CN108731535A - A kind of rough surface structure printed circuit board heat exchanger core body - Google Patents
A kind of rough surface structure printed circuit board heat exchanger core body Download PDFInfo
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- CN108731535A CN108731535A CN201810814579.3A CN201810814579A CN108731535A CN 108731535 A CN108731535 A CN 108731535A CN 201810814579 A CN201810814579 A CN 201810814579A CN 108731535 A CN108731535 A CN 108731535A
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- printed circuit
- circuit board
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- 241000826860 Trapezium Species 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 21
- 239000012530 fluid Substances 0.000 description 15
- DDTVVMRZNVIVQM-UHFFFAOYSA-N 2-(1-azabicyclo[2.2.2]octan-3-yloxy)-1-cyclopentyl-1-phenylethanol;hydrochloride Chemical compound Cl.C1N(CC2)CCC2C1OCC(O)(C=1C=CC=CC=1)C1CCCC1 DDTVVMRZNVIVQM-UHFFFAOYSA-N 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000003416 augmentation Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000001869 rapid Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses a kind of rough surface structure printed circuit board heat exchanger core bodies, including core ontology, several high-temperature medium channels and several cryogenic media channels are provided in core ontology, wherein, the bottom in each high-temperature medium channel and the bottom in cryogenic media channel are both provided with several roughness elements, which has the characteristics that drag losses are small, heat-transfer capability is strong.
Description
Technical field
The invention belongs to heat-exchanger rig fields, are related to a kind of rough surface structure printed circuit board heat exchanger core body.
Background technology
It is board-like that printed circuit board heat exchanger (printed circuit heat exchanger, PCHE) belongs to microchannel
Heat exchanger scope.PCHE has many advantages, such as compact-sized, high temperature resistant, high pressure resistant, safe and reliable, natural in refrigeration air-conditioner, oil
The fields such as gas, nuclear industry, chemical engineering industry, power industry are widely used.
Heat exchange core body is the core component of PCHE, it has the design feature of porous core from the point of view of contour structures.Core
In miniature duct provide flow channel for heat transfer medium, and the basis material (generally sheet metal) in core then plays
The effect of heat is transmitted between high-temperature medium and cryogenic media.The main process of PCHE cores is:First with
(light) chemical etch technique processes required miniature duct on sheet metal, is later contained multilayer using Pervasion Weld Technology
The metal sheet of microchannel connects to form monoblock core.
At present technology mature, put into there are two types of the PCHE core microchannel structure of engineer application:Straight channel and Z-shaped
Channel design.Straight channel is the rectilinear structure of streamwise, and the advantages of straight channel PCHE is simple in structure, drag losses
It is small, but the disadvantage is that heat transfer coefficient is relatively low, heat-transfer capability is poor.Z-shaped channel is the fold-line-shaped structure of streamwise, Z-shaped channel
PCHE advantages are that heat transfer coefficient is high, heat-transfer capability is strong, but the disadvantage is that drag losses are big.
Invention content
It is an object of the invention to overcome the above-mentioned prior art, a kind of rough surface structure printed circuit is provided
Plate heat exchanger core, the core have the characteristics that drag losses are small, heat-transfer capability is strong.
In order to achieve the above objectives, rough surface structure printed circuit board heat exchanger core body of the present invention includes core
Ontology is provided with several high-temperature medium channels and several cryogenic media channels in core ontology, wherein each high-temperature medium channel
The bottom in bottom and cryogenic media channel is both provided with several roughness elements.
All cryogenic media channels are divided into several groups, and each cryogenic media channel in each group cryogenic media channel is in level side
Upward parallel and equidistantly distributed;All high-temperature medium channels are divided into several groups, and each high temperature in each group high-temperature medium channel is situated between
Matter channel is parallel in the horizontal direction and equidistantly distributed.
It is mutually parallel between high-temperature medium channel and cryogenic media channel or vertical.
Each high-temperature medium channel and each cryogenic media channel are straight passage structures.
Each roughness element in high-temperature medium channel is sequentially distributed in an axial direction;
Each roughness element in cryogenic media channel is sequentially distributed in an axial direction.
Each roughness element is two-dimentional roughness element or three-dimensional roughness element.
