CN208684833U - A kind of configuration device of alumina polishing solution - Google Patents
A kind of configuration device of alumina polishing solution Download PDFInfo
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- CN208684833U CN208684833U CN201821274185.5U CN201821274185U CN208684833U CN 208684833 U CN208684833 U CN 208684833U CN 201821274185 U CN201821274185 U CN 201821274185U CN 208684833 U CN208684833 U CN 208684833U
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- container
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- polishing solution
- configuration device
- alumina polishing
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Abstract
The utility model provides a kind of configuration device of alumina polishing solution, including the first container, the first blender, the first pump, sanding apparatus, the second pump, second container, the second blender and ultrasonic pond.Wherein, the first blender is equipped in the first container, the outlet of the first container is connected to the entrance of the first pump, the outlet of first pump is connected to the entrance of sanding apparatus, the outlet of sanding apparatus is connected to the entrance of the second pump, the outlet of second pump is connected to the entrance of second container, is equipped with the second blender in second container, and second container is placed in ultrasonic pond.The configuration device of the alumina polishing solution of the utility model completes the configuration of alumina polishing solution using the combination of high-speed mixer, extra-fine grinding device and ultrasonic pond, adequately alumina powder can be dispersed, avoid the occurrence of agglomeration, the excellent alumina polishing solution of the uniform suspension stability of dispersion degree is obtained, to improve polished surface quality.
Description
Technical field
The utility model belongs to chemical field, in particular to a kind of configuration device of alumina polishing solution.
Background technique
Sapphire is wide because having many advantages, such as that the transparency is good, anti-chemical burn into infrared light transmission is high and wearability is good
It is general to be applied in high-tech sector, such as semiconductor chip substrate, light emitting diode (LED) substrate, precision instrumentation
The manufacture material of window, accurate anti-friction bearing etc..But sapphire is due to hardness height, brittleness is big, chemical property is stable,
Processing is got up very difficult.It is based especially on the raising to LED product luminous efficiency and service life, GaN epitaxial growth pair
Sapphire wafer substrate suface processing quality is stringenter, is the problem of current primary study.
Chemically mechanical polishing (CMP) technology is to realize sapphire surface Subnano-class processing most efficient method, wherein throwing
The performance of light liquid has the dispersion journey of very important influence, the especially uniformity of polish abrasive partial size and abrasive material on CMP effect
Degree directly controls the removal rate and surface smoothness of polished surface, and the polish abrasive of uniform particle sizes can obtain better polishing
Rate and accurate fine smooth surface.The most widely used several CMP polishing fluids are SiO currently on the market2、CeO2And Al2O3
Polishing fluid.Wherein, SiO2Polishing fluid selectivity, good dispersion, mechanical wear better performances, rear cleaning process processing are easier to,
But it is also easy to produce gel during the polishing process, it is low to hard bottom material polishing speed.CeO2Polishing fluid polishing speed is high, material removal
Rate is high, but large viscosity, easily scuffing, and selectivity is bad, and subsequent cleaning is difficult.Al2O3The shortcomings that polishing fluid, is selectivity
It is low, dispersion stabilization is bad, sub-micron particulate is easy to reunite and particle is thicker, cause surface damage serious in polishing process, table
Surface roughness is larger, the surface defects such as polishing scratch, pit occurs, but alumina polishing solution is to hard bottom material Sapphire Substrate
Deng but with excellent removal rate.With the development of LED industry, the demand of Sapphire Substrate is growing, Al2O3Polishing fluid
Application in CMP seems more important.Therefore, the research of alumina polishing solution configuration device is for improving alumina polishing solution
Dispersion stabilization and to break particle aggregation extremely important.
Utility model content
In view of the above drawbacks of the prior art, matching the purpose of this utility model is to provide a kind of alumina polishing solution
Device is set, the configuration device of the alumina polishing solution of sapphire wafer polishing field is particularly applied to.
The configuration device of the alumina polishing solution of the utility model includes the first container, the first blender, the first pump, is sanded
Device, the second pump, second container, the second blender and ultrasonic pond.Wherein, it is equipped with the first blender in the first container, first
The outlet of container is connected to the entrance of the first pump, and the outlet of the first pump is connected to the entrance of sanding apparatus, the outlet of sanding apparatus
It is connected to the entrance of the second pump, the outlet of the second pump is connected to the entrance of second container, is equipped with the second blender in second container,
And second container is placed in ultrasonic pond.
