CN208688319U - A kind of rough surface structure printed circuit board heat exchanger core body - Google Patents
A kind of rough surface structure printed circuit board heat exchanger core body Download PDFInfo
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- CN208688319U CN208688319U CN201821167060.2U CN201821167060U CN208688319U CN 208688319 U CN208688319 U CN 208688319U CN 201821167060 U CN201821167060 U CN 201821167060U CN 208688319 U CN208688319 U CN 208688319U
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Abstract
The utility model discloses a kind of rough surface structure printed circuit board heat exchanger core bodies, including core ontology, several high-temperature medium channels and several cryogenic media channels are provided in core ontology, wherein, the bottom in each high-temperature medium channel and the bottom in cryogenic media channel are provided with several roughness elements, which has the characteristics that drag losses are small, heat-transfer capability is strong.
Description
Technical field
The utility model belongs to heat-exchanger rig field, is related to a kind of rough surface structure printed circuit board heat exchanger core
Body.
Background technique
It is board-like that printed circuit board heat exchanger (printed circuit heat exchanger, PCHE) belongs to microchannel
Heat exchanger scope.PCHE has many advantages, such as compact-sized, high temperature resistant, high pressure resistant, safe and reliable, natural in refrigeration air-conditioner, petroleum
The fields such as gas, nuclear industry, chemical engineering industry, power industry are widely used.
Heat exchange core body is the core component of PCHE, it has the design feature of porous core from the point of view of contour structures.Core
In miniature duct provide flow channel for heat transfer medium, and the basis material (generally sheet metal) in core then plays
The effect of heat is transmitted between high-temperature medium and cryogenic media.The main process of PCHE core are as follows: first with
(light) chemical etch technique processes required miniature duct on sheet metal, is later contained multilayer using Pervasion Weld Technology
The metal sheet of microchannel connects to form monolith core.
At present technology mature, put into there are two types of the PCHE core microchannel structure of engineer application: straight channel and Z-shaped
Channel design.Straight channel is the rectilinear structure of streamwise, and the advantages of straight channel PCHE is that structure is simple, drag losses
It is small, but the disadvantage is that heat transfer coefficient is lower, heat-transfer capability is poor.Z-shaped channel is the fold-line-shaped structure of streamwise, Z-shaped channel
PCHE advantage is that heat transfer coefficient is high, heat-transfer capability is strong, but the disadvantage is that drag losses are big.
Utility model content
The shortcomings that the purpose of the utility model is to overcome the above-mentioned prior arts provides a kind of rough surface structure printing
Circuit board type heat exchanger core body, the core have the characteristics that drag losses are small, heat-transfer capability is strong.
In order to achieve the above objectives, rough surface structure printed circuit board heat exchanger core body described in the utility model includes
Core ontology is provided with several high-temperature medium channels and several cryogenic media channels in core ontology, wherein each high-temperature medium is logical
The bottom in road and the bottom in cryogenic media channel are provided with several roughness elements.
All cryogenic media channels are divided into several groups, and each cryogenic media channel in each group cryogenic media channel is in level side
Parallel and equidistantly distributed upwards；All high-temperature medium channels are divided into several groups, and each high temperature in each group high-temperature medium channel is situated between
Matter channel is parallel in the horizontal direction and equidistantly distributed.
It is parallel to each other between high-temperature medium channel and cryogenic media channel or vertical.
Each high-temperature medium channel and each cryogenic media channel are straight passage structures.
Each roughness element in high-temperature medium channel is sequentially distributed along axial direction；
Each roughness element in cryogenic media channel is sequentially distributed along axial direction.
Each roughness element is two-dimentional roughness element or three-dimensional roughness element.
The two dimension roughness element is rectangular configuration, triangular structure, half elliptic structure or trapezium structure.
The three-dimensional roughness element is cylindrical structure, conical structure, semiellipsoid structure or rectangular parallelepiped structure.
The pitch P of roughness elementopt=(6~12) h, wherein h is the height of roughness element.
