CN104308760B - Fixed abrasive polishing cloth adopting nanometer aggregation structure adhesive - Google Patents

Fixed abrasive polishing cloth adopting nanometer aggregation structure adhesive Download PDF

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Publication number
CN104308760B
CN104308760B CN201410539722.4A CN201410539722A CN104308760B CN 104308760 B CN104308760 B CN 104308760B CN 201410539722 A CN201410539722 A CN 201410539722A CN 104308760 B CN104308760 B CN 104308760B
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CN
China
Prior art keywords
nanometer
abrasive
polishing cloth
material
abrasive material
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CN201410539722.4A
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Chinese (zh)
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CN104308760A (en
Inventor
高绮
谷泰弘
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天津市职业大学
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Abstract

The invention relates to fixed abrasive polishing cloth adopting a nanometer aggregation structure adhesive. The fixed abrasive polishing cloth is characterized by consisting of a polishing cloth substrate and an abrasive uniformly distributed in the polishing cloth substrate, wherein the fixed abrasive is the nanometer aggregation structure adhesive; the nanometer aggregation structure adhesive is a micro-grade spherical abrasive formed by aggregating nanometer particles. The adopted nanometer aggregation structure adhesive is the micro-grade spherical abrasive formed by aggregating the nanometer particles, so that the nanometer particles can be prevented from easily falling into the polishing cloth substrate made of a sticky elastic material, and the machining effect is brought into full play while high surface smoothness is ensured.

Description

A kind of fixed abrasive polishing cloth of employing nanometer aggregated structure abrasive material

Technical field

The present invention relates to hard brittle material surface accurate processing polishing tool, particularly one kind adopt nanometer aggregated structure The fixed abrasive polishing cloth of abrasive material and its processing method.

Background technology

At present, various microelectronic substrate materials (as the substrate of the materials such as si, sic, glass), sio2Dielectric film and microelectronics The Ultra-precision Turning commonly used nanometer abrasive polishing fluid of components and parts, the most frequently used for nano silicon oxide polishing fluid.But due to throwing Light liquid (free abrasive) using brought a series of environmental problem, fixed abrasive processing is increasingly paid attention to.Fixing In abrasive material tools, fixed abrasive polishing cloth is easiest to realize the processing of ultra-precision surface.Fixed abrasive polishing cloth is mainly by polishing Cloth base material and the abrasive material being fixed in base material are constituted, but the current working (machining) efficiency of fixed abrasive polishing cloth and Surface Machining matter Amount, is all not so good as existing free abrasive processing.Trace it to its cause, have direct relation with the abrasive material that polishing cloth is adopted.Due to Nano-size abrasive materials are difficult to uniformly be added in polishing cloth, and are easily absorbed in polishing cloth base material, and working (machining) efficiency is low.Adopt at present is big It is mostly the conventional abrasives of the erose hard being made up of smashing method.Particle diameter generally in submicron, with existing nano-polishing The finished surface of liquid is compared, and easily scratches finished surface, affects suface processing quality.Additionally, in order to improve chemical removal effect, Fixed abrasive polishing cloth typically requires to be used in combination with chemical solution, and such as si substrate generally adopts the alkaline aqueous solution of ph10, processing In easily and in the air co2Reaction, ph value is wayward.

Content of the invention

It is an object of the invention to overcoming the deficiencies in the prior art, provide a kind of fixation of employing nanometer aggregated structure abrasive material Abrasive polishing cloth, it adopts the micron-size spherical particle of nanometer aggregated structure as the abrasive material of fixed abrasive polishing cloth, nanometer Particle can ensure that suface processing quality, and micron-level particle size both can avoid nanometer seed to be absorbed in polishing cloth base material it is ensured that adding Work efficiency rate, is conducive to the preparation of uniform polish cloth again, and feature added material can improve the material of different workpieces to be machined Processing characteristics.

The present invention solves its technical problem and is achieved through the following technical solutions:

A kind of fixed abrasive polishing cloth of employing nanometer aggregated structure abrasive material it is characterised in that: by polishing cloth base material and all The even abrasive material being distributed in polishing cloth base material is constituted, and this fixed abrasive is nanometer aggregated structure abrasive material, this nanometer of aggregated structure mill Material is by the micron-size spherical abrasive material of the sub- particle accumulation of nanometer.