Further, the first container is open-top receptacle, and the outlet of the first container is set to the bottom of the first container.
Further, the first pump and the second pump are centrifugal pump.
Further, sanding apparatus is extra-fine grinding dispersion machine, and type can accordingly be matched according to the volume of grinding material
It sets.
Further, second container is closed container, has top cover, the entrance of second container is located on top cover, on top cover
It is additionally provided with pH test mouth and auxiliary material adding mouth, for real-time monitoring pH value in generating process and addition auxiliary material.Under second container
Portion or bottom are equipped with drain hole, for collecting or introducing next workshop section for product.
Further, the Vltrasonic device of liquid tank and power adjustable is equipped in ultrasonic pond.
The typical configuration process of the configuration device of the alumina polishing solution of the utility model is as follows: alumina powder, water and
Dispersing agent is separately added into the first container, and aluminium oxide coarse dispersion is obtained under the high-speed stirred of the first blender, by the first pump
Be delivered in sanding apparatus, the abrasive media in the grinding groove of sanding apparatus under distribution blade high-speed rotation with alumina particle
It hits, plays the role of dispersion, the size of the time and abrasive media that are sanded by control can obtain different fineness
Alumina fluid dispersion.The alumina fluid dispersion dispersed by sanding apparatus is delivered in second container by the second pump, passes through auxiliary material
Solvent and other auxiliary materials are added in adding mouth, open simultaneously the Vltrasonic device of the second blender and ultrasonic pond, make alumina fluid dispersion
It can be further uniformly mixed with solvent and auxiliary material.After dispersion mixing, collects or introduce by the discharge port of second container
Next workshop section.
The configuration device of the alumina polishing solution of the utility model utilizes high-speed mixer, extra-fine grinding device and ultrasonic pond
Combination complete the configuration of alumina polishing solution, adequately alumina powder can be dispersed, it is existing to avoid the occurrence of reunion
As the excellent alumina polishing solution of the uniform suspension stability of dispersion degree being obtained, to improve polished surface quality.
Detailed description of the invention
Fig. 1 is the configuration device schematic diagram of the alumina polishing solution of one preferred embodiment of the utility model.
Specific embodiment
It elaborates below to the embodiments of the present invention, following embodiments is with technical solutions of the utility model
Premised under implemented, the detailed implementation method and specific operation process are given, but the protection scope of the utility model
It is not limited to the following embodiments.
In a preferred embodiment, as shown in Figure 1, the configuration device of the alumina polishing solution of the utility model includes the
One container 1, the first blender 2, first pump 3, the pump of sanding apparatus 4, second 5, second container 6, the second blender 7 and ultrasonic pond
3.Wherein, the first blender 2 is equipped in the first container 1, the outlet of the first container 1 is connected to the entrance of the first pump 3, the first pump 3
Outlet be connected to the entrance of sanding apparatus 4, the outlet of sanding apparatus 4 is connected to the entrance of the second pump 5, the outlet of the second pump 5
It is connected to the entrance of second container 6, is equipped with the second blender 7 in second container 6, and second container 6 is placed in ultrasonic pond 10.
In a preferred embodiment, the first container 1 is open-top receptacle, and the outlet of the first container 1 is set to the first container 1
Bottom.
In a preferred embodiment, the first pump 3 and the second pump 5 are centrifugal pump.
In a preferred embodiment, sanding apparatus 4 is extra-fine grinding dispersion machine, and type can be according to the volume of grinding material
Carry out corresponding configuration.
In a preferred embodiment, second container 6 is closed container, has top cover, and the entrance of second container 6 is located at top
It covers, pH test mouth 8 and auxiliary material adding mouth 9 is additionally provided on top cover, for real-time monitoring pH value in generating process and addition auxiliary material.
The lower part or bottom of second container 6 are equipped with drain hole 11, for collecting or introducing next workshop section for product.
In a preferred embodiment, the Vltrasonic device of liquid tank and power adjustable is equipped in ultrasonic pond 10.