The two dimension roughness element is rectangular configuration, triangular structure, half elliptic structure or trapezium structure.
The three-dimensional roughness element is cylindrical structure, conical structure, semiellipsoid structure or rectangular parallelepiped structure.
The pitch P of roughness elementopt=(6~12) h, wherein h is the height of roughness element.
The invention has the advantages that:
Rough surface structure printed circuit board heat exchanger core body of the present invention is when specific operation, each high-temperature medium
The bottom in channel and the bottom in cryogenic media channel are both provided with several roughness elements, are made by the disturbance of roughness element fluid medium
With the fluidal texture for changing medium channel bottom, to form whirlpool, to increase the rapids of medium channel near wall regional fluid
Intensity of flow, the heat transfer of strengthening fluid medium and channel wall, through experiment, the present invention and existing smooth straight channel PCHE core phases
Than the heat transfer coefficient of core can increase 30%~90%.In addition, the perturbation action influence of roughness element is only limitted to closely in the present invention
Boundary layer region at wall, roughness element are smaller on the fluidal texture influence of main flow area in medium channel, therefore caused by roughness element
Fluid media (medium) crushing increasing degree is limited, and through experiment, crushing of the invention is only the 1/4 of existing Z-shaped channel PCHE core crushings
~1/2.The roughness element in the present invention can increase the heat transfer area of medium channel, the PCHE cores with existing no roughness element simultaneously
It compares, heat transfer area density bigger of the invention, in identical heat output, structure of the invention is more compact.
Description of the drawings
Fig. 1 is the structural diagram of the present invention;
Fig. 2 is a kind of distribution map of roughness element 4 in the present invention;
Fig. 3 is a kind of structural schematic diagram of roughness element 4 in the present invention;
Fig. 4 is another structural schematic diagram of roughness element 4 in the present invention;
Fig. 5 is another structural schematic diagram of roughness element 4 in the present invention;
Fig. 6 is another structural schematic diagram of roughness element 4 in the present invention;
Fig. 7 is another distribution map of roughness element 4 in the present invention;
Fig. 8 is another structural schematic diagram of roughness element 4 in the present invention;
Fig. 9 is another structural schematic diagram of roughness element 4 in the present invention;
Figure 10 is another structural schematic diagram of roughness element 4 in the present invention;
Figure 11 is another structural schematic diagram of roughness element 4 in the present invention.
Wherein, 1 it is high-temperature medium channel, 2 be cryogenic media channel, 3 be core ontology, 4 is roughness element.
Specific implementation mode
The present invention is described in further detail below in conjunction with the accompanying drawings:
As shown in Figure 1, rough surface structure printed circuit board heat exchanger core body of the present invention includes core ontology
3, several high-temperature medium channels 1 and several cryogenic media channels 2 are provided in core ontology 3, wherein each high-temperature medium channel 1
Bottom and the bottom in cryogenic media channel 2 be both provided with several roughness elements 4.
All cryogenic media channels 2 are divided for several groups, and each cryogenic media channel 2 is in level side in each group cryogenic media channel
Upward parallel and equidistantly distributed;All high-temperature medium channels 1 are divided for several groups, each high-temperature medium in each group high-temperature medium channel
Channel 1 is parallel in the horizontal direction and equidistantly distributed.
Each high-temperature medium channel 1 and each cryogenic media channel 2 are straight passage structures;It is each thick in high-temperature medium channel 1
Rough member 4 is sequentially distributed in an axial direction;Each roughness element 4 in cryogenic media channel 2 is sequentially distributed in an axial direction.
Referring to figs. 2 to Figure 11, each roughness element 4 is two-dimentional roughness element or three-dimensional roughness element, and the two dimension roughness element is rectangle
Structure, triangular structure, half elliptic structure or trapezium structure;The three-dimensional roughness element is cylindrical structure, cone knot
Structure, semiellipsoid structure or rectangular parallelepiped structure can be changed by changing the shape of roughness element 4 with changing in practical applications
The flowing of hot device core and heat-transfer character.
Be mutually parallel between high-temperature medium channel 1 and cryogenic media channel 2 or vertical, when high-temperature medium channel 1 with it is low
When warm medium channel 2 is mutually parallel, cryogenic media is countercurrent flow or downstream heat transfer with high-temperature medium, when high-temperature medium channel
1 with cryogenic media channel 2 when being mutually perpendicular to, and high-temperature medium and cryogenic media are staggeredly fluid interchange.
