CN208637411U - A kind of gravity reflux plume formula chip radiator - Google Patents
A kind of gravity reflux plume formula chip radiator Download PDFInfo
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- CN208637411U CN208637411U CN201820865726.5U CN201820865726U CN208637411U CN 208637411 U CN208637411 U CN 208637411U CN 201820865726 U CN201820865726 U CN 201820865726U CN 208637411 U CN208637411 U CN 208637411U
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- plume
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Abstract
The utility model discloses a kind of gravity reflux plume formula chip radiators, it includes the plume and fin with airtight vacuum chamber, fin is mounted on plume, phase-change working substance is filled in plume, the bottom surface of vacuum chamber is the heating surface to fit with chip, is evaporated after phase-change working substance heat absorption, is condensed into liquid by the air-cooled heat exchange of fin, it flows back by self gravity along vacuum chamber inner wall, completes a cyclic process.The utility model is using safety and environmental protection and the phase-change working substance compatible with electronic equipment is as heat-transfer working medium, simply to evaporate return-flow structure, leakage security risk is prevented, it is safe and reliable to operation, and radiating efficiency is high, simplify heat spreader structures, the utility model only needs to complete using simple machining apparatus, welding equipment and vacuum pumping loading equipment, compared to existing heat-pipe radiator due to needing to compare using sintering process, using agglomerating plant with wick structure, so that cost of manufacture substantially reduces, it is suitable for large-scale application.
Description
Technical field
The utility model relates to a kind of chip radiator more particularly to a kind of gravity reflux plume formula chip radiators.
Background technique
Currently, PC and server etc. calculate the air-cooled radiating device of communication apparatus, heat pipe fin formula is mostly used
Heat-pipe radiator, by the development of many years, heat-pipe radiator is light-weight with its, good heat dissipation effect, and with large-scale production, at
This advantage constantly declined becomes the only selection of wind-cooling heat dissipating.
Heat-pipe radiator needs to be sintered capillary structure, and require after vacuumizing, fills to realize efficient heat transfer characteristic
Fill antifreeze working media (generally water or ethylene glycol mixture).Heat-pipe radiator reduces cost by large-scale production, still
The manufacture craft of heat pipe is complex, and production equipment and artificial input cost are high, and antifreeze working media is water or ethylene glycol,
If leakage, equipment can be caused badly damaged, therefore there are security risks.
Recently, as computer and server performance rise violently, single-machine capacity density is in cumulative year after year trend, and air-cooled radiator
It is limited to that computer server space is limited, makes the promotion of its heat dissipation performance that can not match with the increase of plant capacity.Liquid-cooling heat radiation
Device is a kind of radiating mode that can be realized good heat radiating and energy-saving effect.Liquid cooling heat radiator includes cold plate, spray and immersion
Liquid cooling.Wherein, cold plate is in such a way that liquid cooling plate is bonded chip, and antifreezing liquid working medium flows in cold plate, by chip heat
It takes external heat-exchanging to, still, contains water in antifreezing liquid working medium, there is security risks to electronic equipment, so cold plate radiates
The seal request of device is high, so that server is very expensive, sprays the working medium of liquid cooling using the thermally conductive oils compatible with electronic equipment
Substance needs to solve equipment sealing problem under the premise of not changing existing server architecture, prevents working medium from dissipating and overflows.Immersion
Liquid cooling is a kind of emerging liquid cooling mode, needs to change existing server architecture, changes larger, immersion to existing computer room form
Liquid cooling technology is in the technical perfection rising stage.
Utility model content
That the purpose of the utility model is to provide a kind of structures is simple, at low cost, radiating efficiency is high, it is reliable for operation, without safety
The gravity reflux plume formula chip radiator of hidden danger.