And, described polishing cloth base material is the viscoelastic materials such as polyurethane.

And, the fixed abrasive adding rate of described polishing cloth is 6vol%-50vol%, porosity 10vol%- 50vol%.

And, the particle diameter of described nanometer seed of nanometer aggregated structure abrasive material is 1-80nm, with pore volume is 0.1-5cm3The gather density of/g be gathered into particle diameter be 1-20um about micron-size spherical abrasive material.

And, the aperture of the described ultra micro pore of nanometer aggregated structure abrasive material is 1-80nm.

And, described nanometer aggregated structure abrasive material assembles silicon oxide for nanometer, nanometer assembles aluminium oxide, nanometer assembles oxygen Change cerium or polycrystalline diamond etc..

And, described nanometer is assembled in silica abrasive and is also contained alkaline nano material.

And, described alkaline nano material is the inorganic bases such as koh, or piperazidine or aminated compoundss etc. is organic Alkali.

Advantages of the present invention and having the beneficial effect that

1st, the fixed abrasive polishing cloth of the present invention, using nanometer aggregated structure abrasive material, it is micro- by nanoparticle aggregation Meter level spherical abrasive material, micron-size spherical abrasive material can make nanoparticle be difficult to be absorbed in the polishing cloth base material of viscoelastic material, While ensureing good surface smoothness, give full play to elaboration, in addition the space chip pocket near micron particle, can To ensure the exclusion of abrasive dust, it is advantageously implemented efficient removal.

2nd, the fixed abrasive polishing cloth of the present invention, its nanometer of aggregated structure abrasive material is containing 1-80nm ultra micro pore structure Particle, lower than the mechanical strength of the abrasive material of the traditional solid construction of same particle diameter, hardness is little, so usual mechanical removal effect Low, be conducive to reducing the scuffing to surface to be machined, and the mechanical damage of sub-surface.

3rd, the fixed abrasive polishing cloth of the present invention, the particle of its nanometer of aggregated structure abrasive material is generally than the ratio table of conventional abrasives Area is big, and surface activity is strong, has stronger chemical removal effect, effectively raises working (machining) efficiency.

4th, the fixed abrasive polishing cloth of the present invention, also can add alkaline nanometer material in nanometer aggregated structure silica abrasive Material, the such as organic base such as inorganic base or aminated compoundss such as koh, in the processing of si substrate, deionized water replaces alkalescence water-soluble The polishing solution of liquid, not only can improve the clearance of si substrate, and surface smoothness is moreover it is possible to improve the service efficiency of koh.Subtract Light environmental pressure.The chemical removal effect of silica abrasive can be improved.

Brief description

Fig. 1 is structure and the process principle schematic diagram of fixed abrasive polishing cloth of the present invention;

Fig. 2 is the enlarged drawing (in conjunction with operation principle schematic diagram) that in this Fig. 1, nanometer assembles abrasive material;

Fig. 3 is that existing nano silicon oxide polishing fluid assembles the contrast of silicon oxide polishing fluid processing characteristics with nanometer;

Fig. 4 is the processing characteristics ratio of the fixed abrasive polishing cloth of existing natural oxidation silicon abrasive material and nanometer gathering silicon oxide Relatively.

Description of reference numerals:

1- fixed abrasive polishing cloth, 2- grind machine worktable, 3- deionized water solution, 4- workpiece to be machined, 5- polishing cloth Base material, 6- nanometer aggregated structure abrasive material, 7- nanometer seed, 8- chip pocket, 9- ultra micro pore, 10- feature added material are (such as koh).

Specific embodiment

Below by specific embodiment, the invention will be further described, and following examples are descriptive, is not limit Qualitatively it is impossible to protection scope of the present invention is limited with this.

A kind of fixed abrasive polishing cloth of employing nanometer aggregated structure abrasive material, it is by polishing cloth base material 5 and uniformly make an addition to Fixed abrasive in polishing cloth base material is constituted, and this fixed abrasive is nanometer aggregated structure abrasive material 6, and this nanometer of aggregated structure abrasive material is Micron-size spherical abrasive material by nanometer seed 7 gathering.

Polishing cloth base material is the viscoelastic materials such as polyurethane.Nanometer aggregated structure abrasive material makes an addition to adding in polishing cloth base material Plus rate is 6vol%-50vol%, porosity 10vol%-50vol%.The sub- particle diameter of nanometer is 1-80nm, with pore volume For 0.1cm3/g-5cm3The gather density of/g is gathered into the micron-size spherical abrasive material that particle diameter is 1-20um.Micron-size spherical abrasive material Pore aperture is 1-80nm.Nanometer aggregate particles be nanometer assemble silicon oxide, nanometer assemble aluminium oxide, nanometer gathering cerium oxide and Polycrystalline diamond.

Nanometer is assembled in silica abrasive and is also contained the functional nanomaterials such as alkalescence.Alkaline nano material is the nothing such as koh Machine alkali, and the organic base of piperazidine and aminated compoundss etc..

The fixed abrasive polishing cloth of the present invention, using nanometer aggregated structure abrasive material, it is micro- by the sub- particle accumulation of nanometer Meter level spherical abrasive material, micron-size spherical abrasive material can make nanometer seed be difficult to be absorbed in the polishing cloth base material of viscoelastic material, While ensureing good surface smoothness, give full play to elaboration, in addition the space chip pocket near micron particle 8, it is ensured that the exclusion of abrasive dust, are advantageously implemented efficient removal.

A kind of processing method of the fixed abrasive polishing cloth of employing nanometer aggregated structure abrasive material it is characterised in that: this processing The step of method is:

(1). the preparation method of nanometer aggregated structure abrasive material:

First adopt preparation nanometer seed such as sol-gal process, then using wet type or dry type powder by sub- for nanometer particle accumulation Become micro-size particless, become a nanometer aggregated structure abrasive material.

(2). the interpolation of the functional material such as alkalescence:

The strong adsorptivity of the ultra micro pore of available nanometer aggregated structure abrasive material, with soaking method etc. by materials such as alkaline koh Suck nanometer aggregate material, it would however also be possible to employ nano composite material prepares method.

(3). the method that nanometer aggregated structure abrasive material adds to polishing cloth is:

Nanometer aggregated structure abrasive material is added to the prepolymer of polyurethane, mixing and stirring, injection model.

(4). hardened again, resin is ripe.

(5) after the demoulding, make fixed abrasive polishing cloth finished product.

The experimentation of the fixed abrasive polishing cloth of the present invention is:

By smooth for fixed abrasive polishing cloth 1 on grinder work top 2, together around center with n1Do and at the uniform velocity turn round.Will Deionized water solution 3, at the uniform velocity drips on polishing cloth, is uniformly distributed polishing cloth surface.The machined surface of workpiece to be machined (substrate) 4 It is placed in down on polishing cloth, under grinding pressure p effect, around workpiece centre with n2At the uniform velocity turn round, be fixed the polishing of abrasive material Processing.

Processing conditionss: workpiece to be machined 3 " si substrate, processes 0.25 μm of ra of front surface roughness, 1.8 μm of rz;Polishing fluid Concentration 5wt%, ph10.5;Grinding pressure 50kpa, speed of gyration (workbench, workpiece) 60rpm, polishing time 15min.

Experimental result illustrates:

1. as shown in Figure 3, the nanometer aggregated structure silicon oxide polishing fluid for 5um, its nanometer of seed using mean diameter Seed footpath is 10-20nm, compared with the silicon oxide polishing fluid being 10-20nm with existing particle diameter, can realize rapidly smooth surface Processing, it is possible to reduce the polishing process number of si substrate, and the surface roughness of about 0.8nmra can be obtained, with nano silicon oxide The machined surface roughness (0.75nmra) of polishing fluid is close.

2. the processing technique of quartzy convex ball end face, by 4 procedures of usually 9um-3um-1um- polishing, can be kept to 9um-3um- polishes 3 procedures.Additionally, the electric current grinding machine worktable consumption during processing shown in Fig. 3 can reduce by more than 10%.

3. as shown in Figure 4, fixed abrasive polishing cloth (adding rate 25vol% of silicon oxide, the porosity of 2 kinds of silicon oxides Processing characteristics 26vol%) compares, and is used in combination with the aqueous solution of ph10.5.Nanometer aggregated structure oxygen using mean diameter about 5um The fixed abrasive polishing cloth of SiClx, compared with the fixed abrasive abrasive cloth of mean diameter 3.5um traditional silicon oxide, is difficult to draw Hinder finished surface, processed surface smoothness significantly improves, also significantly improve up to 0.6-0.9nmra. working (machining) efficiency.

4. assemble the fixed abrasive polishing cloth of silicon oxide using the nanometer adding basic matterial, can not adopt ph10.5's Alkaline chemical solution, a deionized water processing si substrate, reach and existing nanometer burnishing liquid identical polishing effect.

Although disclosing embodiments of the invention and accompanying drawing for the purpose of illustration, those skilled in the art can manage Solution: without departing from the present invention and spirit and scope of the appended claims, various replacements, to change and modifications be all possible, Therefore, the scope of the present invention is not limited to embodiment and accompanying drawing disclosure of that.

Claims (5)

1. a kind of fixed abrasive polishing cloth of employing nanometer aggregated structure abrasive material it is characterised in that: by polishing cloth base material and uniformly The abrasive material being distributed in polishing cloth base material is constituted, and this fixed abrasive is nanometer aggregated structure abrasive material, this nanometer of aggregated structure abrasive material It is by the micron-size spherical abrasive material of the sub- particle accumulation of nanometer;Described polishing cloth base material is viscoelastic polyurethane elastomeric material;Institute The fixed abrasive adding rate of the polishing cloth stated is 6vol%-50vol%, porosity 10vol%-50vol%;Described nanometer is gathered The particle diameter of nanometer seed of structure set abrasive material is 1-80nm, with pore volume as 0.1-5cm3The gather density of/g assembles granulating Footpath is the micron-size spherical abrasive material of 1-20um.
2. employing nanometer aggregated structure abrasive material according to claim 1 fixed abrasive polishing cloth it is characterised in that: described The ultra micro pore of nanometer aggregated structure abrasive material aperture be 1-80nm.
3. employing nanometer aggregated structure abrasive material according to claim 1 fixed abrasive polishing cloth it is characterised in that: described Nanometer aggregated structure abrasive material be nanometer assemble silica abrasive, nanometer assemble alumina abrasive, nanometer assemble cerium oxide abrasives Or polycrystalline diamond abrasive.
4. employing nanometer aggregated structure abrasive material according to claim 1 fixed abrasive polishing cloth it is characterised in that: described Nanometer assemble silica abrasive in also contain alkaline nano material.
5. according to claim 4 adopt nanometer aggregated structure abrasive material fixed abrasive polishing cloth it is characterised in that: described alkalescence Nano material is koh inorganic base, or the organic base of piperazidine or aminated compoundss.
CN201410539722.4A 2014-10-13 2014-10-13 Fixed abrasive polishing cloth adopting nanometer aggregation structure adhesive CN104308760B (en)

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Publication number Priority date Publication date Assignee Title
CN110193777A (en) * 2019-06-06 2019-09-03 嘉兴星微纳米科技有限公司 Processing induction type grinding pad based on viscoelastic material

Family Cites Families (7)

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US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US8435098B2 (en) * 2006-01-27 2013-05-07 Saint-Gobain Abrasives, Inc. Abrasive article with cured backsize layer
JP2007000997A (en) * 2005-06-24 2007-01-11 Tadamasa Fujimura Flexible and antistatic nano diamond grinder
AR064997A1 (en) * 2007-01-23 2009-05-06 Saint Gobain Abrasives Inc A coated abrasive product, a suspension of abrasive, a bonded abrasive product, a particulate material, a method of forming an abrasive particulate material and a method for machining a workpiece
CN101372560B (en) * 2008-10-15 2011-06-15 中国科学院上海微系统与信息技术研究所 Grinding medium for chemico-mechanical polishing and preparation thereof
CN101428404A (en) * 2008-12-22 2009-05-13 南京航空航天大学 Fixed abrasive grinding polishing pad and method of manufacturing the same

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