The utility model has the following beneficial effects:
Rough surface structure printed circuit board heat exchanger core body described in the utility model is when specific operation, each high temperature
The bottom of medium channel and the bottom in cryogenic media channel are provided with several roughness elements, pass through disturbing for roughness element fluid medium
The movement fluidal texture for changing medium channel bottom, to form whirlpool, to increase medium channel near wall regional fluid
Turbulence intensity, the heat transfer of strengthening fluid medium and channel wall, through testing, the utility model and existing smooth straight channel PCHE
Core is compared, and the heat transfer coefficient of core is capable of increasing 30%~90%.In addition, in the utility model roughness element perturbation action shadow
The boundary layer region being only limitted at nearly wall is rung, roughness element influences the fluidal texture of main flow area in medium channel smaller therefore thick
Fluid media (medium) crushing increasing degree caused by rough member is limited, and through testing, the crushing of the utility model is only existing Z-shaped channel PCHE
The 1/4~1/2 of core crushing.The roughness element in the utility model can increase the heat transfer area of medium channel simultaneously, and existing
The PCHE core of no roughness element is compared, and the heat transfer area density of the utility model is bigger, and in identical heat output, this is practical
Novel structure is more compact.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is a kind of distribution map of roughness element 4 in the utility model；
Fig. 3 is a kind of structural schematic diagram of roughness element 4 in the utility model；
Fig. 4 is another structural schematic diagram of roughness element 4 in the utility model；
Fig. 5 is another structural schematic diagram of roughness element 4 in the utility model；
Fig. 6 is another structural schematic diagram of roughness element 4 in the utility model；
Fig. 7 is another distribution map of roughness element 4 in the utility model；
Fig. 8 is another structural schematic diagram of roughness element 4 in the utility model；
Fig. 9 is another structural schematic diagram of roughness element 4 in the utility model；
Figure 10 is another structural schematic diagram of roughness element 4 in the utility model；
Figure 11 is another structural schematic diagram of roughness element 4 in the utility model.
Wherein, 1 it is high-temperature medium channel, 2 be cryogenic media channel, 3 be core ontology, 4 is roughness element.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing:
As shown in Figure 1, rough surface structure printed circuit board heat exchanger core body described in the utility model includes core
Ontology 3 is provided with several high-temperature medium channels 1 and several cryogenic media channels 2 in core ontology 3, wherein each high-temperature medium is logical
The bottom in road 1 and the bottom in cryogenic media channel 2 are provided with several roughness elements 4.
All cryogenic media channels 2 are divided for several groups, and each cryogenic media channel 2 is in level side in each group cryogenic media channel
Parallel and equidistantly distributed upwards；All high-temperature medium channels 1 are divided for several groups, each high-temperature medium in each group high-temperature medium channel
Channel 1 is parallel in the horizontal direction and equidistantly distributed.
Each high-temperature medium channel 1 and each cryogenic media channel 2 are straight passage structures；It is each thick in high-temperature medium channel 1
Rough member 4 is sequentially distributed along axial direction；Each roughness element 4 in cryogenic media channel 2 is sequentially distributed along axial direction.
Referring to figs. 2 to Figure 11, each roughness element 4 is two-dimentional roughness element or three-dimensional roughness element, and the two dimension roughness element is rectangle
Structure, triangular structure, half elliptic structure or trapezium structure；The three-dimensional roughness element is cylindrical structure, cone knot
Structure, semiellipsoid structure or rectangular parallelepiped structure can be changed in practical applications by changing the shape of roughness element 4 with changing
The flowing and heat-transfer character of hot device core.
Be parallel to each other between high-temperature medium channel 1 and cryogenic media channel 2 or vertical, when high-temperature medium channel 1 with it is low
When warm medium channel 2 is parallel to each other, cryogenic media and high-temperature medium are counterflow heat exchange or downstream heat transfer, when high-temperature medium channel
1 with cryogenic media channel 2 when being mutually perpendicular to, and high-temperature medium and cryogenic media are staggeredly fluid interchange.
When in use, fluid flow separation is caused by the perturbation action of 4 fluid medium of roughness element, and then in roughness element
4 downstreams form vortex, change the fluidal texture of fluid by vortex, and the turbulent flow for increasing medium channel near wall regional fluid is strong
Degree, and then the heat transfer between strengthening fluid medium and wall surface.