The above-mentioned purpose of the utility model can be realized by following measures: a kind of gravity reflux plume formula chip cooling
Device, it is characterised in that: it includes the plume and fin with airtight vacuum chamber, and the fin is mounted on the plume,
Phase-change working substance is filled in the plume, the bottom surface of the vacuum chamber is the heating surface to fit with chip, and phase-change working substance is inhaled
It is evaporated after heat, is condensed into liquid by the air-cooled heat exchange of fin, flows back by self gravity along vacuum chamber inner wall, complete one and follow
Ring process.
The utility model is using safety and environmental protection and the phase-change working substance compatible with electronic equipment is as heat-transfer working medium, is simple
Return-flow structure is evaporated, leakage security risk has been prevented, it is safe and reliable to operation, and radiating efficiency is high, simplifies heat spreader structures, this
Utility model only needs to complete using simple machining apparatus, welding equipment and vacuum pumping loading equipment, compares
In existing heat-pipe radiator due to needing to compare using sintering process, using agglomerating plant with wick structure, so that system
It is substantially reduced as cost, is suitable for large-scale application.
As a kind of preferred embodiment of the utility model, the phase-change working substance uses perfluor hexanone, molecular formula
C6F12O, 48 DEG C of boiling point, can also use modified paraffin by -108 DEG C of fusing point；If plume can bear higher pressure, may be used also
To select the nontoxic low-temperature refrigerant of the safety and environmental protections such as heptafluoro-propane, R134a and R410a, these working medium are all compatible with electronic component,
Without concern about disclosure accident, guarantee the stability of electronic component.
The filling weight of phase-change working substance described in the utility model accounts for the 20%~95% of the plume volume.
As a kind of embodiment of the utility model, the plume is mainly by a cylinder-shaped open tubular column, cover board and use
In the substrate composition being bonded with chip, the cover board is set to the upper end of open tubular column, and the lower end that the substrate is set to open tubular column is formed
The airtight vacuum chamber, the fin are several pieces and are sleeved on the open tubular column that each fin is along the height side of open tubular column
To arrangement.
As the another embodiment of the utility model, the plume is mainly by the closed open tubular column of more roots and tops and tool
It is made of the pedestal of cavity, the open tubular column and pedestal communicate, close described in formation inside the cavity and open tubular column of the pedestal
Vacuum chamber is closed, the bottom surface of the pedestal is the substrate for being bonded with chip, and the fin is several pieces and is sleeved on the sky
On stem, each fin is arranged along the short transverse of open tubular column.
As a kind of improvement of the utility model, several vertical grooves are equipped on the inner wall of the open tubular column, it can be with
Increase heat exchange area and flow back convenient for phase-change working substance, each groove is along hollow column wall circumference parallel arrangement.
As a kind of preferred embodiment of the utility model, pit is distributed on the inner surface of the substrate.It is described recessed
The depth in hole is 0.2~1.0mm, and aperture is 0.1~1.0mm, and the phase-change working substance of liquid is relatively independent in pit, can heat
Moment reaches higher temperature, to improve liquid superheat to accelerate phase transformation, therefore can reinforced transformation effect.
In order to overcome defect present in existing liquid cooling heat radiator structure, as a kind of improvement of the utility model, in institute
State and be equipped at least one cooling coil in open tubular column, be filled with coolant liquid in the cooling coil, the cooling coil mainly by
Coil section, the inlet tube for accessing coolant liquid and for by outlet tube group derived from the coolant liquid after exchanging heat with phase-change working substance
At the coil section is connected with inlet tube, outlet tube, and the coil section is not contacted with the inner wall of vacuum chamber, institute
It states inlet tube and outlet tube and is pierced by vacuum chamber respectively for connecting external liquid cooling pipeline；It is evaporated after phase-change working substance heat absorption, by
The air-cooled heat exchange of fin, realizes heat dissipation low in calories, simultaneously/or cooling coil flowed through by coolant liquid, and it mutually exchanges work in plume
The heat dissipation that heat realizes high heat is taken away in matter heat exchange.
