CN208653281U - A kind of ultra-thin heat pipe that capillary structure is set - Google Patents

A kind of ultra-thin heat pipe that capillary structure is set Download PDF

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Publication number
CN208653281U
CN208653281U CN201820971331.3U CN201820971331U CN208653281U CN 208653281 U CN208653281 U CN 208653281U CN 201820971331 U CN201820971331 U CN 201820971331U CN 208653281 U CN208653281 U CN 208653281U
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liquid
ultra
capillary structure
bar shaped
heat conducting
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CN201820971331.3U
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罗合云
龙树军
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Shenzhen Leishi Thermal Management Technology Co.,Ltd.
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STONEPLUS THERMAL MANAGEMENT TECHNOLOGY Ltd
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Abstract

The utility model relates to a kind of ultra-thin heat pipes that capillary structure is arranged, including heat conducting pipe, the bar shaped deck being evenly distributed is fixedly installed on the inner wall of the heat conducting pipe, the bar shaped deck is internally provided with water guide core, capillary copper powder layer is equipped on the inner wall of the heat conducting pipe and between two adjacent bar shaped decks, middle part on the inside of the bar shaped deck is fixedly installed with segmentation ring, liquid-sucking core is provided in the segmentation ring, the left end on the outside of the liquid-sucking core is fixedly installed with the feeler being evenly distributed.The ultra-thin heat pipe of above-mentioned setting capillary structure, uniform feeler is distributed on the outside of liquid-sucking core, the feeler extends everywhere outward, liquid after liquefaction can be imported to the inside of liquid-sucking core, circulating and evaporating again utilizes, while the liquid of the water guide in-core of heat conducting pipe inside left end, can directly evaporate utilization, which realizes the rapid evaporation of liquid by increasing capillary structure.