The roughness element 4 is process using method for chemially etching, and roughness element 4 is that two-dimentional roughness element or three-dimensional are coarse
Member.Wherein, two-dimentional roughness element is continuous rib structure, and structural parameters include the pitch P, thick of the high h of roughness element 4, roughness element 4
The inclination angle theta of rough member 4 and the shape of roughness element 4.Three-dimensional roughness element is discontinuous needle rib structure, and structural parameters are roughness element 4
High h, the pitch P of roughness element 4, roughness element 4 horizontal spacing phAnd the shape of roughness element 4, wherein the high h of roughness element 4 and
The pitch P of roughness element 4 is maximum to the augmentation of heat transfer influential effect of roughness element 4.When the high h of roughness element 4 is less than fluid media (medium) in wall
When laminar sublayer thickness δ on face, roughness element 4 is totally submerged inside laminar sublayer, the effect of 4 convection current body disturbance-free of roughness element,
Augmentation of heat transfer effect is zero.When the high h of roughness element 4 is greater than laminar sublayer thickness δ of the fluid media (medium) on wall surface, roughness element 4
Fluid is started to generate perturbation action, disturbance and augmentation of heat transfer effect at this time enhances, fluid with the h high increase of roughness element 4
Crushing also increases with the increase of h.When fluid media (medium) stream roughness element 4 and when forming vortex downstream, the pitch of roughness element 4
P influences the fluidal texture of vortex very big.When the pitch P of roughness element 4 is smaller, abundant development, turbulence intensity is had not yet been reached in vortex
Amplification is limited, and augmentation of heat transfer effect is unobvious；When the pitch P of roughness element 4 is larger, vortex can not be full of between adjacent roughness element 4
Space, lead between adjacent roughness element 4 that there are absence of vortices, undisturbed region, reduce the turbulence levels of near wall, strengthen
Heat-transfer effect is weakened.The best pitch of roughness element 4 is popt≈ (6~12) h both can guarantee that vortex was sufficiently sent out within this range
Exhibition to give full play to the perturbation action of roughness element 4, and can guarantee that vortex full of the space between roughness element 4, avoids the occurrence of irrotationality
The low turbulence intensity region that whirlpool dominates, therefore optimal enhanced heat transfer effect can be obtained.
In practical operation, by adjusting the shape of the high h of roughness element 4, the pitch P of roughness element 4 and roughness element 4
Change the turbulence intensity in heat exchanging medium passage near wall region and the heat transfer area of heat exchanger channels, and then regulates and controls PCHE heat exchange
The flowing of core, heat-transfer character, to adapt to the requirement of different application, different designs operating condition.
The preferred embodiment of only the utility model is described in detail above, the scope of the utility model cannot be limited with this.
Equivalent changes and modifications made by i.e. all foundation present utility model application the scope of the patents, all should belong to the utility model patent culvert
Within the scope of lid.
Claims (9)
1. a kind of rough surface structure printed circuit board heat exchanger core body, which is characterized in that including core ontology (3), core
Several high-temperature medium channels (1) and several cryogenic media channels (2) are provided in ontology (3), wherein each high-temperature medium channel
(1) bottom of bottom and cryogenic media channel (2) is provided with several roughness elements (4).
2. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that all low
Warm medium channel (2) is divided into several groups, and each cryogenic media channel (2) in each group cryogenic media channel is parallel in the horizontal direction
And equidistantly distributed；All high-temperature medium channels (1) are divided into several groups, each high-temperature medium channel in each group high-temperature medium channel
(1) parallel in the horizontal direction and equidistantly distributed.
3. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that high temperature is situated between
It is parallel to each other between matter channel (1) and cryogenic media channel (2) or vertical.
4. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that each high temperature
Medium channel (1) and each cryogenic media channel (2) are straight passage structures.
5. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that high temperature is situated between
Each roughness element (4) in matter channel (1) is sequentially distributed along axial direction；
Each roughness element (4) in cryogenic media channel (2) is sequentially distributed along axial direction.
6. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that each coarse
First (4) are two-dimentional roughness element or three-dimensional roughness element.
7. rough surface structure printed circuit board heat exchanger core body according to claim 6, which is characterized in that described two
Dimension roughness element is rectangular configuration, triangular structure, half elliptic structure or trapezium structure.
8. rough surface structure printed circuit board heat exchanger core body according to claim 6, which is characterized in that described three
Dimension roughness element is cylindrical structure, conical structure, semiellipsoid structure or rectangular parallelepiped structure.
9. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that roughness element
(4) pitch Popt=(6~12) h, wherein h is the height of roughness element (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821167060.2U CN208688319U (en) | 2018-07-23 | 2018-07-23 | A kind of rough surface structure printed circuit board heat exchanger core body |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821167060.2U CN208688319U (en) | 2018-07-23 | 2018-07-23 | A kind of rough surface structure printed circuit board heat exchanger core body |
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| CN208688319U true CN208688319U (en) | 2019-04-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108731535A (en) * | 2018-07-23 | 2018-11-02 | 西安热工研究院有限公司 | A kind of rough surface structure printed circuit board heat exchanger core body |
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2018
- 2018-07-23 CN CN201821167060.2U patent/CN208688319U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108731535A (en) * | 2018-07-23 | 2018-11-02 | 西安热工研究院有限公司 | A kind of rough surface structure printed circuit board heat exchanger core body |
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