The utility model is similar to liquid cooling plate mode, Xiang Biangong using air-cooled phase-change heat-exchange and liquid cooling heat exchange complex form
Matter is the low boiling working fluid compatible with electronic equipment, when chip heating power is small or when cooling pump breaks down, depends merely on wind
Cold heat exchange can solve heat transfer problem or support a period of time, so that data save or system not shutdown maintenance；When chip is sent out
When heat increases, blower can be closed, opens cooling pump, coolant liquid flows through inside cooling coil, the heat in plume is passed through cold
But liquid band is walked.Or blower can not also be closed, while exchanging heat using air-cooled phase-change heat-exchange and liquid cooling, system stability more preferably, takes
Business device or computer do not have security risk, relative to simple air-cooled and cold plate scheme, the good energy saving performance of system.
As a kind of improvement of the utility model, the inlet tube of the cooling coil and the nozzle of outlet tube are located at server
On cabinet, between external liquid cooling pipeline and inlet tube and the nozzle of outlet tube use fast plug form, therefore, there is no need to because
Change existing server architecture for liquid cooling structure, system installation is maintainable good.
Coolant liquid described in the utility model is perfluor hexanone or high-flash conduction oil, and silicone oil can be used in high-flash conduction oil
Deng.If the pressure bearing and seal of vacuum chamber allows, phase-change working substance and coolant liquid are also possible to heptafluoro-propane, R134a and R410a
Equal low-temperature safeties environmental protection working medium.
Compared with prior art, the utility model has following significant effect:
(1) the utility model is using safety and environmental protection and the phase-change working substance compatible with electronic equipment is as heat-transfer working medium, is simple
Evaporation return-flow structure, prevented leakage security risk, it is safe and reliable to operation.
(2) the utility model radiating efficiency is high, simplifies heat spreader structures, the utility model is only needed using simple machine
Process equipment, welding equipment and vacuum pumping loading equipment can complete, compared to existing heat-pipe radiator due to hair
Thin cored structure and need to compare using sintering process, using agglomerating plant so that cost of manufacture substantially reduces, suitable for answering on a large scale
With.
(3) the utility model is exchanged heat complex form using air-cooled phase-change heat-exchange and liquid cooling, system stability more preferably, server
Or computer does not have security risk, relative to simple air-cooled and cold plate scheme, energy saving of system is more preferable.
(4) the utility model is equipped with several vertical grooves on the inner wall of open tubular column, can increase heat exchange area and be convenient for
Phase-change working substance reflux.
(5) be distributed on the inner surface of the substrate of the utility model can reinforced transformation effect pit.
Detailed description of the invention
Utility model is described in further detail in the following with reference to the drawings and specific embodiments.
Fig. 1 is the schematic perspective view of the utility model embodiment 1；
Fig. 2 is the side view of the utility model embodiment 1；
Fig. 3 is the assembling structure schematic diagram of the plume of the utility model embodiment 1；
Fig. 4 is the structural schematic diagram of the substrate of the utility model embodiment 1；
Fig. 5 is the schematic perspective view of the utility model embodiment 2；
Fig. 6 is the side view of the utility model embodiment 2；
Fig. 7 is the schematic perspective view of the utility model embodiment 3；
Fig. 8 is the side view of the utility model embodiment 3；
Fig. 9 is the assembling structure schematic diagram of the utility model embodiment 3.