Description

A kind of ultra-thin heat pipe that capillary structure is set
Technical field
The utility model relates to heat pipe technical field, specially a kind of ultra-thin heat pipe that capillary structure is set.
Background technique
With the continuous improvement of scientific and technological level, the field of heat pipe research and application also will constantly be widened, new energy Exploitation, electronic device chip cooling technique, laptop CPU cooling and high power transistor, thyristor, circuit control panel Deng cooling, the exploitation of the efficient heat transfer mass transfer apparatus in the fields such as chemical industry, power, metallurgy, glass, light industry, ceramics, all will promote The further development of hot pipe technique, heat pipe are a kind of heat conducting elements that heating conduction is high, using the working medium temperature difference heat absorption and put Heat exchange principle, so that the heat transference efficiency of itself is higher by tens times than the fine copper of same material, so that its application range It is wider.
With the development of technological level, the requirement for heat pipe heat dissipation performance is also higher and higher, current ultra-thin thermal conductivity It is all one layer of capillary copper powder to be condensed and be flowed back to steam thermal energy on the inner wall that pipe increases, such thermal energy alternative list One, treatment effeciency also will be low, so a kind of ultra-thin heat pipe of setting capillary structure is provided to solve above-mentioned be previously mentioned The problem of.
Utility model content
In view of the above situation, it is necessary to a kind of ultra-thin heat pipe that capillary structure is arranged be provided, have increase capillary structure The advantages of improving thermal energy conversion efficiency, solving on the inner wall that current ultra-thin heat pipe increases all is that one layer of capillary copper powder comes to steaming What vapour thermal energy was condensed and flowed back, such thermal energy alternative is single, the problem that treatment effeciency also will be low.
A kind of ultra-thin heat pipe that capillary structure is arranged, including heat conducting pipe are fixedly installed on the inner wall of the heat conducting pipe The bar shaped deck being evenly distributed, the bar shaped deck are internally provided with water guide core, on the inner wall of the heat conducting pipe and are located at Capillary copper powder layer is equipped between two adjacent bar shaped decks, the middle part on the inside of the bar shaped deck is fixedly installed with segmentation Ring is provided with liquid-sucking core in the segmentation ring, and the left end on the outside of the liquid-sucking core is fixedly installed with the feeler being evenly distributed, described Right end on the outside of liquid-sucking core offers the through-hole being evenly distributed, and the right on the outside of the heat conducting pipe, which is fixedly installed with, to be spaced substantially equidistant Cooling fin.
Preferably, the liquid-sucking core is hollow form, and the length of the liquid-sucking core is greater than the length of segmentation ring.
Preferably, the both ends of the liquid-sucking core are fixedly connected with the two sidewalls of heat conducting pipe respectively.
Preferably, the length of the feeler is greater than the length of liquid-sucking core to distance between bar shaped deck.
Preferably, the thickness of the capillary copper powder layer is not less than 0.1 millimeter.
Preferably, the inside of heat conducting pipe is sequentially divided into evaporating area and condensing zone by the segmentation ring from left to right, wherein Divide the cold and hot transition region that the space of ring an or so centimeters is formed.
Preferably, the water guide core is constituted using fibrage or embroidery net, the bar shaped deck by be open it is horizontal away from The horizontal distance of its bottom wall of descriscent gradually increases.
It is above-mentioned the utility model has the advantages that
1, the ultra-thin heat pipe of the setting capillary structure, by the left end on the outside of the close heat conducting pipe of heat source, in liquid-sucking core Liquid heat absorption and evaporate, steam carry vaporization thermal energy intracavitary right end that can be flowed to inside it in liquid-sucking core, steam through lead to The inside of liquid-sucking core is discharged in hole, and steam can be in contact with bar shaped deck, water guide core and the capillary copper powder layer on thermally conductive inside pipe wall, steams Vapour, which will liquefy, heat exchange and releases thermal energy and completes transfer duty, and the liquid of condensation is using water guide core and capillary copper powder layer It aspirates the left end inside strength or gravity reflux to heat conducting pipe and enters next working cycles, wherein the water guide core in the process, It can accelerate liquid reflux, then by being used cooperatively with capillary copper powder layer, increase liquid reflux and liquefied efficiency again, And also improve the speed of heat dissipation.
2, the ultra-thin heat pipe of the setting capillary structure is distributed uniform feeler on the outside of liquid-sucking core, and the feeler is outside Side extends everywhere, and the liquid after liquefaction can be imported to the inside of liquid-sucking core, and circulating and evaporating again utilizes, while in heat conducting pipe The liquid of the water guide in-core of portion left end, can directly evaporate utilization, and which realizes the fast of liquid by increasing capillary structure Speed evaporation.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model;
Fig. 2 is sectional structure chart on the left of the utility model structure;
Fig. 3 is part-structure enlarged drawing in the utility model Fig. 2.
In figure: 1 heat conducting pipe, 2 bar shaped decks, 3 water guide cores, 4 capillary copper powder layers, 5 segmentation rings, 6 liquid-sucking cores, 7 feelers, 8 lead to Hole, 9 cooling fins.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation The ultra-thin heat pipe of example, setting capillary structure a kind of to the utility model is further elaborated.It should be appreciated that this place The specific embodiment of description only to explain the utility model, is not used to limit the utility model.
