Patents
Wafer supporting sheet Download PDFInfo
- Publication number
- CN208699383U CN208699383U CN201820962403.8U CN201820962403U CN208699383U CN 208699383 U CN208699383 U CN 208699383U CN 201820962403 U CN201820962403 U CN 201820962403U CN 208699383 U CN208699383 U CN 208699383U
- Authority
- CN
- China
- Prior art keywords
- wafer
- utility
- model
- film
- supporting table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012856 packing Methods 0.000 claims abstract description 14
- 230000003319 supportive effect Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 3
- 241000251468 Actinopterygii Species 0.000 abstract 1
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer backing sheet arranges in and stretches tight in the frame packing carton, including supporting the main part, the periphery that supports the main part is equipped with the screens, and the center is equipped with the convex brace table that is used for placing the wafer. The utility model discloses, use with the cooperation of frame packing carton that stretches tight, a spacing for the wafer, separate and support, make the wafer be in the state of non-contact and micro-movement in the storage, in the transportation, thereby play the effect of protection to the wafer, the brace table can adopt the produced sunk structure of blister forming technology, like the inside appearance of being hollowed out of brace table, make the backing sheet have enough space to make things convenient for placing of wafer, the effective area of wafer can not contact the backing sheet, thereby protect the wafer not contaminated effectively, the fish tail, break, or cause the functional failure because of the mutual displacement.
Description
Technical field
The utility model relates to the technical fields of wafer insulation blocking, and in particular to a kind of wafer support piece.
Background technique
Taut frame is a kind of product dedicated for protecting wafer, and wafer is commonly held within the center of taut frame, and both sides are special
The film of system links together wafer with taut frame.
Seldom occur taut frame currently on the market and obtains the product of suitable protecting, the product of common wafer in a container
For thin rounded flakes shape, there is no corresponding supporting tables, therefore the wafer in taut frame will appear following ask during packed and transported
Topic:
(1) it is easy phenomena such as being collided and bounce, friction occurs, wafer is caused to be worn, pollute；
(2) then rupture wafer under serious conditions；
(3) and it is not easy to store in use and take, very big worries are caused to user.
In view of this, being badly in need of improving the structure of the transport of existing wafer and storage device, to facilitate operation improving
The convenience of storage.
Utility model content
Technical problem to be solved in the utility model is that existing wafer transport and storage device presence should not be stored, be grasped
Make inconvenient problem.
In order to solve the above-mentioned technical problem, technical solution used by the utility model is to provide a kind of wafer support piece,
It is placed in taut frame packing box, including supportive body, the periphery of the supportive body is equipped with detent, and center is equipped with protrusion for putting
Set the supporting table of wafer.
In another preferred embodiment, the periphery of the supportive body is equipped with lug, and the detent is arc, setting
In the two sides root of the lug.
In another preferred embodiment, the supporting table includes tapered portion and platform part, and the platform part setting exists
The center of the tapered portion.
In another preferred embodiment, the inside of taut frame is equipped with film, and the center of film is equipped with through-hole, the support
Platform is placed on film, and projecting surface stretched film.
In another preferred embodiment, the lug is evenly arranged multiple, and the periphery of each lug is
Circular arc line, and the circular arc line is on a concentric circles.
Compared with prior art, the utility model and taut frame packing box are used cooperatively, the limit, separation and branch for wafer
Support, so that the state that wafer moves in storage, transportational process in non-contact and micro-shifting, to play the work of protection to wafer
With sunk structure caused by plastics sucking moulding technique can be used in supporting table, such as the appearance being hollowed out inside supporting table, so that branch
The effective coverage of the placement that blade has enough spaces to facilitate wafer, wafer will not touch support chip, to be effectively protected
Wafer is not contaminated, scratches, rupture, or causes disabler because being mutually shifted.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram that the utility model is applied in taut frame packing box；
Fig. 3 is the schematic enlarged-scale view in the portion A in Fig. 2.
Specific embodiment
The utility model provides a kind of wafer support piece and taut frame packing box is used cooperatively, for wafer limit, point
Every and support so that wafer storage, in transportational process in the state that non-contact and micro-shifting is dynamic, to play protection to wafer
Effect.Sunk structure caused by plastics sucking moulding technique can be used in supporting table, such as the appearance being hollowed out inside supporting table, makes
Obtain the placement that support chip there are enough spaces to facilitate wafer.The effective coverage of wafer will not touch support chip, thus effectively
Not contaminated wafer, scuffing, rupture are protected, or causes disabler because being mutually shifted.With reference to the accompanying drawings of the specification and have
Body embodiment is described in detail the utility model.
As shown in Figure 1, a kind of wafer support piece provided by the utility model, is placed in taut frame packing box 5, including support master
Body 1, the periphery of supportive body 1 are equipped with detent 41, and center is equipped with the supporting table 2 for being used to place wafer 7 of protrusion.
Detent 41 is placed in the periphery of supportive body 1, plays the role of limiting and facilitates pick-and-place, is and taut frame packing box 5
Internal notch forms cooperation, reduces the space that support chip moves inside container, reduces wafer 7 and is scratched, ruptures, and
It is not exposed to when being easily removed or be put into wafer 7, reduces wafer 7 and be contaminated, the person of being convenient to use improves efficiency.
As shown in Figures 2 and 3, the utility model and taut frame packing box 5 are used cooperatively, for wafer 7 limit, separate and
Support, so that the state that wafer 7 moves in storage, transportational process in non-contact and micro-shifting, to play protection to wafer 7
Effect.Sunk structure caused by plastics sucking moulding technique can be used in supporting table 2, such as the appearance being hollowed out inside supporting table 2, makes
Obtain the placement that the utility model there are enough spaces to facilitate wafer 7.The effective coverage of wafer 7 will not touch supporting table 2, thus
It is effectively protected not contaminated wafer 7, scuffing, rupture, or causes disabler because being mutually shifted.