Specific embodiment
Embodiment 1
It as shown in figures 1-4, is a kind of gravity reflux plume formula chip radiator of the utility model, it includes with closed
The plume 1 and fin 2 of vacuum chamber, plume 1 are made of red copper material or aluminium, and fin 2 is made of aluminium, and plume 1 is main
It to be made of a cylinder-shaped open tubular column 3, cover board 4 and substrate 5 for being bonded with chip, cover board 4 is welded on the upper of open tubular column 3
End, the lower end that substrate 5 is welded on open tubular column 3 form airtight vacuum chamber, and substrate 5 is the bottom surface of vacuum chamber, are and core
The heating surface that piece fits, fin 2 are several pieces and are sleeved on open tubular column 3 that each fin 2 is parallel along the short transverse of open tubular column 3
Arrangement.Phase-change working substance is filled in open tubular column 3, phase-change working substance is packed into open tubular column 3 by the mouth 12 that fills welded on cover board 4
In.The 20%~95% of 3 volume of filling weight duty stem of phase-change working substance.It is evaporated after phase-change working substance heat absorption, it is air-cooled by fin 2
Heat exchange is condensed into liquid, flows back by self gravity along vacuum chamber inner wall, completes a cyclic process.
After plume vacuumizes, phase-change working substance, phase-change working substance first choice perfluor hexanone, molecular formula C6F12O, fusing point -108 are filled
DEG C, 48 DEG C of boiling point, with freeze proof, easily evaporation, the advantages such as boiling pressure is low, to plume structural strength, seal request is all lower, and
Performance is poor unlike cryogenic fluid；In other embodiments, phase-change working substance can also use modified paraffin.If plume can be held
By higher pressure, the nontoxic low-temperature refrigerant of the safety and environmental protections such as heptafluoro-propane, R134a and R410a, these working medium can also be selected
It is all compatible with electronic component, prevent leakage security risk, guarantees the stability of electronic component, it is safe and reliable to operation.
Several vertical grooves 6 are equipped on the inner wall of open tubular column 3, each groove 6 is along hollow column wall circumference parallel arrangement.
Groove can increase heat exchange area and flow back convenient for working medium.
Pit 8 is distributed on the inner surface of substrate 5.The depth of pit 8 is 0.2~1.0mm, and cross section is round or other
Various shape, diameter are 0.1~1.0mm, and the phase-change working substance of liquid is relatively independent in pit, can reach higher in heating moment
Temperature, to improve liquid superheat to accelerating phase transformation, therefore can reinforced transformation effect.Annular is equipped in the periphery of pit 8
Card slot 9, the lower end of open tubular column 3 is fastened in card slot 9 and is welded and fixed and be linked together, and the edge of substrate 5 is by under open tubular column 3
End edge, to increase the contact surface with chip, improves radiating efficiency along extending outward into one as the extension edge 7 of annular surface.
Embodiment 2
As it can be seen in figures 5 and 6, the present embodiment difference from example 1 is that: plume 1 is mainly closed by more roots and tops
Open tubular column 10 and pedestal 11 with cavity form, open tubular column 10 and pedestal 11 communicate, the cavity and open tubular column 10 of pedestal 11
Inside forms airtight vacuum chamber, and the bottom surface of pedestal 11 is the substrate 5 for being bonded with chip, and fin 2 is several pieces and is sleeved on
On open tubular column 10, short transverse parallel arrangement of each fin 2 along open tubular column 10.
Plume in embodiment 1 is a thicker open tubular column, and the plume of the present embodiment includes more open tubular columns, these
Open tubular column is thinner groove copper pipe, i.e., several vertical grooves is equipped on the inner wall of open tubular column, each groove is along open tubular column
Wall circumference parallel arrangement.Compared with Example 1, although the present embodiment production is more complex, it is available with increase heat-transfer surface
Product and reduction flow resistance, improve heat transfer effect.