Fig. 1-3, a kind of ultra-thin heat pipe that capillary structure is set, including heat conducting pipe 1 are please referred to, heat conducting pipe 1 is using ultra-thin Heat pipe, be fixedly installed with the bar shaped deck 2 being evenly distributed on the inner wall of heat conducting pipe 1, bar shaped deck 2 is same with heat conducting pipe 1 One material is made, and bar shaped deck 2 is gradually increased from the horizontal distance being open to the horizontal distance of its bottom wall, bar shaped deck 2 it is interior Portion is provided with water guide core 3, and water guide core 3 is made of heat resistance fiber, and water guide core 3 is constituted using fibrage or embroidery net, thermally conductive Capillary copper powder layer 4, the thickness of capillary copper powder layer 4 are equipped on the inner wall of pipe 1 and between two adjacent bar shaped decks 2 Not less than 0.1 millimeter, the middle part of 2 inside of bar shaped deck is fixedly installed with segmentation ring 5, divides ring 5 for the inside of heat conducting pipe 1 by a left side It is sequentially divided into evaporating area and condensing zone to the right, wherein the cold and hot transition region that the space of segmentation 5 or so one centimeters of ring is formed, point It cuts and is provided with liquid-sucking core 6 in ring 5, liquid-sucking core 6 is made of fibrous material, and liquid-sucking core 6 is hollow form, and the length of liquid-sucking core 6 is big In the length of segmentation ring 5, the both ends of liquid-sucking core 6 are fixedly connected with the two sidewalls of heat conducting pipe 1 respectively, the left end in 6 outside of liquid-sucking core It is fixedly installed with the feeler 7 being evenly distributed, the material of feeler 7 is consistent with the material of liquid-sucking core 6, and the length of feeler 7 is greater than imbibition Core 6 is to the length of distance between bar shaped deck 2, and the right end in the outside of liquid-sucking core 6 offers the through-hole 8 being evenly distributed, outside heat conducting pipe 1 The right of side is fixedly installed with the cooling fin 9 being spaced substantially equidistant, and cooling fin 9 can increase the radiating efficiency of heat conducting pipe 1, pass through heat The left end in 1 outside of the close heat conducting pipe in source, liquid heat absorption in liquid-sucking core 6 and evaporate, steam, which carries, vaporizes thermal energy in liquid-sucking core 6 It is interior it is intracavitary can flow to its internal right end, the inside of liquid-sucking core 6 is discharged in steam via through holes 8, and steam can be with 1 inner wall of heat conducting pipe On bar shaped deck 2, water guide core 3 and capillary copper powder layer 4 be in contact, steam, which will liquefy, heat exchange and releases thermal energy and completes biography Hot task, the liquid of condensation is using inside the suction strength or gravity reflux to heat conducting pipe 1 of water guide core 3 and capillary copper powder layer 4 Left end enter next working cycles, the wherein water guide core 3 in the process can accelerate liquid reflux, then by with capillary Copper powder layer 4 is used cooperatively, increase liquid reflux and liquefied efficiency again, and also improves the speed of heat dissipation, also, The outside of liquid-sucking core 6 is distributed uniform feeler 7, which extends everywhere outward, the liquid after liquefaction can be imported The inside of liquid-sucking core 6, circulating and evaporating again utilizes, while the liquid in the water guide core 3 of 1 inside left end of heat conducting pipe, Ke Yizhi The evaporation connect utilizes, and which realizes the rapid evaporation of liquid by increasing capillary structure.
In conclusion the ultra-thin heat pipe of the setting capillary structure, by the left end in close 1 outside of heat conducting pipe of heat source, Liquid in liquid-sucking core 6 absorbs heat and evaporates, and steam carries vaporization thermal energy intracavitary right side that can be flowed to inside it in liquid-sucking core 6 The inside of liquid-sucking core 6 is discharged in end, steam via through holes 8, and steam can be with bar shaped deck 2, water guide core 3 and the hair on 1 inner wall of heat conducting pipe Thin copper powder layer 4 is in contact, and steam, which will liquefy, heat exchange and releases thermal energy and complete transfer duty, and the liquid of condensation is using leading The suction strength or the left end inside gravity reflux to heat conducting pipe 1 of water core 3 and capillary copper powder layer 4 enter next working cycles, The wherein water guide core 3 in the process, can accelerate liquid reflux, then by being used cooperatively with capillary copper powder layer 4, increasing again Add liquid reflux and liquefied efficiency, and also improves the speed of heat dissipation.
Also, the ultra-thin heat pipe of the setting capillary structure, the outside of liquid-sucking core 6 are distributed uniform feeler 7, the feeler 7 extend everywhere outward, and the liquid after liquefaction can be imported to the inside of liquid-sucking core 6, and circulating and evaporating again utilizes, and lead simultaneously Liquid in the water guide core 3 of 1 inside left end of heat pipe, can directly evaporate utilization, and which is realized by increasing capillary structure The rapid evaporation of liquid.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model Limitation be not intended to limit the utility model although the utility model has been disclosed with preferred embodiment as above, it is any ripe Professional and technical personnel is known, is not being departed within the scope of technical solutions of the utility model, when in the technology using the disclosure above Hold the equivalent embodiment for being modified or being modified to equivalent variations, but all without departing from technical solutions of the utility model Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still It is within the scope of the technical solutions of the present invention.