When in use, fluid flow separation is caused by the perturbation action of 4 fluid medium of roughness element, and then in roughness element
4 downstreams form vortex, change the fluidal texture of fluid by vortex, and the turbulent flow for increasing medium channel near wall regional fluid is strong
Degree, and then the heat transfer between strengthening fluid medium and wall surface.
The roughness element 4 is process using method for chemially etching, and roughness element 4 is that two-dimentional roughness element or three-dimensional are coarse
Member.Wherein, two-dimentional roughness element is continuous rib structure, structural parameters include the high h of roughness element 4, roughness element 4 pitch P, thick
The inclination angle theta of rough member 4 and the shape of roughness element 4.Three-dimensional roughness element is discontinuous needle rib structure, and structural parameters are roughness element 4
High h, the pitch P of roughness element 4, roughness element 4 horizontal spacing phAnd the shape of roughness element 4, wherein the high h of roughness element 4 and
The pitch P of roughness element 4 is maximum to the augmentation of heat transfer influential effect of roughness element 4.When the high h of roughness element 4 is less than fluid media (medium) in wall
When laminar sublayer thickness δ on face, roughness element 4 is totally submerged inside laminar sublayer, the effect of 4 convection current body disturbance-free of roughness element,
Augmentation of heat transfer effect is zero.When the high h of roughness element 4 is more than laminar sublayer thickness δ of the fluid media (medium) on wall surface, roughness element 4
Fluid is started to generate perturbation action, disturbance and augmentation of heat transfer effect at this time enhance, fluid with the increase of 4 high h of roughness element
Crushing also increases with the increase of h.When fluid media (medium) stream roughness element 4 and when forming vortex downstream, the pitch of roughness element 4
P influences the fluidal texture of vortex very big.When the pitch P of roughness element 4 is smaller, abundant development, turbulence intensity has not yet been reached in vortex
Amplification is limited, augmentation of heat transfer effect unobvious;When the pitch P of roughness element 4 is larger, vortex can not be full of between adjacent roughness element 4
Space, lead between adjacent roughness element 4 that there are absence of vortices, undisturbed regions, reduce the turbulence levels of near wall, strengthen
Heat-transfer effect is weakened.The best pitch of roughness element 4 is popt≈ (6~12) h both can guarantee that vortex was fully sent out within this range
Exhibition to give full play to the perturbation action of roughness element 4, and can guarantee that vortex full of the space between roughness element 4, avoids the occurrence of irrotationality
The low turbulence intensity region that whirlpool dominates, therefore optimal enhanced heat exchange effect can be obtained.
In practical operation, by adjusting the high h of roughness element 4, the shape of the pitch P of roughness element 4 and roughness element 4
Change the turbulence intensity in heat exchanging medium passage near wall region and the heat transfer area of heat exchanger channels, and then regulates and controls PCHE heat exchange
The flowing of core, heat-transfer character, to adapt to the requirement of different application occasion, different designs operating mode.
Detailed description above is only presently preferred embodiments of the present invention, cannot limit the scope of the present invention with this.It is i.e. every according to
According to equivalent changes and modifications made by scope of the present invention patent, should all belong within the scope of patent of the present invention covers.
Claims (9)
1. a kind of rough surface structure printed circuit board heat exchanger core body, which is characterized in that including core ontology (3), core
It is provided with several high-temperature medium channels (1) and several cryogenic media channels (2) in ontology (3), wherein each high-temperature medium channel
(1) bottom of bottom and cryogenic media channel (2) is both provided with several roughness elements (4).
2. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that all low
Warm medium channel (2) is divided into several groups, and each cryogenic media channel (2) in each group cryogenic media channel is parallel in the horizontal direction
And equidistantly distributed;All high-temperature medium channels (1) are divided into several groups, each high-temperature medium channel in each group high-temperature medium channel
(1) parallel in the horizontal direction and equidistantly distributed.
3. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that high temperature is situated between
It is mutually parallel between matter channel (1) and cryogenic media channel (2) or vertical.
4. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that each high temperature
Medium channel (1) and each cryogenic media channel (2) are straight passage structures.
5. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that high temperature is situated between
Each roughness element (4) in matter channel (1) is sequentially distributed in an axial direction;
Each roughness element (4) in cryogenic media channel (2) is sequentially distributed in an axial direction.
6. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that each coarse
First (4) are two-dimentional roughness element or three-dimensional roughness element.
7. rough surface structure printed circuit board heat exchanger core body according to claim 6, which is characterized in that described two
Dimension roughness element is rectangular configuration, triangular structure, half elliptic structure or trapezium structure.
8. rough surface structure printed circuit board heat exchanger core body according to claim 6, which is characterized in that described three
Dimension roughness element is cylindrical structure, conical structure, semiellipsoid structure or rectangular parallelepiped structure.
9. rough surface structure printed circuit board heat exchanger core body according to claim 1, which is characterized in that roughness element
(4) pitch Popt=(6~12) h, wherein h is the height of roughness element (4).
Priority Applications (1)
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CN201810814579.3A CN108731535A (en) | 2018-07-23 | 2018-07-23 | A kind of rough surface structure printed circuit board heat exchanger core body |
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CN201810814579.3A CN108731535A (en) | 2018-07-23 | 2018-07-23 | A kind of rough surface structure printed circuit board heat exchanger core body |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110095007A (en) * | 2019-05-28 | 2019-08-06 | 西安热工研究院有限公司 | A kind of compact heat exchanger |
Citations (8)
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JP2001201286A (en) * | 2000-01-21 | 2001-07-27 | Mitsubishi Heavy Ind Ltd | Heat exchange tube |
CN202254976U (en) * | 2011-08-27 | 2012-05-30 | 徐福昌 | Built-in plate type heat exchanger |
CN202930432U (en) * | 2009-12-16 | 2013-05-08 | 贝洱两合公司 | Heat exchanger |
CN204963622U (en) * | 2015-07-17 | 2016-01-13 | 上海科凌能源科技有限公司 | Mechanically engrave printed circuit board formula heat exchanger of wearing |
CN107121000A (en) * | 2017-06-14 | 2017-09-01 | 大连理工大学 | A kind of efficient plate-fin heat exchanger of inner-heating tube |
CN107388854A (en) * | 2017-07-26 | 2017-11-24 | 西安交通大学 | A kind of novel printed circuit board formula heat exchanger based on 3D printing technique |
CN206739946U (en) * | 2017-05-26 | 2017-12-12 | 中国核动力研究设计院 | A kind of surface texture of the heat exchanger plates of printed circuit board compact heat exchanger |
CN208688319U (en) * | 2018-07-23 | 2019-04-02 | 西安热工研究院有限公司 | A kind of rough surface structure printed circuit board heat exchanger core body |
-
2018
- 2018-07-23 CN CN201810814579.3A patent/CN108731535A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001201286A (en) * | 2000-01-21 | 2001-07-27 | Mitsubishi Heavy Ind Ltd | Heat exchange tube |
CN202930432U (en) * | 2009-12-16 | 2013-05-08 | 贝洱两合公司 | Heat exchanger |
CN202254976U (en) * | 2011-08-27 | 2012-05-30 | 徐福昌 | Built-in plate type heat exchanger |
CN204963622U (en) * | 2015-07-17 | 2016-01-13 | 上海科凌能源科技有限公司 | Mechanically engrave printed circuit board formula heat exchanger of wearing |
CN206739946U (en) * | 2017-05-26 | 2017-12-12 | 中国核动力研究设计院 | A kind of surface texture of the heat exchanger plates of printed circuit board compact heat exchanger |
CN107121000A (en) * | 2017-06-14 | 2017-09-01 | 大连理工大学 | A kind of efficient plate-fin heat exchanger of inner-heating tube |
CN107388854A (en) * | 2017-07-26 | 2017-11-24 | 西安交通大学 | A kind of novel printed circuit board formula heat exchanger based on 3D printing technique |
CN208688319U (en) * | 2018-07-23 | 2019-04-02 | 西安热工研究院有限公司 | A kind of rough surface structure printed circuit board heat exchanger core body |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110095007A (en) * | 2019-05-28 | 2019-08-06 | 西安热工研究院有限公司 | A kind of compact heat exchanger |
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