Embodiment 3
As shown in figs. 7-9, the present embodiment difference from example 1 is that: in open tubular column 3 be equipped with a cooling
Coil pipe 13 is filled with coolant liquid in cooling coil 13, and coolant liquid is perfluor hexanone or high-flash conduction oil, and high-flash conduction oil can
Using silicone oil etc..Cooling coil 13 is mainly by coil section 14, the inlet tube 15 for accessing coolant liquid and for will be with phase transformation
Outlet tube 16 derived from coolant liquid after working medium heat exchange forms, and coil section 14 is connected with inlet tube 15, outlet tube 16, specifically
It is that cooling coil 13 by inlet tube 15 is coiled into coil section 14 upwards, then encloses in the space included from coil section 14 and stretch downwards
Straight pipe is connected with outlet tube 16 out, and coil section 14 is not contacted with the inner wall of vacuum chamber, and inlet tube 15 and outlet tube 16 divide
It is not pierced by vacuum chamber for connecting external liquid cooling pipeline；It evaporates after phase-change working substance heat absorption, by the air-cooled heat exchange of fin 2, realizes
Heat dissipation low in calories, simultaneously/or cooling coil 13 flowed through by coolant liquid, heat is taken away with phase-change working substance heat exchange in plume 1
Realize the heat dissipation of high heat.
Phase-change working substance in plume is the low boiling working fluid compatible with electronic equipment, can specifically use perfluor hexanone or modification
Paraffin, if the pressure bearing and seal of vacuum chamber allows, phase-change working substance and coolant liquid be also possible to heptafluoro-propane, R134a and
The low-temperature safeties environmental protection working medium such as R410a.
The present embodiment is exchanged heat complex form using air-cooled phase-change heat-exchange and liquid cooling, when chip heating power is small or cooling
When pump breaks down, heat transfer problem or support a period of time can be solved by depending merely on air-cooled heat exchange, so as to data preservation or system
Not shutdown maintenance；When chip calorific value increases, blower can be closed, opens cooling pump, coolant liquid flows through inside cooling coil, will
Heat in plume is taken away by coolant liquid.Or blower can not also be closed, while exchanging heat using air-cooled phase-change heat-exchange and liquid cooling,
More preferably, server or computer do not have security risk to system stability, relative to simple air-cooled and cold plate scheme, the energy conservation of system
Property is more preferable.
The inlet tube 15 of cooling coil 13 and the nozzle of outlet tube 16 are located on machine box for server, external liquid cooling pipeline with
Fast plug form is used between inlet tube 15 and the nozzle of outlet tube 16, therefore, there is no need to change because of liquid cooling structure existing
There is server architecture, system installation is maintainable good.
Heat dissipation effect according to actual needs can also be equipped with two or more cooling coils in open tubular column.
The embodiments of the present invention is without being limited thereto, above content according to the present utility model, according to the general of this field
Logical technological know-how and customary means, under the premise of not departing from the utility model above-mentioned basic fundamental thought, the heat of the utility model
The specific structure of column and fin, phase-change working substance, coolant liquid etc. also have other embodiments.Therefore, the utility model may be used also
To make the modification, replacement or change of other diversified forms, all fall within scope of protection of the utility model.
Claims (10)
1. a kind of gravity reflux plume formula chip radiator, it is characterised in that: it include have airtight vacuum chamber plume and
Fin, the fin are mounted on the plume, and phase-change working substance is filled in the plume, and the bottom surface of the vacuum chamber is
The heating surface to fit with chip evaporates after phase-change working substance heat absorption, liquid is condensed by the air-cooled heat exchange of fin, by itself weight
Power flows back along vacuum chamber inner wall, completes a cyclic process.
2. gravity reflux plume formula chip radiator according to claim 1, it is characterised in that: the phase-change working substance uses
Perfluor hexanone or modified paraffin.
3. gravity reflux plume formula chip radiator according to claim 2, it is characterised in that: the plume is mainly by one
Cylinder-shaped open tubular column, cover board and the substrate composition for being bonded with chip, the cover board is set on the upper end of open tubular column, the base
The lower end that plate is set to open tubular column forms the airtight vacuum chamber, and the fin is several pieces and is sleeved on the open tubular column,
Each fin is arranged along the short transverse of open tubular column.
4. gravity reflux plume formula chip radiator according to claim 2, it is characterised in that: the plume is mainly by more
The closed open tubular column of roots and tops and pedestal composition with cavity, the open tubular column and pedestal communicate, the cavity of the pedestal and
The airtight vacuum chamber is formed inside open tubular column, the bottom surface of the pedestal is the substrate for being bonded with chip, the wing
Piece is several pieces and is sleeved on the open tubular column that each fin is arranged along the short transverse of open tubular column.
5. gravity reflux plume formula chip radiator according to claim 3, it is characterised in that: set in the open tubular column
Have at least one cooling coil, be filled with coolant liquid in the cooling coil, the cooling coil mainly by coil section, be used for
Access coolant liquid inlet tube and for by outlet tube derived from the coolant liquid after exchanging heat with phase-change working substance form, the coiled portion
Divide and be connected with inlet tube, outlet tube, and the coil section is not contacted with the inner wall of vacuum chamber, the inlet tube and out liquid
Pipe is pierced by vacuum chamber for connecting external liquid cooling pipeline respectively；It is evaporated after phase-change working substance heat absorption, it is real by the air-cooled heat exchange of fin
Existing heat dissipation low in calories, simultaneously/or cooling coil flowed through by coolant liquid, heat reality is taken away with phase-change working substance heat exchange in plume
The heat dissipation of existing high heat.
6. gravity reflux plume formula chip radiator according to claim 5, it is characterised in that: in the open tubular column
Wall is equipped with several vertical grooves, and each groove is along hollow column wall circumference parallel arrangement.
7. gravity reflux plume formula chip radiator according to claim 6, it is characterised in that: the inner surface of the substrate
On be distributed with can reinforced transformation effect pit, the depth of the pit is 0.2~1.0mm, and aperture is 0.1~1.0mm.
8. gravity reflux plume formula chip radiator according to claim 7, it is characterised in that: the phase-change working substance fills
Loading amount accounts for the 20%~95% of the plume volume.
9. gravity reflux plume formula chip radiator according to claim 8, it is characterised in that: the cooling coil into
The nozzle of liquid pipe and outlet tube is located on machine box for server, adopts between external liquid cooling pipeline and inlet tube and the nozzle of outlet tube
With fast plug form.
10. gravity reflux plume formula chip radiator according to claim 5, it is characterised in that: the coolant liquid is complete
Fluorine hexanone or high-flash conduction oil or low-temperature safety environmental protection working medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820865726.5U CN208637411U (en) | 2018-06-05 | 2018-06-05 | A kind of gravity reflux plume formula chip radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820865726.5U CN208637411U (en) | 2018-06-05 | 2018-06-05 | A kind of gravity reflux plume formula chip radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208637411U true CN208637411U (en) | 2019-03-22 |
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ID=65734463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820865726.5U Active CN208637411U (en) | 2018-06-05 | 2018-06-05 | A kind of gravity reflux plume formula chip radiator |
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| CN (1) | CN208637411U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615714A (en) * | 2018-06-05 | 2018-10-02 | 广东合新材料研究院有限公司 | A kind of gravity reflux plume formula chip radiator |
-
2018
- 2018-06-05 CN CN201820865726.5U patent/CN208637411U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615714A (en) * | 2018-06-05 | 2018-10-02 | 广东合新材料研究院有限公司 | A kind of gravity reflux plume formula chip radiator |
| CN108615714B (en) * | 2018-06-05 | 2023-10-13 | 广东西江数据科技有限公司 | Gravity backflow thermal column type chip radiator |
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Effective date of registration: 20211124 Address after: 526000 room 142, workshop (Building B), Zhaoqing New District Investment Development Co., Ltd., north 8 District, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xijiang Data Technology Co.,Ltd. Address before: 510530 building 21, YUNPU 1st Road, YUNPU Industrial Park, Huangpu District, Guangzhou, Guangdong Patentee before: GUANGDONG HI-1 NEW MATERIALS TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |
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