Existing taut frame packing box 5 is designed to comprising a single taut frame 6, when wafer 7 is placed on one by the frame 6 that stretches tight
On the film of support, and the utility model is placed in below film, then support chip can make film keep tension state, wafer 7
Naturally it is attached in exposed supporting table 2, more firmly keeps relative motion relative to taut frame 6, help to maintain wafer 7 and wrapping
Safety in mounted box 5.If may make the vibration of wafer 7 or " drum " not in the state of tension, such movement may
Lead to wafer 7 and nearby generate between object it is unnecessary contact, and result even in bending and the cracking of wafer 7.
The utility model has the advantages that: when multiple taut frames 6 are stacked together, it is isolated by the utility model, i.e., originally
Utility model is placed between taut frame 6.Due to the low structure in both sides high among the utility model, and there is certain thickness, therefore
Other than contacting with supporting table 2, rest part contacts wafer 7 with taut frame 6, thus effective protection wafer 7.
The periphery of supportive body 1 is equipped with lug 4, and detent 41 is arc, and the two sides root of lug 4 is arranged in.Detent 41 is set
It sets in the two sides of lug 4, the detent 41 of arc is more round and smooth, can greatly improve the stationarity of detent 41, conveniently take and transfer.
Supporting table 2 includes tapered portion 3 and platform part, and the center of tapered portion 3 is arranged in platform part.This structure can increase
The thickness of supporting table 2, and guarantee that wafer 7 can be placed in platform part, it is smooth docile.
The inside of taut frame 6 is equipped with film, and the center of film is equipped with through-hole, and supporting table 2 is placed on film, and projecting surface is tensioned
Film.This structure type defines the positional relationship and connection relationship of the utility model and existing taut frame 6, so that taut frame 6,
Film, the utility model and wafer 7 have the bradyseism structure of an entirety, and cushion performance is stronger, further improves steady journey
Degree.
Lug 4 be it is evenly arranged multiple, the periphery of each lug 4 is circular arc line, and circular arc line is on a concentric circles.
The setting of lug 4 guarantees harmonious and center of gravity stability, and periphery is circular arc line, is agreed with the notch of the inner wall of packing box 5, more
Easy processing.
The application method (course of work) of the utility model is as follows:
One wafer 7 is placed on one by stretching tight on the film that frame 6 supports, and will be put into taut frame packing box 5, then incite somebody to action this
Utility model is put under film.Film is allowed to be maintained in the state of tension, then wafer 7 is attached to naturally in supporting table 2, with
The rest may be inferred afterwards stacks taut frame 6.Because they are loaded into or are all to maintain tension state from container taking-up, do not interfere with
The relative motion of wafer 7 is cracked so that wafer 7 be protected not to be bent.
The utility model and taut frame packing box are used cooperatively, for the limit, separation and support of wafer, so that wafer is storing up
The state deposited, moved in transportational process in non-contact and micro-shifting, to play the role of protection to wafer.Suction can be used in supporting table
Sunk structure caused by moulding process is moulded, such as the appearance being hollowed out inside supporting table, so that support chip there are enough spaces
Facilitate the placement of wafer.The effective coverage of wafer will not touch support chip, to be effectively protected, wafer is not contaminated, draws
Wound, rupture, or disabler is caused because being mutually shifted.
The utility model is not limited to above-mentioned preferred forms, and anyone should learn that the enlightenments in the utility model
Under the structure change made, it is all that there is same or similar technical solution with the utility model, each fall within the utility model
Within protection scope.
Claims (3)
1. a kind of wafer support piece is placed in taut frame packing box, which is characterized in that including supportive body, the supportive body
Periphery is equipped with detent, and center is equipped with the supporting table for being used to place wafer of protrusion；
The periphery of the supportive body is equipped with lug, and the detent is arc, and the two sides root of the lug is arranged in；
The supporting table includes tapered portion and platform part, and the center of the tapered portion is arranged in the platform part.
2. wafer support piece according to claim 1, which is characterized in that the inside of taut frame is equipped with film, the center of film
Equipped with through-hole, the supporting table is placed on film, and projecting surface stretched film.
3. wafer support piece according to claim 1, which is characterized in that the lug be it is evenly arranged multiple, it is each
The periphery of the lug is circular arc line, and the circular arc line is on a concentric circles.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820962403.8U CN208699383U (en) | 2018-06-21 | 2018-06-21 | Wafer supporting sheet |
| TW107209905U TWM567956U (en) | 2018-06-21 | 2018-07-20 | Wafer support sheet |
| SG10201809633QA SG10201809633QA (en) | 2018-06-21 | 2018-10-30 | A wafer supporting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820962403.8U CN208699383U (en) | 2018-06-21 | 2018-06-21 | Wafer supporting sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208699383U true CN208699383U (en) | 2019-04-05 |
Family
ID=64870876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820962403.8U Active CN208699383U (en) | 2018-06-21 | 2018-06-21 | Wafer supporting sheet |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN208699383U (en) |
| SG (1) | SG10201809633QA (en) |
| TW (1) | TWM567956U (en) |
-
2018
- 2018-06-21 CN CN201820962403.8U patent/CN208699383U/en active Active
- 2018-07-20 TW TW107209905U patent/TWM567956U/en unknown
- 2018-10-30 SG SG10201809633QA patent/SG10201809633QA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SG10201809633QA (en) | 2020-01-30 |
| TWM567956U (en) | 2018-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |