CN208674078U - Stove face plate cleaning plant and semiconductor processing equipment - Google Patents
Stove face plate cleaning plant and semiconductor processing equipment Download PDFInfo
- Publication number
- CN208674078U CN208674078U CN201821278310.XU CN201821278310U CN208674078U CN 208674078 U CN208674078 U CN 208674078U CN 201821278310 U CN201821278310 U CN 201821278310U CN 208674078 U CN208674078 U CN 208674078U
- Authority
- CN
- China
- Prior art keywords
- sealing
- face plate
- unit
- stove face
- cleaning plant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 130
- 238000006243 chemical reaction Methods 0.000 claims abstract description 68
- 238000010926 purge Methods 0.000 claims description 20
- 230000002000 scavenging effect Effects 0.000 claims description 20
- 239000002245 particle Substances 0.000 abstract description 22
- 239000006227 byproduct Substances 0.000 abstract description 19
- 239000007789 gas Substances 0.000 description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Abstract
The utility model is related to a kind of stove face plate cleaning plant and semiconductor processing equipment, including sealing unit and vacuum unit, the vacuum unit is connected to the sealing unit, wherein the sealing unit includes sealing cover, sealing space is formed for covering the surface towards reaction chamber of stove face plate, and on the surface towards reaction chamber of the stove face plate；The vacuum unit includes vacuum pump, is connected to the sealing unit by pipeline, and for being connected to the sealing space, vacuumize to the sealing space.Above-mentioned stove face plate cleaning plant and semiconductor processing equipment are due to sealing unit and vacuum unit, chamber door can be extracted by extracting vacuum towards the byproduct of reaction particle on the surface of reaction chamber, reduce byproduct of reaction particle and blown off, fallen a possibility that forming marginal particle on wafer by air-flow.
Description
Technical field
The utility model relates to crystal productions to manufacture processing equipment field, and in particular to a kind of stove face plate cleaning plant and half
Conductor processing equipment.
Background technique
In the production process of wafer, it is often necessary to place the wafer in reaction chamber and be reacted.In reaction process
In, some byproduct of reaction particles can be attached in the chamber door of the reaction chamber.During chamber door opening and closing, air pressure
It changes and generates air-flow, the byproduct of reaction particle being attached in chamber door may be blown off, to what is reacted in reaction chamber
Wafer impacts.
When being such as diffused processing procedure to wafer using boiler tube, the surface of stove face plate towards the reaction chamber of most of boiler tube exists
Some byproduct of reaction particles can be accepted in use process.When switching the stove face plate, the air-flow meeting of the variation generation of air pressure
Stove face plate is blown off towards the byproduct of reaction particle on the surface of reaction chamber, falls byproduct of reaction particle on wafer,
Form marginal particle.
Utility model content
The purpose of this utility model is to provide a kind of stove face plate cleaning plant and semiconductor processing equipments, can clear up chamber
Room door reduces byproduct of reaction and is blown off by air-flow, formed on wafer towards the byproduct of reaction particle on the surface of reaction chamber
A possibility that marginal particle.
In order to solve the above technical problems, the following provide a kind of stove face plate cleaning plant, including sealing unit and vacuumize
Unit, the vacuum unit are connected to the sealing unit, wherein the sealing unit includes sealing cover, for covering furnace
Door closure forms sealing space towards the surface of boiler tube cavity, and on the surface towards boiler tube cavity of the stove face plate；The pumping
Vacuum unit includes vacuum pump, and is connected to sealing cover by pipeline, so that it is connected to the sealing space, it is empty to the sealing
Between vacuumized.
Optionally, the sealing unit further includes sealing ring, is mounted on the surface towards reaction chamber of the stove face plate,
It is contacted with the sealing cover on the surface towards reaction chamber for covering the stove face plate, it is empty to form sealing in the fire door cap surface
Between.
Optionally, the vacuum unit further includes the first pneumatic operated valve, is set to the vacuum pump and the sealing unit
Between pipeline on.
Optionally, the stove face plate cleaning plant further includes scavenging pipeline, and one end is connected to the sealing space, the other end
For being connected to purge gas source, for being passed through purge gas into the sealing space.
Optionally, the scavenging pipeline is connected to one second pneumatic operated valve, controls the scavenging conduit by second pneumatic operated valve
Purging of the road to sealing space.
Optionally, the stove face plate cleaning plant further includes control unit, is connected to first pneumatic operated valve and the second gas
Dynamic valve, for controlling the on-off of first pneumatic operated valve and the second pneumatic operated valve.
Optionally, described control unit includes main controller and PLC programmable logic controller (PLC), and the main controller passes through institute
It states PLC programmable logic controller (PLC) and is connected to first pneumatic operated valve and the second pneumatic operated valve.
A kind of semiconductor processing equipment also provided below, including cleaning plant and reaction board, wherein cleaning dress
It sets including sealing unit and vacuum unit, the vacuum unit is connected to the sealing unit, wherein the sealing unit
Including sealing cover, for covering the region for clearance of reaction board, and formed in the region for clearance of the reaction board close
Seal space；The vacuum unit includes vacuum pump, is connected to the sealing unit by pipeline, and described close for being connected to
Space is sealed, the sealing space is vacuumized；The reaction board includes reaction chamber and chamber door, wherein the chamber
Door includes rotary shaft, and the chamber door can be around the rotary shaft in the plane internal rotation for being parallel to reaction chamber opening, and institute
Chamber door is stated after the rotary shaft Unscrew, the sealing cover is covered in surface of the chamber door towards reaction chamber,
Sealing space is formed towards the surface of reaction chamber in the chamber door.
Optionally, the sealing unit further includes sealing ring, and the sealing ring is installed on the direction of the chamber door instead
The surface for answering chamber is contacted with the sealing cover on the surface towards reaction chamber for covering the chamber door, in the chamber door
Towards reaction chamber surface formed sealing space.
Optionally, the vacuum unit further includes the first pneumatic operated valve, is set to the vacuum pump and the sealing unit
Between pipeline on.
Above-mentioned stove face plate cleaning plant and semiconductor processing equipment are due to sealing unit and vacuum unit, Ke Yitong
It crosses extraction vacuum to extract chamber door towards the byproduct of reaction particle on the surface of reaction chamber, reduces byproduct of reaction
Particle is blown off by air-flow, falls a possibility that forming marginal particle on wafer.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of semiconductor processing equipment in a kind of specific embodiment of the utility model.
Fig. 2 is vacuum unit and the signal of the connection relationship of scavenging pipeline in a kind of specific embodiment of the utility model
Figure.
Fig. 3 is the connection relationship of vacuum unit and control unit signal in a kind of specific embodiment of the utility model
Figure.
Fig. 4 is the company of vacuum unit in a kind of specific embodiment of the utility model, scavenging pipeline and control unit
Connect relation schematic diagram.
Fig. 5 is installed to signal when stove face plate for stove face plate cleaning plant in a kind of specific embodiment of the utility model
Figure.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of stove face plate cleaning plant and partly lead
Body processing equipment is further described.According to following explanation and claims, the advantages of the utility model and feature will more
It is clear.
Fig. 1 is please referred to for the structural schematic diagram of semiconductor processing equipment described in present embodiment, at the semiconductor
Reason equipment includes cleaning plant 100 and reaction board 114, wherein the cleaning plant 100 includes sealing unit 110 and vacuumizes
Unit 113, the vacuum unit 113 are connected to the sealing unit 110, wherein the sealing unit 110 includes sealing cover
106, sealing is formed for covering the region for clearance of reaction board 114, and in the region for clearance of the reaction board 114
Space 108.The vacuum unit 113 includes vacuum pump 111, is connected to the sealing unit 110 by pipeline 109, is used in combination
In being connected to the sealing space 108, the sealing space 108 is vacuumized.The reaction board 114 includes reaction chamber
Room 101 and chamber door 112, the chamber door 112 includes rotary shaft 105, and the chamber door 112 can be around the rotary shaft 105
In the plane internal rotation for being parallel to reaction chamber opening, and the chamber door 112 is after 105 Unscrew of rotary shaft, institute
The surface towards reaction chamber that sealing cover 106 covers the chamber door 112 is stated, in the direction reaction of the chamber door 112
Sealing space 108 is formed on the surface of chamber 101.
The chamber door 112 includes lid 103 and pedestal 104, wherein the pedestal 104 is connected to rotary shaft 105, and can
It is rotated around the rotary shaft 105 with the direction for being parallel to reaction chamber opening, the setting of lid 103, can be on the pedestal 104
It is rotated with the pedestal 104 around rotary shaft 105.
The sealing unit 110 further includes sealing ring 102, and the direction that the sealing ring 102 is set to the lid 103 is anti-
Answer the surface of chamber.After the opening of rotary shaft 105, the sealing ring 102 on lid 103 is covered the lid 103 by sealing cover 106
Pressure forms sealing space 108 on the surface towards reaction chamber of the lid 103.The vacuum pump 111 passes through pipeline 109
It is connected to the sealing cover 106, and is connected to the sealing space 108.It can be realized by the vacuum pump 111 to the sealing
Space 108 is vacuumized.In other specific embodiments, the sealing cover 106, which can directly cover, is pressed on the lid 103
The surface towards reaction chamber, on the surface towards reaction chamber of the lid 103 formed sealing space 108.
The vacuum unit 113 further includes the first pneumatic operated valve 107.Wherein the first pneumatic operated valve 107 is arranged in vacuum valve 111
Between sealing unit 110, the vacuumizing to sealing space 108 of vacuum pump 111 is controlled by first pneumatic operated valve 107.
In specific embodiment shown in Fig. 1, first pneumatic operated valve 107 setting the vacuum pump 111 and sealing cover 106 it
Between, by controlling the opening and closing of first pneumatic operated valve 107, control vacuum pump 111 arrives the on-off of the pipeline between sealing cover 106,
To control the vacuumizing to sealing space 108 of vacuum pump 111.
Please refer to the connection relationship diagram that Fig. 2 is vacuum unit and scavenging pipeline described in present embodiment.Institute
Stating cleaning plant further includes a scavenging pipeline 206, and one end is connected to the sealing cover 201, so that it is connected to the sealing space,
The other end is for being connected to purge gas source, the byproduct of reaction on the surface towards reaction chamber for purging chamber door
Grain.In a specific embodiment, it is provided with the second pneumatic operated valve 204 in the scavenging pipeline 206, passes through the second pneumatic operated valve
Purging of the 204 control scavenging pipelines 206 to sealing space.It, can also be by described in control in other specific embodiments
Purge gas source controls purging of the scavenging pipeline 206 to sealing space.
In a specific embodiment, it first passes through the second pneumatic operated valve 204 and controls the scavenging pipeline 206 to the sealing
It is passed through purge gas in space, sweeps up byproduct of reaction particle, then the vacuum pump is controlled by first pneumatic operated valve 203
205 pairs of sealing spaces vacuumize, to extract the byproduct of reaction particle in sealing space out.Scavenging pipeline 206 is right
The purging of byproduct of reaction particle is so that the byproduct of reaction particle for being deposited on the fire door cap surface is blown afloat in sealing space,
Extract the byproduct of reaction particle of more fire door cap surfaces when vacuumizing the vacuum unit to sealing space.
In a specific embodiment, the purge gas source is source nitrogen.In other specific embodiments, institute
The gas source that purge gas source may be other stabilizing gas such as helium gas source is stated, user, which can according to need, voluntarily to be adjusted.
Please referring to Fig. 3 is vacuum unit, the connection relationship diagram of control unit described in present embodiment, described
Cleaning plant further includes control unit, described control unit and be set between the vacuum pump 305 and sealing cover 301 first
Pneumatic operated valve 303 is connected, and controls the opening and closing of first pneumatic operated valve 303, to control the vacuum pump 305 to sealing space
It vacuumizes.In a specific embodiment, to include that main controller 306 and PLC interconnected are programmable patrol described control unit
Controller 304 is collected, the PLC programmable logic controller (PLC) 304 is connected to first pneumatic operated valve 303.In a kind of specific implementation
In mode, main controller 306 gets control instruction by external equipment, at this point, the main controller 306 is connected to external equipment,
Obtain the instruction that user is provided by external equipment.After the main controller 306 gets instruction, instruction is communicated to the PLC
Programmable logic controller (PLC) 304 controls first pneumatic operated valve 303 according to instruction by the PLC programmable logic controller (PLC) 304
Opening and closing.
In other specific embodiments, when the cleaning plant does not include control unit, user can be by manual
The opening and closing for controlling the first pneumatic operated valve 303 vacuumizes sealing space to control vacuum pump 305, or passes through control vacuum pump
305 whether powering on, to control the evacuated state of the vacuum pump 305.
Please referring to Fig. 4 is vacuum unit, the connection relationship of purge unit and control unit described in present embodiment
Schematic diagram.The vacuum pump 405 is connected to sealing cover 401 by the pipeline 402, and described 406 one end of scavenging pipeline is connected to
Sealing cover 401, the other end is connected to purge gas source.The vacuum pump 405 and scavenging pipeline 406 are connected to sealing space,
Sealing space is acted on.The first pneumatic operated valve 403, scavenging pipeline are provided between the vacuum pump 405 and sealing cover 401
The second pneumatic operated valve 404 is provided between 406 and sealing cover 401, first pneumatic operated valve 403 and the second pneumatic operated valve 404 are all connected with
To the PLC programmable logic controller (PLC) 407 of described control unit.
Described control unit further includes main controller 408, is instructed for issuing to the PLC programmable logic controller (PLC) 407,
Control the opening and closing of two pneumatic operated valves.In a specific embodiment, the main controller 408 is connected to external equipment, described outer
Equipment is connect for controlling for user the cleaning plant.In this specific embodiment, main controller 408 receives external
The instruction of equipment, and two pneumatic operated valves are transferred to by PLC programmable logic controller (PLC) 407, the opening and closing of the pneumatic operated valve is controlled,
To control, the vacuum pump 405 vacuumizes sealing space and the scavenging pipeline 406 is to the purging of sealing space.
Please referring to Fig. 5 is schematic diagram when stove face plate cleaning plant described in present embodiment is installed on stove face plate,
When boiler tube handles wafer 510, the wafer 510 is placed in cassette 511, is held by cassette pedestal 512, is put into institute
It states in the cavity 501 of boiler tube, and passes through stove face plate described in 505 rotary closing of rotary shaft.
Stove face plate includes lid 503 and pedestal 504, and the surface towards reaction chamber of lid 503 is provided with sealing ring
502, and the lid 503 is mounted on the pedestal 504, described 504 one end of pedestal is installed to the rotary shaft 505, can be around
The rotary shaft 505 rotates on the face for be parallel to cavity outlet, and the lid 503 can follow pedestal 504 to rotate.Work as rotation
The pedestal 504, when opening the stove face plate, the sealing ring 502 that is arranged on the surface towards reaction chamber of the lid 503
The sealing cover 506 is touched, pressure is covered by the sealing cover 506, forms sealing space 514 on 503 surface of lid.Institute
It states vacuum pump 516 and the sealing cover 506 is connected to by pipeline 513, so that the sealing space 514 is connected to, for close
It seals space 514 and carries out vacuum pumping.The scavenging pipeline 515 is connected to the sealing cover 506, to be connected to the sealing
Space 514, for carrying out purge operations to the sealing space 514.
The vacuum pump 516 is controlled vacuumizing for sealing space 514 by the first pneumatic operated valve 507, the scavenging pipeline 515
Vacuumizing for sealing space 514 is controlled by the second pneumatic operated valve 517.First pneumatic operated valve 507 and the second pneumatic operated valve 517 connect
It is connected to the PLC programmable logic controller (PLC) 508 of described control unit.The PLC programmable logic controller (PLC) 508 is according to main controller
The instruction of 509 external equipments received controls the opening and closing of two pneumatic operated valves.
Above-mentioned stove face plate cleaning plant and semiconductor processing equipment are due to sealing unit and vacuum unit, Ke Yitong
It crosses extraction vacuum to extract the byproduct of reaction particle on fire door cap surface, reduces byproduct of reaction particle and blown by air-flow
It falls, fall a possibility that forming marginal particle on the wafer of cassette.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of stove face plate cleaning plant, which is characterized in that including sealing unit and vacuum unit, the vacuum unit connects
It is connected to the sealing unit, wherein
The sealing unit includes sealing cover, for covering stove face plate towards the surface of boiler tube cavity, and in the stove face plate
Towards boiler tube cavity surface formed sealing space；
The vacuum unit includes vacuum pump, and is connected to sealing cover by pipeline, so that it is connected to the sealing space, it is right
The sealing space is vacuumized.
2. stove face plate cleaning plant according to claim 1, which is characterized in that the sealing unit further includes sealing ring, peace
It is close with the surface towards reaction chamber that covers the stove face plate mounted in the surface towards reaction chamber of the stove face plate
Closure contacts form sealing space in the fire door cap surface.
3. stove face plate cleaning plant according to claim 1, which is characterized in that the vacuum unit further includes first pneumatic
Valve is set on the pipeline between the vacuum pump and the sealing unit.
4. stove face plate cleaning plant according to claim 3, which is characterized in that the stove face plate cleaning plant further includes purging
Pipeline, one end are connected to the sealing space, and the other end is for being connected to purge gas source, for leading into the sealing space
Enter purge gas.
5. stove face plate cleaning plant according to claim 4, which is characterized in that it is pneumatic that the scavenging pipeline is connected to one second
Valve controls the scavenging pipeline to the purging of sealing space by second pneumatic operated valve.
6. stove face plate cleaning plant according to claim 5, which is characterized in that the stove face plate cleaning plant further includes control
Unit is connected to first pneumatic operated valve and the second pneumatic operated valve, for controlling the logical of first pneumatic operated valve and the second pneumatic operated valve
It is disconnected.
7. stove face plate cleaning plant according to claim 6, which is characterized in that described control unit includes main controller and PLC
Programmable logic controller (PLC), and the main controller is connected to first pneumatic operated valve by the PLC programmable logic controller (PLC)
With the second pneumatic operated valve.
8. a kind of semiconductor processing equipment characterized by comprising
Cleaning plant, including sealing unit and vacuum unit, the vacuum unit are connected to the sealing unit, wherein
The sealing unit includes sealing cover, for covering the region for clearance of reaction board, and in the reaction board
Region for clearance forms sealing space；
The vacuum unit includes vacuum pump, is connected to the sealing unit by pipeline, and for being connected to the sealing
Space vacuumizes the sealing space；
Board, including reaction chamber and chamber door are reacted, wherein the chamber door includes rotary shaft, and the chamber door can be around institute
Rotary shaft is stated in the plane internal rotation for being parallel to reaction chamber opening, and the chamber door is after the rotary shaft Unscrew,
The sealing cover is covered in surface of the chamber door towards reaction chamber, in the chamber door towards the surface shape of reaction chamber
At sealing space.
9. semiconductor processing equipment according to claim 8, which is characterized in that the sealing unit further includes sealing ring, and
The sealing ring is installed on surface of the chamber door towards reaction chamber, and covers the chamber door towards reaction chamber
The sealing cover on surface contacts, and forms sealing space towards the surface of reaction chamber in the chamber door.
10. semiconductor processing equipment according to claim 8, which is characterized in that the vacuum unit further includes the first gas
Dynamic valve, is set on the pipeline between the vacuum pump and the sealing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821278310.XU CN208674078U (en) | 2018-08-08 | 2018-08-08 | Stove face plate cleaning plant and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821278310.XU CN208674078U (en) | 2018-08-08 | 2018-08-08 | Stove face plate cleaning plant and semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208674078U true CN208674078U (en) | 2019-03-29 |
Family
ID=65837373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821278310.XU Expired - Fee Related CN208674078U (en) | 2018-08-08 | 2018-08-08 | Stove face plate cleaning plant and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208674078U (en) |
-
2018
- 2018-08-08 CN CN201821278310.XU patent/CN208674078U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190329 |