Claims (7)

1. a kind of ultra-thin heat pipe that capillary structure is arranged, including heat conducting pipe (1), it is characterised in that: the heat conducting pipe (1) it is interior The bar shaped deck (2) being evenly distributed is fixedly installed on wall, being internally provided with water guide core (3) for the bar shaped deck (2) is described Capillary copper powder layer (4), the item are equipped on the inner wall of heat conducting pipe (1) and between two adjacent bar shaped decks (2) Middle part on the inside of shape deck (2) is fixedly installed with segmentation ring (5), is provided with liquid-sucking core (6), the suction in the segmentation ring (5) Left end on the outside of wick-containing (6) is fixedly installed with the feeler (7) being evenly distributed, and the right end on the outside of the liquid-sucking core (6) offers point The uniform through-hole of cloth (8), the right on the outside of the heat conducting pipe (1) are fixedly installed with the cooling fin (9) being spaced substantially equidistant.
2. the ultra-thin heat pipe of setting capillary structure as described in claim 1, it is characterised in that: during the liquid-sucking core (6) is Empty shape, the length of the liquid-sucking core (6) are greater than the length of segmentation ring (5).
3. the ultra-thin heat pipe of setting capillary structure as described in claim 1, it is characterised in that: the two of the liquid-sucking core (6) End is fixedly connected with the two sidewalls of heat conducting pipe (1) respectively.
4. the ultra-thin heat pipe of setting capillary structure as described in claim 1, it is characterised in that: the length of the feeler (7) Greater than liquid-sucking core (6) to the length of distance between bar shaped deck (2).
5. the ultra-thin heat pipe of setting capillary structure as described in claim 1, it is characterised in that: the capillary copper powder layer (4) Thickness be not less than 0.1 millimeter.
6. the ultra-thin heat pipe of setting capillary structure as described in claim 1, it is characterised in that: the segmentation ring (5) will lead The inside of heat pipe (1) is sequentially divided into evaporating area and condensing zone from left to right, wherein the space of one centimeters of segmentation ring (5) left and right Form cold and hot transition region.
7. the ultra-thin heat pipe of setting capillary structure as described in claim 1, it is characterised in that: the water guide core (3) uses Fibrage or embroidery net are constituted, and the bar shaped deck (2) is gradually increased from the horizontal distance being open to the horizontal distance of its bottom wall Add.
CN201820971331.3U 2018-06-23 2018-06-23 A kind of ultra-thin heat pipe that capillary structure is set Active CN208653281U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820971331.3U CN208653281U (en) 2018-06-23 2018-06-23 A kind of ultra-thin heat pipe that capillary structure is set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820971331.3U CN208653281U (en) 2018-06-23 2018-06-23 A kind of ultra-thin heat pipe that capillary structure is set

Publications (1)

Publication Number Publication Date
CN208653281U true CN208653281U (en) 2019-03-26

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Country Status (1)

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CN (1) CN208653281U (en)

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Address after: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen Leishi Thermal Management Technology Co.,Ltd.

Address before: 518000 room 1204, 12 / F, block C, building 2, Shenzhen software industry base, Keyuan Road, Nanshan street, Nanshan District, Shenzhen City, Guangdong Province

Patentee before: STONEPLUS THERMAL MANAGEMENT TECHNOLOGIES Ltd.