In a preferred embodiment, the typical configuration process of the configuration device of the alumina polishing solution of the utility model
As follows: alumina powder, water and dispersing agent are separately added into the first container 1, are aoxidized under the high-speed stirred of the first blender 2
Aluminium coarse dispersion is delivered in sanding apparatus 4 by the first pump 3, and the abrasive media in the grinding groove of sanding apparatus 4 is in distribution blade
It is hit under high-speed rotation with alumina particle, plays the role of dispersion, by controlling the time and abrasive media that are sanded
Size can obtain the alumina fluid dispersion of different fineness.The alumina fluid dispersion dispersed by sanding apparatus 4 is by the second pump 5
It is delivered in second container 6, solvent and other auxiliary materials is added by auxiliary material adding mouth 9, open simultaneously the second blender 7 and ultrasound
Pond 10, is uniformly mixed alumina fluid dispersion further with solvent and auxiliary material.After dispersion mixing, pass through second container
Next workshop section is collected or introduced to 6 discharge port 11.
The preferred embodiments of the present invention have been described in detail above.It should be appreciated that this field ordinary skill without
It needs creative work according to the present utility model can conceive and makes many modifications and variations.Therefore, it is all in the art
Technical staff passes through logic analysis, reasoning or limited test according to the design of the utility model on the basis of existing technology can
It, all should be within the scope of protection determined by the claims with obtained technical solution.
Claims (8)
1. a kind of configuration device of alumina polishing solution, which is characterized in that the configuration device of the alumina polishing solution includes the
One container, the first blender, the first pump, sanding apparatus, the second pump, second container, the second blender and ultrasonic pond；Described
It is equipped with first blender in one container, the outlet of the first container is connected to the described first entrance pumped, and described first
The outlet of pump is connected to the entrance of the sanding apparatus, and the outlet of the sanding apparatus is connected to the entrance of second pump, institute
The outlet for stating the second pump is connected to the entrance of the second container, is equipped with the second blender in the second container, and described the
Two containers are placed in the ultrasonic pond.
2. the configuration device of alumina polishing solution as described in claim 1, which is characterized in that the first container is open holds
Device, the outlet of the first container are set to the bottom of the first container.
3. the configuration device of alumina polishing solution as described in claim 1, which is characterized in that first pump and described second
Pump is centrifugal pump.
4. the configuration device of alumina polishing solution as described in claim 1, which is characterized in that the sanding apparatus is ultra-fine grinds
Grind dispersion machine.
5. the configuration device of alumina polishing solution as described in claim 1, which is characterized in that the second container has top
Lid, the entrance of the second container are located on the top cover.
6. the configuration device of alumina polishing solution as claimed in claim 5, which is characterized in that be additionally provided with pH survey on the top cover
Try mouth and auxiliary material adding mouth.
7. the configuration device of alumina polishing solution as described in claim 1, which is characterized in that the lower part of the second container or
Bottom is equipped with drain hole.
8. the configuration device of alumina polishing solution as described in claim 1, which is characterized in that be equipped with liquid in the ultrasound pond
The Vltrasonic device of slot and power adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821274185.5U CN208684833U (en) | 2018-08-08 | 2018-08-08 | A kind of configuration device of alumina polishing solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821274185.5U CN208684833U (en) | 2018-08-08 | 2018-08-08 | A kind of configuration device of alumina polishing solution |
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| Publication Number | Publication Date |
|---|---|
| CN208684833U true CN208684833U (en) | 2019-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821274185.5U Active CN208684833U (en) | 2018-08-08 | 2018-08-08 | A kind of configuration device of alumina polishing solution |
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| CN (1) | CN208684833U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110681303A (en) * | 2019-11-27 | 2020-01-14 | 湖南大合新材料有限公司 | Polishing solution preparation device |
-
2018
- 2018-08-08 CN CN201821274185.5U patent/CN208684833U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110681303A (en) * | 2019-11-27 | 2020-01-14 | 湖南大合新材料有限公司 | Polishing solution preparation device |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221102 Address after: No. 198 Shedai Road, Hechen Town, Xinghua City, Taizhou City, Jiangsu Province, 225743 (west of Xingfu Village) Patentee after: Jiangsu Yijie Industrial Media Co.,Ltd. Address before: No. 211, Qianshi Road, Qianzhou Street, Huishan District, Wuxi City, Jiangsu Province, 214181 Patentee before: WUXI E-CLEANING INDUSTRIAL MEDIUM CO.,LTD. |